JP2910719B2 - Method and apparatus for separating components from printed circuit board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating a component from a printed circuit board on which the component is mounted, and to an apparatus for separating the component.

[0002]

2. Description of the Related Art Conventionally, as a method of separating a component from a printed circuit board on which the component is mounted (hereinafter, referred to as a component mounted printed circuit board), a method of removing the component using a tool such as a screwdriver or pliers, or a method of melting solder. After that, a manual method of separating parts using tweezers or the like, or
After melting the solder, there is a method of separating only specific parts by using a special jig (Japanese Utility Model Application Laid-Open No. 59-2143).
These methods have a main purpose of replacing a defective component with a normal component, and are called a component repair method in a quality control process of a component mounting printed circuit board.

[0003]

In order to recycle a component-mounted printed circuit board, if the components and the printed circuit board can be separated and collected separately, the components contain gold and silver, so that the components can be used for smelting. The printed circuit board contains copper as gold and silver resources and can be reused as copper resources for smelting.

[0004] Ordinary component-mounted printed circuit boards alone have a low content of valuable metals such as gold, silver and copper, and the smelting cost is higher than the disposal cost. Have been. On the other hand, if the components and the substrate can be efficiently separated, the content of these metals will be improved, and the smelting cost will be reduced, making the smelting resource valuable.

As described above, it is very important to separate components from a component mounting printed board in order to recycle them. However, the conventional manual method and the method disclosed in
With a component separation method such as −2143, it is not possible to efficiently separate all components at once. In addition, the method disclosed in Japanese Patent Application Laid-Open No. 59-2143 is effective only for separating specific components on a board. However, it is difficult to separate all the components on a variety of component-mounted printed boards at a time. Have difficulty.

In addition, when the substrate is heated to melt the solder and the components are separated, a large heating furnace is required, the apparatus becomes large, and the manufacturing cost of the apparatus becomes extremely high. .

[0007] It has been attempted to collect valuable metals by a physical method by crushing the components and the substrate collectively without separating them, but the valuable metal unevenly distributed on the components and the substrate body is crushed. It is difficult to efficiently recover these metals because they diffuse into the material.

As described above, it has been a major challenge to establish a method for efficiently separating components from a component-mounted printed circuit board for the purpose of recycling.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method and an apparatus for efficiently separating a component from a component mounting printed circuit board at low cost. .

[0010]

According to the present invention, a component is mounted and mounted.
Separating the component from the printed circuit board,
Two rotating rollers with grooves on the surface make the rotation axis parallel
And the two rotating rollers
Gap between the printed circuit board and the component
The printed circuit board after component mounting, which is larger than the thickness of the main body
Are installed to be smaller than the overall thickness of the two
The printed circuit board in the gap between the rotating rollers
By inserting the shaft so that the component mounting surface is
At least one of the parts
Part and separate the part from the printed circuit board.
Component mounting print characterized by having a separation process
This is a method for separating components from the substrate.

Further, there is provided a method of separating a component from a component-mounted printed circuit board by repeating the separating step a plurality of times.

[0012] In addition, parts from the component mounting printed circuit board
The separation method is mainly screwed on the printed circuit board
At least one component to be joined is mounted
It is characterized by the following.

The present invention relates to a printed circuit board on which components are mounted.
Device for separating the parts from
It was installed facing the substrate so that the rotation axis was parallel,
Having two rotating rollers having grooves on the surface, and
Two opposing gaps are formed by the printer before mounting a component.
Is larger than the thickness of the main body of the printed circuit board.
Installed to be smaller than the overall thickness of the printed circuit board.
And the printed circuit board is a gap between the two rotating rollers.
When passing through, the part mounted by the rotating roller
The product is subject to a shear force that can damage the product.
Is a device for separating components from component mounted printed circuit boards.
You.

Further, the two rotating rollers are configured in multiple stages.
The printed circuit board is subjected to multiple shear forces.
And features.

The printed circuit board is mainly screwed.
At least one component to be joined is mounted
It is characterized by the following.

The surface of the rotating roller is formed by a groove.
The cross-sectional shape of the rotating roller surface is trapezoidal or triangular.
Or a quadrilateral.

[0017]

[0018]

[0019]

[0020]

[0021]

The operation of the present invention will be described. Components on a component mounting printed circuit board can be roughly classified into those that are mainly joined by screws (hereinafter referred to as screw-type components), and that the leads of the components are inserted into holes provided in the board and joined by solder. (Hereinafter, through-hole type parts),
There is a substrate (surface-mounted component) that is joined to the surface of a substrate with solder and / or an adhesive.

In the case of a screw-type component, if an external force equal to or greater than the joining force of the screw is applied to the component, the screw will be damaged, and the component can be separated from the printed circuit board. In addition, even if the external force is not more than the screw joining force and the external force is large enough to damage the component, the component can be separated from the substrate by damaging the component.

In this case, a piece of a component such as a screw remains on the board. However, since both the component and the board are intended to be reused as metal resources, even if the component is damaged, it is still necessary to print the printed board. It does not matter if some pieces of the parts remain.

With respect to through-hole components, it is possible to separate the components by cutting the leads of the components or damaging the components. In this case as well, the leads of the components and fragments of the components slightly remain on the substrate, but there is no problem in reusing them as metal resources. With respect to the surface mount component, the component can be separated if an external force equal to or more than the bonding force of the solder and / or the adhesive is applied to the component.

As the direction of the external force, a direction perpendicular to the component mounting surface of the printed circuit board and a direction parallel thereto can be considered. However, since the screws and leads are located perpendicular to the component mounting surface, these are cut. Requires a force parallel to the mounting surface.

The types of external force include shear force, impact force,
Vibration force is conceivable. In the case of impact force, the impact energy is used as energy for separating parts efficiently.
Difficult to convert. In other words, when an impact force applied part collides with some parts, energy is lost,
There may be a shortage of energy to separate other components. In the case of a vibration force, it is difficult to supply a force enough to separate components.

On the other hand, in the case of the shear force, the energy loss due to the contact between the part to which the shear force is applied and the component is much smaller than the impact force. Therefore, a shearing force is suitable for the purpose of supplying a force for cutting a screw or a lead or breaking a component to many components at once.

As a mechanism for applying a shearing force, a mechanism composed of two opposed rotating rollers installed so that their rotating axes are parallel is efficient. By inserting the component mounting printed board into the gap between the two rotating rollers so that the rotation axis and the component mounting surface are parallel, a shearing force is applied to the component.

As a result, the screws and leads are cut or
The component is damaged and the component can be separated from the printed circuit board.
The component separation efficiency is further improved by inserting the component mounting printed circuit board a plurality of times or providing a plurality of component separation portions in the component separation portion having the two rotating rollers as one set.

Further, by providing a plurality of irregularities on the rotating roller, a shear force can be more efficiently supplied to the component. The rotation directions of the two rotating rollers are both the same as the direction in which the printed circuit board is inserted, but the rotation speeds thereof may be the same or slightly different.

The gap between the two rotating rollers is preferably larger than the thickness of the main body of the printed circuit board, and smaller than the entire thickness of the printed circuit board after component mounting. If the thickness is smaller than the thickness of the printed circuit board main body, the printed circuit board itself is crushed, and it is difficult to separate the printed circuit board from components. If the thickness is equal to or larger than the entire thickness of the component mounting printed board, neither separation nor crushing occurs.

[0033]

Next, an embodiment of the present invention will be described.

As a sample, a printed circuit board made of a glass fiber reinforced epoxy resin with a copper pattern and components mounted thereon was used. The thickness of this printed circuit board before component mounting is 1.6 mm. The parts used were screw-type parts, through-hole parts, and surface-mount parts. As the screw-type parts, two signal input / output connectors with 16 lead pins were used, and mounted on a printed circuit board with screws and solder having a diameter of 2 mm.

As a through-hole type component, a DIP (dual in-line package) having 240 lead pins is used.
Were mounted on a substrate by soldering using 10 resistors and 10 resistors each having two lead pins.

As the surface mount type component, the number of lead pins is 6
10 QFPs (Quad Flat Package)
And 50 chip resistors were used. The QFP was mounted on the board by solder, and the chip resistor was mounted on the board by an adhesive and solder. The thickness of the entire component mounting printed board is 15 mm.

First, Examples 1 and 2 of the present invention and Comparative Examples 1 to
3 is shown. The part separability was evaluated by the part separation rate. Here, the part separation ratio indicates the ratio of the weight of the separated and collected part to the total weight of the part.

In the embodiment of the present invention, a roll crusher as shown in FIG. 1 was used as an apparatus having two opposing rotating rollers installed with their rotating axes parallel. The material of the roller is desirably high chromium cast iron, and other abrasion resistant materials can be used. Further, a cover can be hung on the roller. Tungsten carbide may be adhered to about 5 mm or less by welding.

In the first embodiment, the roll crusher 2
The rotating shafts 2 and 2 ′ of the two rotating rollers 1 and 1 ′ and the component mounting surface of the
The component mounting printed circuit board 5 was inserted into the gap 4 between the two rotating rollers.

The gap 4 is adjusted according to the material and thickness of the printed board, the thickness of the components to be mounted, and the like, but is adjusted according to a typical board. The thickness is set so as to be larger than the thickness of the printed board not mounted and smaller than the thickness of the printed board after mounting, but it is preferable to set the thickness to just about the middle.

In the first embodiment, the diameter of the rotating rollers 1 and 1 'is 150 mm, the length is 200 mm, the gap 4 between the rotating rollers 1 and 1' is 10 mm, and the rotation direction of the rotating rollers 3 and 3 'is inserted into the printed circuit board. In the same direction as the direction 9, the number of rotations of the rotating rollers was set to 50 rpm for both rollers. Generally, the diameter of the rotating rollers 1 and 1 'is 50-1000 mm and the length is 1
00-3000mm, rotation speed of rotating roller is 5-500rp
It is appropriate to set to about m.

In Example 2, the conditions of Example 1 were repeated twice.

In Comparative Example 1, the same apparatus as in Example 1 was used, and the gap between the rotating rollers was set to 1.6 mm. Other conditions are the same as in the first embodiment.

In Comparative Example 2, an impact force was applied to the component by a hammer from a direction parallel to the component mounting surface. At this time,
The hammer was a Charpy impact tester. The weight of the hammer is 2.2 kg, the distance from the rotation axis of the hammer to the hit point is 36 cm, and the lifting angle of the hammer is 90.
Set to degree.

In Comparative Example 3, an impact force was applied to the component by a hammer from a direction perpendicular to the component mounting surface. The apparatus used at this time and its conditions are the same as in Comparative Example 2.

In Comparative Example 4, a vibration force was applied by a vibrator in a direction parallel to the component mounting surface. At this time, the maximum acceleration due to the vibration force was set to 40G.

[0047]

[Table 1]

As is clear from the examples and comparative examples of the present invention, it is understood that according to the present invention, many components can be efficiently separated from the component mounting printed board at one time. By comparing Example 1 with Comparative Examples 2 to 4, it can be seen that a shear force parallel to the component mounting surface is suitable as an external force for separating components. As a comparison target,
Shear force perpendicular to the component mounting surface is mentioned. This power is
It is realized by pulling while gripping a part, but it is difficult to apply such a force to many parts at once.

Further, by comparing Example 1 and Comparative Example 1, it is understood that it is preferable that the gap between the rotating rollers is larger than the thickness of the printed circuit board.

Further, by comparing Example 1 and Example 2, it can be seen that the separation efficiency is improved by repeating the separation step a plurality of times.

FIGS. 2 and 3 are schematic views showing another embodiment of the present invention, in which a belt conveyor is used for moving a printed circuit board. The rotating rollers may be installed on both upper and lower surfaces as shown in FIG. 2, or may be installed on one of the upper surface and the lower surface as shown in FIG. In general, the separation efficiency is higher when they are installed on both sides.

FIGS. 4 to 7 are partially enlarged views of the cross-sectional shape of the rotating surface of the rotating roller. The rotating surface of the rotating roller may be flat as shown in FIG. 7 or may be uneven as shown in FIGS. At this time, the groove depth 11 is 1-3.
0 mm and a groove width 12 of 1 to 30 mm are appropriate. The surface shape of the rotating roller is most preferably as shown in FIG. 4, and has such a shape that a shearing force capable of damaging at least some components on the printed board can be applied to the printed board.

[0053]

An advantage of the present invention is that components can be efficiently and easily separated from a component mounting printed board at low cost. The reason is that a shear force is applied to the component from a direction parallel to the component mounting surface.

According to the present invention, the conventional manual separation step becomes unnecessary, and the separation efficiency can be greatly improved. Also, in contrast to the method of selecting and separating only specific parts, various kinds of parts can be separated at a time, so that also in this case, the separation efficiency can be greatly improved.

Further, according to the present invention, there is provided a method for simultaneously pulverizing parts without separating them and physically separating valuable metals.
Since the dispersion of valuable resources can be suppressed, the recovery rate of valuable resources is improved.

As described above, according to the present invention, even a component-mounted printed board that has been discarded with a low content of valuable metals such as gold, silver, and copper as it is, has a high content of gold and silver. It can be separated and collected into parts and a printed circuit board body with a high copper content. As a result, the burden of recovering valuable resources in the subsequent smelting process etc. can be significantly reduced,
Since the recovery rate can be further improved, efficient recycling can be achieved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a separation mechanism applied to an embodiment of the present invention.

FIG. 2 is a schematic diagram of a separating mechanism showing an example in which a rotating roller applied to another embodiment of the present invention is on both sides.

FIG. 3 is a schematic diagram of a separation mechanism showing an example in which a rotary roller applied to another embodiment of the present invention is on one side.

FIG. 4 is a view of the rotating rollers 1 and 1 ′ shown in FIGS. 1, 2 and 3;
FIG. 3 is a partially enlarged view of a first example of a cross section of FIG.

FIG. 5 is a view of the rotating rollers 1 and 1 ′ shown in FIGS. 1, 2 and 3;
It is the elements on larger scale of the 2nd example of the section of.

FIG. 6 is a view of the rotary rollers 1 and 1 ′ shown in FIGS. 1, 2 and 3;
It is the elements on larger scale of the 3rd example of the section of.

FIG. 7 is a view of the rotary rollers 1 and 1 ′ shown in FIGS.
It is the elements on larger scale of the 4th example of the section of.

[Explanation of symbols]

 Reference Signs List 1, 1 'rotating roller 2, 2' rotating shaft 3, 3 'rotating direction of roller 4 gap between two rollers 5 component mounting printed board 6 component 7, 7' printed board 8 separated component or component piece 9 Insertion direction of component mounting printed circuit board 10 Belt conveyor 11 Depth of groove 12 Width of groove

Claims (7)

(57) [Claims] 1. A method for separating a component from a printed circuit board on which the component is mounted, comprising :
Rollers are installed facing each other so that their rotation axes are parallel.
And the gap between the two rotating rollers mounts the component.
Larger than the thickness of the main body of the printed circuit board before
Smaller than the overall thickness of the printed circuit board after product mounting
So that the gap between the two rotating rollers is
The printed circuit board is set so that the rotation axis and the component mounting surface are parallel.
The shear force obtained by inserting
And separating the component from the printed circuit board by breaking at least a part of the component. 2. The method for separating a component from a component-mounted printed circuit board according to claim 1, wherein the separating step is repeated a plurality of times. Wherein said printed circuit board, components from the component mounting printed circuit board according to any one of claims 1 and 2 the parts to be mainly joined by screws, characterized in that it is at least one mounting Separation method. 4. A from the printed board on which component device for separating the components, printed circuit board and the rotary shaft to be inserted is placed so as to face in parallel grooves on the surface
It possesses two rotating rollers having, and said opposing
Two gaps are formed in the printed circuit board before mounting components.
The printed circuit board after component mounting, which is larger than the thickness of the main body
The printed circuit board is subjected to a shearing force such that the components mounted by the rotating rollers are damaged when passing through the gap between the two rotating rollers. Characterized by parts
A device for separating components from the mounted printed circuit board . 5. The apparatus according to claim 1, wherein the two rotating rollers are configured in multiple stages.
Is, the printed circuit board separating device according to claim 4, wherein that you receive a plurality of shearing forces. The method according to claim 6, wherein said printed circuit board, parts of any one of claims 4 and 5 the parts that are mainly joined by screws, characterized in that it is at least one mounting
Equipment for separating components from printed circuit boards . 7. Formed by grooves on the surface of the rotating roller
The cross-sectional shape of the rotating roller surface is trapezoidal or triangular.
Claims that are either shaped or squared
Item 4. The component separating device according to items 4, 5, and 6.