JP4374639B2 - Circuit board processing method and apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method and apparatus for processing a circuit board (printed wiring board, three-dimensional wiring board, etc.) to be discarded or recycled, and more specifically, various electronic components soldered and mounted on the printed wiring board or the like are removed, The present invention relates to a method and apparatus for separately collecting electronic components.
[0002]
[Prior art]
Various electronic devices such as waste television are dismantled and separated and recycled (recycled) for each component material for the purpose of effective use of resources and global environmental conservation.
As a processing method of a printed wiring board constituting various electronic devices, for example, in JP-A-8-143823, a printed wiring board is accommodated in a rotating drum, heated from the periphery of the drum, A method for separating and collecting electronic components and solder has been proposed.
[0003]
[Problems to be solved by the invention]
However, the above-mentioned JP-A-8-143823 is a batch process, and it is difficult to perform unmanned operation continuously for 24 hours.
[0004]
An object of the present invention is to heat a printed wiring board, that is, a soldering portion in a short time, efficiently remove an electronic component, and automate the separation and collection of the electronic component, the solder, and the substrate.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the present invention heats a circuit board that moves in a vibration cage, separates solder attached to the circuit board and mounted electronic components, and separates and collects the solder, electronic components, and board respectively. The circuit board processing method is as follows.
In addition, the circuit board processing apparatus includes a ridge, a means for vibrating the ridge obliquely upward, and a means for heating the ridge. The heating means was an electric heating furnace or a high-frequency heating furnace.
[0006]
Further, a cutting means for cutting one main surface of the printed circuit board is attached to the support shaft erected on the main surface of the rotating body so that the striking body can be rotated, and the rotating body is rotated at a high speed to The structure is made to collide with at least one of the main surface of the circuit board and the component at a speed equal to or higher than the critical impact speed (about 50 m / sec (180 km / hr)).
[0007]
The cutting principle of the workpiece (workpiece) used in the present invention is a plastic wave theory in which a plastic wave is generated when a high-speed tensile force equal to or higher than the critical impact velocity is applied, and a fracture occurs immediately at the applied end, or a high-speed When compressive force is applied, the theory is that a plastic wave is generated, a very large stress is generated instantaneously, and the applied end breaks with a small strain (a phenomenon similar to brittleness). Specifically, instead of a conventional tool having a cutting edge, an impacting body made of a hard solid such as metal is made to collide with a workpiece (workpiece / circuit board) at a high speed and with a high frequency, and the impact energy causes a plastic wave. Based on the principle of instantly destroying and removing the collision site.
That is, when an impacting body that performs high-speed circular motion (a speed of about 50 m / sec (180 Km / h) or more) collides with a workpiece and reflects (repels), high-speed compression generated with an impact, or high-speed tension caused by friction, The cutting method was based on the principle of instantaneously crushing (breaking) the workpiece surface into fine particles or fine pieces within a very limited range in the vicinity of and near the impacted part and the workpiece by high-speed shearing.
[0008]
In order to generate a plastic wave, the speed at which the impacting body collides with the workpiece was set in a range of about 50 m / sec (180 Km / h) to 300 m / sec (1,080 Km / h).
In terms of the peripheral speed of the disc, this corresponds to the rotation of a disc having a diameter of 100 mm at a rotational speed of 10,000 rpm to 60,000 rpm.
When cutting resin molded products, printed wiring boards, etc., the impacting body (hard solid) is made to collide with the workpiece at a speed of about 50 m / sec (180 km / hr) or more and at a frequency of about 150 times / sec or more. The surface was crushed.
In the case of cutting of metal such as carbon steel for machine structure and cold rolled steel sheet, glass, etc., the striking body has a speed of about 150 m / sec (540 km / hr) or more and a frequency of about 1,800 times / sec. Thus, the workpiece surface is crushed by colliding with the workpiece.
[0009]
The fitting gap between the support shaft for supporting the striking body and the through hole of the striking body was 2 mm or more, preferably the fitting gap was about 5 to 10 mm. The fitting gap needs to be set large in response to an increase in impact speed of the impacting body. The fitting gap in the present invention is generally much larger than the JIS standard clearance value that defines the fitting state between the shaft and the bearing, and is two to three digits higher.
[0010]
Thus, the cutting principle of the present invention is different from the conventional cutting principle. The conventional cutting principle is that the cutting edge of a cutting tool (tool) is made to collide with the workpiece at a low speed (maximum of about 10 m / sec or less), and the workpiece undergoes elastic deformation, which is sequentially deformed from plastic deformation to fracture. A relatively wide area is destroyed.
Moreover, the impacting body in the present invention does not have a sharp cutting edge portion like a conventional cutting tool (tool).
[0011]
According to the above configuration, the present invention can efficiently automate the removal of electronic components and the separation and collection of the removed components, solder, and substrate with simple equipment. As a result, the recycling rate is improved, which helps environmental conservation and effective use of resources.
Further, there is no need to consider the mixing of different materials of the workpiece, such as a phenol resin substrate, a glass epoxy substrate, a ceramic substrate, a metal substrate, etc. in the cutting process.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
According to a first aspect of the present invention, there is provided a circuit board processing apparatus for separating components soldered to a circuit board, the cutting means for cutting one surface of the circuit board, and the cutting process. A circuit board processing apparatus, comprising: a trough for transporting the circuit board, a heating unit for heating the trough, and a vibration unit for vibrating the trough. The removal of components and the collection of boards, solder, and electronic components can be performed efficiently.
[0022]
Further, the second invention, before Symbol cutting means, attached to the striking member rotatably on a support shaft erected on the main surface of the rotating body, for the circuit of the striking body is rotated at a high speed of the rotating body The apparatus for processing a circuit board according to the first aspect of the invention is characterized in that the circuit board is made to collide with one surface of the circuit board at a speed equal to or higher than a critical impact speed of the board. One side can be cut regardless of the type, making it easy to remove the mounted parts.
[0023]
【Example】
A circuit board processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings.
[0024]
(Example)
FIG. 1 is a longitudinal sectional view showing a main part of a concept of a vibration / heating apparatus constituting a processing apparatus for a printed wiring board in an embodiment of the present invention. FIG. 2 is a cross-sectional view of the main part from the side surface direction of the sieve portion of the ridge constituting FIG. (Cutting along cutting lines S to S)
The vibration / heating device 100 shown in FIG. 1 receives a printed wiring board, guides and transfers it, and vibrates the hook 1 obliquely upward to convey the printed wiring board in one direction while repeating jumping to dropping. It is provided with a vibration means and a heating furnace 10 which is arranged in the middle of the basket 1 and heats the printed wiring board to a predetermined temperature at which the solder melts.
The vibration means includes a plate 6 on which the rod 1 is mounted, a leaf spring 2 that is inclined at an angle of about 60 degrees with respect to the plate 6 and is attached to two locations, a leaf spring locking portion 7, and the leaf spring 2. It comprises means for swinging back and forth (vibrating), for example, a link plate 3, an eccentric plate 4, a transmission motor 5, and the like.
[0025]
The heating furnace 10 was either a general electric heating furnace or a high-frequency heating furnace. Of course, it goes without saying that any other heating means may be used. The heating furnace 10 shown in FIG. 2 has a rectangular annular shape that matches the substantially rectangular bowl 1 and has electric heaters 20 such as nichrome heaters, far-infrared heaters, or SiC resistors on the four inner surfaces facing the bowl 1. One of the heating rods or the like is arranged.
The temperature at which the printed wiring board is heated via the 樋 1 is in the range of about 200 degrees Celsius to 500 degrees Celsius, and preferably about 250 degrees Celsius to 300 degrees Celsius, sufficient to melt the mounting solder of the electronic component. .
[0026]
As another operating means for heating the printed circuit board, the operating condition of the high-frequency heating device is such that 180V, 200A is applied at 1500 to 2000 hertz and is operated for at least 10 to 60 seconds in the moving section on the heel.
The high-frequency output of the high-frequency heating device used in the present invention is 60 KW at maximum, and the frequency setting range is about 0.5 to 20 kHz. Needless to say, the setting of the output and the frequency may be appropriately set according to the size and the number of printed wiring boards to be handled.
[0027]
The excitation means is mounted on a base plate 8 that also serves as a weight. Anti-vibration rubber 9 is attached to the lower surface of the base plate 8 to provide anti-vibration means. When the heating means is mounted on the base plate 8, it is desirable to consider using vibration-proof rubber or the like so that vibration is not transmitted to the heating means.
[0028]
FIG. 2 shows a cross-sectional shape of an example of the ridge 1. In this case, the ridge 1 is a cylindrical body having a substantially rectangular cross section, and the bottom plate portion has a V shape with a gentle inclination. The purpose of this is to collect the solder melted and dropped from the printed wiring board at the center of the bottom plate of the bowl 1.
As shown in FIG. 1, the ridge 1 includes a sieve portion 11 for collecting molten solder and a drop hole 12 for electronic components in the vicinity of the right end portion in the traveling direction of the printed wiring board. With this configuration, the substrate, solder, and electronic components can be separately collected. Of course, the sieve portion 11 may be omitted and the solder and the electronic component may be dropped into the same collection box.
[0029]
In order to allow the electronic parts to pass through while the sieving portion 11 collects the solder outside, the fine holes having a diameter of about 0.5 mm to 1 mm are arranged in a matrix as shown in FIG. A slit having a width of about 0.5 mm to 1 mm was provided, or a mesh-like wire net made by woven metal wires as shown in FIG. 6 was attached.
The electronic component drop hole 12 drops a relatively small discrete component such as a resistor or a capacitor and a chip component, while passing a flyback transformer, a large electrolytic capacitor, a substrate on which the electronic component is mounted, or the like. Appropriate dimensions were adopted.
[0030]
As a matter of course, the plate 6 has through holes 13 and 14 corresponding to the sieve portion 11 and the drop hole 12, respectively, and a solder recovery box 16 and an electronic component recovery box (not shown) at the lower part. Z.) is installed. A substrate recovery box 15 is installed at the lower end of the basket 1.
[0031]
In this embodiment, as described above, the means 1 for vibrating the flange 1 or the printed wiring board obliquely upward by about 30 degrees includes two leaf springs 2 attached to the plate 6 at an angle of about 60 degrees, and the leaf spring 2 It is implemented by a link plate 3, an eccentric plate 4, a transmission motor 5 and the like that are swung back and forth. As a matter of course, the eccentric plate 4 is attached to the rotating shaft of the transmission motor 5.
As the vibration conditions of 樋 1, the amplitude was several mm to several tens mm, and the vibration frequency was about several tens to 2,000 hertz. The vibration conditions are appropriately set according to the size of the printed wiring board and the number of processed sheets.
[0032]
In the embodiment of the present invention, the axial center (long axis) of the longitudinal direction of the flange 1 is generally matched with the vibration direction of the plate 6 to which the flange 1 is attached.
However, as shown in FIG. 4, the ridge may be opened (tilted) by a predetermined angle in the horizontal plane with respect to the vibration direction. By setting the vibration direction and the long axis of the basket to a predetermined opening angle, the traveling speed of the printed wiring board in the basket is delayed, and the impact force on the printed wiring board is increased. This is due to the fact that the printed wiring board jumps upward and collides with the side surface of the bag, and the jump direction is different from the path direction of the bag.
[0033]
FIG. 3 shows a cross-sectional shape of the collar 10A according to another embodiment of the present invention. In this case, the wrinkle has a semicircular shape, and the molten solder and electronic components separated from the printed circuit board are accumulated on the bottom of the wrinkle and moved to the front end of the wrinkle. In addition, a gap can always be provided between the printed wiring board and the bag.
[0034]
As a matter of course, the cross-sectional shape of the ridge is not limited to the above two types. It goes without saying that U-shaped, W-shaped, concave shapes such as corrugations, or the base plate may be set to an arbitrary shape such as a mountain shape or a corrugated convex shape.
Further, the circuit board may be transported in any manner. In addition to sending the printed circuit board in a substantially horizontal state where the printed circuit board is naturally stable or in a slightly inclined state, the printed circuit board may be transported simultaneously in an independent multi-row in a state where the circuit board is substantially upright. (See Figure 7.)
Next, the process of separating solder and electronic components from the printed wiring board will be described. First, printed wiring boards to be recycled are sequentially fed from the board loading port on one side (left side in FIG. 1) of the basket 1 by the belt conveyor 201 or the like (FIGS. 16 and 17).
The cage 1 is always vibrated and heated to an ambient temperature at which solder can be melted in the middle section. Therefore, the input printed circuit board is vibrated in a certain direction, jumped diagonally forward and forward, is subjected to an impact while repeating dropping, and moves toward the tip in the longitudinal direction of the heel.
And the solder which was heated in the middle of a movement in a cage | basket | melt, the electronic component adhere | attached fuse | melts, and an electronic component is removed from a printed wiring board. Also, the molten solder is dropped on the bottom surface of the cocoon and moves toward the tip in the longitudinal direction of the cocoon.
The sieve portion 11 and the drop hole 12 are provided in the vicinity of the tip of the ridge 1, and the solder, the electronic component, and the substrate are separately collected in a predetermined manner.
[0035]
In the above-described embodiment, the motor, the eccentric plate attached to the motor, the link plate, and the leaf spring are used as the vibration means. However, a link mechanism may be used instead of the leaf spring. . Further, instead of the embodiment of FIG. 1, a general electromagnetic vibration mechanism may be used.
[0036]
Furthermore, lead wires, jumper wires, crimped eyelets, etc. of electronic parts bent on one main surface side (for example, the back surface side) of the printed wiring board are cut and removed in advance, and the printed wiring board is put into a bag. You may make it do.
[0037]
FIG. 17 shows an example of a cutting apparatus 600 that cuts parts attached to the main surface of the circuit board or the circuit board book. Hereinafter, the cutting device 600 and the cutting unit 400 constituting the cutting device 600 will be described.
[0038]
8 is a cross-sectional view of a cutting unit constituting a cutting device according to an embodiment of the present invention, FIG. 9 is a cross-sectional view of FIG. 8 taken along the cutting line S1-S1, and FIG. 10 is a circuit using the cutting unit of FIG. FIG. 11 is a front view of an impacting body constituting the cutting unit of FIG. 8, and FIG. 12 is a cutting line S3. FIG. 13 and FIG. 14 are front views of another striking body constituting FIG. 8, and FIG. 15 is a sectional view of a cutting device constituting the circuit board processing apparatus in one embodiment of the present invention. FIG. 16 is a plan view of the main part of the concept of the processing apparatus for circuit substrates in one embodiment of the present invention, FIG. 17 is a sectional view of the main part of the concept of the cutting apparatus in one embodiment of the present invention, and FIG. Sectional drawing of the principal part of the circuit board (printed wiring board) used for explanation of the invention Figure 19 is a fragmentary sectional view of a state in which cutting a one main surface of the printed wiring board, FIG. 20 is a plan view of a frame-type plate which constitutes a cutting apparatus in an embodiment of the present invention.
[0039]
16 and 17, the circuit board processing apparatus 200 lifts the circuit board 300 from the conveyor 201 and conveys the circuit board (printed wiring board) 300 and the circuit board 300. A cutting device 600 (cutting means) for cutting and fixing at least one of a means for holding and fixing a peripheral portion of the circuit board 300 and a main surface of the circuit board 300 or various circuit components attached to the circuit board 300 And a heating furnace 10 (heating means) for heating the circuit board 300 to a solder melting temperature or higher, and a vibration means for conveying the circuit board 300 while jumping in one direction.
[0040]
16 and 17, reference numeral 100 denotes a vibration / heating device, 250 denotes a frame plate, 251 denotes a fixed plate, 205 denotes a driving motor of the cutting device 600, and 206 denotes a driving screw.
[0041]
The cutting device 600 rotatably attaches an impacting body to a spindle erected on the main surface of the rotating body, rotates the rotating body at a high speed, and rotates the impacting body at a speed higher than the critical impact speed. It is made to collide with at least one of the main surface or the said components.
Further, the device of the present invention is configured such that the cutting device 600 is arranged at a plurality of two or more locations, and each cutting device cuts parts mounted on different main surface positions or different main surface positions of the printed wiring board.
Further, as shown in FIG. 16, the cutting device 600 is driven back and forth in the direction of arrow Y by a drive motor 205 such as a pulse motor and a drive screw 206 such as a ball screw, so that the cutting position can be arbitrarily changed. Moreover, the cutting device 600 can move to an arbitrary place in a horizontal plane by adopting a configuration in which left and right driving is performed in the arrow X direction.
[0042]
Note that the cutting device 600 may be provided at only one place. In that case, in order to be able to cut almost the entire area of the printed wiring board 300, it is necessary to sequentially move the cutting device 600 in the width direction of the printed wiring board 300. That is, it is only necessary to sequentially feed (traverse) the printed wiring board 300 in a direction (arrow Y direction) perpendicular to the direction in which the printed circuit board 300 is conveyed by the conveyor 201.
[0043]
Next, the cutting device 600 and the cutting unit 400 constituting the cutting device 600 will be described.
As shown in FIGS. 8 to 10, the cutting unit 400 according to the present invention has a support shaft 103 installed between a pair of discs (rotating bodies) 101 and 101 whose main surfaces are opposed to each other. 500 is rotatably attached, the pair of discs (rotating bodies) 101, 101 are rotated at a high speed, and the striking body 500 (hard solid) is moved at a speed of about 50 m / sec (180 km / hr) or more and about It is configured to collide with at least one of the main surface or components of the printed wiring board 300 at an impact frequency of 167 times / second (10,000 / 60 times per second) or more. Note that the rotational speed allows a variation of about ± 10% due to fluctuations in the power supply voltage and other reasons.
[0044]
The impact speed of the impacting body 500 against the workpiece (workpiece / circuit board or circuit component in the present invention) naturally corresponds to the rotational speed of the pair of disks (rotating bodies). In the present embodiment, a high-speed rotation region of 10,000 to 60,000 rpm (peripheral speed of 180 to 1080 km / h) was used for a pair of disks (rotating bodies). By the rotation speed region, the impacting body 500 can obtain an improvement in impact force, an air cooling effect and work hardening, and an improvement in the life of the impacting body 500 can be achieved.
[0045]
In the cutting unit 400 shown in FIG. 8, four cross-shaped impacting bodies 500 having four rectangular protrusions on the cylindrical surface are arranged at equal intervals on the main surface of the disc 101. The quadrangular protrusion corresponds to the cutting edge 3 of a conventional tool and strikes the workpiece. As is clear from FIG. 8, a part of the outer periphery of the impacting body 500 (the cutting edge portion 3) is positioned outward from the outer periphery of the disc 101.
Since the impacting body 500 is arranged at four locations on the main surface of the disc 101 at equal intervals, the impact frequency of the workpiece is (10,000 revolutions / minute) × 4 locations = 40,000 times / minute or more.
[0046]
In FIG. 8, the fitting gap 104 between the support shaft 104 and the impacting body 500 is about 7 mm. By providing the fitting gap 104, the impact applied to the cutting blade portion 3 and the support shaft 103 of the impacting body 500 is reduced even though the rotating body 101 rotates at a high speed, and the cutting unit 400 such as the support shaft is damaged. To prevent.
[0047]
The outer shape of the impacting body may be arbitrarily set in addition to the cross shape. For example, it may be a polygon having a plurality of corners (regular triangle, regular square, rectangle, regular pentagon, regular hexagon, etc.), disk shape, or the like. FIG. 6 and FIG. 7 show examples of disc-shaped and regular hexagonal impact bodies.
Further, the shape of the rotating body may be an arbitrary shape such as a regular polygon in addition to the disk shape. However, as a matter of course, the rotational balance of the rotating body is required.
[0048]
Next, an example of the dimensions and materials of each part of the rotating body and the impacting body will be described. In the case of the cutting unit shown in FIG. 8, the diameter of the disc 101 is 100 mm, the plate thickness is 5 mm, the material is carbon steel for machine structure, the support shaft 103 is 10 mm in diameter, and the material is carbon steel for machine structure or carbon tool steel (JIS standard). Symbol / SK2), the distance L between the tops of the cutting blades of the impacting body 500 is about 40 mm, the diameter of the through hole 2 is 17 mm, the width w of the cuttings is about 15 mm, and the thickness t of the cuttings is about 5 mm. , Material is carbon steel for machine structure (S45C), carbon tool steel (SK2), high speed tool steel (SKH2), Ni-Cr steel (SNC631), Ni-Cr-Mo steel (SNCM420), Cr-Mo steel Any one of (SCM430), chromium steel (SCr430), manganese steel for mechanical structure (SMn433), etc. was used.
[0049]
In the cutting example shown in FIG. 10, the disc 101 is rotated in the direction of the arrow 107 at 30,000 rpm, and the impact speed at which the impacting body 500 collides with the main surface of the workpiece (0.8 mm thick metal substrate) 105 is 157 m. Per second (565 km / hour), the cutting movement speed was 50 mm / second, and the cutting direction was 108. In this case, the hit frequency is (30,000 revolutions / minute) × 4 places = 120,000 times / minute.
Since the main shaft 102 rotates at a high speed of 30,000 rpm, a large centrifugal force acts on the impacting body 500. The centrifugal force generates a high-speed compressive force with a shock within a limited range near the collision surface between the cutting edge portion 3 of the impacting body 500 and the workpiece 105 and the vicinity thereof, and the workpiece 105 is instantaneously and rapidly crushed. . The cutting waste becomes finely granular. Experiments have confirmed that cutting is possible without a sharp cutting edge.
[0050]
In addition, the glass substrate and the ceramic substrate could be cut under the above processing conditions. Also, plastic such as a resin wiring board for a circuit, a resin molded product, and the like, the rotation speed of the disc 101 is 10,000 rpm, and the impacting body is impacted 10,000 times / minute (the number of impacting bodies attached to the rotating body is 1). The experiment confirmed that the cutting movement speed can be processed at 50 mm / S.
[0051]
In the above embodiment, if the impact speed of the impacting body is about 50 m / second (180 km / hour) or more and the number of impacts is about 167 times / second (10,000 / 60 times per second), it corresponds to the workpiece. Needless to say, it may be set arbitrarily.
Similarly, if the material of the impacting body is a hard solid, it may be set arbitrarily other than the metal member.
Furthermore, the number of impact bodies may be two or more, or may be only one.
Further, the rotating body may be only one side instead of a pair of opposed main surfaces. The rotating body may be driven at a high speed using a general spindle motor or the like.
[0052]
The striking body 500 constituting the device of the present invention does not include a sharp cutting edge portion unlike a conventional cutting tool. The cutting principle in the present invention is beyond conventional common sense, and by giving the striking body 500 a speed much higher than that of a conventional cutting tool, it is brittle such as metal, resin, glass, ceramics even without a sharp cutting edge. Allows cutting to part.
[0053]
FIG. 15 shows a cross-sectional view of a cutting device 600 constituting the device of the present invention. The cutting apparatus 600 has a large number of the cutting units 400 mounted on one shaft. Therefore, the cutting principle, cutting process conditions, and the like are the same as those in the cutting example of FIG.
In FIG. 15, reference numeral 600 is a cutting device, 601 is a disk (rotary body), 602 is a main shaft, 603 is a support shaft, 604 is a fitting gap, 605 and 606 are spacers, and 400 is a cutting unit.
[0054]
The cutting apparatus 600 in FIG. 15 includes a plurality of cutting units 400 in which a support shaft 603 is installed between a pair of rotating bodies 601 and 601 whose main surfaces face each other, and the impacting body 500 is rotatably attached to the support shaft 603. The cutting unit 400 is attached to the same main shaft 602 at predetermined intervals, the main shaft 602 is rotated at a high speed, and each impacting body 500 is cut at a speed of about 50 m / sec (180 km / hr) or more. It is characterized by being made to collide with.
[0055]
The number and arrangement pitch of the cutting units 400 to be arranged, the number of striking bodies 500 disposed on the rotating body 601, the striking speed of the striking body 500, and the like may be arbitrarily set according to the workpiece.
Note that the support bearing structure of the main shaft 602 may be arbitrarily set such as cantilever support or both-end support.
The conveyor 201 that conveys the printed wiring board 300 is intermittently driven in a constant arrow direction.
[0056]
FIG. 18 shows a cross-section of the main part of an example of the printed wiring board 300. In FIG. 18, a lead wire component (axial lead component) 301 and a lead wire component (radial lead component) 302 are provided on one main surface of the printed wiring board 300, and a chip component 303 is provided on the other main surface. An example of installation is shown.
In addition, the components may be any circuit components such as resistors, capacitors, transistors, ICs, LSIs (integrated circuits), flyback transformers, tuners with shield cases, heat sinks, connectors, jumper wires, and through holes. .
The cutting device 600 cuts one main surface of the printed circuit board, a lead wire protruding to the main surface side, a bent (clinched) lead wire, a chip component, and the like, and the solder in the soldering portion is subjected to vibration / heating device 100. When it is melted and vibrated, it is configured to be released (dropped) from the printed wiring board. FIG. 19 is a cross-sectional view of a main part in a state where one main surface side of the printed wiring board 300 is cut.
[0057]
In the apparatus of the present invention, a frame-shaped fixing plate 251 is disposed below the cutting device 600, and the printed wiring board 300 is sandwiched between the frame-type plate 250 that moves up and down. With this configuration, the printed circuit board 300 is sandwiched and fixed at the peripheral edge, and does not bend greatly during the cutting process or leave no cutting.
[0058]
A plan view of an example of the frame plate 250 is shown in FIG. The frame plate 250 lifts the printed wiring board 300 conveyed by the conveyor 201 to a predetermined position by a motor drive (not shown) or a cylinder drive using a fluid.
[0059]
Next, an operation of cutting one main surface side of the circuit board 300 will be briefly described. First, the printed wiring board 300 is conveyed to the lower part of the cutting device 600 by the conveyor 201 and stopped.
Next, the frame-type plate 250 lifts the printed wiring board 300, rises, and sandwiches it with the fixed plate 251.
Subsequently, the first cutting device 600 moves in the longitudinal direction of the printed wiring board 300 while rotating in a predetermined direction (in FIG. 17, moves from left to right, or moves from right to left (arrows in FIG. 16). X direction)), cutting at least one first portion of one main surface of the printed wiring board 300 or an attached component.
Thereafter, the printed wiring board 300 is lowered, conveyed by a predetermined pitch, and conveyed to the lower part of the second cutting apparatus position. Thereafter, the second portion of the printed wiring board 300 is cut by the same operation as described above. In addition, the 3rd, 4th cutting process is given to the uncut part of the printed wiring board 300 as needed. (Not shown)
After the cutting process is completed over almost the entire area of the printed wiring board 300, the printed wiring board 300 is again conveyed by the conveyor 201 to the upper side of the ridge 1 of the vibration / heating device 100 and falls into the ridge 1. Subsequent processing is as described above.
[0060]
In the above-described embodiment, the frame plate and the fixed plate may have any frame shape. Furthermore, the frame body plate and the fixed plate may be configured by four movable sides that are each driven by a fluid cylinder, and the frame shape may be changed according to the printed wiring board. (Not shown)
In a television receiver or the like, a printed wiring board is mounted and fixed on a frame-like member called a chassis rail. The chassis rail is formed of a resin molded product or a metal member. Such a printed wiring board recycling process may be performed with the frame-like member attached. The cutting device 600 cuts at least one of the main surface and parts of the printed wiring board together with the frame-shaped member.
[0061]
【The invention's effect】
As described above, according to the method and apparatus of the present invention, electronic components and solder can be efficiently removed from a printed wiring board in a short time. Moreover, the separation reproduction process after dismantling is facilitated. As a result, the recycling rate is improved, which helps environmental conservation and effective use of resources.
[Brief description of the drawings]
FIG. 1 is a conceptual diagram of a configuration of a printed wiring board processing apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a main part of FIG. 1 cut along cutting lines S to S. FIG. FIG. 4 is a plan view for explaining the relationship between the vibration direction and the heel arrangement in one embodiment of the present invention. FIG. 5 is a main portion of the sieve section in one embodiment of the present invention. [Fig. 6] Fig. 6 is a plan view of an essential part of a sieve portion according to an embodiment of the present invention. Fig. 7 is a sectional view of an essential portion of a ridge according to another embodiment of the present invention. FIG. 9 is a cross-sectional view of FIG. 8 as viewed from the cutting line S1-S1. FIG. 10 is a cross-sectional view of the circuit board or component cut using the cutting unit of FIG. FIG. 11 is a front view of a striking body constituting the cutting unit of FIG. 8. FIG. 12 is a sectional view of FIG. FIG. 13 is a sectional view taken along S3-S3. FIG. 13 is a front view of another striking body constituting FIG. 8. FIG. 14 is a front view of another striking body constituting FIG. FIG. 16 is a cross-sectional view of an essential part of a cutting apparatus constituting a processing apparatus for a circuit board in an embodiment. FIG. 16 is a plan view of an essential part of a processing apparatus for a circuit board in an embodiment of the present invention. FIG. 18 is a fragmentary cross-sectional view of a concept of a circuit board processing apparatus in one embodiment. FIG. 18 is a fragmentary cross-sectional view of a circuit substrate (printed wiring board) used for explaining the present invention. FIG. 20 is a cross-sectional view of a main part in a state in which one main surface side of a (printed wiring board) is cut. FIG. 20 is a plan view of a frame plate constituting a cutting device according to an embodiment of the present invention.
1, 1A, 1B 樋 2 Leaf spring (or link plate)
3 Link plate 4 Eccentric plate 5 Transmission motor 6, 6A Plate 7 Leaf spring locking portion 8 Base plate 9 Anti-vibration rubber 10, 10A Heating furnace (electric heating or high frequency induction heating device)
11, 11A Sieve 12 Drop hole 13, 14, 13A Through hole 14 Mounting plate 15, 16 Collection box 20 Heater 100 Vibration / heating device 101, 601 Disc (rotary body)
102 Through-holes 103 and 603 Support shafts 104 and 604 Clearance 107 Rotation direction 108 Cutting direction (moving direction)
200 Circuit Board Processing Device 201 Conveyor (Circuit Board Conveying Means)
202 Conveyor (Means for conveying detached parts)
203 Heating furnace 204 Heater 205 Drive motor 206 Drive screw 250 Frame type plate 251 Fixing plate 300 Circuit board (printed wiring board)
301 Lead wire parts (Axial lead parts)
302 Lead wire parts (radial lead parts)
303 Chip component 304 Solder (solder)
400 Cutting unit 500, 500A, 500B Impact body 502, 502A, 502B Hole (through hole)
503, 503A, 503B Cutting edge portion 600 Cutting device 602 Spindle 605, 606 Spacer

Claims (8)

A processing method of a circuit board for separating components soldered to a circuit board, the cutting step of cutting one surface of the circuit board, and the cut circuit board as a scissors a transfer step of transferring, the heating step of heating the trough, and step excitation for exciting the gutter possess,
In the cutting step, an impacting body is rotatably attached to a support shaft standing on the main surface of the rotating body, the rotating body is rotated at a high speed, and the impacting body is moved at a speed higher than a critical impact speed of the circuit board. A method of processing a circuit board, wherein the circuit board is caused to collide with one surface of the circuit board. A processing device for a circuit board for separating components soldered to a circuit board, the cutting means for cutting one surface of the circuit board, and the cut circuit board being transferred Comprising a scissors, heating means for heating the scissors, and vibration means for exciting the scissors ,
The cutting means attaches a striking body rotatably to a support shaft standing on the main surface of the rotating body, rotates the rotating body at a high speed, and moves the striking body at a speed higher than the critical impact speed of the circuit board. An apparatus for processing a circuit board, wherein the apparatus is made to collide with one surface of the circuit board. 3. The circuit board processing apparatus according to claim 2, wherein the critical impact velocity is 50 m / second (180 km / hour) or more. The circuit board processing apparatus according to claim 2 , wherein a fitting gap between the support shaft and the impacting body is set to 5 to 10 mm. 3. The circuit board processing apparatus according to claim 2, wherein the cutting means is movable in an arbitrary direction within a horizontal plane. 3. The circuit board processing apparatus according to claim 2 , wherein a plurality of the impacting bodies are arranged at equal intervals on the main surface of the rotating body. The bottom of the cutting means, according to claim, characterized in that a pair of the frame for holding the circuit board, one of the pair of frame has to lift the substrate for the circuit from the substrate conveying means 2 The circuit board processing apparatus as described. 3. The circuit board according to claim 2 , wherein the outer shape of the impacting body is one of a polygon having a plurality of corners, a cross shape having a plurality of corners, and a disk shape. 4. Processing equipment.

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