JP2928008B2 - Printed wiring board for high-speed signals - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for passing a high-speed signal through a circuit.

[0002]

2. Description of the Related Art An example of a layer structure of a conventional high-speed signal printed wiring board will be described below with reference to the drawings. FIG. 2 is a partial sectional perspective view, and FIG. 2 shows a multilayer printed wiring board having six layers.
The component surface pattern 1 and the solder surface pattern 2 are vertically symmetrically arranged, and the component surface pattern 1 and the solder surface pattern 2 are low dielectric materials having a signal propagation delay time, a stray capacity, and a crosstalk reducing effect, respectively. A transmission line through which a high-speed signal flows is formed by being bonded to the resin insulating layer 3. The material of the low dielectric constant resin insulating layer 3 is generally a fluororesin or a composite thereof, and the relative dielectric constant is about ε = 1.6 to 2.4.

The component surface pattern 1 and the solder surface pattern 2 have a microstrip line structure as a transmission line so as to keep the characteristic impedance constant, and serve as a ground conductor for power supply as a ground conductor of the microstrip line. Layer 4 is shared. A power supply layer 5 is disposed on the other surface of the ground layer 4.

[0004] In the above configuration, descriptions of through holes, clearances, parts lands and the like are omitted. Furthermore, as a conventional technology, 1985 Nikkan Kogyo Shimbun
There is a printed wiring technology reader issued. For high-speed signals
Indispensable printed wiring boards for high frequency circuits
Edge materials include paper-based phenolic resin and glass cloth-based epoxy.
Resin has high frequency loss, so desired characteristics can be obtained.
Can be used for high-speed signal circuits
It is shown.

[0005]

SUMMARY OF THE INVENTION An object However fluorinated use in insulation layer that by the prior art of the resin or composite, generally the mechanical strength of the printed wiring board in order to be soft is small, In addition, there is a problem that the dimensional stability depends on the adherend due to its elasticity, and further, there is a problem that a thermal dimensional change and a dimensional change over time are large.

Further, since the dielectric constant is low, the capacity between the power supply layer and the ground layer is also reduced, and the effect of reducing the impedance on the power supply side is reduced, which is disadvantageous in noise countermeasures. Further, a general fluorine-based resin or a composite thereof has a very high unit price and causes an increase in the unit price of the printed wiring board itself. Also multi-layer
Low and high dielectric constant insulating materials for printed circuit boards
The technique of using the ingredients together is disclosed in JP-A-63-299298.
However, this is a problem in general multilayer printed circuit boards.
This technology aims to omit the bypass capacitor.
It is technically difficult to omit the intended bypass capacitor.
And the high-speed communication of the present invention
No consideration has been given to the technology relating to the printed wiring board.

[0007]

Means for Solving the Problems] The present invention arranges the component surface pattern and the solder surface pattern on the upper and lower surfaces, and bonding the these components surface pattern and the solder surface pattern insulation layer of each fluorine-containing resin in Te to form a transmission line for flowing a high-speed signal, the high-speed signal for a printed wiring board that this laminated on both insulation layers are ground and power planes,
Glass cloth epoxy resin between ground layer and power layer
Wherein the a of the insulation layer was.

[0008]

According to the action above configuration, the electromagnetic field of high-speed signals, since it can be considered to be in the insulating layer of practically fluorine resin, glass cloth base epo between the ground layer and power layer
By using an insulating layer made of a xy-resin, an increase in capacity is expected to increase by a factor of 2 to 3 in proportion to an increase in the relative dielectric constant, and a power-side impedance reduction effect equivalent to that of a normal printed wiring board is obtained . High speed signal pudding with good noise characteristics
Door wiring board and ing.

[0009]

An embodiment of the present invention will be described below with reference to the drawings. In the following description, the same parts as those in the above-described related art will be described using the same reference numerals. FIG. 1 is a partial cross-sectional perspective view, which shows a multilayer printed wiring board having six layers, in which a component surface pattern 1 and a solder surface pattern 2 are vertically symmetrically arranged. Reference numeral 2 denotes a transmission line for flowing a high-speed signal, which is adhered to an insulating layer 3 made of a fluororesin that has a signal propagation delay time, a stray capacity, and a crosstalk reduction effect.

The component surface pattern 1 and the solder surface pattern 2 have a microstrip line structure as a transmission line so as to make the characteristic impedance constant, and serve as a ground conductor for power supply as a ground conductor of the microstrip line. Layer 4 is shared. The above fluorine
The insulating layer 3 made of a resin is bonded to the ground layer 4.
The ground layer 4 is insulation <br/> edge layer 6 of glass cloth-based epoxy resin, power supply layer 5, a glass cloth base epoxy further center
The insulating layer 6 is sequentially laminated with a resin insulating layer 6.

[0011] To describe an example of the material of the respective member, component side pattern 1 and the solder surface pattern 2 copper foil 35 [mu] m, the material of the ground layer 4 and the power supply layer 5 is copper foil 70 [mu] m, Fu
The insulating layer 3 of a nitrogen- based resin is a porous type and ε = about 1.8,
The insulating layer 6 of the glass cloth base epoxy resin has ε = about 5.0, and the insulating layer 3 of the fluororesin and the glass cloth base epoxy
The thickness of the resin insulating layer 6 is appropriately allocated depending on the total thickness and transmission line characteristics.

In the above configuration, descriptions of through holes, clearances, component lands, and the like are omitted.

[0013]

According to the above configuration according to the present invention, an electromagnetic field of high-speed signals, since it can be considered to be in the insulating layer of the practical fluorine-based resin and excluding external space, glass between the ground layer and power layer By using an insulating layer made of cloth-based epoxy resin, the capacity is expected to increase two to three times in proportion to the increase in the relative dielectric constant. Of noise characteristics
Good high-speed signal for a printed wiring board and ing.

Further, by using a glass cloth base epoxy resin for the insulating layer between the ground layer and the power supply layer, sufficient mechanical strength and thermal and temporal dimensional stability can be obtained. This has the effect of providing a stable printed wiring board for high-speed signals.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional perspective view showing an embodiment.

FIG. 2 is a partial cross-sectional perspective view showing a conventional example.

[Explanation of symbols]

1 part surface pattern 2 soldering surface pattern 3 insulating layer of fluorine-based resin of the insulating layer 4 ground layer 5 Power layer 6 of glass cloth-based epoxy resin

Claims (1)

(57) [Claims] [Claim 1] Place the component surface pattern and the solder surface pattern on the upper and lower surfaces, forming a transmission line supplying a high-speed signal by bonding with these parts surface pattern and the solder surface pattern insulation layer of fluorine-based resin respectively and, this in both insulation interlayer ground layer and the high-speed signal for a printed wiring board formed by laminating are a power supply layer is disposed, a glass cloth-based epoxy resin between the ground layer and power layer
High-speed signal for a printed wiring board, characterized in that the insulation layer.