JP2928065B2 - Manufacturing method of copper foil with good water wettability - Google Patents
Manufacturing method of copper foil with good water wettabilityInfo
- Publication number
- JP2928065B2 JP2928065B2 JP5276156A JP27615693A JP2928065B2 JP 2928065 B2 JP2928065 B2 JP 2928065B2 JP 5276156 A JP5276156 A JP 5276156A JP 27615693 A JP27615693 A JP 27615693A JP 2928065 B2 JP2928065 B2 JP 2928065B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- thickness
- copper
- water wettability
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 82
- 239000011889 copper foil Substances 0.000 title claims description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title description 13
- 238000004519 manufacturing process Methods 0.000 title description 3
- 238000000034 method Methods 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 238000005096 rolling process Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 18
- 229920003002 synthetic resin Polymers 0.000 description 14
- 239000000057 synthetic resin Substances 0.000 description 14
- 239000010949 copper Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 238000009736 wetting Methods 0.000 description 9
- 238000004140 cleaning Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 239000010731 rolling oil Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- 238000000137 annealing Methods 0.000 description 6
- 238000005097 cold rolling Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005238 degreasing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
Landscapes
- Laminated Bodies (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、その表面が水にぬれや
すい性質を持つため、合成樹脂製フィルム等との接着性
に優れた銅箔の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a copper foil excellent in adhesion to a synthetic resin film or the like because its surface is easily wettable by water.
【０００２】[0002]
【従来の技術】従来より、銅箔は各種の用途に使用され
ているが、近年、電磁波シールド材，フレキシブル印刷
回路板，電池極板等の用途に使用され始めている。例え
ば、電磁波シールド材に使用される場合には、銅箔単体
で使用されるのではなく、合成樹脂製フィルムと銅箔と
が貼合されて使用される。従って、銅箔と合成樹脂製フ
ィルムとの接着性が良好でないと、銅箔と合成樹脂製フ
ィルムとが剥離しやすくなって、耐久性が低下すること
になる。また、フレキシブル印刷回路板に使用される場
合には、銅箔と合成樹脂製フィルムとを貼合した後、銅
箔上に所定のマスキングを施し、続いてマスキングが施
されていない箇所の銅箔部分をエッチングによって除去
することによって、フレキシブル印刷回路板が製造され
ている。従って、この場合においても、銅箔と合成樹脂
製フィルムとの接着性が良好でないと、銅箔と合成樹脂
製フィルムとが剥離しやすくなって、銅箔によって形成
された回路が短絡しやすくなるということになる。2. Description of the Related Art Conventionally, copper foil has been used for various applications, but recently, it has begun to be used for applications such as electromagnetic wave shielding materials, flexible printed circuit boards, and battery plates. For example, when used as an electromagnetic wave shielding material, a synthetic resin film and a copper foil are bonded and used instead of being used as a single copper foil. Therefore, if the adhesiveness between the copper foil and the synthetic resin film is not good, the copper foil and the synthetic resin film are easily peeled off, and the durability is reduced. In addition, when used for a flexible printed circuit board, after laminating a copper foil and a synthetic resin film, a predetermined masking is performed on the copper foil, and then the copper foil in an unmasked portion is applied. Flexible printed circuit boards have been produced by removing parts by etching. Therefore, even in this case, if the adhesiveness between the copper foil and the synthetic resin film is not good, the copper foil and the synthetic resin film are easily peeled off, and the circuit formed by the copper foil is easily short-circuited. It turns out that.
【０００３】ところで、従来の銅箔は、以下のようにし
て製造されている。即ち、銅を溶解して鋳造した後、熱
間圧延を行ない、その後冷間圧延，中間焼鈍を繰り返し
行ない、最終厚さが1.0〜0.1mmとなったところで、中間
焼鈍を行ない、その後仕上冷間圧延して銅箔が製造され
ている。そして、仕上冷間圧延時に、仕上冷間圧延を良
好に行なうために、銅薄板や銅箔表面に圧延油が塗布さ
れる。従って、銅箔の表面に付着している圧延油を、最
終的に除去するため、最終工程として有機溶剤での脱脂
処理が施される。[0003] A conventional copper foil is manufactured as follows. That is, after the copper is melted and cast, hot rolling is performed, and then cold rolling and intermediate annealing are repeatedly performed. When the final thickness reaches 1.0 to 0.1 mm, intermediate annealing is performed. Rolled to produce copper foil. Then, at the time of finish cold rolling, rolling oil is applied to the surface of the copper thin plate or copper foil in order to perform the finish cold rolling well. Therefore, in order to finally remove the rolling oil adhering to the surface of the copper foil, a degreasing treatment with an organic solvent is performed as a final step.
【０００４】しかしながら、このような方法で得られた
銅箔は、脱脂処理によって、その表面に付着している圧
延油が完全に除去されず、このため合成樹脂製フィルム
との接着性が悪いという欠点があった。即ち、このよう
な銅箔に接着剤溶液を塗布して、合成樹脂製フィルムと
貼合すると、銅箔上の圧延油が接着剤溶液を弾き、均一
な接着が行なえないのである。従って、この銅箔は、電
磁波シールド材等の素材として不適当なものであった。[0004] However, the rolling oil adhering to the surface of the copper foil obtained by such a method is not completely removed by the degreasing treatment, so that the adhesiveness to the synthetic resin film is poor. There were drawbacks. That is, when an adhesive solution is applied to such a copper foil and bonded to a synthetic resin film, the rolling oil on the copper foil repels the adhesive solution and uniform bonding cannot be performed. Therefore, this copper foil was unsuitable as a material such as an electromagnetic wave shielding material.
【０００５】このような欠点を回避するため、銅箔表面
に、酸洗浄や電解洗浄といった強力な洗浄処理を施すこ
とが、従来より行なわれている。即ち、銅箔表面から、
完全に圧延油を除去し、接着剤溶液を弾きにくくして、
銅箔と合成樹脂製フィルムとを接着剤溶液で良好に貼合
することが行なわれている。しかし、得られた銅箔表面
に強力な洗浄処理を施すと、銅箔の厚さが厚い場合には
問題は少ないが、銅箔の厚さが15μｍ以下程度の薄さに
なると、ピンホールが生じたり、極端に厚さの薄い箇所
が生じるなどして、銅箔の機械的強度が低下するという
ことがあった。また、電子機器や電気機器等の部品とし
て、厚さ15μｍ以下の銅箔が使用される場合に、厚さ精
度が悪くなると、電子機器等の故障の原因となることも
あった。[0005] In order to avoid such drawbacks, a strong cleaning treatment such as acid cleaning or electrolytic cleaning has been conventionally performed on the copper foil surface. That is, from the copper foil surface,
Completely remove the rolling oil, make the adhesive solution hard to flip,
2. Description of the Related Art A copper foil and a synthetic resin film have been well bonded with an adhesive solution. However, when the obtained copper foil surface is subjected to strong cleaning treatment, there is little problem when the thickness of the copper foil is large, but when the thickness of the copper foil becomes about 15 μm or less, a pinhole is formed. In some cases, the mechanical strength of the copper foil may be reduced due to the occurrence of a portion or an extremely thin portion. In addition, when a copper foil having a thickness of 15 μm or less is used as a component of an electronic device or an electric device, if the thickness accuracy is deteriorated, the electronic device or the like may be damaged.
【０００６】[0006]
【発明が解決しようとする課題】そこで、本発明は、強
力な洗浄処理を施して、銅箔表面の圧延油を除去するの
ではなく、他の全く異なる手段を採用して、銅箔表面の
水ぬれ性を向上させようというものである。Therefore, the present invention does not remove the rolling oil on the copper foil surface by performing a powerful cleaning treatment, but employs another completely different means to remove the copper foil surface. It is intended to improve water wettability.
【０００７】[0007]
【課題を解決するための手段】即ち、本発明は、所望の
厚さに圧延した銅箔を、酸素の存在下において８０℃以
上の温度で加熱して、銅箔の表面に１００〜１５００オ
ングストロームの厚さの酸化皮膜層を形成させ、その後
は実質的に該銅箔に圧延を施さないことを特徴とする水
ぬれ性の良い銅箔の製造方法に関するものである。That is, according to the present invention, a copper foil rolled to a desired thickness is heated at a temperature of 80 ° C. or more in the presence of oxygen, so that the surface of the copper foil has a thickness of 100 to 1500 angstroms. of to form an oxide film layer having a thickness of, then
The present invention relates to a method for producing a copper foil having good water wettability, wherein the copper foil is not substantially subjected to rolling .
【０００８】まず、本発明においては、従来公知の任意
の方法で、銅箔を製造する。例えば、銅を溶解して鋳造
した後、熱間圧延を行なって銅板を得る。この銅板に冷
間圧延，中間焼鈍を繰り返し行なって、厚さ1.0〜0.1mm
程度の銅薄板を得る。その後、更に中間焼鈍を施した
後、冷間圧延を施して、例えば厚さ15μｍ以下の銅箔を
得る。この銅箔に、有機溶剤等を用いて脱脂処理を施し
てもよいし、また、最後に仕上焼鈍を施してもよい。ま
た、軽度の酸洗浄や電解洗浄を施しても差し支えない。First, in the present invention, a copper foil is manufactured by any conventionally known method. For example, after copper is melted and cast, hot rolling is performed to obtain a copper plate. Cold rolling and intermediate annealing are repeatedly performed on this copper plate to obtain a thickness of 1.0 to 0.1 mm.
To obtain a thin copper plate. Then, after further performing intermediate annealing, cold rolling is performed to obtain a copper foil having a thickness of, for example, 15 μm or less. This copper foil may be subjected to a degreasing treatment using an organic solvent or the like, or may be finally subjected to finish annealing. Also, slight acid cleaning or electrolytic cleaning may be performed.
【０００９】本発明においては、このようにして得られ
た銅箔を、酸素の存在下において80℃以上の温度で加熱
する。酸素の不存在下において加熱処理しても、銅箔の
表面に所望の厚さの酸化皮膜を形成させることができな
いので、好ましくない。また、加熱温度が80℃未満であ
る場合においても、所望の厚さの酸化皮膜を形成させる
ことができないので、好ましくない。一般的な加熱処理
の条件は、加熱温度が100℃までにおいては１〜25時間
の保持時間が好ましく、加熱温度が100〜200℃である場
合には5〜50分の保持時間が好ましく、また加熱温度が2
00℃を超える場合には1分以下の保持時間が好ましい。In the present invention, the copper foil thus obtained is heated at a temperature of 80 ° C. or higher in the presence of oxygen. Heat treatment in the absence of oxygen is not preferable because an oxide film having a desired thickness cannot be formed on the surface of the copper foil. Also, when the heating temperature is lower than 80 ° C., it is not preferable because an oxide film having a desired thickness cannot be formed. General heating conditions are preferably a holding time of 1 to 25 hours when the heating temperature is up to 100 ° C, and a holding time of 5 to 50 minutes when the heating temperature is 100 to 200 ° C, and Heating temperature is 2
When the temperature exceeds 00 ° C., a holding time of 1 minute or less is preferable.
【００１０】上記した加熱処理によって、銅箔表面に
は、100〜1500オングストロームの厚さの酸化皮膜層が
形成される。酸化皮膜の厚さが100オングストローム以
下であると、銅箔表面の水ぬれ性が向上しないため、好
ましくない。逆に、酸化皮膜の厚さが1500オングストロ
ームを超えると、銅箔表面において、電気抵抗が大きく
なり、銅箔をフレキシブル印刷回路板等の電気部品の材
料として使用できなくなるため、好ましくない。なお、
酸化皮膜層の厚さは、株式会社島津製作所製のＸ線光電
子分析装置ＥＳＣＡ−８５０を使用して行った。即ち、
銅箔の表面に軟Ｘ線を照射しながら、イオンエッチング
によって、一定時間当り一定の厚さずつ銅箔表面を削り
取って、Ｏ（酸素）1sとＣｕ（銅）2pの結合エネルギー
の割合を測定してゆく。そして、Ｏ（酸素）1sの結合エ
ネルギーの割合が下限値で飽和する時間、及びＣｕ
（銅）2pの結合エネルギーの割合が上限値で飽和して時
間を求め、その時間でどれだけの表面厚さが削り取られ
たかを求め、それによって酸化皮膜の厚さを測定するの
である。By the above heat treatment, an oxide film layer having a thickness of 100 to 1500 Å is formed on the surface of the copper foil. If the thickness of the oxide film is less than 100 Å, the wettability of the copper foil surface is not improved, which is not preferable. Conversely, if the thickness of the oxide film exceeds 1500 angstroms, the electrical resistance on the surface of the copper foil increases, and the copper foil cannot be used as a material for electrical components such as a flexible printed circuit board, which is not preferable. In addition,
The thickness of the oxide film layer was measured using an X-ray photoelectron analyzer ESCA-850 manufactured by Shimadzu Corporation. That is,
While irradiating the surface of the copper foil with soft X-rays, the surface of the copper foil is scraped off by a certain thickness per fixed time by ion etching, and the ratio of the binding energy of O (oxygen) 1s and Cu (copper) 2p is measured. I will do it. The time during which the ratio of the binding energy of O (oxygen) 1s is saturated at the lower limit,
The time at which the ratio of the binding energy of (copper) 2p saturates at the upper limit value is determined, and how much surface thickness is removed during that time is determined, thereby measuring the thickness of the oxide film.
【００１１】以上のようにして、銅箔表面の水ぬれ性が
向上するのである。そして、銅箔表面の水ぬれ性が良い
ほど、接着剤溶液によって貼合された合成樹脂製フィル
ムとの接着性が向上することになるのである。なお、本
発明においては、加熱処理によって、特定の厚さの酸化
皮膜層を形成させた後は、実質的に銅箔に圧延を施さな
い。この理由は、圧延を施すと、加熱処理によって形成
された酸化皮膜層の厚さが薄くなったり、或いは酸化皮
膜層が一部脱落する恐れがあるからである。本発明にお
いて、水ぬれ性は、ぬれ指数（ｄｙｎｅ／ｃｍ）として
測定し、ぬれ指数が３５（ｄｙｎｅ／ｃｍ）を超える程
度にするのが好ましい。ぬれ指数が３５（ｄｙｎｅ／ｃ
ｍ）以下であると、接着剤溶液を弾きやすく、合成樹脂
製フィルムとの接着性が十分に向上しない傾向となるの
である。なお、ぬれ指数は、ＪＩＳ Ｋ ６７６８に記
載の方法に準拠して測定されるものである。As described above, the wettability of the copper foil surface is improved. And, the better the wettability of the copper foil surface is, the better the adhesion with the synthetic resin film bonded by the adhesive solution is. The book
In the present invention, the heat treatment allows oxidation of a specific thickness.
After forming the coating layer, do not substantially roll the copper foil.
No. The reason for this is that when rolled, it is formed by heat treatment
The thickness of the oxide film layer that has been
This is because a part of the film layer may fall off. In the present invention, the water wettability is measured as a wetting index (dyne / cm), and it is preferable that the wetting index exceeds 35 (dyne / cm). The wetting index is 35 (dyne / c)
If m) or less, the adhesive solution tends to be repelled, and the adhesiveness to the synthetic resin film tends not to be sufficiently improved. The wetting index is measured according to the method described in JIS K 6768.
【００１２】[0012]
【実施例】 実施例１〜６及び比較例１〜６ 純度99.90％以上のタフピッチ銅を溶解して鋳造し、鋳
塊を得た。この鋳塊に熱間圧延を施し、次いで冷間圧延
と中間焼鈍を繰り返して施し、厚さ15μｍの銅箔を得
た。そして、この銅箔に洗浄処理を施した後、表１に示
す温度条件及び時間条件で、且つ大気雰囲気下（酸素の
存在下）で加熱処理を施した。EXAMPLES Examples 1 to 6 and Comparative Examples 1 to 6 Tough pitch copper having a purity of 99.90% or more was melted and cast to obtain an ingot. The ingot was subjected to hot rolling, and then cold rolling and intermediate annealing were repeated to obtain a copper foil having a thickness of 15 μm. Then, after the copper foil was subjected to the cleaning treatment, the copper foil was subjected to a heat treatment under the temperature conditions and time conditions shown in Table 1 and in the air atmosphere (in the presence of oxygen).
【００１３】[0013]
【表１】 [Table 1]
【００１４】加熱処理した後、銅箔表面に存在する酸化
皮膜層の厚さ、ぬれ指数、及び表面抵抗増加率を以下の
方法で測定し、その結果を表１に示した。 ［酸化皮膜層の厚さ］：株式会社島津製作所製のＸ線光
電子分析装置ＥＳＣＡ−８５０を使用して行った。な
お、詳細な測定条件は、以下のとおりである。即ち、Ｘ
線源としてAlアノードを使用し、電圧8KV、電流30mAで
Ｘ線を放射した。Ｏ1sの結合エネルギーは526.0〜542.0
eVとし、Ｃｕ 2pの結合エネルギーは926.0〜950.0eVと
した。イオンエッチングの条件は、イオン種としてAr
（アルゴン）99.999％を使用し、加速電圧を2.0Kvとし
た。 ［ぬれ指数］：市販のぬれ指数標準液（No.31〜No.54）
を用い、室温23±2℃で測定した。 ［表面抵抗増加率］：三菱油化株式会社製の表面抵抗計
LORESTAを使用し、ピン間距離を10mmとして、電気抵抗
を測定した。そして、加熱処理前の銅箔表面の電気抵抗
をΩ0とし、加熱処理後の銅箔表面の電気抵抗をΩ1とし
て、以下の式によって表面抵抗増加率を算出した。表面
抵抗増加率（％）＝［（Ω1−Ω0）／Ω0］×100。そし
て、表面抵抗増加率が50％以下のときを「良」と評価し
た。After the heat treatment, the thickness, the wetting index, and the rate of increase in the surface resistance of the oxide film layer present on the surface of the copper foil were measured by the following methods, and the results are shown in Table 1. [Thickness of oxide film layer]: This was performed using an X-ray photoelectron analyzer ESCA-850 manufactured by Shimadzu Corporation. The detailed measurement conditions are as follows. That is, X
X-rays were emitted at a voltage of 8 KV and a current of 30 mA using an Al anode as a radiation source. The binding energy of O1s is 526.0-542.0
eV, and the binding energy of Cu 2p was 926.0 to 950.0 eV. The conditions of ion etching are as follows:
(Argon) 99.999% was used, and the acceleration voltage was 2.0 Kv. [Wetting index]: Commercial wetting index standard solution (No. 31 to No. 54)
Was measured at room temperature 23 ± 2 ° C. [Surface resistance increase rate]: Surface resistance meter manufactured by Mitsubishi Yuka Corporation
Using LORESTA, the electrical resistance was measured with the distance between the pins being 10 mm. Then, the electrical resistance of the heating treatment prior to the copper foil surface and Omega 0, the electrical resistance of the copper foil surface after the heat treatment as Omega 1, to calculate the surface resistance increase rate by the following equation. Surface resistance increase rate (%) = [(Ω 1 −Ω 0 ) / Ω 0 ] × 100. Then, when the rate of increase in surface resistance was 50% or less, it was evaluated as “good”.
【００１５】以上の結果から明らかなように、実施例１
〜６に係る方法で加熱処理して得られた銅箔は、ぬれ指
数が大きく水ぬれ性に優れているものであり、且つ表面
抵抗増加率も50％以下であり良好なものであった。これ
に対し、加熱処理を施さないか又は施しても加熱温度が
十分でない条件で得られた銅箔（比較例１及び２）は、
ぬれ指数が小さく水ぬれ性に劣るものであった。また、
比較的高温で且つ比較的長時間の加熱処理を行った得ら
れた銅箔（比較例３〜６）は、水ぬれ性は良好であるも
のの、表面抵抗増加率が大きく、電気部品等の材料とし
て銅箔を使用するには、不適当なものであった。As apparent from the above results, Example 1
The copper foils obtained by the heat treatment according to the methods of Nos. To 6 had good wetting indices and excellent water wettability, and also had a good surface resistance increase rate of 50% or less. On the other hand, the copper foil (Comparative Examples 1 and 2) obtained under the condition that the heating temperature is not sufficient or the heating temperature is not sufficient even if the heat treatment is performed,
The wetting index was small and poor in water wettability. Also,
The copper foils (Comparative Examples 3 to 6) obtained by performing the heat treatment at a relatively high temperature for a relatively long time have good surface wettability, but a large surface resistance increase rate, and are suitable for materials such as electric parts. Was unsuitable for using copper foil.
【００１６】[0016]
【作用】本発明に係る方法で得られた銅箔の水ぬれ性が
良好である理由は、定かではないが、以下の作用による
ものと考えられる。即ち、銅箔表面に形成された酸化皮
膜層は、その最表面層において多数の亀裂が生じてい
る。そして、この亀裂の中に圧延油等の水ぬれ性を阻害
する物質が入り込み、酸化皮膜層の表面に圧延油等の物
質が多量に残存していないためであると考えられる。ま
た、この亀裂が存在することによって、その表面に水を
塗布したとき、水の接触角が小さくなって、水がころが
りにくくなるためではないかと考えられる。The reason why the copper foil obtained by the method according to the present invention has good water wettability is not clear, but is considered to be due to the following effects. That is, the oxide film layer formed on the copper foil surface has many cracks in its outermost surface layer. It is considered that a substance that inhibits water wettability, such as rolling oil, enters into the crack, and a large amount of a substance, such as rolling oil, does not remain on the surface of the oxide film layer. In addition, it is considered that the presence of the cracks may cause the contact angle of water to become small when water is applied to the surface thereof, which makes it difficult for water to roll.
【００１７】[0017]
【発明の効果】以上説明したように、本発明に係る方法
で得られた銅箔の表面は、水ぬれ性が向上しており、こ
の銅箔と合成樹脂製フィルムとを接着剤溶液を使用して
貼合した場合、接着剤溶液が銅箔表面において弾かれる
ことが少なく、銅箔と合成樹脂製フィルムとが均一に接
着して、両者の接着力が向上するのである。従って、電
磁波シールド材等として、この貼合品を使用した場合、
剥離しにくく、耐久性のある電磁波シールド材等が得ら
れるという効果を奏する。また、銅箔に各種塗料を塗布
した場合にも、銅箔表面が塗料を弾くことが少なく、銅
箔表面に対して良好にぬれるので、形成された塗膜と銅
箔との接着力が向上する。従って、塗膜が形成された銅
箔を各種用途に適用すれば、その耐久性が向上するとい
う効果をも奏する。As described above, the surface of the copper foil obtained by the method according to the present invention has improved water wettability, and the copper foil and the synthetic resin film are bonded using an adhesive solution. When they are bonded together, the adhesive solution is less likely to be repelled on the surface of the copper foil, and the copper foil and the synthetic resin film are uniformly bonded to each other, so that the adhesive strength between them is improved. Therefore, when this bonded product is used as an electromagnetic shielding material,
This has the effect of being able to obtain a durable electromagnetic wave shielding material or the like that is difficult to peel off. In addition, even when various paints are applied to the copper foil, the surface of the copper foil is less likely to repel the paint, and the copper foil is well wetted, so that the adhesion between the formed coating and the copper foil is improved. I do. Therefore, when the copper foil on which the coating film is formed is applied to various uses, there is an effect that the durability is improved.
Claims (1)
在下において８０℃以上の温度で加熱して、銅箔の表面
に１００〜１５００オングストロームの厚さの酸化皮膜
層を形成させ、その後は実質的に該銅箔に圧延を施さな
いことを特徴とする水ぬれ性の良い銅箔の製造方法。1. A copper foil rolled to a desired thickness is heated at a temperature of 80 ° C. or more in the presence of oxygen to form an oxide film layer having a thickness of 100 to 1500 Å on the surface of the copper foil. After that, substantially no rolling is performed on the copper foil.
Method of producing a water-wettable copper foil, characterized in that brewing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5276156A JP2928065B2 (en) | 1993-10-06 | 1993-10-06 | Manufacturing method of copper foil with good water wettability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5276156A JP2928065B2 (en) | 1993-10-06 | 1993-10-06 | Manufacturing method of copper foil with good water wettability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07109558A JPH07109558A (en) | 1995-04-25 |
| JP2928065B2 true JP2928065B2 (en) | 1999-07-28 |
Family
ID=17565534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5276156A Expired - Lifetime JP2928065B2 (en) | 1993-10-06 | 1993-10-06 | Manufacturing method of copper foil with good water wettability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2928065B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4203131B2 (en) * | 1997-01-27 | 2008-12-24 | 日本製箔株式会社 | Method for producing soft copper foil with good wettability |
| JP2006194510A (en) * | 2005-01-13 | 2006-07-27 | Sumitomo Light Metal Ind Ltd | Method of manufacturing heat transfer copper tube for absorption refrigerator and heat transfer copper tube for absorption refrigerator obtained by the manufacturing method |
| GR1005582B (en) * | 2005-08-11 | 2007-07-16 | Composite seamless, circular tube made of copper with a mixture of a plastic lining (pe-hd-md-ld-lld, pe-xa,b,c, pe-rt, pp-rc, polyolefin-based lsf, pet, eva, pvc or pe) the components of which are strongly bonded together by an adhesive mixture suitable for sanitary installations, heating/air-conditioning installations and gas (refrigerant, fuel and natural gas) installations and production method | |
| JP6323490B2 (en) * | 2016-04-14 | 2018-05-16 | トヨタ自動車株式会社 | Current collector, battery, and manufacturing method thereof |
| JP7761417B2 (en) * | 2021-08-03 | 2025-10-28 | 宇部エクシモ株式会社 | Surface-treated copper material, copper-clad laminate, method for manufacturing surface-treated copper material, and method for manufacturing copper-clad laminate |
-
1993
- 1993-10-06 JP JP5276156A patent/JP2928065B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07109558A (en) | 1995-04-25 |
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