JP2937151B2 - Ground case for surface mount components and semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ground case used for a semiconductor device, and to the present invention using such a ground case. The present invention relates to a semiconductor device capable of obtaining a good grounding.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor device, a surface mount component is mounted on an appropriate printed circuit board, and signal lines and ground lines are electrically connected to each other to be integrated. However, in particular, in the connection between the ground electrodes, a method of connecting the metal wires for the ground electrode formed on the respective substrates with an appropriate conductor or through hole or the like is mainly adopted. .

However, in such a connection method, the connection state of the connection portion is unstable or the connection strength is not uniform, so that the semiconductor device cannot be expected to be used for a long time, Alternatively, there has been a problem that it is difficult to use the semiconductor device in an environment requiring high temperature or earthquake resistance. Further, in particular, when the semiconductor device having the configuration in which the ground electrode is connected by the above-described lead wire or through-hole is used in a high frequency region of, for example, 6 GHz or more, the inductance in the ground electrode portion is reduced. Therefore, there is also a problem that the signal transmission becomes slow because of the increase in the signal transmission.

As a method for solving such a problem, for example, FIG.
Japanese Patent Application Laid-Open No. HEI 3-12089 discloses a configuration employing a method of connecting a surface mount component to a printed circuit board as shown in FIGS.
No. 2 discloses this. That is, in the method shown in FIG. 3, the component terminal portion 21 (including the ground electrode) provided on one main surface of the surface mount component 20 as shown in FIG.
The surface mounting pad portion 11 for fitting the component terminal portion 21 is provided on a part of the main surface of the printed circuit board 19 corresponding to. The structure is such that each of the component terminal portions 21 of the mounted component is fitted to each of the surface mounting pad portions 11 provided corresponding to the main surface of the printed circuit board 19 to achieve electrical contact.

[0006] As shown in FIG. 6A, a specific configuration of the surface mounting pad portion 11 is such that a concave portion 12 is provided at the center thereof, and the inner diameter of the concave portion 12 is as follows. , Are designed to be substantially the same as the outer diameter of the component terminal portion 21 of the surface mount component. The surface mounting pad 11 is made of, for example, copper or copper plating 13 and is fitted into a via hole 16 formed by a copper foil 15 and a copper plating layer 14 provided on the printed circuit board 19. .

Accordingly, the surface mounting pad portion 1 also includes the ground electrodes of the surface mounting component 20 and the printed circuit board 19.
1 and the component terminal 21.
In such a conventional example, the shape of the component terminal portion 21 and the shape of the surface mounting pad portion 11 are substantially the same, and the components are firmly fitted to each other so that the mechanical strength of the connection portion is reduced. The purpose is to increase the.

[0007]

However, in the above arrangement, not only the structure of both the surface-mounted component and the printed board becomes complicated, but also when the two are connected, much effort is required to align them. In addition to the above, even when solder or the like is used together for connection, the area of the connection portion between the two is small, so for long-term use of the semiconductor device or use in a severe use environment, It was not enough.

In the case where grounding is required from the top or side surface of the surface mount component,
It is impossible to perform sufficient grounding, and the bonding between the surface mounting pad 11 and the component terminal 21 is
Since the area is still limited to a small area, it has not been possible to solve the above-mentioned problem in a high frequency range.

That is, in the above structure, since the width of the ground electrode portion cannot be made sufficiently large, the L characteristic becomes large particularly in a high frequency region, so that perfect grounding cannot be obtained. An object of the present invention is to provide a semiconductor device having a ground electrode structure which has the above disadvantages of the prior art, has a high degree of earthquake resistance and durability, and has a simple structure and a low manufacturing cost. At the same time, it is possible to obtain sufficient and reliable grounding with the printed circuit board from the ground electrode provided in any part of the surface mount component, and of course, have good grounding characteristics even in the high frequency range. An object of the present invention is to provide a semiconductor device which can be used and a ground case used for the semiconductor device.

[0010]

In order to achieve the above-mentioned object, the present invention employs a basic technical configuration as described below. That is, as an aspect according to the present invention,
Is mounted on a suitable printed circuit board,
A semiconductor device in which a predetermined electrical connection is formed between the two.
And at least a part of the surface mount component is
The body part has at least a part of the surface mount
It has a shape that can be conjugated and held, and at least one
At least a portion is provided on a part of the surface mount component.
Are also configured so that they can be electrically connected to some of the ground electrodes.
Is fixedly held inside the ground case
And provided on a part of the substrate portion of the surface mount component.
At least a part of the ground electrode portion
That is electrically connected to the ground
The two opposing side walls constituting the main body of the case are:
Penetrates through the printed circuit board and fits into the printed circuit board
Semiconductor device .

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The ground case and the semiconductor device according to the present invention employ the above-mentioned technical configuration, and therefore, a part or the whole of the surface mount component is securely bonded to the inside of the ground case. At least a part of the surface mount component, for example, the ground electrode portion formed on the back surface of the surface mount component is held and fixed, so that a part or the whole of the ground electrode portion reliably connects to the inner surface of the ground case. In addition to the above, the ground case is securely joined and fixed to the printed board by a metal block such as solder or solder, and the ground case is provided on a part of the printed board. Since it can be electrically connected to the part through a considerable area,
It is possible to obtain a strong and durable ground electrode structure, and at the same time, the high-frequency ground characteristics are extended to a high frequency region because the electrical resistance of the ground case that connects between the surface mounting components and the ground electrode of the printed circuit board is small. Things become possible.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific examples of a ground case and a semiconductor device according to the present invention will be described below in detail with reference to the drawings. That is, FIG. 1 shows the configuration of one specific example of the ground case according to the present invention.
Has a shape capable of holding and holding at least a part of the surface mount component 4 therein, and at least a part of the ground electrode part 5 provided at a part of the surface mount component 4. It is configured to be electrically connectable, and further to the other part of the main body part 10, namely, the side wall part 1.
The tip portions 9 of 2 and 13 are ground electrode portions 6 provided on an appropriate printed circuit board 7 on which the surface mount component 4 is mounted.
A ground case 1 having a configuration that can be electrically connected to the ground case 1 is shown.

The surface mount component 4 according to the present invention includes, for example, a device group 2 which is an electronic component including a transistor, a capacitor, a resistor, a coil, and the like;
And the substrate 3 mounted and arranged on one principal surface thereof. Further, in the surface mount component 4 according to the present invention, the ground electrode portion 5 may be formed on the other main surface of the substrate 3, and the ground electrode portion 5 may be formed on the side surface of the substrate 3. The electrode portion 5 may be formed.

FIG. 1A is a side view of a ground case 1 according to the present invention, showing an engagement state with an appropriate surface mount component 4, and FIG. It is sectional drawing seen from XX. Ground case 1 according to the present invention
The main body portion 10 has a shape configured to surround at least the surface mount component 4 from three directions. Preferably, the main body portion is formed in a U-shape as shown in the figure. Things.

In the present invention, the ground case 1
May have a width or length so as to cover the entire surface mount component 4, and may be a part of the surface mount component 4 and a ground electrode 5 formed on the surface mount component 4. May have a length or a width that covers at least a part of. The ground case 1 in the present invention
Is preferably made of a material having conductivity, and is made of copper, aluminum, or the like.

Further, the ground case 1 according to the present invention.
Since it is necessary to fix the surface-mounted component 4 to the printed circuit board 7 while holding the surface-mounted component 4 firmly, it is desirable that the surface-mounted component 4 has a rigid structure with an appropriate thickness. Since the ground case 1 has such a configuration, a member connecting the surface mounting component 4 and the ground electrodes 5 and 6 of the printed circuit board 7 is formed of a conductor having a low resistance. In addition, it is possible to greatly improve the L characteristic in the above, and at the same time, it is possible to achieve a grounding structure excellent in durability and earthquake resistance.

Therefore, the inner surface of the main body portion 10 of the ground case 1 according to the present invention has at least a portion of the ground electrode portion 5 provided on a portion of the substrate portion 3 of the surface mount component 4. It is desirable to be configured so that it can be electrically connected to. In a specific example of the ground case 1 according to the present invention in FIG. 1, a part or all of the device group 2 constituting the surface mount component 1 is a cover member 11 having an appropriate insulating property. It may be coated.

In the ground case 1 according to the present invention, two opposing side walls 12 and 13 of the main body 10 are provided.
Is desirably configured to be longer than the height of the surface mount component 4 held and held in the main body portion 10. Such a configuration is effective, for example, in a case where the side wall portions 12 and 13 of the ground case 1 penetrate the printed board 7 and are connected to a ground electrode 16 formed on the back surface of the printed board 7. It is.

FIG. 2 shows an example of use in the case where the entire surface mount component 4 to which the ground case 1 is applied in the present invention is covered with a cover member 11 formed of an appropriate insulating material. FIG. 2 is a diagram for explaining, and the relationship between FIG. 2A and FIG. 2B is exactly the same as the relationship between FIG. 1A and FIG. That is, in FIG. 2, for example, the ground electrode portions 5, 5 ', 5 "
Are provided, and the signal electrode 15 is provided.

The ground electrode portions 5, 5 ', 5 "of the cover member 11 are in close contact with the inner surface of the ground case 1. The signal electrodes 15 are provided.
Is connected to a signal line 8 provided on the printed circuit board 7 when the printed circuit board 7 contacts the printed circuit board 7 as a semiconductor device, for example. Next, a specific example of the semiconductor device 20 according to the second embodiment of the present invention, which is configured using the ground case 1, will be described in detail with reference to the drawings.

That is, FIG. 3 shows a configuration of a specific example of the semiconductor device 20 according to the present invention. In the drawing, the surface mount component 4 is mounted on an appropriate printed circuit A predetermined electrical connection is formed in the surface mount component 4, at least a part of which is fixedly held and held inside the ground case 1 described above, and Board part 3 of mounted component 4
At least a part of the ground electrode portion 5 provided in a part of the ground case 1 is electrically connected to the ground case 1, and the ground case 1 is partially in contact with the printed circuit board 7. The semiconductor device 20 electrically connected to at least a part of the ground electrode portion 6 provided on the printed circuit board 7 is shown.

FIG. 3A is a side view of the semiconductor device 20, and FIG. 3B is a cross-sectional view taken along line XX. In such a configuration, the front end portions 9 of the two opposing side walls 12 and 13 of the ground case 1 are
It is firmly fixed to the ground electrode portion 6 provided on the printed circuit board 7 by a metal block 22 made of, for example, solder or brazing, and at the same time, is securely connected electrically.

Further, when the surface mount component 4 is mounted on the printed circuit board 7, it is preferable that the surface mounted component 4 is connected to the printed circuit board 7 via an appropriate spacer 21.
Further, at least a part of the device section 2 disposed on the surface of the substrate section 3 in the surface mount component 4 may be covered with an appropriate cover member 11.

FIGS. 4 and 5A show the structure of another specific example of the semiconductor device 20 according to the present invention. When the surface mount component 4 is mounted on the printed circuit board 7, the semiconductor device 20 is face down. When the surface mount component 4 is mounted on the printed circuit board 7 according to the type, an opening 30 having an appropriate size is provided in advance in the printed circuit board 7, and the board portion 3 in the surface mount component 4 is provided. The cover member 11 that covers at least a part of the device unit 2 or at least a part of the device unit 2 disposed on the surface of the device is mounted so as to be inserted into the opening 30.
Similarly to the above, the ground case 1 holds the surface mounted component 4 while holding and holding the surface mounted component 4 so as to directly connect to the ground electrode portion 5 formed on the back surface of the surface mounted component 4. The ground case 1 is fixed to the main surface of the printed circuit board 7, and two opposite side walls of the ground case 1 are fixed through the printed circuit board 7, and the ground case 1 is provided on the back surface of the printed circuit board 7. It is configured to be connected to the electrode section 16 to take grounding.

FIGS. 5B to 5D show the engagement connection between the ground case 1 and the printed board 7 when the surface mount component 4 using the cover member 11 is mounted on the printed board 7. It is a figure explaining an example of a state. That is, the ground case 1 is connected to the ground electrode portion 5 of the surface mount component 4, and the tip portions 9 of the side walls 12 and 13 of the ground case 1 are provided on the printed circuit board 7. It penetrates through hole 40 and is connected to ground electrode section 16 formed on the back surface of printed circuit board 7 via an appropriate connection member to form grounding.

In this embodiment, the signal line portion provided on the main surface of the surface mount component 4 on which the cover member 11 is disposed is a signal line portion provided on the surface of the printed circuit board 7. It is connected to the wiring section 8. In this specific example, the ground case 1 is the surface mount component 4.
And the front end portions 9 of the side wall portions 12 and 13 of the ground case 1.
Are fixedly fixed by being inserted into through holes 40 provided in the printed circuit board 7, so that the surface-mounted component 4 and the printed circuit board 7 are securely fixed, and have heat resistance, It is possible to obtain the semiconductor device 20 having excellent quake resistance and a simple structure having a long life.

Of course, since a large-sized and low-resistance ground electrode connecting conductor is used, the inductance can be reduced as much as possible, so that the L characteristic in a high frequency region is improved and the R characteristic is improved.
As a result of improving the high frequency characteristics of the F ground, it becomes possible to apply the surface mounting technology to high frequency devices. That is, in the specific example of the present invention, two opposing side wall portions 1 forming the main body portion 10 of the ground case 1 are provided.
Desirably, 2 and 13 pass through the printed circuit board 7 and are fitted and fixed to the printed circuit board 7, and the ground electrode portion 5 of the surface mount component 4 is connected to the ground case 1 through the ground case 1. It is also preferable that the printed circuit board 7 is electrically connected to a ground electrode portion 16 provided on a main surface opposite to the main surface on which the surface mounting component 4 is mounted.

[0028]

The ground case and the semiconductor device 20 using the ground case according to the present invention have a high level of earthquake resistance and durability, and have a simple structure and a low manufacturing cost. At the same time as providing a semiconductor device with an electrode structure, from the ground electrode provided in any part of the surface mount component, it is possible to obtain sufficient and reliable grounding with the printed circuit board,
A semiconductor device that can exhibit good grounding characteristics even in a high-frequency region can be obtained.

[Brief description of the drawings]

FIG. 1 is a view for explaining the configuration of a specific example of a ground case according to the present invention. FIG. 1 (A) is a side view thereof, and FIG. XX in (A)
It is sectional drawing seen from the line.

FIG. 2 is a view for explaining the configuration of another specific example of the ground case according to the present invention. FIG. 2 (A) is a side view thereof, and FIG. X- in 2 (A)
It is sectional drawing seen from X-ray.

FIG. 3 is a diagram showing a configuration of a specific example of a semiconductor device configured using the ground case according to the present invention;
FIG. 3A is a side view, and FIG.
It is sectional drawing seen by the XX line of (A).

FIG. 4 is a side view showing the configuration of another specific example of the semiconductor device configured using the ground case according to the present invention.

FIG. 5 is a diagram showing a configuration of still another specific example of a semiconductor device configured using the ground case according to the present invention. FIG. 5A is a side view thereof, and FIG.
FIG. 5B is a plan view of FIG.
5A is a sectional view taken along line YY in the plan view of FIG. 5B, and FIG. 5C is a sectional view of ZZ in the plan view of FIG. It is sectional drawing seen from the line. Further FIG.
FIG. 5D is a rear view of FIG.

FIG. 6 is a diagram illustrating an example of a conventional connection structure for connecting signal lines or ground electrode portions between a surface mount component and a printed board to each other.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Ground case 2 ... Device part 3 ... Substrate 4 ... Surface mount parts 5 ... Ground electrode part for surface mount parts 6 ... Ground electrode part of printed board 7 ... Printed board 8 ... Signal wiring of printed board 9 ... Ground case Tip portion of side wall portion 10 Body portion 11 Cover member 12, 13 Side wall portion of ground case 15 Signal wiring portion on surface mount component side 16 Ground electrode portion of ground case 20 Semiconductor device 21 Spacer 22 ... Solder, brazing part, metal block 30 ... Opening part 40 ... Through hole part

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H05K 1/18 H05K 7/14

Claims (8)

(57) [Claims] 1. A surface mount component mounted on an appropriate printed circuit board.
And a predetermined electrical connection is formed between the two.
Semiconductor device, wherein at least
In some cases, the main body part at least partially
It has a shape that can be held inside
And a part thereof is provided in a part of the surface mount component.
To be electrically connected to at least a part of the ground electrode
Fixedly held inside the ground case
And a part of the substrate part of the surface mount component.
At least a part of the ground electrode portion provided in
It is electrically connected to the land case and
Two opposing two parts that constitute the main body of the ground case
The side wall portion penetrates the printed circuit board and the printed circuit board
A semiconductor device, which is fitted and fixed to a semiconductor device. 2. The ground electrode portion of the surface mount component is provided with
The surface mount component of the printed circuit board via a land case
The grounding electrode provided on the main surface opposite to the main surface on which the
2. An electrical connection with the pole part.
13. The semiconductor device according to claim 1. 3. The main body part includes the ground case.
Is formed in a U-shape.
The semiconductor device according to claim 1. 4. The ground case body portion is opposed to the ground case body portion.
The two side walls are held together within the body portion
Is configured to be longer than the height of the surface mount component
The semiconductor according to any one of claims 1 to 3, wherein
apparatus. 5. The surface-mounted component is provided with an appropriate spacer.
Connected to the printed circuit board via
The semiconductor device according to claim 1. 6. The surface mounting component according to claim 1, wherein
At least some of the device parts arranged on the surface are
2. The cover member is covered with a cover member.
7. The semiconductor device according to any one of claims 1 to 6. 7. Mounting the surface mount component on the printed circuit board
When performing the operation, the substrate portion of the surface mount component
At least some of the devices located on the surface of the minute
Or the cover member is provided with an appropriate opening provided on the printed circuit board.
It is characterized by being mounted so that it is inserted into the mouth
The semiconductor device according to claim 1. 8. At least one of the outer surface portions of the cover portion
The ground electrode part of the surface mount component is placed in the part
The semiconductor device according to claim 6, wherein: