JP3885586B2

JP3885586B2 - Terminal resistor mounting structure of high frequency relay and mounting method thereof

Info

Publication number: JP3885586B2
Application number: JP2002006385A
Authority: JP
Inventors: 正和西川
Original assignee: Matsushita Electric Works Ltd
Current assignee: Panasonic Electric Works Co Ltd
Priority date: 2002-01-15
Filing date: 2002-01-15
Publication date: 2007-02-21
Anticipated expiration: 2022-01-15
Also published as: JP2003208839A

Description

【０００１】
【発明の属する技術分野】
本発明は、高周波回路における高アイソレーションを確保する高周波リレーの終端抵抗取り付け構造、及びその取り付け方法に関するものである。
【０００２】
【従来の技術】
図６は従来の高周波リレーの終端抵抗取り付け状態を示し、図７は終端抵抗周辺の部分断面図を示しており、プリント基板４の一方の面には、電磁石装置よりなる駆動装置により開閉駆動される接点装置を囲むシールドケース２で外郭を構成する高周波リレー１が底面に設けた端子５をプリント基板４に挿通して実装され、プリント基板４の他方の面には表面実装タイプの終端抵抗８が実装されて、終端抵抗８の両端に形成された表面実装用の電極８ａ，８ｂはプリント基板４のパターン９ａ，９ｂに半田１０で接続、固定される。電極８ａはパターン９ａを介して高周波リレー１の端子５に接続し、電極８ｂはパターン９ｂを介してプリント基板４に設けたスルーホール４ａに接続し、さらにスルーホール４ａはプリント基板の一方の面に形成した銅箔ベタのアース部１１に接続している。
【０００３】
【発明が解決しようとする課題】
しかし、終端抵抗８は表面実装タイプの抵抗であり、プリント基板４の基板面上に実装されるので周りの信号の影響を受けやすく、また終端抵抗８からの信号もれの影響により高周波特性において高いアイソレーション（７０ｄｂ以上）を確保することができなかった。さらに終端抵抗８の電極８ｂはスルーホール４ａを介してアース部１１に接続しているので、充分なアースを取ることができなかった。
【０００４】
本発明は、上記事由に鑑みてなされたものであり、その目的は、終端抵抗の充分なアースを取ることができ、高周波特性において高いアイソレーション（７０ｄｂ以上）を確保することができる高周波リレーの終端抵抗取り付け構造、及びその取り付け方法を提供することにある。
【０００５】
【課題を解決するための手段】
請求項１の発明は、電磁石装置よりなる駆動装置により開閉駆動される接点装置を囲むシールドケース、前記シールドケースと電気的に接続された金属製のサブベース、前記サブベースと電気的に接続されたアース部を備えた高周波リレーと、前記高周波リレーを実装し、前記サブベースと電気的に接続されたアース部を備えたプリント基板と、一方の電極はリボン形状を有して前記高周波リレーの接点装置を構成する端子に直接巻き付けて半田付けし、他方の電極は前記サブベースに直接半田付けした終端抵抗とから構成されたことを特徴とする。
【０００６】
請求項２の発明は、請求項１の発明において、前記高周波リレーは、前記プリント基板に前記サブベースと基板面とが対向して実装され、前記プリント基板は、前記サブベースを露出させ且つ銅メッキを側面に施した開口部を形成して、前記銅メッキは前記サブベースに半田付けされ、前記終端抵抗は前記開口部によって露出したサブベース上に配置されたことを特徴とする。
【０００７】
請求項３の発明は、電磁石装置よりなる駆動装置により開閉駆動される接点装置を囲むシールドケース、前記シールドケースと電気的に接続された金属製のサブベース、前記サブベースと電気的に接続されたアース部を備えた高周波リレーをプリント基板に実装し、前記プリント基板のアース部を前記サブベースに電気的に接続し、終端抵抗のリボン形状を有する一方の電極を前記高周波リレーの接点装置を構成する端子に直接巻き付けて半田付けし、他方の電極を前記サブベースに直接半田付けすることを特徴とする。
【０００８】
請求項４の発明は、請求項３の発明において、前記プリント基板に銅メッキを側面に施した開口部を形成し、前記サブベースとプリント基板の基板面とを対向させ、前記開口部によって前記サブベースを露出させるように前記高周波リレーを前記プリント基板に実装し、前記開口部側面の銅メッキを前記開口部によって露出したサブベースに半田付けして、前記終端抵抗を前記開口部によって露出したサブベース上に配置したことを特徴とする。
【０００９】
【発明の実施の形態】
以下、本発明の実施の形態を図面に基づいて説明する。
【００１０】
図１は本実施形態の高周波リレーの終端抵抗取り付け状態を示し、図２は終端抵抗周辺の部分拡大図を示し、図３は終端抵抗の外観を示し、図４はシールドケースとサブベースとの分解斜視図を示し、図５はシールドケースとサブベースとの取付図を示す。高周波リレー１は、電磁石装置よりなる駆動装置により開閉駆動される接点装置を囲むシールドケース２で外郭を構成し、接点装置を構成する端子５を備えたシールドケース２の底面に金属製のサブベース３を装着しており、サブベース３は、底面上の高周波リレー１の端子５の周囲に形成したリレーアース部１２（図４斜線部分）に半田付けされて電気的に接続し、サブベース３の側片３ｂは、シールドケース２の側面の導電部１３（図５斜線部分）に半田付けされて電気的に接続している。
【００１１】
そして、端子５がサブベース３の挿通孔３ａを介してプリント基板４に挿通してプリント基板４の一方の面に実装される。このとき、サブベース３は、プリント基板４の一方の面に形成した銅箔ベタのアース部上に実装されており、サブベース３とプリント基板４のアース部とは電気的に接続される。
【００１２】
また、終端抵抗６を接続する端子５とその周辺のサブベース３とが露出するようにプリント基板４には開口部７が形成されており、次に、その開口部７によって露出したサブベース３上に終端抵抗６が配置される。終端抵抗６は一方の端部にリボン形状の電極６ａを設け、他方の端部には表面実装用の電極６ｂを設けており、リボン形状の電極６ａは端子５に直接巻き付けられて密着し、半田によって接続、固定され、信号のロスを小さくすることができる。電極６ｂは、サブベース３上に直接半田付けされて、接続、固定され、従来例のようにスルーホールを介してアースに接続されるのではなく、サブベース３を介して、リレーアース部１２、プリント基板４のアース部と電気的に接続されることで充分なアースを取ることができる。
【００１３】
そして、開口部７の側面７ａは銅メッキを施されており半田によってサブベース３に接続されることによって、サブベース３を介して、リレーアース部１２、プリント基板４のアース部と電気的に接続されることで充分なアースを取ることができ、且つ終端抵抗６をシールドするような構造となり、高周波特性において高いアイソレーション（７０ｄｂ以上）を確保することができる。
【００１４】
【発明の効果】
請求項１の発明は、電磁石装置よりなる駆動装置により開閉駆動される接点装置を囲むシールドケース、前記シールドケースと電気的に接続された金属製のサブベース、前記サブベースと電気的に接続されたアース部を備えた高周波リレーと、前記高周波リレーを実装し、前記サブベースと電気的に接続されたアース部を備えたプリント基板と、一方の電極はリボン形状を有して前記高周波リレーの接点装置を構成する端子に直接巻き付けて半田付けし、他方の電極は前記サブベースに直接半田付けした終端抵抗とから構成されたので、終端抵抗のリボン形状の電極は、高周波リレーの端子に直接巻き付けられて密着し、半田によって接続、固定されることによって信号のロスを小さくすることができ、且つ他方の電極は、従来例のようにスルーホールを介してアースに接続されるのではなく、サブベースを介して、高周波リレーのアース、及びプリント基板のアースと電気的に接続されることで充分なアースを取ることができるという効果がある。
【００１５】
請求項２の発明は、請求項１の発明において、前記高周波リレーは、前記プリント基板に前記サブベースと基板面とが対向して実装され、前記プリント基板は、前記サブベースを露出させ且つ銅メッキを側面に施した開口部を形成して、前記銅メッキは前記サブベースに半田付けされ、前記終端抵抗は前記開口部によって露出したサブベース上に配置されたので、プリント基板の開口部に終端抵抗が入る構造になり、その開口部の側面の銅メッキは、サブベースを介して、高周波リレーのアース、及びプリント基板のアースと電気的に接続されることで充分なアースを取ることができるので終端抵抗をシールドするような構造となり、高周波特性において高いアイソレーション（７０ｄｂ以上）を確保することができるという効果がある。
【００１６】
請求項３の発明は、電磁石装置よりなる駆動装置により開閉駆動される接点装置を囲むシールドケース、前記シールドケースと電気的に接続された金属製のサブベース、前記サブベースと電気的に接続されたアース部を備えた高周波リレーをプリント基板に実装し、前記プリント基板のアース部を前記サブベースに電気的に接続し、終端抵抗のリボン形状を有する一方の電極を前記高周波リレーの接点装置を構成する端子に直接巻き付けて半田付けし、他方の電極を前記サブベースに直接半田付けするので、請求項１と同様の効果を奏する。
【００１７】
請求項４の発明は、請求項３の発明において、前記プリント基板に銅メッキを側面に施した開口部を形成し、前記サブベースとプリント基板の基板面とを対向させ、前記開口部によって前記サブベースを露出させるように前記高周波リレーを前記プリント基板に実装し、前記開口部側面の銅メッキを前記開口部によって露出したサブベースに半田付けして、前記終端抵抗を前記開口部によって露出したサブベース上に配置したので、請求項２と同様の効果を奏する。
【図面の簡単な説明】
【図１】本発明の実施形態の終端抵抗取り付け状態を示す図である。
【図２】本発明の実施形態の部分拡大図である。
【図３】本発明の実施形態の終端抵抗の外観図である。
【図４】本発明の実施形態のシールドケースとサブベースとの分解斜視図である。
【図５】本発明の実施形態のシールドケースとサブベースとの取付図である。
【図６】従来例の終端抵抗取り付け状態を示す図である。
【図７】従来例の部分断面図である。
【符号の説明】
１高周波リレー
２シールドケース
３サブベース
４プリント基板
５端子
６終端抵抗
７開口部[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a termination resistor mounting structure of a high frequency relay that ensures high isolation in a high frequency circuit, and a mounting method thereof.
[0002]
[Prior art]
FIG. 6 shows a state in which a termination resistor is attached to a conventional high-frequency relay, and FIG. 7 shows a partial cross-sectional view around the termination resistor. A high-frequency relay 1 that forms an outline with a shield case 2 that surrounds the contact device is mounted by inserting a terminal 5 provided on the bottom surface into a printed circuit board 4 and is mounted on the other surface of the printed circuit board 4 with a surface mount type termination resistor 8. Are mounted, and the surface mounting electrodes 8 a and 8 b formed at both ends of the termination resistor 8 are connected and fixed to the patterns 9 a and 9 b of the printed circuit board 4 by the solder 10. The electrode 8a is connected to the terminal 5 of the high frequency relay 1 through the pattern 9a, the electrode 8b is connected to the through hole 4a provided in the printed circuit board 4 through the pattern 9b, and the through hole 4a is connected to one surface of the printed circuit board. It is connected to the ground portion 11 of the solid copper foil formed in the above.
[0003]
[Problems to be solved by the invention]
However, the termination resistor 8 is a surface mount type resistor, and is mounted on the substrate surface of the printed circuit board 4 so that it is easily influenced by surrounding signals. In addition, the termination resistor 8 has high frequency characteristics due to the signal leakage from the termination resistor 8. High isolation (70 db or more) could not be ensured. Further, since the electrode 8b of the termination resistor 8 is connected to the ground portion 11 through the through hole 4a, it is not possible to obtain a sufficient ground.
[0004]
The present invention has been made in view of the above-mentioned reasons, and an object of the present invention is to provide a high-frequency relay capable of taking a sufficient grounding of a termination resistor and ensuring high isolation (70 db or more) in high-frequency characteristics. An object of the present invention is to provide a terminal resistor mounting structure and a mounting method thereof.
[0005]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a shield case surrounding a contact device driven to be opened and closed by a drive device comprising an electromagnet device, a metal sub-base electrically connected to the shield case, and electrically connected to the sub-base. A high-frequency relay having a ground portion, a printed circuit board having a ground portion mounted with the high-frequency relay and electrically connected to the sub-base, and one electrode having a ribbon shape, It is characterized in that it is composed of a terminal resistor which is directly wound and soldered on a terminal constituting the contact device, and the other electrode is directly soldered to the sub-base.
[0006]
According to a second aspect of the present invention, in the first aspect of the invention, the high frequency relay is mounted on the printed circuit board so that the sub base and the substrate surface face each other, the printed circuit board exposes the sub base and is copper. The copper plating is soldered to the sub-base by forming an opening with plating on the side, and the termination resistor is disposed on the sub-base exposed by the opening.
[0007]
According to a third aspect of the present invention, there is provided a shield case surrounding a contact device driven to be opened and closed by a drive device comprising an electromagnet device, a metal sub-base electrically connected to the shield case, and electrically connected to the sub-base. A high frequency relay having a grounding portion is mounted on a printed circuit board, the grounding portion of the printed circuit board is electrically connected to the sub-base, and one electrode having a ribbon shape of a termination resistor is connected to the contact device of the high frequency relay. It is characterized in that it is directly wound around a terminal to be configured and soldered, and the other electrode is directly soldered to the sub-base.
[0008]
According to a fourth aspect of the present invention, in the third aspect of the present invention, the printed board is formed with an opening having a copper plating on its side surface, the sub-base and the board surface of the printed board are opposed to each other, and the opening is used to The high frequency relay is mounted on the printed circuit board so as to expose the sub-base, and the copper plating on the side surface of the opening is soldered to the sub-base exposed by the opening, and the termination resistor is exposed by the opening. It is arranged on the sub-base.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0010]
FIG. 1 shows a state in which a termination resistor is attached to the high-frequency relay of this embodiment, FIG. 2 shows a partially enlarged view around the termination resistor, FIG. 3 shows an appearance of the termination resistor, and FIG. FIG. 5 is an exploded perspective view, and FIG. 5 is an attachment view of the shield case and the sub base. The high-frequency relay 1 is configured by a shield case 2 surrounding a contact device that is opened and closed by a drive device composed of an electromagnet device, and a metal sub-base is formed on the bottom surface of the shield case 2 having terminals 5 constituting the contact device. 3, and the sub-base 3 is soldered and electrically connected to a relay ground portion 12 (shaded portion in FIG. 4) formed around the terminal 5 of the high-frequency relay 1 on the bottom surface. The side piece 3b is soldered and electrically connected to the conductive portion 13 (shaded portion in FIG. 5) on the side surface of the shield case 2.
[0011]
Then, the terminal 5 is inserted into the printed board 4 through the insertion hole 3 a of the sub base 3 and mounted on one surface of the printed board 4. At this time, the sub base 3 is mounted on a ground portion of a solid copper foil formed on one surface of the printed board 4, and the sub base 3 and the ground portion of the printed board 4 are electrically connected.
[0012]
Further, an opening 7 is formed in the printed circuit board 4 so that the terminal 5 to which the termination resistor 6 is connected and the peripheral sub-base 3 are exposed. Next, the sub-base 3 exposed through the opening 7 is formed. A termination resistor 6 is disposed above. The terminating resistor 6 is provided with a ribbon-shaped electrode 6a at one end, and a surface-mounting electrode 6b is provided at the other end. The ribbon-shaped electrode 6a is directly wound around the terminal 5 and is in close contact with it. It is connected and fixed by solder, and signal loss can be reduced. The electrode 6b is directly soldered on the sub-base 3, connected and fixed, and is not connected to the ground via a through hole as in the conventional example, but is connected to the relay ground portion 12 via the sub-base 3. A sufficient grounding can be obtained by being electrically connected to the grounding part of the printed circuit board 4.
[0013]
The side surface 7a of the opening 7 is plated with copper, and is electrically connected to the relay ground portion 12 and the ground portion of the printed circuit board 4 through the sub base 3 by being connected to the sub base 3 with solder. By being connected, sufficient grounding can be obtained, and the terminal resistor 6 can be shielded, and high isolation (70 db or more) can be ensured in high frequency characteristics.
[0014]
【The invention's effect】
According to a first aspect of the present invention, there is provided a shield case surrounding a contact device driven to be opened and closed by a drive device comprising an electromagnet device, a metal sub-base electrically connected to the shield case, and electrically connected to the sub-base. A high-frequency relay having a ground portion, a printed circuit board having a ground portion mounted with the high-frequency relay and electrically connected to the sub-base, and one electrode having a ribbon shape, Since the terminal electrode constituting the contact device is directly wound and soldered, and the other electrode is composed of the terminal resistor soldered directly to the sub-base, the ribbon resistor electrode of the terminal resistor is directly connected to the terminal of the high frequency relay. The signal loss can be reduced by being wound and in close contact, and connected and fixed by soldering. There is an effect that sufficient grounding can be obtained by being electrically connected to the ground of the high frequency relay and the ground of the printed circuit board via the sub-base instead of being connected to the ground through the hole. .
[0015]
According to a second aspect of the present invention, in the first aspect of the invention, the high frequency relay is mounted on the printed circuit board so that the sub base and the substrate surface face each other, the printed circuit board exposes the sub base and is copper. Since the copper plating is soldered to the sub-base, and the termination resistor is disposed on the sub-base exposed by the opening, the copper plating is formed on the side surface of the printed circuit board. It becomes a structure that the termination resistance enters, and the copper plating on the side surface of the opening can be sufficiently grounded by being electrically connected to the ground of the high frequency relay and the ground of the printed circuit board through the sub-base. Therefore, the termination resistance is shielded, and there is an effect that high isolation (70 db or more) can be secured in the high frequency characteristics.
[0016]
According to a third aspect of the present invention, there is provided a shield case surrounding a contact device driven to be opened and closed by a drive device comprising an electromagnet device, a metal sub-base electrically connected to the shield case, and electrically connected to the sub-base. A high frequency relay having a grounding portion is mounted on a printed circuit board, the grounding portion of the printed circuit board is electrically connected to the sub-base, and one electrode having a ribbon shape of a termination resistor is connected to the contact device of the high frequency relay. Since the other terminal is directly wound and soldered to the terminal to be configured, and the other electrode is directly soldered to the sub-base, the same effect as in the first aspect can be obtained.
[0017]
According to a fourth aspect of the present invention, in the third aspect of the present invention, the printed board is formed with an opening having a copper plating on its side surface, the sub-base and the board surface of the printed board are opposed to each other, and the opening is used to The high frequency relay is mounted on the printed circuit board so as to expose the sub-base, and the copper plating on the side surface of the opening is soldered to the sub-base exposed by the opening, and the termination resistor is exposed by the opening. Since it is arranged on the sub-base, the same effect as in claim 2 can be obtained.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a state in which a termination resistor is attached according to an embodiment of the present invention.
FIG. 2 is a partially enlarged view of an embodiment of the present invention.
FIG. 3 is an external view of a termination resistor according to the embodiment of the present invention.
FIG. 4 is an exploded perspective view of a shield case and a sub base according to the embodiment of the present invention.
FIG. 5 is an attachment diagram of the shield case and the sub base according to the embodiment of the present invention.
FIG. 6 is a diagram illustrating a state in which a terminating resistor is attached according to a conventional example.
FIG. 7 is a partial cross-sectional view of a conventional example.
[Explanation of symbols]
1 High Frequency Relay 2 Shield Case 3 Subbase 4 Printed Circuit Board 5 Terminal 6 Termination Resistor 7 Opening

Claims

A shield case that surrounds a contact device that is opened and closed by a drive device comprising an electromagnet device, a metal subbase that is electrically connected to the shield case, and a high frequency device that includes a ground portion that is electrically connected to the subbase. A relay, a printed circuit board having a ground portion mounted with the high frequency relay and electrically connected to the sub-base, and one electrode having a ribbon shape as a terminal constituting a contact device of the high frequency relay A terminal resistor mounting structure for a high frequency relay, wherein the terminal electrode is composed of a terminal resistor that is directly wound and soldered, and the other electrode is soldered directly to the sub-base.

The high-frequency relay is mounted on the printed board with the sub base and the board surface facing each other, and the printed board exposes the sub base and forms an opening with copper plating on the side surface, 2. The termination resistor mounting structure for a high frequency relay according to claim 1, wherein the copper plating is soldered to the sub-base, and the termination resistor is disposed on the sub-base exposed by the opening.

A shield case that surrounds a contact device that is opened and closed by a drive device comprising an electromagnet device, a metal subbase that is electrically connected to the shield case, and a high frequency device that includes a ground portion that is electrically connected to the subbase. A relay is mounted on a printed circuit board, the ground portion of the printed circuit board is electrically connected to the sub-base, and one electrode having a ribbon shape of a termination resistor is directly wound around a terminal constituting the contact device of the high-frequency relay. A method for attaching a terminating resistor of a high frequency relay, wherein the other electrode is soldered directly to the sub-base.

The printed circuit board is formed with an opening having a copper plating on a side surface, the sub base and the substrate surface of the printed circuit board are opposed to each other, and the high frequency relay is connected to the printed circuit board so that the sub base is exposed through the opening. The soldering is performed by soldering copper plating on the side surface of the opening to the sub-base exposed through the opening, and the termination resistor is disposed on the sub-base exposed through the opening. A method of attaching the terminating resistor of the high frequency relay described.