JP2946732B2 - Hybrid integrated circuit device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device used for electronic equipment and the like.

2. Description of the Related Art In recent years, hybrid integrated circuit devices have been used in pursuit of high-density mounting, standardization of circuits, and the like.

 Hereinafter, a conventional hybrid integrated circuit device will be described.

FIG. 3A is a perspective view of a conventional hybrid integrated circuit device. FIG. 3B is a sectional view taken along a line a′-a ″ of FIG. 3A, and FIG. 3C is a sectional view of FIG.
3 (D) is a back view of the package case. FIG. 3 (A), (B), (C), (D)
, 1 is a printed wiring board, 2 is a package case,
Reference numeral 3 denotes an adhesive for bonding the printed wiring board 1 to the package case, and reference numeral 4 denotes a lead terminal for connection to an external circuit.

Regarding the hybrid integrated circuit device configured as described above,
Hereinafter, the production method will be described.

A thermosetting epoxy resin is applied as an adhesive 3 to the printed wiring board 1 or the package case 2, and the printed wiring board 1 and the package case 2 are joined together.
Let stand for a while to adhere.

Problems to be Solved by the Invention However, the production method described above has a disadvantage that production costs are high because production efficiency is poor. Further, when a short-time thermosetting adhesive or a thermoplastic adhesive is used in order to increase the production efficiency, there is a disadvantage that the adhesive strength is reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inexpensive hybrid integrated circuit device having a high production efficiency and a high adhesive strength, which solves the above-mentioned conventional problems.

Means for Solving the Problems To achieve this object, the hybrid integrated circuit device of the present invention is provided with a counterbore only on the inner wall side of the joint surface of the package case for bonding the package case to the printed wiring board, The adhesive applied to the joint surface is accumulated in the counterbore, which is the inside of the device, and the accumulated adhesive increases the bonding area.

Action With this configuration, the bonding area can be increased by the portion including the counterbore of the bonding surface, so that the bonding strength can be improved even if a short-time thermosetting adhesive or a thermoplastic adhesive is used, and the bonding strength can be improved. By collecting the agent roughly, excess adhesive does not protrude outside the apparatus.

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1A is a perspective view of a hybrid integrated circuit device according to a first embodiment of the present invention. FIG. 1B is a cross-sectional view taken along the line c′-c ″ of FIG.
FIG. 1C is a detailed view of a portion d in FIG. 1B, and FIG.
Is a rear view of the case. FIG. 1 (A), (B),
In (C) and (D), 1 is a printed wiring board, 2 is a case for a package, 4 is a lead terminal for connection to an external circuit, 5
Is a short-time thermosetting or thermoplastic adhesive for adhering the printed wiring board 1 and the package case 2; 7, a joining surface between the printed wiring board 1 and the package case 2; Case bonding surface 7 for bonding case 2
The counterbore 6 is shown in (D)
As shown in the figure, it is formed by a plurality of concave portions separated on the inner wall side of the joining surface 7.

Regarding the hybrid integrated circuit device configured as described above,
The operation will be described below.

The counterbore 6 provided in the package case allows the adhesive 5 to accumulate in the counterbore 6 to increase the bonding area. In addition, if a rubber-like adhesive is used, there is also curing as a cushioning material, so that the adhesive strength can be improved. When the case and the printed wiring board are pressurized and cured, if the amount of the adhesive is large, the adhesive flows along the counterbore into the inside of the hybrid integrated circuit device, and the adhesive oozes out of the hybrid integrated circuit device. Not something.

Hereinafter, a second embodiment of the present invention will be described with reference to the drawings.

FIG. 2A is a perspective view of a hybrid integrated circuit device according to a second embodiment of the present invention. FIG. 2B is a sectional view taken along the line e′-e ″ of FIG.
FIG. 2C is a detailed view of a portion f in FIG. 2B, and FIG.
Is a rear view of the case. FIG. 2 (A), (B),
In (C) and (D), 1 is a printed wiring board, 2 is a case for a package, 4 is a lead terminal for connection to an external circuit, 5
Is a short-time thermosetting or thermoplastic adhesive for bonding the printed wiring board 1 to the package case, and 7 is the printed wiring board 1.
The surface 6 of the case for bonding the package case 2 to the printed wiring board 1 is partially provided with a counterbore. The counterbore 6 in this example is shown in FIG. As described above, it is formed continuously on the inner wall side of the joining surface 7.

The operation of the hybrid integrated circuit device configured as described above is the same as in the first embodiment, and will not be described.

Effect of the Invention As described above, the present invention provides a counterbore only on the inner wall side of the bonding surface of the package case for bonding the package case to the printed wiring board, and applies the adhesive applied to the bonding surface to the inside of the device. It is stored in the counterbore that is the side, and the adhesive area is configured to be large by this accumulated adhesive, so that the large adhesive area can improve the adhesive strength even with a short-curing or heat-plastic adhesive, By collecting the agent roughly, excess adhesive does not protrude to the outside of the device, thereby realizing an inexpensive hybrid integrated circuit device with high production efficiency.

[Brief description of the drawings]

FIG. 1 (A) is a perspective view of a hybrid integrated circuit device according to a first embodiment of the present invention, and FIG. 1 (B) is c 'of FIG. 1 (A).
FIG. 1 (C) is a detailed view of a part d in FIG. 1 (B), FIG. 1 (D) is a rear view of the case, and FIG. 2 (A) is a second view of the present invention. FIG. 2 (B) is a perspective view of the hybrid integrated circuit device in the embodiment, FIG.
2 (C) is a detailed view of a portion f in FIG. 2 (B), FIG. 2 (D) is a rear view of the case, FIG. 3 (A) is a perspective view of a conventional hybrid integrated circuit device, and FIG. FIG. 3B is a sectional view taken along the line a′-a ″ of FIG. 3A, FIG. 3C is a detailed view of a portion b of FIG. 3B, and FIG. 3D is a rear view of the case. 1 ... printed wiring board 2 ... package case 3 ...
Adhesive, 4 ... lead terminal, 5 ... short-curing adhesive or thermoplastic adhesive, 6 ... counterbore provided partially on the case bonding surface, 7 ... joining of printed wiring board and package case surface.

Claims (1)

(57) [Claims] 1. A counterbore is provided only on the inner wall side of a joint surface of a package case for bonding a package case to a printed wiring board, and an adhesive applied to the joint surface is applied to the counterbore which is an inner side of the apparatus. A hybrid integrated circuit device that is configured to accumulate and increase a bonding area by the accumulated adhesive.