JPH0779187B2 - Mounting method for surface mount electronic components - Google Patents
Mounting method for surface mount electronic componentsInfo
- Publication number
- JPH0779187B2 JPH0779187B2 JP1034046A JP3404689A JPH0779187B2 JP H0779187 B2 JPH0779187 B2 JP H0779187B2 JP 1034046 A JP1034046 A JP 1034046A JP 3404689 A JP3404689 A JP 3404689A JP H0779187 B2 JPH0779187 B2 JP H0779187B2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- electronic component
- wiring board
- printed wiring
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Details Of Resistors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はプリント配線基板に搭載する表面実装用電子部
品の実装方法に関する。The present invention relates to a mounting method of a surface mounting electronic component mounted on a printed wiring board.
従来、この種の表面実装用電子部品は出来るだけ表面実
装密度を上げるための小型で、しかも背が低くく取り付
けられるように種々の工夫及び改善が施されれきた。Heretofore, this kind of surface mounting electronic component has been variously devised and improved so that it can be mounted in a small size to increase the surface mounting density as much as possible and to be mounted short and short.
例えば、従来の表面実装用電子部品は、電子回路が形成
された半導体チップや抵抗あるはコンデンサのような電
子部品をセラミックやモールド樹脂で封止してなる外郭
体を形成し、その外郭体の側面に外部リードである電極
を取り付けた構造になっている。このような表面実装用
電子部品をプリント配線基板にはんだ付け及び接着剤で
実装を行なっている。For example, a conventional surface mounting electronic component is a semiconductor chip on which an electronic circuit is formed, or an electronic component such as a resistor or a capacitor is sealed with a ceramic or a molding resin to form an outer shell, and the outer shell of the outer shell is formed. The structure is such that electrodes that are external leads are attached to the side surfaces. Such surface mounting electronic components are soldered and mounted on a printed wiring board with an adhesive.
第４図（ａ）〜（ｃ）は従来の表面実装用電子部品をプ
リント配線基板に取り付ける工程順に示した表面実装用
電子部品を含めたプリント配線基板の断面図である。次
に、電子部品をプリント配線基板に実装する方法を説明
すると、まず、第４図（ａ）に示すように、プリント配
線基板１の銅箔２間に接着剤３を滴下し、銅箔２にはは
んだを塗布する。次に、第４図（ｂ）に示すように、電
子部品５をプリント配線基板１に搭載する。このとき、
電子部品５の電極７がそれぞれのはんだ４の上に、ま
た、電子部品５の取り付け面に接着剤3aの上に乗せるよ
うな位置にする。4 (a) to 4 (c) are cross-sectional views of a printed wiring board including the surface-mounting electronic component shown in the order of steps for mounting the conventional surface-mounting electronic component on the printed wiring board. Next, a method of mounting the electronic component on the printed wiring board will be described. First, as shown in FIG. 4A, the adhesive 3 is dropped between the copper foils 2 of the printed wiring board 1 to form the copper foil 2. Apply solder to. Next, as shown in FIG. 4B, the electronic component 5 is mounted on the printed wiring board 1. At this time,
The electrode 7 of the electronic component 5 is placed on each solder 4 and on the mounting surface of the electronic component 5 on the adhesive 3a.
次に、紫外線ランプ６により接着剤3aを硬化させ電子部
品５をプリント配線基板１に接着させる。次に、赤外線
ランプあるいは温風を吹き付けることにより、第４図
（ｃ）に示すように、はんだ４をリフローさせ、電子部
品５の電極７をプリント配線基板１の銅箔２にはんだ4a
で接続固定する。Next, the adhesive 3a is cured by the ultraviolet lamp 6 to bond the electronic component 5 to the printed wiring board 1. Next, as shown in FIG. 4 (c), the solder 4 is reflowed by blowing an infrared lamp or warm air, and the electrode 7 of the electronic component 5 is soldered to the copper foil 2 of the printed wiring board 1 with the solder 4a.
Connect and fix with.
上述した表面実装用電子部品では、プリント配線基板に
実装するときに、接着剤を塗布し、紫外線による接着剤
を硬化させる工程が必要であることや、この工程に必要
な設備を整えなければならないという欠点がある。ま
た、接着剤という公害材料を使用しているため、その直
接材料としての費用がかかるばかりか、公害材料として
の保管及び管理する費用がかかる欠点もある。更に、一
度実装すると、この電子部品を交換する場合に、はんだ
を溶かしてもこの接着剤の接着力が強く、プリント配線
基板から取り外しにくいという欠点もある。In the above-mentioned surface mount electronic component, when mounting on a printed wiring board, a step of applying an adhesive and curing the adhesive by ultraviolet rays is necessary, and the equipment necessary for this step must be prepared. There is a drawback that. Further, since a pollution material called an adhesive is used, there is a drawback that not only the cost as a direct material but also the cost for storage and management as the pollution material is required. Further, once mounted, when the electronic component is replaced, even if the solder is melted, the adhesive has a strong adhesive force and is difficult to remove from the printed wiring board.
本発明は接着剤を硬化させる工程が不要であり、また、
この工程に使用したり、接着剤を保管したりする特別な
設備を必要とすることなくプリント配線基板に実装すこ
とが出来るとともにプリント配線基板より容易に取り外
し出来る表面実装用部品の実装方法を提供することにあ
る。The present invention does not require a step of curing the adhesive, and
We provide a mounting method for surface mounting components that can be mounted on a printed wiring board without the need for special equipment for use in this process or storing adhesives, and that can be easily removed from the printed wiring board. To do.
本発明の特徴は、プリント配線基板上に実装する表面実
装用電子部品の実装方法において、前記表面実装用電子
部品の前記プリント配線基板への取付け面に両面接着テ
ープを貼付け、前記プリント配線板の銅箔のはんだ上に
前記表面実装用電子部品の電極が乗るように位置決めす
るとともに前記両面接着テープで該表面実装用電子部品
を前記取付け面に接着し、しかる後に赤外線あるいは温
風により前記はんだをリフローして前記電極と前記銅箔
とを接続固定する表面実装用電子部品の実装方法であ
る。A feature of the present invention is, in a method of mounting a surface mounting electronic component to be mounted on a printed wiring board, a double-sided adhesive tape is attached to a mounting surface of the surface mounting electronic component to the printed wiring board, Position the electrode of the surface-mounting electronic component on the solder of the copper foil and bond the surface-mounting electronic component to the mounting surface with the double-sided adhesive tape, and then bond the solder by infrared rays or warm air. It is a method of mounting an electronic component for surface mounting, which comprises reflowing to connect and fix the electrode and the copper foil.
次に、本発明について図面を参照して説明する。 Next, the present invention will be described with reference to the drawings.
第１図は本発明による一実施例を示す表面実装用電子部
品の断面図、第２図は第１図に示す表面実装用電子部品
の梱包状態を示す断面図、第３図（ａ）及び（ｂ）はプ
リント配線基板に実装する工程順に示す表面実装用電子
部品を含めたプリント配線基板の断面図である。FIG. 1 is a sectional view of an electronic component for surface mounting showing an embodiment according to the present invention, FIG. 2 is a sectional view showing a packaged state of the electronic component for surface mounting shown in FIG. 1, FIG. (B) is sectional drawing of the printed wiring board containing the surface mounting electronic component shown in the process order mounted in a printed wiring board.
この表面実装用電子部品は、第１図に示すように、電子
部品５のプリント配線基板に対向する面すなわち取り付
け面に両面接着テープ８が貼り付けられていることであ
る。それ以外は従来例と同じである。As shown in FIG. 1, the surface mounting electronic component has a double-sided adhesive tape 8 attached to the surface of the electronic component 5 facing the printed wiring board, that is, the mounting surface. Otherwise, it is the same as the conventional example.
また、この表面実装用電子部品を梱包する場合には、第
２図に示すように、エンボス付きテープ11の窪み９の底
にこの電子部品５の両面接着テープ８で貼り付け、テー
プ10でシールすれば良い。When packaging the surface-mounting electronic component, as shown in FIG. 2, the double-sided adhesive tape 8 of the electronic component 5 is attached to the bottom of the recess 9 of the embossed tape 11 and sealed with the tape 10. Just do it.
次に、この表面実装用電子部品をプリント配線基板に実
装する場合には、まず、第３図（ａ）に示すように、プ
リント配線基板１の上に乗せ、銅箔２の間に両面接着テ
ープ８で接着する。このとき、電極７がはんだ４の上に
乗るように電子部品５を位置決めする。Next, when mounting this surface mounting electronic component on a printed wiring board, first, as shown in FIG. 3 (a), it is placed on the printed wiring board 1 and double-sided bonded between the copper foils 2. Adhere with tape 8. At this time, the electronic component 5 is positioned so that the electrode 7 rides on the solder 4.
次に、第３図（ｂ）に示すように、赤外線あるいは温風
によりはんだをリフローして、電子部品５の電極７と銅
箔２とをはんだ4aで接続固定する。Next, as shown in FIG. 3B, the solder is reflowed by infrared rays or warm air to connect and fix the electrode 7 of the electronic component 5 and the copper foil 2 with the solder 4a.
以上説明したように本発明は、表面実装用電子部品のプ
リント配線基板に取り付ける面に両面接着テープを貼り
付けることにより、プリント配線基板に固着する接着剤
を塗布し硬化する工程が不要になるばかりか、この工程
に必要な設備及び接着剤を保管する設備等も不要にな
り、更に、実装した後でも、容易に取り外しが出来る表
面実装用電子部品の実装方法が得られるという効果があ
る。As described above, according to the present invention, the double-sided adhesive tape is attached to the surface of the surface-mounting electronic component to be attached to the printed wiring board, which eliminates the need for the step of applying and curing the adhesive agent to be fixed to the printed wiring board. In addition, there is no need for equipment necessary for this step, equipment for storing an adhesive, and the like, and there is an effect that a mounting method of a surface mounting electronic component that can be easily removed even after mounting is obtained.
第１図は本発明による一実施例を示す表面実装用電子部
品の断面図、第２図は第１図に示す表面実装用電子部品
の梱包状態を示す断面図、第３図（ａ）及び（ｂ）はプ
リント配線基板に実装する工程順に示す表面実装用電子
部品を含めたプリント配線基板の断面図、第４図（ａ）
〜（ｃ）は従来の表面実装用電子部品をプリント配線基
板に取り付ける工程順に示した表面実装用電子部品を含
めたプリント配線基板の断面図である。 １……プリント配線基板、２……銅箔、３、3b、3c……
接着剤、４、4a……はんだ、５……電子部品、６……紫
外線ランプ、７……電極、８……両面接着テープ、９…
…窪み、10……テープ、11……エンボス付きテープ。FIG. 1 is a sectional view of an electronic component for surface mounting showing an embodiment according to the present invention, FIG. 2 is a sectional view showing a packaged state of the electronic component for surface mounting shown in FIG. 1, FIG. FIG. 4B is a cross-sectional view of the printed wiring board including surface-mounting electronic components shown in the order of steps of mounting on the printed wiring board; FIG.
8A to 8C are cross-sectional views of the printed wiring board including the surface-mounting electronic component shown in the order of steps for attaching the conventional surface-mounting electronic component to the printed wiring board. 1 ... Printed wiring board, 2 ... Copper foil, 3, 3b, 3c ...
Adhesive, 4, 4a ... Solder, 5 ... Electronic component, 6 ... UV lamp, 7 ... Electrode, 8 ... Double-sided adhesive tape, 9 ...
… Dents, 10 …… tape, 11 …… embossed tape.
Claims (1)
電子部品の実装方法において、前記表面実装用電子部品
の前記プリント配線基板への取付け面に両面接着テープ
を貼付け、前記プリント配線板の銅箔のはんだ上に前記
表面実装用電子部品の電極が乗るように位置決めすると
ともに前記両面接着テープで該表面実装用電子部品を前
記取付け面に接着し、しかる後に赤外線あるいは温風に
より前記はんだをリフローして前記電極と前記銅箔とを
接続固定することを特徴とする表面実装用電子部品の実
装方法。1. A method for mounting an electronic component for surface mounting to be mounted on a printed wiring board, wherein a double-sided adhesive tape is attached to a mounting surface of the electronic component for surface mounting to the printed wiring board, and copper of the printed wiring board is attached. Position the electrode of the surface-mounting electronic component on the solder of the foil and adhere the surface-mounting electronic component to the mounting surface with the double-sided adhesive tape, and then reflow the solder with infrared rays or warm air. Then, the electrode and the copper foil are connected and fixed, and a method for mounting a surface-mounting electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1034046A JPH0779187B2 (en) | 1989-02-13 | 1989-02-13 | Mounting method for surface mount electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1034046A JPH0779187B2 (en) | 1989-02-13 | 1989-02-13 | Mounting method for surface mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02213111A JPH02213111A (en) | 1990-08-24 |
| JPH0779187B2 true JPH0779187B2 (en) | 1995-08-23 |
Family
ID=12403371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1034046A Expired - Lifetime JPH0779187B2 (en) | 1989-02-13 | 1989-02-13 | Mounting method for surface mount electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0779187B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020170810A (en) * | 2019-04-04 | 2020-10-15 | Ｎｅｃプラットフォームズ株式会社 | Manufacturing method for circuit board and electronic component |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437069U (en) * | 1977-08-19 | 1979-03-10 | ||
| JPS5739466U (en) * | 1980-08-19 | 1982-03-03 |
-
1989
- 1989-02-13 JP JP1034046A patent/JPH0779187B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02213111A (en) | 1990-08-24 |
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