JP2960645B2 - Ceramic heater and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic heater which can be used for various kinds of semiconductor manufacturing equipment such as PVD, plasma CVD, low pressure CVD, plasma etching, and optical etching, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, there has been known a ceramic heater in which a heating resistor wound spirally is embedded in a disk-shaped ceramic heater base made of dense ceramic, and electric terminals are connected to both ends of the electric heating resistor. And is used as a heating device for semiconductor manufacturing equipment and the like.

In order to obtain a semiconductor device or the like having good characteristics by using a ceramic heater, the ceramic heater needs to have uniform heating characteristics. For example, in a heating device for semiconductor manufacturing equipment, the set temperature of the heating surface is set to a high temperature of 700 ° C., 800 ° C., etc.
In addition, extremely high temperature uniformity is required, in which the difference between the minimum temperature and the average temperature and the difference between the maximum temperature and the average temperature on the heating surface must be kept within a predetermined range.
Therefore, it is necessary to set the planar pattern shape / arrangement and the number of windings of the winding body in the ceramic base so that the temperature of the heating surface of the heater does not become uneven. This is because if the temperature of the heating surface of the heater becomes uneven, it is impossible to uniformly heat the entire object to be heated. In particular, in the case of a semiconductor manufacturing apparatus, the thickness of the semiconductor film becomes uneven, and It is because it causes.

The above ceramic heater is generally manufactured by the following method. That is, first, a resistance heating element made of a high melting point metal is spirally wound to obtain a wound body, terminals (electrodes) are bonded to both ends of the wire body, and ceramic powder is charged in a press molding machine. Preform until a certain degree of hardness is achieved. At this time, a continuous concave portion or groove is provided on the surface of the preform along a predetermined planar pattern, the wound body is housed in the concave portion or groove, and the ceramic powder is further filled thereon. Then, the ceramic powder is uniaxially pressed to produce a disk-shaped molded body, and the disk-shaped molded body is sintered by hot pressing.

[0005]

However, when a disk-shaped ceramic heater is actually manufactured, it has been found that it is unexpectedly difficult to eliminate uneven heating on the heating surface of the heater and to make the temperature uniform. did. That is, the wound body that is a resistance heating element is usually formed by winding a thin resistance wire in a spiral coil shape, and is very easily and freely deformed three-dimensionally. Therefore, when the wound body is placed inside the ceramic molded body, a displacement of the wound body occurs, and the ceramic powder flows when the molded body is fired. I do. As a result, it is difficult to keep the distance between adjacent windings and the distance from the heating surface of the ceramic substrate to the electric resistance heating element constant, and the heating resistance element itself is helically twisted. The distance from the heating surface of the base to the heating resistor is not uniform. As a result, when using the heater, a uniform heat distribution could not be obtained, and a ceramic heater having highly uniform heating characteristics could not be obtained. In the actual manufacturing process of ceramic heaters, the phenomena that cause these non-uniformities and the means for solving the causes of the phenomena are hardly elucidated at present. It has been difficult to produce ceramic heaters constantly.

On the other hand, conventionally, equipment costs are increasing in a mass production factory for 16DRAM semiconductors, and a semiconductor wafer processing apparatus or the like using a ceramic heater is required to improve throughput (wafer processing amount) and maintain the apparatus. To reduce downtime. Here, the downtime of the device means that when performing maintenance on the device, it is necessary to wait for the ceramic heater to cool down to a temperature that can be handled. The total time of the required time is called “downtime of the apparatus (downtime)”, and it is required that the downtime be as short as possible.

In particular, in a thermal CVD, epitaxial, sputtering, and etching apparatus, a heater is installed in a container, a semiconductor wafer is installed in the heater, and the wafer is heated to a high temperature. However, for example, 10
After heating the semiconductor wafer to 00 ° C. and processing the semiconductor wafer, it usually takes a long time of 1 hour or more to stop supplying power to the resistance heating element and lower the temperature of the base to 80 ° C. or less. , Downtime was long.

[0008] Accordingly, in order to enhance the response of the ceramic heater, it has been demanded that the temperature of the ceramic heater can be freely and rapidly changed, thereby improving the processing efficiency of the substance to be processed.

[0009]

An object of the present invention is to provide a ceramic heater having a ceramic heater base and an electric resistance heating element embedded in the heater base, in which the temperature of the heating surface can be controlled to a high degree. It is to provide a ceramic heater.

Another object of the present invention is to provide a ceramic heater capable of rapidly cooling the ceramic heater. Still another object of the present invention is to provide a method for manufacturing a ceramic heater which can manufacture a ceramic heater excellent in temperature control by a simple and easy method.

[0011]

The present invention relates to a ceramic heater comprising a ceramic heater base and an electric heating resistor embedded in the ceramic heater base. A fluid passage extending along a heating surface is provided between the ceramic heater and the heating surface of the ceramic heater main body by forcibly introducing / filling a fluid into the fluid passage from outside the ceramic heater and leading the fluid outside the ceramic heater. And a ceramic heater capable of controlling the temperature of the ceramic heater.

The present invention also relates to a ceramic heater comprising a ceramic heater base and an electric heating resistor embedded in the ceramic heater base, wherein the ceramic heater further has a cooling mechanism, and the cooling mechanism is provided inside the ceramic heater base. And a fluid passage extending along the heating surface between the heating surface of the ceramic heater base and the heating resistor, and cooling of the ceramic heater can be promoted by flowing a fluid into the fluid passage. The present invention relates to a ceramic heater with a cooling mechanism.

Further, the present invention provides a first ceramic molded body in which a heating resistor is embedded, and a second ceramic molded body to be joined to the first ceramic molded body. A method of manufacturing a ceramic heater by joining a fired ceramic molded body and the second ceramic molded body, wherein a fluid is applied to at least one of the joining surfaces of the first and second ceramic molded bodies. By providing a groove that forms a passage, forming a fluid inlet and a fluid outlet that communicate with the passage in the first ceramic molded body, and joining the first ceramic molded body and the second ceramic molded body, A ceramic heater having a fluid passage extending along a heating surface between the heating surface of the ceramic heater base and the heating resistor by the groove and another joining surface. It relates to production method.

[0014]

According to the ceramic heater of the present invention, the heat generated by the heating resistor moves in the solid ceramic heater base, and is absorbed by the fluid forced to flow partially through the fluid passage, thereby causing the convection in the fluid. The movement reduces the temperature difference at each location of the ceramic heater base, thereby making it possible to control the temperature of the ceramic heater uniformly.

In the case where a semiconductor or the like is processed using a ceramic heater, it is necessary to repeat the steps of processing at a predetermined high temperature, cooling to a predetermined temperature, and then performing the processing again. According to the ceramic heater, by flowing a predetermined fluid through the fluid passage, the ceramic heater can be cooled more quickly, and downtime can be significantly reduced as compared with the conventional ceramic heater. Throughput (processing amount) of an object to be processed such as a semiconductor can be improved.

Further, according to the method of manufacturing a ceramic heater of the present invention, a groove for forming a fluid passage is provided on at least one of the joining surfaces of the ceramic heater and the first or second molded body and communicates with the passage. By forming a fluid inlet and a fluid outlet and joining the first ceramic compact and the second ceramic compact, a heating surface is provided between the heating surface of the ceramic heater base and the electric heating resistor. Can easily be provided, and ceramic heaters having extremely high temperature uniformity can be constantly mass-produced at a high yield.

Preferred embodiments of the ceramic heater according to the present invention include the following. (1) A ceramic heater using an inert gas selected from argon, helium, and nitrogen as the fluid. In this case, a desired soaking effect can be achieved without adversely affecting the ceramic material and the heating resistor constituting the ceramic heater. (2) A ceramic heater in which the ceramic heater base has a disk shape, and the heating resistor is spirally wound and embedded in the ceramic heater base. In this case,
The heating resistor is spirally wound and the heating resistor is uniformly arranged in the disk-shaped ceramic heater, and a higher soaking effect can be obtained in combination with the installation of the fluid passage. (3) The ceramic heater, wherein the fluid passage comprises a plurality of annular passages extending substantially concentrically, and the plurality of annular passages extend between the fluid inlet and the fluid outlet. In this case, it is possible to independently and uniformly control the heating of the individual annular regions on the heating surface, which is particularly effective in the case of the ceramic heater (2). In addition, even from the viewpoint of the entire heating surface, by dividing the heating surface into small areas and controlling them uniformly, the temperature of the entire heating surface can be more uniformly controlled. (4) At least one set of an outer fluid inlet, an outer fluid outlet, a set of a central fluid inlet, and a central fluid outlet,
Outer fluid passages and central fluid passages are substantially concentric in the circumferential direction between the pair of outer fluid inlets and the outer fluid outlet and between the pair of central fluid inlets and the central fluid outlet, respectively. Ceramic heater that extends in a zigzag manner. Also in this case, the outer peripheral area and the central area of the heating surface can be independently and uniformly heated, which is particularly effective in the case of the ceramic heater (2). (5) A ceramic heater in which a heating surface portion of the ceramic heater main body is divided into a plurality of regions in a circumferential direction, and a flow path extending zigzag in a circumferential direction from an outer peripheral portion to an inner peripheral portion corresponding to each region is provided. In this case, it is possible to independently and uniformly control the temperature of a plurality of regions where the heating surface is divided in the circumferential direction.

In a preferred embodiment of the method for manufacturing a ceramic heater, a mask for giving a shape corresponding to a fluid passage is placed on at least one of the joining surfaces of the first and second ceramic molded bodies. A groove for forming a fluid passage is formed by sandblasting or etching, and an adhesive such as YSiAlON-based glass is applied to at least one of the bonding surfaces of the first and second ceramic molded bodies, and then the first ceramic body is coated. And the second ceramic body are bonded via a glass coating layer and fired. According to this method, it is possible to obtain a ceramic heater that is strongly bonded.

Hereinafter, the present invention will be described in detail. The substrate of the ceramic heater of the present invention is formed of dense ceramics. Preferably, nitride ceramics such as silicon nitride, aluminum nitride, and sialon can be used. When silicon nitride is used, a ceramic heater having high thermal shock resistance can be obtained. When aluminum nitride is used, a ceramic heater having high corrosion resistance to a halogen-based corrosive gas can be obtained. In particular, silicon nitride containing at least one of Y ₂ O ₃ and Yb ₂ O ₃ as a sintering aid and aluminum nitride containing Y ₂ O ₃ as a sintering aid have high thermal conductivity as ceramics. It is particularly preferable from the viewpoint of improving the uniformity of the heating surface.

When a sintered body is manufactured from such silicon nitride by a hot pressing method, the thermal conductivity in the direction perpendicular to the pressure axis is higher than the thermal conductivity in the axial direction. Therefore, when a disk-shaped substrate is manufactured by the hot press method,
This is preferable from the viewpoint that the thermal conductivity in the direction parallel to the heating surface of the disk-shaped substrate becomes larger than the thermal conductivity in the thickness direction of the disk-shaped substrate, thereby improving heat uniformity. When a sintered body is manufactured by a hot press method, aluminum nitride does not cause anisotropy in thermal conductivity, but is preferable because aluminum nitride improves strength and thermal conductivity as compared with a normal pressure sintered product.

The metal constituting the wound body is preferably a high melting point metal, especially in a ceramic heater for high temperature, and more preferably, tungsten, molybdenum, platinum, or an alloy thereof. As the wound body, one having various shapes can be used, but a wound body having a coil spring shape is preferable because it is easily available. This wound body is formed by winding a wire in a spiral shape, and the wound body extends spirally in a substantially cylindrical shape. However, the spiral shape of the wound body can be an elliptical shape, a quadrilateral shape, or the like, in addition to a circular shape.

The fluid passage is provided inside the ceramic heater base and between the heating surface of the base and the heating resistor. As long as the heat distribution of the ceramic heater is made uniform and the heating state of the substrate heating surface is made uniform and / or the ceramic heater can be cooled in a short period of time,
There is no particular limitation on the arrangement and the like. Further, "the fluid passage extends along the heating surface of the base" means not only that the fluid passage extends only in parallel with the heating surface, but also because it is inside the base and between the heating surface of the base and the heating resistor. This includes the case of waving up and down to some extent. Further, "between the heating surface of the base and the heating resistor" means not only the case where the entire fluid passage is located between the heating surface of the base and the heating resistor, but also the soaking / cooling effect of the present invention is exhibited. Where possible, this includes the case where a part of the fluid passage extends below the heating resistor opposite to the heating surface of the substrate.
Further, it is preferable that the fluid passage is provided continuously, but “the fluid passage is provided continuously” is provided so that the fluid can continuously flow in the fluid passage. However, this also includes the case where a part is discontinuous.

[0023]

In order to force the fluid to flow in the fluid passage, a forced flow mechanism including a pump, a valve, a flow meter, a fluid passage and the like is connected to the fluid passage. Since such a forced flow mechanism can be easily adopted by those skilled in the art as appropriate, a detailed description thereof will be omitted. In this case, it is preferable to use a forced circulation flow mechanism for circulating the fluid.

As the fluid flowing through the fluid flow path, argon,
An inert gas such as helium or nitrogen is preferably used.
The preferable flow rate range of the fluid is appropriately determined depending on the shape and arrangement of the flow path, the type of the fluid, and the like. For the purpose of increasing the heat uniformity, it is preferable to flow the fluid within a range of 1 to 301 SCCM. When the purpose is to increase the cooling rate, the cooling rate is preferably set to 1 SCCM or more, and the flow rate of the gas is preferably increased. The fluid flowing through the fluid channel may be introduced into the channel at room temperature, or may be introduced in a heated or cooled state. In addition, fluids at normal pressure, pressurized pressure, and reduced pressure can be used as appropriate. Further, such a fluid can be circulated and flown in the fluid flow path, and in this case, the running cost of the ceramic heater can be reduced.

Next, a ceramic heater and a method of manufacturing the same according to the present invention will be described with reference to the accompanying drawings. FIG.
FIGS. 1A and 1B are a vertical sectional view and a plan view, respectively, of a ceramic heater according to a first embodiment of the present invention.
In the figure, a wound heating resistor 2 is spirally embedded in a disc-shaped ceramic heater base 1, and both ends of the heating resistor are connected to terminals 3 embedded in a lower surface 1 a of the base 1. . Inside the ceramic heater base and between the heating surface 1b of the base 1 and the heating resistor 2, a fluid flow path 4 having the shape and arrangement shown in FIG. 1 (b) is provided. The part is connected to a fluid inlet 5 and a fluid outlet 7 via a fluid inlet 6 and a fluid outlet 8, respectively. The wafer 9 to be processed is placed on the heating surface 1b of the ceramic heater base. The shape and arrangement of the fluid flow path 4 will be described in more detail. The fluid flow path 4 generally extends substantially in parallel with the substrate heating surface 2b, and the fluid flow path 4 has a concentric flow path 4 extending annularly. _1, 4 _2, 4 _3, 4 _4, 4 _5, 4 ₆ and made from a fluid flow path 4 ₀ Metropolitan radially extending fluid inlet channel 6 and the fluid outlet channel 8 is the outermost annular fluid passage 4 ₁ both end portions of the fluid flow path 4 ₀ is in communication with the opening of the fluid inlet channel 6 and the fluid outlet channel 8 with an opening. Annular channels 4 ₁ , 4 ₂ , 4 ₃ , 4
_4, 4 _5, 4 ₆ is continuous in a zigzag shape.

When a ceramic heater is used, a current flows through the heating resistor 2 and heat is generated from the resistor 2 to the heater base. On the other hand, the fluid inlet 5 fluid through the inlet passage 6 the annular channel ₄₁ to ₅ and the fluid channel 40, outlet channel 8, flows to the outlet 7 are as given flow rate. As a result, the heat generated by the heating resistor is transmitted through the solid ceramic heater base, and is absorbed, convected and moved by the fluid flowing through the fluid flow path, so that the heat distribution in the ceramic heater base is made uniform and the ceramic heater base becomes uniform. The heating surface of the heater is uniformly heated. According to this embodiment, since the annular flow path is provided concentrically, it is possible to more uniformly heat the heater heating surface.

[0028]

FIGS. 2A and 2B are a longitudinal sectional view and a plan view, respectively, of a second embodiment according to the present invention. First
The difference between this embodiment and the second embodiment is that in the second embodiment, two sets of fluid flow paths 4a and 4b are provided, and fluid inlets 51 and 52 are provided at both ends of each fluid flow path. And fluid outlet 7
_1, 7 ₂ and each fluid inflow channel 61, 62 and the fluid outlet channel 8
Connected through 1, 82. Other points are substantially the same as those of the first embodiment.

The fluid flow paths 4a and 4b will be further described. The fluid flow path 4a extends circumferentially and zigzag from the outside in the radial direction to the inside in the radial direction, while the flow path 4b is provided at the center and has an annular shape. And have a Z-shape as a whole. The fluid flow paths 4a and 4b extend generally parallel to the substrate heating surface. In the second embodiment,
The central part in the radial direction when viewed from the heating surface of the ceramic heater,
Although the outer peripheral portion is divided into two sections, it may be divided into three or more annular sections and a fluid flow path continuous to each section may be provided.

According to the second embodiment of the present invention, substantially the same effects as those of the first embodiment can be obtained, and the fluid flow path 4a
By changing the flow rate, temperature, type, and the like of the fluid flowing through the ceramic heater 4b, the temperature of the central portion and the peripheral portion of the heating surface of the ceramic heater can be independently and uniformly set and / or controlled.

[0032]

FIG. 3 is a cross-sectional view of a third embodiment according to the present invention. In FIG. 3, the shaded portion represents the wall of the flow channel. In the third embodiment, the radially extending 4
When the substrate heating surface is viewed in the circumferential direction by the four partition walls 11a, 11b, 11c, and 11d, the substrate is divided into four fan-shaped sections having the same area, and each section has partition walls 12a ₁ , 12a ₂ as shown in FIG. , 12
a ₃ , 12a ₄ , 12a ₅ , 12a ₆ ; bulkheads 12b ₁ , 12b ₂ , 12b ₃ , 12b ₄ ,
12b ₅ , 12b ₆ ; bulkheads 12c ₁ , 12c ₂ , 12c ₃ , 12c ₄ , 12c ₅ , 12
c ₆ ; partition walls 12d ₁ , 12d ₂ , 12d ₃ , 12d ₄ , 12d ₅ , 12d ₆ are provided, and each partition portion extends between adjacent radial partition walls,
The partition walls extending in the circumferential direction are alternately opened to the two partition walls between adjacent radial partition walls. With these partition walls, an annular fluid flow path is continuously provided in a zigzag manner from the radially outer peripheral portion toward the central portion. Other configurations of the third embodiment are substantially the same as those of the first embodiment.

When the ceramic heater of the third embodiment is used, a current flows through the heating resistor 2 while the fluid branches off through the fluid inlet and the inflow path 6 into the annular flow paths 13c and 13d. The fluid flows in a circumferential zigzag manner from the outer peripheral portion to the central portion, and when reaching the central portion, the branched fluids merge, and the fluid again branches into the fluid flow paths 13a and 13b, and the fluid flows circumferentially from the central portion to the outer peripheral portion. Flows in a zigzag shape and reaches the fluid outflow passage. In the third embodiment, the circumferential direction is divided into four equal-area sections, and a fluid flow path is formed continuously in each section. However, the circumferential direction is divided into three or five areas having the same area or different areas. It is also possible to divide into the above-mentioned sections, and to form a continuous fluid channel in a zigzag shape in the circumferential direction in each section. Further, in the third embodiment, the fluid inflow path and the fluid outflow path are provided in common for all the fluid flow paths, but a fluid inflow path and a fluid outflow path can be provided for each flow path, A fluid inflow path and a fluid outflow path can be provided for each set as a set of several flow paths.

In the third embodiment, in addition to the effect obtained in the first embodiment, there is an effect that each of the four divided sections can be uniformly heated, and the partition wall extends in the radial direction. The surface is reinforced, and the mechanical strength of the ceramic heater is increased.

Next, a method of manufacturing a ceramic heater according to the present invention will be described with reference to manufacturing process diagrams which are schematic sectional views shown in FIGS. 4 (a) to 4 (d). Hereinafter, description will be made in the order of steps. First, a first ceramic heater molded body shown in FIG. That is, terminals (electrodes) are adhered to both ends of a wound body obtained by winding a high melting point metal wire, ceramic powder is charged in a press molding machine, and the surface of the preformed body is
A continuous recess or groove is provided along a predetermined planar pattern. Then, the wound body is accommodated in this concave portion, and further filled with ceramic powder, and the ceramic powder is uniaxially pressed to form a disk-shaped molded body, and the disk-shaped molded body is sintered by hot pressing. Tie.

Next, a fluid inflow channel 5 and a fluid outflow channel 6 are formed in the obtained first ceramic molded body [FIG. 4 (b)].
]. Thereafter, a mask forming a fluid passage is placed on the surface of the first ceramic heater base portion on the base heating surface side,
A groove for forming a fluid passage is formed by performing a sandblasting process or an etching process (FIG. 4C).
]. Finally, the thin plate-shaped second ceramic molded body is overlaid on the groove forming surface via an adhesive such as glass (for example, YSiALON-based glass) and fired to integrate the thin plate-shaped body [FIG. )]. In the present manufacturing method, the fluid passage forming groove is provided on the surface of the first ceramic heater molded body, but a groove for forming a fluid flow path may be provided in the thin plate-shaped second molded body. Each ceramic compact is most preferably sintered by a hot press method, but may be sintered under normal pressure, or may be sintered by a hot isostatic press method after being pre-sintered at normal pressure. .

[0038]

EXAMPLES The following experiments were conducted to investigate the soaking effect of the ceramic heater of the present invention. The ceramic heater used had the shape of the third embodiment shown in FIG. 3, and the dimensions of each part were as follows. The base of the ceramic heater was formed by molding and firing silicon nitride. 1) Ceramic heater base diameter: 205 mm 2) Fluid flow path width: 10 mm, depth: 0.3 mm 3) Partition wall width: 28 mm, height: 0.3 mm 4) Distance from heated surface to upper surface of fluid flow path: 1 mm As shown in FIG. 5, a fluid inflow pipe 14 and a fluid outflow pipe 15 are joined to a fluid inlet and a fluid outlet of the ceramic heater by an active silver brazing 16, respectively, and an 8-inch silicone wafer is placed on the heating surface of the ceramic heater. Mechanically fixed with a mechanical clamp (not shown). As a fluid flowing through the flow channel, an Ar fluid was used at room temperature without preheating, and the fluid was passed through the flow channel at a predetermined flow rate to measure the uniformity of the ceramic heater.

In the measurement, the ceramic heaters of the respective examples prepared in this test example were placed in a sealed state in the vacuum vessel 17, and the wafer was fixed and held at a predetermined distance from the substrate heating surface. Then, the resistance heating element is heated so that the average value of the temperature of the substrate heating surface is about 850 ° C., and the center of the wafer held on the heating surface (the inner region of a circle having a diameter of 190 mm from the center of the wafer) is heated. Temperatures at 30 different locations were measured with an infrared radiation thermometer. Table 1 shows these results in frequency distribution.
The heat uniformity was represented by a value calculated by (variation temperature / average temperature × 100). As a conventional example, the same ceramic heater was used except that the fluid flow path was not provided, and the fluid flow path was evacuated without flowing gas as a reference example.

[0040]

[Table 1]

As can be seen from the above table, when the inside of the fluid channel was evacuated, the heat uniformity was ± 4.3%, but the heat uniformity was improved to ± 3.2% when Ar gas was filled (1 atm). . Furthermore, when Ar gas was passed through the fluid flow path at a constant flow rate of 1 SCCM, the heat uniformity was improved to 1.1%. On the other hand, A
When the flow rate of r gas was changed to 10 SCCM, the soaking temperature was improved to 0.55%. However, even when Ar gas was supplied to the fluid flow path at a flow rate higher than 10 SCCM, the heat uniformity was not further improved.

[0042]

The ceramic heater according to the present invention comprises a ceramic heater base and an electric heating resistor buried in the ceramic heater main body, and is formed inside the ceramic heater base and between the heating surface of the ceramic heater main body and the electric heating resistor. Since a fluid passage extending along the heating surface is provided between the fluid passages and the fluid can be filled in the fluid passage, the temperature of the heating surface of the ceramic heater can be uniformly controlled.

The ceramic heater according to the present invention comprises a ceramic heater base and a heating resistor embedded in the ceramic heater base. The ceramic heater further has a cooling mechanism. A fluid passage extends along the heating surface between the heating surface of the heater base and the heating resistor. Therefore, it is possible to quickly cool the ceramic heater by flowing a fluid in the fluid passage.

Further, in the method for manufacturing a ceramic heater according to the present invention, a first ceramic molded body in which a heating resistor is embedded is formed, and a second ceramic molded body to be joined to the first ceramic molded body is formed. Forming a ceramic heater by joining the first fired ceramic molded body and the second ceramic molded body, wherein at least a joint surface between the first and second ceramic molded bodies is formed. A groove for forming a fluid passage is provided in one of the joining surfaces, and a fluid inlet and a fluid outlet communicating with the fluid passage are formed in the first ceramic molded body, and the first ceramic molded body and the second ceramic molded body are formed. By joining the bodies, the groove and the other joining surface extend along the heating surface between the heating surface of the ceramic heater base and the heating resistor. Since provision of the body passageway, it is possible to easily produce a ceramic heater capable of uniformly heating.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) are a vertical sectional view and a plan view, respectively, of a ceramic heater according to a first embodiment of the present invention.

FIGS. 2 (a) and 2 (b) are a vertical sectional view and a plan view, respectively, of a ceramic heater according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of a ceramic heater according to a third embodiment of the present invention.

FIGS. 4 (a) to 4 (d) are process diagrams illustrating a method for manufacturing a ceramic heater according to the present invention in a cross-sectional view.

FIG. 5 is a diagram illustrating an experimental example in which the thermal uniformity of a ceramic heater was examined.

[Explanation of symbols]

1 ceramic heater base, 1b heating surface, 2 heating resistor, 3 terminals, 4, 40, 41, 42, 43, 44, 45, 4
a, 4b fluid flow path, 5, 51, 52 fluid inlet, 6, 61,
62 Fluid inlet, 7, 71, 72 Fluid outlet, 8, 81, 82
Fluid outflow channel, 9 wafers, 11a, 11b, 11c, 11d, 12a, 1
2b, 12c, 12d partition, 13a, 13b, 13c, 13d fluid flow path,
14 Fluid inlet pipe, 15 Fluid outlet pipe, 16 Activated silver braze, 17
Vacuum container

Claims (11)

(57) [Claims] 1. A ceramic heater comprising a ceramic heater base and an electric heating resistor embedded in the ceramic heater base, wherein a heating surface is provided inside the ceramic heater base and between a heating surface of the ceramic heater base and the heating resistor. A fluid passage extending along the ceramic heater is provided, forcibly introducing and filling a fluid into the fluid passage from outside the ceramic heater, and leading the fluid outside the ceramic heater, thereby controlling the temperature of the heating surface of the ceramic heater body. Ceramic heater made possible. 2. The ceramic heater according to claim 1, wherein said fluid is an inert gas selected from argon, helium, and nitrogen. 3. The ceramic heater according to claim 1, wherein the ceramic heater base has a disk shape, and the heating resistor is spirally wound and embedded in the ceramic heater base. 4. The ceramic heater according to claim 1, wherein said fluid flows at a speed in a range of 1 to 30 SCCM. 5. The fluid passage according to claim 1, wherein said fluid passage comprises a plurality of annular passages extending substantially concentrically, said plurality of annular passages extending between a fluid inlet and a fluid outlet. A ceramic heater described in any of the above. 6. A system comprising at least one set of outer fluid inlets, an outer fluid outlet, a set of central fluid inlets, and a central outlet, between the pair of outer fluid inlets and the outer fluid outlet. 5. An outer peripheral fluid passage and a central fluid passage respectively extending between the central fluid inlet and the central fluid outlet in a substantially concentric and zigzag manner in a circumferential direction between the pair of central fluid inlets and the central fluid outlet. Ceramic heater. 7. A heating surface portion of the ceramic heater body is divided into a plurality of regions in a circumferential direction, and a passage extending in a circumferential direction from the outer peripheral portion to the inner peripheral portion in a zigzag manner is provided for each region. The ceramic heater according to any one of the above. 8. A ceramic heater comprising a ceramic heater base and a heating resistor embedded in the ceramic heater base, wherein the ceramic heater further has a cooling mechanism, the cooling mechanism being inside the ceramic heater base and in the ceramic heater base. A ceramic heater with a cooling mechanism, comprising a fluid passage extending along the heating surface between the heating surface of the ceramic heater and the heating resistor, and allowing the fluid to flow through the fluid passage to promote the cooling of the ceramic heater. . 9. The ceramic heater according to claim 8, wherein said fluid flows at a speed of 1 SCCM or more. 10. A first ceramic molded body in which a heating resistor is embedded, a second ceramic molded body to be joined to the first ceramic molded body is formed, and the first fired ceramic molded body is formed. A method for manufacturing a ceramic heater by joining a body and said second ceramic molded body, wherein a fluid passage is formed in at least one of the joining surfaces of the first and second ceramic molded bodies. The ceramic heater is provided by forming a groove, forming a fluid inlet and a fluid outlet in the first ceramic molded body communicating with the fluid passage, and joining the first ceramic molded body and the second ceramic molded body. A method of manufacturing a ceramic heater, wherein a fluid passage extending along a heating surface is provided between the heating surface of a base and the heating resistor by the groove and the other joining surface. 11. A method for forming a fluid passage by sandblasting or etching, wherein a mask for providing a shape corresponding to the fluid passage is mounted on at least one of the joint surfaces of the first and second ceramic molded bodies. With a groove,
An adhesive such as YSiAlON glass is applied to at least one of the bonding surfaces of the first and second ceramic molded bodies, and then the first ceramic molded body and the second ceramic molded body are coated with a glass coating layer. 12. The method for manufacturing a ceramic heater according to claim 11, wherein the ceramic heater is joined and fired.