JP2970724B2 - Manufacturing method of copper foil with good water wettability - Google Patents
Manufacturing method of copper foil with good water wettabilityInfo
- Publication number
- JP2970724B2 JP2970724B2 JP5020648A JP2064893A JP2970724B2 JP 2970724 B2 JP2970724 B2 JP 2970724B2 JP 5020648 A JP5020648 A JP 5020648A JP 2064893 A JP2064893 A JP 2064893A JP 2970724 B2 JP2970724 B2 JP 2970724B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- rolling oil
- heat treatment
- water wettability
- good water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 72
- 239000011889 copper foil Substances 0.000 title claims description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 8
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000010731 rolling oil Substances 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 18
- 238000005238 degreasing Methods 0.000 claims description 9
- 238000009736 wetting Methods 0.000 claims description 9
- 239000011261 inert gas Substances 0.000 claims description 7
- 239000003960 organic solvent Substances 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 description 15
- 239000000057 synthetic resin Substances 0.000 description 15
- 238000005097 cold rolling Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000137 annealing Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005098 hot rolling Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、その表面が水にぬれや
すい性質を持つ銅箔の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a copper foil whose surface is easily wetted by water.
【０００２】[0002]
【従来の技術】従来より、銅箔は各種の用途に使用され
ているが、近年、電磁波シールド材，フレキシブル印刷
回路板，電池極板等の用途に使用され始めている。例え
ば、電磁波シールド材に使用される場合には、銅箔単体
で使用されるのではなく、合成樹脂製フィルムと銅箔と
が貼合されて使用される。従って、銅箔と合成樹脂製フ
ィルムとの接着性が良好でないと、銅箔と合成樹脂製フ
ィルムとが剥離しやすくなって、耐久性が低下すること
になる。また、フレキシブル印刷回路板に使用される場
合には、銅箔と合成樹脂製フィルムとを貼合した後、銅
箔上に所定のマスキングを施し、続いてマスキングが施
されていない箇所の銅箔部分をエッチングによって除去
することによって、フレキシブル印刷回路板が製造され
ている。従って、この場合においても、銅箔と合成樹脂
製フィルムとの接着性が良好でないと、銅箔と合成樹脂
製フィルムとが剥離しやすくなって、銅箔によって形成
された回路が短絡しやすくなるということになる。2. Description of the Related Art Conventionally, copper foil has been used for various applications, but recently, it has begun to be used for applications such as electromagnetic wave shielding materials, flexible printed circuit boards, and battery plates. For example, when used as an electromagnetic wave shielding material, a synthetic resin film and a copper foil are bonded and used instead of being used as a single copper foil. Therefore, if the adhesiveness between the copper foil and the synthetic resin film is not good, the copper foil and the synthetic resin film are easily peeled off, and the durability is reduced. In addition, when used for a flexible printed circuit board, after laminating a copper foil and a synthetic resin film, a predetermined masking is performed on the copper foil, and then the copper foil in an unmasked portion is applied. Flexible printed circuit boards have been produced by removing parts by etching. Therefore, even in this case, if the adhesiveness between the copper foil and the synthetic resin film is not good, the copper foil and the synthetic resin film are easily peeled off, and the circuit formed by the copper foil is easily short-circuited. It turns out that.
【０００３】ところで、従来の銅箔は、以下のようにし
て製造されている。即ち、銅を溶解して鋳造した後、熱
間圧延を行ない、その後冷間圧延，中間焼鈍を繰り返し
行ない、最終厚さが1.0〜0.1mmとなったところで、中間
焼鈍を行ない、その後冷間圧延して銅箔が製造されてい
る。そして、冷間圧延時に、冷間圧延を良好に行なうた
めに、銅薄板や銅箔表面に圧延油が塗布される。従っ
て、銅箔の表面に付着している圧延油を、最終的に除去
するため、最終工程として有機溶剤での脱脂処理が施さ
れる。この脱脂処理の際、銅箔の表面に付着している圧
延油は完全に除去されるのではなく、ある程度の量を残
存させる。この理由は、銅箔上の圧延油を完全に除去す
ると、銅が大気に曝されて、酸化及び変色するからであ
る。[0003] A conventional copper foil is manufactured as follows. That is, after melting and casting copper, hot rolling is performed, and then cold rolling and intermediate annealing are repeatedly performed. When the final thickness reaches 1.0 to 0.1 mm, intermediate annealing is performed, and then cold rolling is performed. Copper foil is manufactured. Then, at the time of cold rolling, rolling oil is applied to the surface of the copper thin plate or copper foil in order to perform the cold rolling well. Therefore, in order to finally remove the rolling oil adhering to the surface of the copper foil, a degreasing treatment with an organic solvent is performed as a final step. During this degreasing treatment, the rolling oil adhering to the surface of the copper foil is not completely removed but remains in a certain amount. The reason for this is that when the rolling oil on the copper foil is completely removed, the copper is exposed to the atmosphere and oxidizes and discolors.
【０００４】以上の如き方法で製造された銅箔は、その
表面に圧延油が付着しているため、合成樹脂製フィルム
との接着性が悪いという欠点があった。即ち、このよう
な銅箔に接着剤溶液を塗布して、合成樹脂製フィルムと
貼合すると、銅箔上の圧延油が接着剤溶液を弾き、均一
な接着が行なえないのである。また、合成樹脂製フィル
ムを軟化又は溶融させて、銅箔に貼合する場合にも、合
成樹脂製フィルムと銅箔との間に圧延油が介在し、両者
の接着力を低下させるのである。従って、この銅箔は、
電磁波シールド材等の素材として不適当なものであっ
た。[0004] The copper foil produced by the above-described method has a drawback that the adhesiveness to the synthetic resin film is poor because the rolling oil adheres to the surface. That is, when an adhesive solution is applied to such a copper foil and bonded to a synthetic resin film, the rolling oil on the copper foil repels the adhesive solution and uniform bonding cannot be performed. Also, when the synthetic resin film is softened or melted and bonded to a copper foil, rolling oil is interposed between the synthetic resin film and the copper foil, and the adhesive strength between the two is reduced. Therefore, this copper foil
It was unsuitable as a material such as an electromagnetic wave shielding material.
【０００５】[0005]
【発明が解決しようとする課題】そこで、本発明は、銅
箔表面が酸化及び変色するのを最低限に抑制しながら、
銅箔表面に存在する圧延油を最大限除去することによ
り、合成樹脂製フィルムとの接着性に優れた銅箔を得よ
うとするものである。SUMMARY OF THE INVENTION Accordingly, the present invention provides a method for suppressing the oxidation and discoloration of a copper foil surface to a minimum.
An object of the present invention is to obtain a copper foil excellent in adhesiveness to a synthetic resin film by removing rolling oil present on the copper foil surface to the maximum extent.
【０００６】[0006]
【課題を解決するための手段】即ち、本発明は、所望の
厚さに圧延された銅箔に、所望により有機溶剤による脱
脂処理を施した後、不活性ガス雰囲気下又は真空下で且
つ180℃以上の温度で加熱処理を施すことにより、該銅
箔表面に付着している圧延油を蒸発させ、該銅箔表面の
ぬれ指数を34（dyne／cm）以上にすることを特徴とする
水ぬれ性の良い銅箔の製造方法に関するものである。That is, according to the present invention, a copper foil rolled to a desired thickness is subjected to a degreasing treatment with an organic solvent, if desired, and then subjected to an inert gas atmosphere or a vacuum under an inert gas atmosphere. A heat treatment at a temperature of at least 100 ° C. to evaporate the rolling oil adhering to the surface of the copper foil and to make the wetting index of the surface of the copper foil to 34 (dyne / cm) or more. The present invention relates to a method for producing a copper foil having good wettability.
【０００７】まず、本発明においては、従来公知の任意
の方法で、銅箔を製造する。例えば、銅を溶解して鋳造
した後、熱間圧延を行ない、その後冷間圧延，中間焼鈍
を繰り返し行ない、最終厚さが1.0〜0.1mmとなったとこ
ろで、中間焼鈍を行ない、その後冷間圧延して銅箔を製
造する。この銅箔の厚さは、任意に決定しうるものであ
るが、一般的には、100μｍ以下程度である。この銅箔
には、前述したように、その表面に圧延油が残存してい
る。First, in the present invention, a copper foil is manufactured by any conventionally known method. For example, after melting and casting copper, hot rolling is performed, and then cold rolling and intermediate annealing are repeatedly performed. When the final thickness reaches 1.0 to 0.1 mm, intermediate annealing is performed, and then cold rolling is performed. To produce copper foil. The thickness of the copper foil can be arbitrarily determined, but is generally about 100 μm or less. As described above, the rolling oil remains on the surface of the copper foil.
【０００８】次に、この銅箔に加熱処理を施す。加熱処
理は、不活性ガス雰囲気下又は真空下で行なわれる。こ
の理由は、銅箔の表面が酸化及び変色しにくいようにす
るためである。不活性ガスとしては、窒素，アルゴン，
ヘリウム等が使用される。特に、経済的理由から、窒素
を使用するのが好ましい。例えば、活性ガス雰囲気下で
ある大気雰囲気下で加熱処理を施すと、銅箔表面が酸化
及び変色して、商品価値が低下する。加熱処理の温度
は、180℃以上とする。温度を180℃未満にして、加熱処
理を施すと、銅箔表面に残存している圧延油が十分に除
去できないので、好ましくない。なお、加熱処理の時間
は、任意に決定しうる事項であるが、一般的には3〜25
時間程度である。Next, a heat treatment is applied to the copper foil. The heat treatment is performed in an inert gas atmosphere or under a vacuum. The reason for this is to make the surface of the copper foil difficult to oxidize and discolor. Inert gases include nitrogen, argon,
Helium or the like is used. In particular, it is preferred to use nitrogen for economic reasons. For example, when heat treatment is performed in an air atmosphere, which is an active gas atmosphere, the copper foil surface is oxidized and discolored, and the commercial value is reduced. The temperature of the heat treatment is set to 180 ° C. or higher. Heat treatment at a temperature of less than 180 ° C. is not preferable because the rolling oil remaining on the copper foil surface cannot be sufficiently removed. The time of the heat treatment is a matter which can be arbitrarily determined, but is generally 3 to 25.
About an hour.
【０００９】また、本発明においては、加熱処理の前
に、従来より行なわれている有機溶剤による脱脂処理を
行なってもよい。この脱脂処理を行なうと、銅箔表面に
残存している圧延油の量が少なくなり、加熱処理の温度
が若干低くても、また加熱処理の時間が若干短くても、
銅箔表面の圧延油を十分に除去することが可能となる。In the present invention, prior to the heat treatment, a conventional degreasing treatment with an organic solvent may be performed. When this degreasing treatment is performed, the amount of rolling oil remaining on the copper foil surface decreases, and even if the temperature of the heat treatment is slightly lower, or the time of the heat treatment is slightly shorter,
The rolling oil on the copper foil surface can be sufficiently removed.
【００１０】以上の加熱処理によって、銅箔表面に付着
している圧延油は蒸発して、その表面から圧延油がほぼ
完全に除去されるのである。銅箔の表面にどの程度圧延
油が残存しているかは、銅箔表面の水ぬれ性を評価する
ことによって行なうことができる。即ち、圧延油の残存
量が少なければ少ないほど、水ぬれ性が向上することに
なる。従って、銅箔の水ぬれ性が良いほど、圧延油の残
存量が少なくなって、合成樹脂製フィルムとの接着性は
向上することになるのである。本発明において、水ぬれ
性は、ぬれ指数（dyne／cm）として測定し、ぬれ指数が
35（dyne／cm）以上になるようにする。ぬれ指数が35
（dyne／cm）未満であると、銅箔表面に未だ多量の圧延
油が残存しており、合成樹脂製フィルムとの接着性が十
分に向上しないので、好ましくない。なお、ぬれ指数
は、JIS K 6768に記載の方法に準拠して測定されるもの
である。[0010] By the above heat treatment, the rolling oil adhering to the copper foil surface evaporates, and the rolling oil is almost completely removed from the surface. How much rolling oil remains on the surface of the copper foil can be determined by evaluating the water wettability of the copper foil surface. That is, the smaller the remaining amount of the rolling oil, the better the water wettability. Therefore, the better the water wettability of the copper foil is, the smaller the remaining amount of the rolling oil is, and the better the adhesion to the synthetic resin film is. In the present invention, water wettability is measured as a wetting index (dyne / cm).
It should be 35 (dyne / cm) or more. 35 wetting index
If it is less than (dyne / cm), a large amount of rolling oil still remains on the surface of the copper foil, and the adhesiveness to the synthetic resin film is not sufficiently improved. The wetting index is measured according to the method described in JIS K 6768.
【００１１】[0011]
実施例１〜20及び比較例１〜６ 純度99.90％以上のタフピッチ銅を溶解して鋳造した
後、熱間圧延を行ない、その後冷間圧延を行なう。更
に、中間焼鈍及び冷間圧延を繰り返して行ない、厚さ15
μｍの銅箔を得た。この銅箔に、所望により従来公知の
溶剤脱脂処理を施した後、表１及び表２に示す条件で、
加熱処理を行なった。以上のようにして得られた銅箔表
面のぬれ指数（dyne／cm）を、JIS K 6768に記載の方法
に準拠して測定した。なお、JIS K 6768に記載のぬれ指
数標準液では測定不可能なものは、各々「30以下」又は
「56以上」として表わした。以上の結果を表１及び表２
に示した。Examples 1 to 20 and Comparative Examples 1 to 6 After toughness pitch copper having a purity of 99.90% or more is melted and cast, hot rolling is performed, and then cold rolling is performed. Further, the intermediate annealing and the cold rolling are repeatedly performed to obtain a thickness of 15 mm.
A μm copper foil was obtained. After subjecting the copper foil to a conventionally known solvent degreasing treatment, if desired, under the conditions shown in Tables 1 and 2,
Heat treatment was performed. The wetting index (dyne / cm) of the copper foil surface obtained as described above was measured according to the method described in JIS K 6768. In addition, those that cannot be measured with the wetting index standard solution described in JIS K 6768 are represented as “30 or less” or “56 or more”, respectively. Table 1 and Table 2 show the above results.
It was shown to.
【００１２】[0012]
【表１】 [Table 1]
【表２】 [Table 2]
【００１３】表１及び表２の結果から明らかなように、
実施例１〜20に係る方法で得られた銅箔は、加熱処理を
施さないもの（比較例１及び２）や加熱温度が150℃で
あるもの（比較例３〜６）に比べて、ぬれ指数が大きい
ことが分かる。従って、実施例に係る方法で得られた銅
箔表面には、圧延油の残存率が少なく、この銅箔を使用
すれば合成樹脂製フィルムとの接着性が良好になる。ま
た、例えば実施例１と４とを比較すれば明らかなよう
に、加熱処理の前に、溶剤脱脂処理を施した場合には、
溶剤脱脂処理を施さない場合に比べて、ぬれ指数が大き
くなることが分かる。As is clear from the results in Tables 1 and 2,
The copper foils obtained by the methods according to Examples 1 to 20 were wetter than those without heat treatment (Comparative Examples 1 and 2) and those with a heating temperature of 150 ° C. (Comparative Examples 3 to 6). It can be seen that the index is large. Therefore, the surface of the copper foil obtained by the method according to the example has a small residual ratio of the rolling oil, and the use of this copper foil improves the adhesion to the synthetic resin film. Also, for example, as is apparent from a comparison between Examples 1 and 4, when a solvent degreasing treatment was performed before the heat treatment,
It can be seen that the wetting index is larger than when no solvent degreasing treatment is performed.
【００１４】[0014]
【発明の効果】以上説明したように、冷間圧延時に付与
された圧延油が残存している銅箔に、不活性ガス雰囲気
下又は真空下で且つ180℃以上の温度で加熱処理を施せ
ば、圧延油が蒸発して、その除去が進行し、銅箔と合成
樹脂製フィルムとを貼合した場合、両者の接着力が向上
する。従って、電磁波シールド材等として、この貼合品
を使用した場合、剥離しにくく、耐久性のある電磁波シ
ールド材等が得られるという効果を奏する。また、銅箔
に各種塗料を塗布した場合にも、銅箔表面に圧延油がほ
とんど残存していないので、形成された塗膜と銅箔との
接着力が向上する。従って、塗膜が形成された銅箔を各
種用途に適用すれば、その耐久性が向上するという効果
をも奏する。As described above, the copper foil in which the rolling oil applied at the time of cold rolling remains is subjected to a heat treatment in an inert gas atmosphere or under vacuum and at a temperature of 180 ° C. or more. When the rolling oil evaporates and its removal proceeds, when the copper foil and the synthetic resin film are bonded to each other, the adhesive strength between them is improved. Therefore, when this bonded product is used as an electromagnetic wave shielding material or the like, an effect is obtained in that it is difficult to peel off and a durable electromagnetic wave shielding material or the like can be obtained. Further, even when various paints are applied to the copper foil, almost no rolling oil remains on the surface of the copper foil, so that the adhesion between the formed coating film and the copper foil is improved. Therefore, when the copper foil on which the coating film is formed is applied to various uses, there is an effect that the durability is improved.
Claims (2)
ガス雰囲気下又は真空下で且つ180℃以上の温度で加熱
処理を施すことにより、該銅箔表面に付着している圧延
油を蒸発させ、該銅箔表面のぬれ指数を34（dyne／cm）
以上にすることを特徴とする水ぬれ性の良い銅箔の製造
方法。1. A copper foil rolled to a desired thickness is subjected to a heat treatment at a temperature of 180 ° C. or more under an inert gas atmosphere or vacuum and a temperature of 180 ° C. or more, so that the roll adhered to the copper foil surface Oil is evaporated and the wetting index of the copper foil surface is 34 (dyne / cm)
A method for producing a copper foil having good water wettability, characterized by the above.
剤による脱脂処理を施した後、更に不活性ガス雰囲気下
又は真空下で且つ180℃以上の温度で加熱処理を施すこ
とにより、該銅箔表面に付着している圧延油を蒸発さ
せ、該銅箔表面のぬれ指数を34（dyne／cm）以上にする
ことを特徴とする水ぬれ性の良い銅箔の製造方法。2. A copper foil rolled to a desired thickness is subjected to a degreasing treatment with an organic solvent, and further subjected to a heat treatment at 180 ° C. or more in an inert gas atmosphere or under vacuum. A method for producing a copper foil having good water wettability, wherein the rolling oil adhering to the surface of the copper foil is evaporated to make the wetting index of the surface of the copper foil 34 (dyne / cm) or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5020648A JP2970724B2 (en) | 1993-01-12 | 1993-01-12 | Manufacturing method of copper foil with good water wettability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5020648A JP2970724B2 (en) | 1993-01-12 | 1993-01-12 | Manufacturing method of copper foil with good water wettability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06212375A JPH06212375A (en) | 1994-08-02 |
| JP2970724B2 true JP2970724B2 (en) | 1999-11-02 |
Family
ID=12033050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5020648A Expired - Fee Related JP2970724B2 (en) | 1993-01-12 | 1993-01-12 | Manufacturing method of copper foil with good water wettability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2970724B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2740144B1 (en) | 1995-10-18 | 1997-11-21 | Pechiney Rhenalu | ALMG ALLOY FOR WELDED CONSTRUCTS WITH IMPROVED MECHANICAL CHARACTERISTICS |
-
1993
- 1993-01-12 JP JP5020648A patent/JP2970724B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06212375A (en) | 1994-08-02 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |