JP2988232B2 - Electronic circuit device and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit device having a resin package for sealing a part of a lead, an electronic circuit board and wires, and a method of manufacturing the same. In particular, the present invention is suitably applied to an electronic circuit device of a type having a plurality of semiconductor chips on an electronic circuit board and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, as this kind of technique, for example, a technique disclosed in Japanese Patent Application Laid-Open No. 5-102217 is known. In this technique, for example, a method suitable for manufacturing an electronic circuit device (QFP IC) having a quad flat package is described. That is, the electronic circuit device includes an electronic circuit board (semiconductor pellet), a plurality of leads, a plurality of wires, and a resin package. The leads are radially wired outside the electronic circuit board, and the wires connect between the electrodes on the electronic circuit board and the inner ends of the leads. The package seals a part of each lead, the electronic circuit board, and the wires.

[0003] In molding the above package,
First, the electronic circuit board, a part of each lead, and a plurality of wires are arranged in the cavity by supporting and fixing the leads at predetermined positions of the mold. At this time, the gate of the mold is formed at a position substantially corresponding to the center of the electronic circuit board. Then, the plasticized resin is injected into the cavity. Then, the resin flows in a direction perpendicular to the electronic circuit board, and then diffuses in a direction in which the wires are arranged, that is, radially.

Therefore, according to the above technique, unlike the case where the gate is provided at the end (corner) of the cavity, the resin from the gate does not directly collide with the wire, and is connected in an arch shape. The dropped wire will not fall down. As a result, short-circuiting between adjacent wires due to the wires lying down is suppressed.

[0005]

However, in the above prior art, the electronic circuit board is directly subjected to the injection pressure of the resin, and the pressure may push the electronic circuit board. Therefore, there is a possibility that the electronic circuit board may move or a wire connecting the electronic circuit board and the lead may be cut.

[0006] Regarding the above-mentioned problems, the above publication discloses that
It is described that a holding pin is provided in the cavity so as to be able to advance and retreat in order to suppress the movement of the electronic circuit board. According to this configuration, even if the electronic circuit board is pressed by the pressure of the injected resin, it is possible to suppress the movement of the electronic circuit board by the holding pins.

However, in the case where the holding pin is provided so as to be able to advance and retreat in the cavity, the structure of the mold becomes extremely complicated, and as a result, the equipment becomes complicated,
This has led to an increase in manufacturing costs.

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to suppress the occurrence of problems such as movement of an electronic circuit board during manufacturing and to simplify the equipment. It is an object of the present invention to provide an electronic circuit device and a method of manufacturing the same.

[0009]

In order to achieve the above object, according to a first aspect of the present invention, there is provided an electronic circuit board on which an electronic circuit is formed, and a plurality of electronic circuit boards wired outside the electronic circuit board. Connecting a plurality of wires to the inner tip of the lead, installing a part of each of the leads, the electronic circuit board and the wires in a mold cavity, Inject the resin of reduced viscosity into the cavity from the gate of, a part of each lead,
Forming a package by sealing the electronic circuit board and the wires with the resin to form a package, wherein a through-hole is formed at a substantially central portion of the electronic circuit board; The gist is that a mold gate is provided at a position substantially corresponding to the through hole.

According to a second aspect of the invention, in the method for manufacturing an electronic circuit device of the first aspect, the gist is that the opening area of the gate is formed larger than the opening area of the through hole. I have.

In a third aspect of the present invention, in the method of manufacturing an electronic circuit device according to the first aspect, the center of the gate is shifted from the center of the through hole.

According to a fourth aspect of the present invention, in the method for manufacturing an electronic circuit device according to the first aspect, the through hole is
The gist of the invention is that it is constituted by a plurality of pores.

In addition, in the fifth invention, an electronic circuit board on which an electronic circuit is formed, a plurality of leads wired outside the electronic circuit board, and an electrode on the electronic circuit board And a plurality of wires connecting between the inner tip of the lead and a part of each of the leads, the electronic circuit board and the resin, formed by using a mold to seal the wires. In the electronic circuit device provided with a package, the electronic circuit board has a through hole formed at a substantially central portion thereof, and the package is provided with resin at a position substantially corresponding to the through hole on the surface thereof. The gist is that a trace of a gate for implantation is formed.

[0014]

According to the structure of the first aspect of the invention, first, between the electronic circuit board on which the electronic circuit is formed and the inner ends of the plurality of leads wired outside the electronic circuit board. Are connected by a plurality of wires. In addition, a part of each lead, an electronic circuit board, and a wire are set in a cavity of the mold. Then, a resin having a reduced viscosity is injected into the cavity from the gate of the mold, and a part of each of the leads, the electronic circuit board, and the wires are sealed with the resin to form a package. After the resin is cured, the resin is taken out of the cavity to obtain an electronic circuit device.

Here, in the present invention, a through hole is formed substantially at the center of the electronic circuit board, and a gate of a mold is provided at a position substantially corresponding to the through hole.
For this reason, a part of the resin injected from the gate flows in the direction perpendicular to the electronic circuit board, and thereafter diffuses in the arrangement direction of the wires, that is, radially. Further, the remaining part of the injected resin passes through the through hole and escapes to the opposite side of the gate. Then, on the other side,
The resin is diffused radially. So basically,
The resin from the gate does not directly collide with the wire, and the wire does not fall down. Further, the electronic circuit board does not receive all the pressure of the resin injected from the gate. Therefore, even if a special mechanism such as a holding pin is not provided, the electronic circuit board is suppressed from moving or vibrating due to being pressed by the pressure.

According to the structure of the second invention, in addition to the effect of the first invention, since the opening area of the gate is formed larger than the opening area of the through hole, the gate is injected from the gate. At least a portion of the resin that has hit the electronic circuit board reliably. Therefore, the effect that the resin is diffused radially can be made more reliable, and the amount of flowing resin can be efficiently distributed by further adjusting each opening area.

Further, according to the configuration of the third aspect, the first aspect
In addition to the function of the second invention, since the center of the gate is shifted from the center of the through hole, the same function as the function of the second invention is achieved.

In addition, according to the configuration of the fourth aspect, the first aspect
In addition to the operation of the invention, the through-hole is constituted by a plurality of pores, the size and number of the pores are adjusted, so that the amount of resin hitting the electronic circuit board and the through-holes are reduced. The amount of resin passing through can be adjusted.

In addition, according to the structure of the fifth aspect of the present invention, in the electronic circuit device, the electronic circuit board has a through hole formed substantially at the center thereof, and the package has a through hole formed on the surface thereof. Traces of the gate for injecting the resin are formed at positions substantially corresponding to. For this reason, when manufacturing the electronic circuit device, an operation substantially equivalent to the operation of the first invention is exerted.

Further, according to the electronic circuit device having the configuration of the present invention, the resin package is connected to the electronic circuit board via the through hole so as to sandwich the electronic circuit board.
For this reason, the bonding strength between the package and the electronic circuit board becomes relatively large.

[0021]

【Example】

(First Embodiment) A first embodiment embodying an electronic circuit device and a method of manufacturing the same according to the present invention will be described below in detail with reference to FIGS.

FIG. 1 is a sectional view showing an electronic circuit device 1 according to this embodiment. The electronic circuit device 1 includes an electronic circuit board 2
And a plurality of inner leads 3 as leads, a plurality of wires 4, and a resin package 5. A plurality of semiconductor chips 6 are mounted on the surface of the electronic circuit board 2. That is, in this embodiment, the electronic circuit device 1 is a so-called multi-chip module (MC
M). On the other side of the surface of the electronic circuit board 2 opposite to the semiconductor chip 6, a plurality of chip components 7 including resistors, capacitors and the like and islands 10 of the inner leads 3 are mounted. Further, an electronic circuit (not shown) is provided on the surface of the electronic circuit board 2. In addition, at a predetermined location on the surface of the electronic circuit board 2,
Electrodes (not shown) are provided, and are electrically connected to the semiconductor chip 6.

The inner leads 3 are wired radially (in the figure, in the left-right direction) outside the electronic circuit board 2. The wires 4 are bonded so as to connect between the electrodes on the electronic circuit board 2 and the inner ends of the inner leads 3.

The package 5 is made of, for example, an epoxy-based thermosetting resin, and seals the inner ends of the inner leads 3, the electronic circuit board 2 and the wires 4.

In this embodiment, a through hole 8 is formed at a substantially central portion of the electronic circuit board 2. The resin constituting the package 5 is inserted into the through hole 8. Also, a mark (not shown) of a gate 9 described later remains at a position substantially corresponding to the through hole 8 on one end face (lower end face in the figure) of the package 5.

Next, the mold 11 used for molding the package 5 will be described. As shown in FIG. 2, the mold 11 includes an upper mold 12 and a lower mold 13.
These two dies 12 and 13 form a cavity 14 for molding the package 5. As shown in the figure, at the boundary (PL) between the upper mold 12 and the lower mold 13, at least the outer end of the inner lead 3 is sandwiched and fixed between the upper mold 12 and the lower mold 13. ing. Further, a gate 9 for injecting a resin is formed substantially at the center of the lower mold 13 so as to extend in the vertical direction in the drawing. The opening area of the gate 9 is formed to be somewhat larger than the opening area of the through hole 8. The gate 9 is connected to the pot via a runner (not shown). The pot is a place for accommodating a pre-heated tablet-shaped resin having a reduced viscosity. When the resin is compressed by the plunger, the resin is pressure-fed in the runner and injected from the gate 9 into the cavity 14.

Next, a description will be given of a method of manufacturing the electronic circuit device 1 and the functions and effects at the time of manufacturing. First, based on a known wire bonding technique, a predetermined electrode on the electronic circuit board 2 on which an electric circuit or the like is formed and the inner end of the inner lead 3 are connected by a plurality of wires 4.

Subsequently, the electronic circuit board 2 and the inner leads 3
And the one in which the wire 4 is integrated is set at a predetermined position of the mold 11. That is, as shown in FIG.
Then, the lower die 13 is supported and fixed so as to sandwich the outer end of the inner lead 3. Then, the electronic circuit board 2, the inner end of the inner lead 3, and the wire 4 are arranged in the cavity 14 in a state of being suspended in the air.

Next, from this state, the tablet-like resin, which has been stored in the pot and has been preheated and has a reduced viscosity, is compressed by the plunger. Then, as shown in FIG. 3, the resin is pressure-fed in the runner and injected from the gate 9 into the cavity 14.

At this time, a through hole 8 is formed substantially at the center of the electronic circuit board 2, and a gate 9 is provided at a position substantially corresponding to the through hole 8. Therefore, the resin injected from the gate 9 flows in a direction perpendicular to the electronic circuit board 2. Then, a part thereof hits the electronic circuit board 2 and is subsequently diffused in the arrangement direction of the inner wires 3, that is, radially. Further, the remaining part of the injected resin passes through the through hole 8 and escapes to the opposite side (upper side in the figure) of the gate 9. Thereafter, on the opposite side, the resin is radially diffused.

Then, as shown in FIG. 4, after the cavity 14 is filled with the resin, the resin is thermally cured by the heat transfer from the mold 11, and the molding of the package 5 is completed. After the resin is completely cured, the mold 11 is opened, and the electronic circuit device 1 is obtained.

As described above, in the present embodiment, of the resin injected from the gate 9 and flowing in the direction perpendicular to the electronic circuit board 2, the remaining resin that does not pass through the through hole 8 is the electronic circuit board. Two hits. Then, the wires 4 are diffused in the arrangement direction of the wires 4, that is, radially.
Therefore, basically, the resin from the gate 9 does not directly collide with the wire 4 and the wire 4 does not fall down. As a result, it is possible to prevent the adjacent wires 4 from being short-circuited due to the overturning of the wires 4. Further, in this embodiment, since the opening area of the gate 9 is larger than the opening area of the through hole 8, at least a part of the resin injected from the gate 9 surely hits the electronic circuit board 2. Therefore, the above-described operation and effect can be further ensured. Further, by adjusting each opening area, the amount of flowing resin can be efficiently distributed.

In this embodiment, since the through hole 8 is formed at a position substantially corresponding to the gate 9, a part of the resin injected from the gate 9 passes through the through hole 8 and passes through the gate 9.
And diffuses and flows on the other side. Therefore, the electronic circuit board 2 does not need to receive all the pressure of the resin injected from the gate 9. Therefore, unlike the related art in which it is necessary to provide a special mechanism such as a holding pin, it is possible to suppress the electronic circuit board 2 from being moved or vibrated by being pressed by pressure with an extremely simple configuration. it can. As a result, it is possible to suppress the occurrence of problems such as the movement of the electronic circuit board 2 and the cutting of the wires 4 and to simplify the equipment including the mold 11.

Further, in this embodiment, the molded package 5 is consequently connected so as to sandwich the electronic circuit board 2 through the through hole 8. Therefore, the bonding strength between the package 5 and the electronic circuit board 2 can be further increased. As a result, the durability of the electronic circuit device 1 against external impact can be improved.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIG. However, also in this embodiment, since the basic configuration of the electronic circuit device is almost the same as that of the first embodiment, the same members are denoted by the same reference numerals and description thereof will be omitted.

As shown in FIG. 5, also in this embodiment,
The electronic circuit board 2 has a through hole 16 formed therein. However, this is different from the first embodiment in that the center of the through hole 16 and the center of the gate 9 are shifted.

In this embodiment, the same operation and effect as those of the first embodiment can be obtained. That is, the electronic circuit board 2
Of the resin flowing in the vertical direction, a part of the resin injected from the gate 9 passes through the through hole 16 to the opposite side of the gate 9, and diffuses and flows on the opposite side. For this reason, the electronic circuit board 2 does not need to receive all the pressure of the resin injected from the gate 9, and it is possible to suppress the electronic circuit board 2 from being moved or vibrated by the pressure. .

Further, since the center of the through hole 16 is shifted from the center of the gate 9, the remaining resin that does not pass through the through hole 8 is generated without fail. Then, the resin surely hits the electronic circuit board 2. The resin is diffused in the direction in which the wires 4 are arranged, that is, radially. That is, the resin can be made to diffuse and flow above and below the electronic circuit board 2, and the amount of the flowing resin can be efficiently distributed by appropriately adjusting the positions of the through holes 16 and the gates 9. .

(Third Embodiment) Next, a third embodiment of the present invention will be described with reference to FIG. However, also in this embodiment, since the basic configuration of the electronic circuit device is almost the same as that of the first and second embodiments, the same members are denoted by the same reference numerals, and description thereof will be omitted. .

As shown in FIG. 6, also in this embodiment,
The electronic circuit board 2 has a through hole 17 formed therein. However, the through hole 17 is different from the first and second embodiments in that the through hole 17 is constituted by a plurality of small holes 17a gathered.

In this embodiment, the same operation and effect as those of the first and second embodiments can be obtained. Further, by adjusting the size and number of the fine holes 17a, the electronic circuit board 2
And the amount of resin passing through the through-hole 17 can be adjusted.

It should be noted that the present invention is not limited to the above-described embodiments, but may be implemented as follows by appropriately changing a part of the configuration without departing from the spirit of the invention. (1) In each of the above embodiments, the configuration is adopted in which the wire 4 is bonded so as to connect between the electrode on the electronic circuit board 2 and the inner end of the inner lead 3.
The configuration may be such that the semiconductor chip 6 and the inner end of the inner lead 3 are connected by the wire 4.

(2) In each of the above embodiments, the inner lead 3 is used as a lead, but a lead frame may be used instead. (3) The configuration may be such that the chip component 7 in each of the above embodiments is partially or entirely omitted. Further, a configuration in which these chip components 7 are mounted on the same side as the semiconductor chip 6 may be adopted.

[0044]

As described above in detail, according to the electronic circuit device and the method of manufacturing the same of the present invention, it is possible to suppress the occurrence of troubles such as the movement of the electronic circuit board during the manufacturing, and to improve the equipment. An excellent effect that simplification can be achieved is achieved.

Further, by applying the second to fourth inventions in particular, the above effect can be further ensured. Further, according to the fifth aspect, in addition to the above-described effects at the time of manufacturing, the bonding strength between the package and the electronic circuit board can be increased, and the durability against external impacts and the like can be improved. An excellent effect is achieved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic circuit device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a mold for molding a package when the electronic circuit device according to the first embodiment is manufactured.

FIG. 3 is a partial sectional view showing a state in which a resin is injected into a cavity of a mold in the first embodiment.

FIG. 4 is a sectional view showing a state in which a resin is filled in a cavity of a mold in the first embodiment.

FIG. 5 is a sectional view showing a mold for molding a package when manufacturing an electronic circuit device according to a second embodiment of the present invention.

FIG. 6 is a cross-sectional view showing a mold for molding a package when manufacturing an electronic circuit device according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Electronic circuit device, 2 ... Electronic circuit board, 3 ... Inner lead as a lead, 4 ... Wire, 5 ... Package, 8,
16, 17 ... through-hole, 9 ... gate, 11 ... mold, 14 ...
Cavities, 17a ... pores.

──────────────────────────────────────────────────の Continued on front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 21/56

Claims (5)

(57) [Claims] A step of connecting a plurality of wires between an electronic circuit board on which an electronic circuit is formed, and inner ends of a plurality of leads wired outside the electronic circuit board; Placing a part of each of the leads, the electronic circuit board and the wire in a cavity of a mold; and injecting a resin having a reduced viscosity into the cavity from the gate of the mold to form each of the leads. Forming a package by sealing a part of the electronic circuit board and the wire with the resin to form a package, wherein a through hole is formed at a substantially central portion of the electronic circuit board. And a gate of the mold is provided at a position substantially corresponding to the through hole. 2. The method of manufacturing an electronic circuit device according to claim 1, wherein an opening area of the gate is formed larger than an opening area of the through hole. Method. 3. The method of manufacturing an electronic circuit device according to claim 1, wherein a center of said gate is shifted from a center of said through hole. 4. The method for manufacturing an electronic circuit device according to claim 1, wherein said through-hole is constituted by a plurality of pores. 5. An electronic circuit board on which an electronic circuit is formed; a plurality of leads wired outside the electronic circuit board; electrodes on the electronic circuit board; An electronic circuit device comprising: a plurality of wires connecting between the plurality of wires; and a part of each of the leads, a resin package molded by using a mold to seal the electronic circuit board and the wires. In the electronic circuit board, a through hole is formed at a substantially central portion of the electronic circuit board, and the package has a trace of a gate for injecting a resin at a position substantially corresponding to the through hole on the surface of the package. An electronic circuit device characterized by being formed.