JP2990966B2 - IC card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of an IC card.

[0002]

2. Description of the Related Art As shown in FIG.
A connector connection lead 2 is soldered to an edge of the module substrate 1 on which the semiconductor device is mounted, and a connector 3 is connected to the connector connection lead 2. Then, four sides of the module substrate 1 are fitted into the thermoplastic frame 4. Thereafter, the adhesive sheets 6 are attached to both surfaces of the thermoplastic frame 4 and the decorative panel 8 is attached thereon, thereby completing the process. Here, when producing the module substrate, FR
Generally, the semiconductor device is soldered to both sides of the substrate such as -4 by two reflows, and the four sides of the module substrate 1 are fixed to the thermoplastic frame 4.

[0003]

In the structure of the conventional IC card, since the four sides of the module substrate to which the components such as ICs are soldered are fixed to the thermoplastic frame, the IC card body is bent by an external force. If so, there is a problem that the module substrate is also bent at the same time.

[0004] The module substrate is generally 0.3 mm.
A thick FR-4 material is used.
It is necessary to perform reflow soldering process twice
Because of the large thermal stress applied to the substrate, there was a possibility that the reliability was impaired.

An object of the present invention is to provide an IC card which has improved reliability against bending resistance and has simplified the manufacturing process.

[0006]

In order to achieve the above object, an IC card according to the present invention is an IC card having a module substrate, a connector, and a frame, wherein the module substrate has a film shape, A component such as a semiconductor device is mounted and folded in two, and a lead is provided on the folded edge. The connector is fixed to the folded edge of the module board, and the lead of the board is The frame is electrically connected, and the frame is formed in a frame shape, both ends of which are connected to the connector, surrounds the periphery of the module substrate, and supports the folded portion of the module substrate.

[0007]

The entire periphery of the module substrate is not integrally fixed to the thermoplastic frame, and only a part thereof is supported. Therefore, no external force is directly applied from the entire periphery of the module substrate, and the module substrate is not forcibly bent.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings.

FIG. 1 is an exploded perspective view showing an IC card according to a first embodiment of the present invention. FIG. 2 is a partial sectional view after assembling the IC card of FIG.

In FIG. 1, an IC card according to the present embodiment is obtained by folding a film-shaped module substrate 1 on which components such as ICs are mounted into two, and then thermocompression-bonding a connector connection lead 2 to the tip of the lead 2. Is inserted into the connector 3.

On the other hand, the thermoplastic frame 4 is formed by bending in a cross-girder shape, and one side is open. Frame 4
In this example, a pair of hook-shaped locking pieces 4a, 4a are provided on the opposite edges of the open side, and the module board support pins 5 are provided on the inner side of the opposite edge sandwiching the open side. I have.

The module substrate 1 folded into two is:
The module board supporting pins 5 of the frame 4 are inserted into the folded side, and three sides of the frame 4 except for the side where the connector connection lead 2 is provided are surrounded by the thermoplastic frame 4.

The connector 3 covers a side of the module substrate 1 which is not surrounded by the frame 4 and has a hook 3a.
Is hooked from the outside of the frame 4 to the hook-shaped locking pieces 4a, 4a for connection. The module board 1 is provided with a through hole 1a for inserting a spring in the folded superposed surface.

The thermoplastic frame 4 includes a double-sided adhesive sheet 6
Are bonded to the opposite end faces in the thickness direction. The decorative panel 8 is adhered to the double-sided adhesive sheet 6. The decorative panel 8 includes a spring 7 installed in the through hole 1a of the substrate 1.
Is compressed from above and below.

FIG. 2 is a sectional view showing a completed state.
In this embodiment, the module substrate 1 is fixed only to the connector 3, and is supported by the thermoplastic frame 4 via the support pins 5. Therefore, as shown in the conventional example of FIG. 5, since the module substrate 1 is different from the structure in which the entire surface is sandwiched by the thermoplastic frame 4, the module substrate 1 is not directly bent when the IC card is bent. .

FIG. 3 is a view showing a process of printing a solder paste on the module substrate 1. In the related art, a solder paste is printed on the front surface of a module substrate, components are mounted through a reflow furnace, the solder mask is changed, and the solder paste is reprinted on the back surface, and the mounted module substrate is completed again through the reflow furnace.

On the other hand, according to the present invention, a mounted module substrate can be manufactured by only one reflow mounting process.

First, since the module substrate 1 is a film-like substrate made of polyimide or the like, the module substrate 1 is stuck on the heat-resistant substrate 10 using the temporary fixing adhesive 9. Next, the heat-resistant substrate 10 is fixed to the solder paste printing machine table 11, the solder mask 12 is aligned, and the solder paste 14 is printed by the squeegee 13. Thereafter, components such as ICs are mounted at predetermined positions, and the module substrate 1 together with the heat resistant substrate 10 is passed through a reflow furnace and mounted. Thereafter, the module substrate 1 is peeled off from the heat-resistant substrate 10 and folded at the center of the module substrate 1 which is not a component mounting portion such as an IC, so that the module substrate 1 is equivalent to or less than a module substrate conventionally made of FR-4 or the like. The thickness becomes feasible.

Embodiment 2 FIG. 4 is a longitudinal sectional view showing an IC card according to Embodiment 2 of the present invention. In the second embodiment, a groove 4a is provided on the opposite wall of the connector connection portion of the thermoplastic frame 4 so that the folded portion of the module board fits. In this case, the module supporting pin 5 as in the first embodiment is not required, and when the thermoplastic frame is integrally formed, there is no protrusion, so that the moldability can be improved.

[0020]

As described above, according to the present invention, since the module substrate is not completely fixed to the thermoplastic frame, the module substrate itself is not bent with respect to the bending applied to the IC card, and the components such as ICs are not bent. This has the effect of avoiding the problem that the soldered portion is dislocated.

In addition, since the module of the thermoplastic frame is not affected by the position of components such as ICs mounted on the substrate, there is an effect that it is not necessary to manufacture a thermoplastic frame for each type as in the related art. Furthermore, since a single-sided reflow mounting is performed using a film-like substrate such as polyimide as a material of the module substrate, and the module substrate is folded and incorporated into the IC card, the component mounting process can be shortened.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an IC card according to a first embodiment of the present invention.

FIG. 2 is a longitudinal sectional view taken along line AA ′ of FIG. 1 after assembly.

FIG. 3 is a view showing a process of printing solder paste on the module substrate shown in FIG. 1;

FIG. 4 is a longitudinal sectional view showing an IC card according to a second embodiment of the present invention.

FIG. 5 is a longitudinal sectional view showing a conventional IC card.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Module board 2 Connector connection lead 3 Connector 4 Thermoplastic frame 4a Groove 5 Module board support pin 6 Double-sided adhesive sheet 7 Spring 8 Decorative panel 9 Temporary adhesive 10 Heat resistant flat plate 11 Solder paste printing machine table 12 Solder mask 13 Squeegee 14 Solder paste

Claims (1)

(57) [Claims] 1. An IC card having a module substrate, a connector, and a frame, wherein the module substrate has a film shape, a component such as a semiconductor device is mounted, the module substrate is folded in two, and the folded edge is folded. The connector is fixed to the folded edge of the module substrate, and the lead of the substrate is electrically connected. The frame is formed in a frame shape and the connector is An IC card having both ends joined to surround a periphery of the module substrate and supporting a folded portion of the module substrate.