JP3000431B2 - Method for testing abatement agents and their raw materials - Google Patents
Method for testing abatement agents and their raw materialsInfo
- Publication number
- JP3000431B2 JP3000431B2 JP8101379A JP10137996A JP3000431B2 JP 3000431 B2 JP3000431 B2 JP 3000431B2 JP 8101379 A JP8101379 A JP 8101379A JP 10137996 A JP10137996 A JP 10137996A JP 3000431 B2 JP3000431 B2 JP 3000431B2
- Authority
- JP
- Japan
- Prior art keywords
- cupric hydroxide
- crystal grain
- grain size
- abatement
- diffraction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Treating Waste Gases (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Description
【0001】[0001]
【発明の属する技術分野】本発明は、除害剤及びその原
料の検査方法に関し、詳しくは、半導体製造工程等で原
材料ガスとして使われる揮発性無機水素化物、揮発性無
機ハロゲン化物、あるいは、有機金属化合物等の有害成
分を除害するための結晶性の水酸化第二銅を主成分とす
る除害剤及びこの除害剤を製造する際の原料の検査方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an abatement agent and a method for inspecting a raw material thereof, and more particularly, to a volatile inorganic hydride, a volatile inorganic halide, or an organic compound used as a raw material gas in a semiconductor manufacturing process or the like. The present invention relates to a scavenger containing crystalline cupric hydroxide as a main component for removing a harmful component such as a metal compound, and a method of inspecting a raw material when producing the scavenger.
【0002】[0002]
【従来の技術】半導体製造工程では、各種半導体基板処
理装置に、原材料ガスとして、シラン,アルシン,ホス
フィン等の揮発性無機水素化物や、揮発性無機ハロゲン
化物あるいは有機金属化合物が供給される。したがっ
て、各種半導体基板処理装置からの排ガスには、未反応
の前記原材料ガスが含まれる。これらの原材料ガスは有
害なので、排ガスを大気に放出する前に、排ガス中のこ
れらの有害成分を除害処理して無害化する必要がある。2. Description of the Related Art In a semiconductor manufacturing process, a volatile inorganic hydride such as silane, arsine, phosphine, a volatile inorganic halide or an organometallic compound is supplied as a raw material gas to various semiconductor substrate processing apparatuses. Therefore, the exhaust gas from various semiconductor substrate processing apparatuses includes the unreacted raw material gas. Since these raw material gases are harmful, it is necessary to remove these harmful components in the exhaust gas to make them harmless before releasing the exhaust gas to the atmosphere.
【0003】前記有害成分を含む排ガスの無害化処理と
しては、酸化銅等の金属酸化物を反応主成分とする固体
除害剤を充填した除害筒に、前記排ガスを流通する方法
が普及している。しかし、金属酸化物を反応主成分とす
る固体除害剤は、揮発性無機水素化物の中で、シランに
対しては、その処理量が小さいという欠点があった。As a method of detoxifying the exhaust gas containing the harmful components, a method of distributing the exhaust gas to a detoxifying cylinder filled with a solid detoxifying agent containing a metal oxide such as copper oxide as a main component has been widely used. ing. However, among the volatile inorganic hydrides, the solid abatement agent containing a metal oxide as a main component has a disadvantage that the treatment amount of silane is small.
【0004】そこで、金属酸化物の前記欠点を解決すべ
く、本出願人は、先に、水酸化第二銅を反応主成分とし
た除害剤を提案した(特開平6ー319945号公報参
照)。そして、水酸化第二銅としては結晶性のものがシ
ランに対して優れた除害能力のあること、さらに、シラ
ン以外の揮発性無機水素化物や、揮発性無機ハロゲン化
物、有機金属化合物等にも、広く除害能力を発現するこ
とを開示した。[0004] In order to solve the above-mentioned drawbacks of metal oxides, the present applicant has previously proposed an abatement agent containing cupric hydroxide as a reaction main component (see JP-A-6-319945). ). And, as cupric hydroxide, a crystalline thing has an excellent abatement ability to silane, and further, to volatile inorganic hydrides other than silane, volatile inorganic halides, organometallic compounds, etc. Also disclosed that the abatement ability was widely exhibited.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、結晶性
の水酸化第二銅を種々用意して、これをペレットに成形
し、これらを用いて有害成分の除害処理を行うと、除害
性能にバラツキの起こることがあった。そこで、本発明
者らは、結晶性の水酸化第二銅を反応主成分とする除害
剤において、性能のバラツキの原因を究明し、性能の安
定した除害剤を得るために鋭意研究を重ねた。その結
果、化学的には同じCu(OH)2 と表示される結晶性
の水酸化第二銅であっても、その結晶粒径によって性能
が異なることを知見した。However, when various crystalline cupric hydroxides are prepared, formed into pellets, and detoxification of harmful components is performed using these, the detoxification performance is reduced. Variation sometimes occurred. In view of the above, the present inventors have investigated the cause of the dispersion in the performance of the abatement agent containing crystalline cupric hydroxide as a main component of the reaction, and conducted intensive research to obtain an abatement agent with stable performance. Stacked. As a result, it has been found that even if the cupric hydroxide is crystalline, which is chemically expressed as Cu (OH) 2 , the performance differs depending on the crystal grain size.
【0006】[0006]
【課題を解決するための手段】本発明の除害剤及びその
原料の検査方法は、上記知見に基づいて成されたもので
あって、本発明の除害剤は、結晶性の水酸化第二銅を反
応主成分とする除害剤であって、水酸化第二銅のX線回
折から、水酸化第二銅の格子面(0,2,1)の回折線
を用いてシェラー(Scherrer)の式、「D=
(0.9・λ)/(β・cosθ)」(式中、Dは結晶
粒径[オングストローム]、λはX線の波長[オングス
トローム],βは回折線の半値幅[ラジアン]、θは回
折角である。)によって求めた結晶粒径Dが40オング
ストローム以上である水酸化第二銅を主として用いるこ
とを特徴としている。Means for Solving the Problems The abatement agent of the present invention and the method for inspecting the raw material thereof are made based on the above-mentioned findings. It is an abatement agent containing cupric copper as a main component, and is obtained from X-ray diffraction of cupric hydroxide using a diffraction line of a lattice plane (0, 2, 1) of cupric hydroxide. ), "D =
(0.9 · λ) / (β · cos θ) ”(where D is the crystal grain size [angstrom], λ is the X-ray wavelength [angstrom], β is the half-width of the diffraction line [radian], θ is (Diffraction angle)) is characterized mainly by using cupric hydroxide having a crystal grain size D of 40 Å or more.
【0007】また、本発明の除害剤原料の検査方法は、
結晶性の水酸化第二銅を主成分とした原料をペレットに
成形して除害剤を製造するにあたり、該原料のX線回折
から、水酸化第二銅の格子面(0,2,1)の回折線を
用いて前記シェラーの式によって求めた結晶粒径Dが4
0オングストローム以上の水酸化第二銅を合格とするこ
とを特徴としている。[0007] Further, the method for inspecting raw materials for abatement agents of the present invention comprises:
When a raw material containing crystalline cupric hydroxide as a main component is formed into pellets to produce an abatement agent, a lattice plane (0, 2, 1) of cupric hydroxide is determined from X-ray diffraction of the raw material. The crystal grain size D obtained by the above-mentioned Scherrer's formula using the diffraction line of 4) is 4
It is characterized in that cupric hydroxide of 0 Å or more is accepted.
【0008】さらに、除害対象がシランを含む場合に
は、前記シェラーの式によって求めた結晶粒径Dが90
オングストローム以上である水酸化第二銅を合格として
これを除害剤の主成分として用いることを特徴としてい
る。[0008] Further, when the harmful substance contains silane, the crystal grain size D obtained by the above Scherrer's formula is 90%.
It is characterized in that cupric hydroxide having a thickness of Å or more is accepted and used as a main component of the abatement agent.
【0009】上記除害剤の反応主成分として用いる水酸
化第二銅は、一般に、各種銅塩(II)の水溶液を各種塩
基で中和して沈殿させ、これを濾過・乾燥することによ
り得られる。そこで、前記中和法における条件を変えて
種々の水酸化銅を作成し、また、市販の水酸化第二銅も
含めて、これらを粉末法X線回折に供した。そして、水
酸化第二銅の格子面(0,2,1)の回折線を用いて前
記シェラーの式により結晶粒径を求めたところ、結晶粒
径が算出不能な非晶質状態のものから、結晶粒径が20
0オングストローム程度のものまでが存在した。なお、
200オングストロームを超える大きな結晶粒径のもの
は、通常の方法では作成することが困難であった。The cupric hydroxide used as the main reaction component of the abatement agent is generally obtained by neutralizing and precipitating an aqueous solution of various copper salts (II) with various bases, followed by filtration and drying. Can be Thus, various copper hydroxides were prepared by changing the conditions in the neutralization method, and these were also subjected to powder X-ray diffraction, including commercially available cupric hydroxide. Then, the crystal grain size was determined by the above-mentioned Scherrer's formula using the diffraction line of the lattice plane (0, 2, 1) of cupric hydroxide. , With a crystal grain size of 20
Up to about 0 angstroms were present. In addition,
Those having a large crystal grain size exceeding 200 angstroms were difficult to prepare by a usual method.
【0010】次に、各種結晶粒径の水酸化第二銅を使用
して除害実験を行った結果、前記シェラーの式により求
めた結晶粒径と除害性能との関連性が極めて強く、結晶
粒径が大きい程、除害性能が良いことが判明した。すな
わち、図1のX線回折チャートにおいて線Aで示す結晶
性のものは、線Bで示す非結晶性のものに比べて優れた
除害性能を発揮する。Next, as a result of conducting an abatement experiment using cupric hydroxide having various crystal grain sizes, the relationship between the crystal grain size obtained by the above-mentioned Scherrer's formula and the abatement performance was extremely strong. It was found that the larger the crystal grain size, the better the abatement performance. That is, in the X-ray diffraction chart of FIG. 1, the crystalline one shown by the line A exhibits more excellent abatement performance than the non-crystalline one shown by the line B.
【0011】そして、除害対象ガスとなる有害成分を種
々選択して除害性能を検討した結果、シラン以外の有害
成分においては、前記シェラーの式により求めた結晶粒
径が40オングストローム未満では充分な性能が得られ
ず、40オングストローム以上の結晶粒径のものが除害
剤として好適であることが判明した。さらに、シランを
対象にして結晶粒径と除害性能との関連性を検討したと
ころ、シランに対しては、前記シェラーの式により求め
た結晶粒径が40オングストローム以上のものならば、
それ以下のものよりある程度の除害能力の向上が図れる
が、90オングストローム以上の水酸化第二銅を用いる
ことにより、十分な除害性能が得られることが判明し
た。As a result of examining the harmful performance by variously selecting harmful components to be a harmful gas, it was found that, with respect to harmful components other than silane, if the crystal grain size determined by the above-mentioned Scherrer's formula is less than 40 Å, it is sufficient. Performance was not obtained, and those having a crystal grain size of 40 Å or more were found to be suitable as a scavenger. Furthermore, when the relationship between the crystal grain size and the abatement performance was examined for silane, for silane, if the crystal grain size determined by the Scherrer's formula was 40 Å or more,
Although it is possible to improve the detoxification ability to some extent as compared with those below, it has been found that sufficient detoxification performance can be obtained by using cupric hydroxide of 90 Å or more.
【0012】また、結晶粒径が90オングストローム以
上の水酸化第二銅は、シランのみならず、他のアルシン
やホスフィンをはじめとする各種有害成分を、より高効
率で除害することができるので、シランを含む、含まな
いにかかわらず、90オングストローム以上の結晶粒径
の水酸化第二銅を除害剤の主成分とすることが好まし
い。In addition, cupric hydroxide having a crystal grain size of 90 Å or more can more efficiently remove not only silane but also other harmful components such as other arsine and phosphine. Preferably, cupric hydroxide having a crystal grain size of 90 Å or more, whether or not containing silane, is used as the main component of the scavenger.
【0013】このような水酸化第二銅を原料とする除害
剤は、ガスの通気性を考慮して適当な形状に成形する必
要があるが、水酸化第二銅粉末をそのまま打錠機等を用
いてペレットに成形してもよく、水酸化第二銅粉末に担
体や安定化剤として他の物質を加えてからペレットに成
形してもよい。さらに、銅塩(II)の水溶液を中和して
水酸化銅を作成する際に、水溶液中に担体や安定化剤と
して作用する物質を加えて共沈させることにより得た粉
末を原料とすることもできる。Although it is necessary to form such an abatement agent using cupric hydroxide as a raw material in consideration of gas permeability, the cupric hydroxide powder is used as is in a tableting machine. Or the like, or may be formed into a pellet after adding another substance as a carrier or a stabilizer to the cupric hydroxide powder. Furthermore, when preparing an aqueous solution of copper salt by neutralizing an aqueous solution of copper salt (II), a powder obtained by adding a substance acting as a carrier or a stabilizer to the aqueous solution and co-precipitating it is used as a raw material. You can also.
【0014】さらに、打錠機でペレットに成形する際に
水酸化第二銅の結晶粒径が変化するかどうか確認したと
ころ、この成形工程では、水酸化第二銅の結晶粒径は、
変化しないことが確認された。したがって、成形前の原
料をX線回折に供し、結晶粒径が40オングストローム
未満の水酸化第二銅を不適格として選別すれば、成形工
程前に、その水酸化第二銅が除害剤として適当かどうか
を判定することができ、不適格なものを成形するという
無駄を省くことができるとともに、除害剤として所定の
性能を有するものを提供することができる。Further, when it was confirmed whether or not the crystal particle size of cupric hydroxide changes when being formed into pellets with a tableting machine, in this forming step, the crystal particle size of cupric hydroxide is as follows:
It was confirmed that it did not change. Therefore, if the raw material before molding is subjected to X-ray diffraction and the cupric hydroxide having a crystal grain size of less than 40 angstroms is selected as unqualified, the cupric hydroxide is used as a scavenger before the forming step. It is possible to judge whether or not it is appropriate, and it is possible to eliminate the waste of molding an unsuitable one, and to provide an abatement agent having a predetermined performance.
【0015】本発明の除害剤で除害処理を行うことがで
きる有害成分は、特に、半導体製造工場等で使用される
揮発性無機水素化物,揮発性無機ハロゲン化物,有機金
属化合物である。前記揮発性無機水素化物としては、ジ
ボラン,シラン,ジシラン,ゲルマン,アンモニア,ホ
スフィン,アルシン,硫化水素,セレン化水素等を挙げ
ることができ、また、揮発性無機ハロゲン化物として
は、三フッ化ホウ素,三塩化ホウ素,四フッ化ケイ素,
ジクロルシラン,トリクロルシラン,四塩化ケイ素,ト
リクロルアルシン,六フッ化タングステン,フッ素,塩
素,フッ化水素,塩化水素,臭化水素等、ハロゲンガス
も含む各種ガスを挙げることができる。The harmful components which can be subjected to the abatement treatment with the abatement agent of the present invention are, in particular, volatile inorganic hydrides, volatile inorganic halides, and organometallic compounds used in semiconductor manufacturing plants and the like. Examples of the volatile inorganic hydride include diborane, silane, disilane, germane, ammonia, phosphine, arsine, hydrogen sulfide, and hydrogen selenide. Examples of the volatile inorganic hydride include boron trifluoride. , Boron trichloride, silicon tetrafluoride,
Examples include various gases including halogen gas such as dichlorosilane, trichlorosilane, silicon tetrachloride, trichloroarsine, tungsten hexafluoride, fluorine, chlorine, hydrogen fluoride, hydrogen chloride, and hydrogen bromide.
【0016】さらに、有機金属化合物としては、アルキ
ル基を含むものとして、ジメチル亜鉛,ジエチル亜鉛,
トリメチルアルミニウム,トリエチルアルミニウム,ト
リメチルガリウム,トリエチルガリウム,トリメチルイ
ンジウム,トリエチルインジウム,テトラメチル錫,テ
トラエチル錫,ターシャリーブチルホスフィン,トリメ
チルアルシン,トリエチルアルシン,ターシャリーブチ
ルアルシン等を、アルコキシド基を含むものとして、ジ
メトキシ亜鉛,トリブトキシガリウム,トリメトキシボ
ロン,トリエトキシボロン,テトラメトキシシラン,テ
トラエトキシシラン,テトラメトキシゲルマン,テトラ
エトキシゲルマン,テトラターシャリーブトキシ錫,ト
リメトキシホスフィン,トリエトキシホスフィン,トリ
メトキシアルシン,トリエトキシアルシン,テトラエト
キシセレン,テトラメトキシチタン,テトラエトキシチ
タン,テトライソプロポキシチタン,テトライソプロポ
キシジルコニウム,テトラターシャリーブトキシジルコ
ニウム,ペンタメトキシタンタル,ペンタエトキシタン
タル等をそれぞれ挙げることができる。Further, as the organometallic compound, dimethyl zinc, diethyl zinc,
Trimethylaluminum, triethylaluminum, trimethylgallium, triethylgallium, trimethylindium, triethylindium, tetramethyltin, tetraethyltin, tertiarybutylphosphine, trimethylarsine, triethylarsine, tertiarybutylarsine, etc. as those containing an alkoxide group; Dimethoxyzinc, tributoxygallium, trimethoxyboron, triethoxyboron, tetramethoxysilane, tetraethoxysilane, tetramethoxygermane, tetraethoxygermane, tetratertiarybutoxytin, trimethoxyphosphine, triethoxyphosphine, trimethoxyarsine, trimethoxyzinc Ethoxyarsine, tetraethoxyselenium, tetramethoxytitanium, tetraethoxytitanium, tetraiso Ropokishichitan, tetraisopropoxy zirconium, tetra-tertiary-butoxy zirconium, pentamethoxy tantalum, pentaethoxytantalum etc. can be mentioned, respectively.
【0017】[0017]
【実施例】以下、本発明の実施例及び比較例を説明す
る。 実施例及び比較例 種々の水酸化第二銅試料をX線(CuKα)回折に供
し、(0,2,1)面の回折線(図1参照)の半値幅を
測定し(標準Siで補正)、前記シェラーの式によって
結晶粒径を算出し、表1に示すように、結晶粒径が30
〜170オングストロームの範囲の水酸化第二銅原料を
6種類使用した。EXAMPLES Examples and comparative examples of the present invention will be described below. Examples and Comparative Examples Various cupric hydroxide samples were subjected to X-ray (CuKα) diffraction, and the half-value width of the diffraction line (see FIG. 1) on the (0, 2, 1) plane was measured (corrected with standard Si). ), The crystal grain size was calculated by the above Scherrer's formula, and as shown in Table 1, the crystal grain size was 30
Six types of cupric hydroxide raw materials in the range of -170 angstroms were used.
【0018】これらの各種水酸化第二銅の原料粉末を打
錠機で厚さ3mm、径3mmのペレットに成形した。成
形後にもペレットを粉砕して結晶粒径を同様にして算出
したところ、いずれの試料も成形前の結晶粒径と変わら
なかった。These various cupric hydroxide raw material powders were formed into pellets having a thickness of 3 mm and a diameter of 3 mm using a tableting machine. After the molding, the pellets were pulverized and the crystal grain size was calculated in the same manner. As a result, none of the samples was the same as the crystal grain size before the molding.
【0019】結晶粒径の異なる各水酸化第二銅ペレット
を、内径43mmのカラムに100mmの高さに充填
し、ここに有害成分を含む試験ガスを流して除害剤の破
過までに供給した有害成分ガスの量と除害剤の量とから
除害剤1kg当たりの処理量[リットル]を算出した。Each cupric hydroxide pellet having a different crystal grain size is packed into a column having an inner diameter of 43 mm to a height of 100 mm, and a test gas containing a harmful component is flowed through the column to supply the gas until breakthrough of the abatement agent. The processing amount [liter] per 1 kg of the abatement agent was calculated from the amount of the harmful component gas and the amount of the abatement agent.
【0020】有害成分を含む試験ガスには、次のG1〜
G6の6種類を使用した。 G1:0.5%のシランを含む窒素 G2:0.5%のシランを含む水素 G3:0.5%のアルシンを含む窒素 G4:0.5%のアルシンを含む水素 G5:0.5%のホスフィンを含む窒素 G6:0.5%のホスフィンを含む水素 なお、各試験ガスの空筒速度は毎秒0.5cmとし、シ
ランの破過濃度は5ppm、アルシンの破過濃度は0.
05ppm、ホスフィンの破過濃度は0.3ppmとし
た。結果を表1に示す。The test gases containing harmful components include the following G1
Six types of G6 were used. G1: Nitrogen containing 0.5% silane G2: Hydrogen containing 0.5% silane G3: Nitrogen containing 0.5% arsine G4: Hydrogen containing 0.5% arsine G5: 0.5% G6: Hydrogen containing 0.5% phosphine The velocities of each test gas were 0.5 cm / sec, the breakthrough concentration of silane was 5 ppm, and the breakthrough concentration of arsine was 0.1%.
The phosphine breakthrough concentration was set to 0.3 ppm. Table 1 shows the results.
【0021】[0021]
【表1】 [Table 1]
【0022】[0022]
【発明の効果】以上説明したように、本発明によれば、
除害能力が極めて高い除害剤を確実に得ることができ
る。As described above, according to the present invention,
It is possible to reliably obtain an abatement agent having extremely high abatement ability.
【図面の簡単な説明】[Brief description of the drawings]
【図1】 結晶性が異なる2種類の水酸化第二銅のX線
回折チャートである。FIG. 1 is an X-ray diffraction chart of two types of cupric hydroxides having different crystallinities.
A…結晶性の水酸化第二銅、B…非結晶性の水酸化第二
銅A: crystalline cupric hydroxide, B: amorphous cupric hydroxide
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平6−319945(JP,A) (58)調査した分野(Int.Cl.7,DB名) B01D 53/46 B01D 53/68 B01J 20/02 ────────────────────────────────────────────────── (5) References JP-A-6-319945 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) B01D 53/46 B01D 53/68 B01J 20 / 02
Claims (4)
る除害剤であって、水酸化第二銅のX線回折から、水酸
化第二銅の格子面(0,2,1)の回折線を用いてシェ
ラーの式、 D=(0.9・λ)/(β・cosθ) (式中、Dは結晶粒径[オングストローム]、λはX線
の波長[オングストローム],βは回折線の半値幅[ラ
ジアン]、θは回折角である。) によって求めた結晶粒径Dが40オングストローム以上
である水酸化第二銅を主として用いることを特徴とする
除害剤。1. An abatement agent containing crystalline cupric hydroxide as a main component, and the X-ray diffraction of cupric hydroxide indicates that the lattice plane (0, 2, Scherrer's equation using the diffraction line of 1), D = (0.9 · λ) / (β · cos θ) (where D is the crystal grain size [angstrom], λ is the wavelength of X-ray [angstrom], β is the half value width of the diffraction line [radian], and θ is the diffraction angle.) A scavenger characterized by mainly using cupric hydroxide having a crystal grain size D of 40 Å or more.
前記シェラーの式によって求めた結晶粒径Dが90オン
グストローム以上である水酸化第二銅を主として用いる
ことを特徴とする請求項1記載の除害剤。2. The harm-removing object of the harm-removing agent contains silane,
2. The harm-removing agent according to claim 1, wherein cupric hydroxide having a crystal grain size D determined by the Scherrer's formula of 90 Å or more is mainly used.
料をペレットに成形して除害剤を製造するにあたり、該
原料のX線回折から、水酸化第二銅の格子面(0,2,
1)の回折線を用いてシェラーの式、 D=(0.9・λ)/(β・cosθ) (式中、Dは結晶粒径[オングストローム]、λはX線
の波長[オングストローム],βは回折線の半値幅[ラ
ジアン]、θは回折角である。) によって求めた結晶粒径Dが40オングストローム以上
の水酸化第二銅を合格とすることを特徴とする除害剤原
料の検査方法。3. When a raw material containing crystalline cupric hydroxide as a main component is formed into pellets to produce an abatement agent, a lattice plane of cupric hydroxide is determined from X-ray diffraction of the raw material. 0,2,
Scherrer's equation using the diffraction line of 1), D = (0.9 · λ) / (β · cos θ) (where D is the crystal grain size [angstrom], λ is the wavelength of X-ray [angstrom], β is the half width of the diffraction line [radian], and θ is the diffraction angle.) The cupric hydroxide having a crystal grain size D of 40 Å or more is determined to be acceptable. Inspection methods.
前記シェラーの式によって求めた結晶粒径Dが90オン
グストローム以上である水酸化第二銅を合格とすること
を特徴とする請求項3記載の除害剤原料の検査方法。4. The harm-removing object of the harm-removing agent contains silane,
4. The method of claim 3, wherein cupric hydroxide having a crystal grain size D determined by the Scherrer equation of 90 Å or more is accepted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8101379A JP3000431B2 (en) | 1996-04-23 | 1996-04-23 | Method for testing abatement agents and their raw materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8101379A JP3000431B2 (en) | 1996-04-23 | 1996-04-23 | Method for testing abatement agents and their raw materials |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09285716A JPH09285716A (en) | 1997-11-04 |
| JP3000431B2 true JP3000431B2 (en) | 2000-01-17 |
Family
ID=14299164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8101379A Expired - Lifetime JP3000431B2 (en) | 1996-04-23 | 1996-04-23 | Method for testing abatement agents and their raw materials |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3000431B2 (en) |
-
1996
- 1996-04-23 JP JP8101379A patent/JP3000431B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09285716A (en) | 1997-11-04 |
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