JP3013820B2 - Die bonding equipment for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a die bonding apparatus used in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art FIG. 3A shows a conventional die bonding apparatus for a semiconductor device, and FIG.
The solder 6 supplied above is shown. Heater block 8 is 3
The heater is heated to about 50 ° C., and the lead frame 5 is installed on the heater block 8. The solder supply collet 2 is arranged above the lead frame 5 on the heater block 8. The solder supply collet 2 has one solder supply hole 4 for supplying the solder 1, and the solder 1 is supplied from the solder supply hole 4 onto the lead frame 5. Also, a solder stirring collet 7 for stirring the solder supplied on the lead frame is arranged above the lead frame 5 instead of the solder supply collet 2.

In the conventional die bonding apparatus configured as described above, the solder 1 solidified from the solder supply collet 2 is supplied onto the lead frame 5 through the supply hole 4, and the solder 6 is heated by the heater block 8. Is melted on the lead frame. Next, the solder supply collet 2 is retracted, and the stirring unit 7 is disposed above the lead frame 5. By rotating the stirring unit 7, an appropriate amount of the solder 6 melted on the lead frame 5 is obtained.
To spread the solder throughout the island. After that, a semiconductor pellet (not shown) is die-bonded on the lead frame 5.

[0004]

However, in this conventional die bonding apparatus, the solidified (hardened) solder 1 is supplied onto the lead frame 5 from one solder supply hole 4 and the lead frame 5 is removed. Since the above method is used for melting, the solder 1 is likely to be caught in the solder supply hole 4. For this reason, the dispersion of the solder supply position and the supply amount on the lead frame becomes large, and the adhesion between the semiconductor pellet and the lead frame 5 becomes insufficient,
There is a problem that the bonded pellets are inclined with respect to the lead frame. Further, in this conventional die bonding apparatus, it is necessary to agitate the solder after supplying the solder to spread it over the entire island of the lead frame. Therefore, after supplying the solder, the solder supply collet 2 is moved and the stirring unit 7 is moved. The work of arranging on a lead frame is required, and there is a disadvantage that productivity is poor.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and reduces the dispersion of the solder supply position and the supply amount. Therefore, an object of the present invention is to provide a die bonding apparatus for a semiconductor device which can improve productivity by eliminating the above.

[0006]

A die bonding apparatus for a semiconductor device according to the present invention is a die bonding apparatus used for die bonding of a semiconductor device, comprising: a solder supply collet having a solder supply hole; It has a heater block mounted thereon for heating the solder in the solder supply hole, and a plurality of solder discharge holes connected to the plurality of branch supply holes branched from the solder supply hole and discharging the solder.

In this die bonding apparatus for a semiconductor device, it is preferable that the solder discharge hole is constituted by a hole at a central portion and peripheral holes provided at equal positions around the hole.

According to another aspect of the present invention, there is provided a die bonding apparatus for use in die bonding of a semiconductor device, comprising: a solder supply collet having a solder supply hole; and the solder supply collet mounted on the solder supply collet. It has a heater block for heating the solder in the supply hole, and a driving means for driving the solder supply collet to rotate around its central axis.

In this die bonding apparatus for a semiconductor device, a plurality of branch supply holes branched from the solder supply holes are provided, and a plurality of the solder discharge holes are connected to each of the branch supply holes to be provided. Can be configured.

In the die bonding apparatus for a semiconductor device, the solder supply hole may be formed in a block formed of stainless steel or copper.

Further, the heater block may be 300 to 4
It can be configured to generate heat at a temperature of 00 ° C., and can be configured to have a supply unit for supplying a predetermined amount of solder into the solder supply hole.

In the die bonding apparatus for a semiconductor device according to the present invention, by mounting a heater block on the solder supply collet, the solid solder is heated and melted in the solder supply hole, and the molten solder is discharged from the discharge hole into the lead frame. Supply on top.

Therefore, it is possible to prevent the solder from being caught in the solder supply hole and to reduce the variation in the solder supply position and the supply amount. In addition, by providing a plurality of solder supply holes or by rotationally driving the solder supply collet, the step of stirring the solder on the lead frame by the stirring unit, which is conventionally required, can be omitted.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be specifically described with reference to the accompanying drawings. FIG. 1A is a schematic diagram illustrating a die bonding apparatus according to a first embodiment of the present invention, and FIG. 1D is a plan view illustrating an island portion of a lead frame 5.

In FIG. 1, a solder supply hole 9 is formed coaxially in the solder supply collet 2, and a heater block 3 is mounted below the solder supply collet 2. Solder supply is performed by the heater block 3. The solder 1 in the hole 9 is heated.

Below the heater block 3, a block 10 made of copper or stainless steel is arranged.
The block 10 has a plurality of branch supply holes 11 branched from the solder supply holes 9. The branch supply hole 11 is opened on the lower surface of the block 10 as a plurality of solder discharge holes. As can be seen from FIG. 1B which shows the solder on the lead frame discharged from these discharge holes, the central holes are arranged at the center of the block 10 immediately below the solder supply holes 9. Then, four peripheral holes are arranged at four equally spaced positions with the center hole as the center.

Next, the operation of the embodiment of the present invention will be described. In the die bonding process of the semiconductor device, the solder 1 in the wire state as it is solidified is fed into the heater block 3 through the solder supply holes 9 at regular intervals, and the fed solder 1 is heated to a constant temperature of 300 to 400 ° C. It melts in the heated heater block 3. afterwards,
The molten solder is discharged from the lower surface of the block 10 onto the lead frame 5 through a number of branch supply holes 11, and as shown in FIG. It will be supplied to five locations. At this time, the solder supply collet 2 descends from above the lead frame 5 to a place where the gap with the lead frame 5 is several tens μm. The solder supply collet 2 that has completed the solder supply rises and retreats to its original position, and the lead frame 5 is sent to the next die bonding step of semiconductor pellets. By repeating these steps, the semiconductor pellet is mounted on the lead frame.

In this embodiment, since the solder is supplied to the lead frame in a molten state, it is possible to reduce the variation in the solder supply position and the supply amount due to the catch of the solder in the solder supply hole 9. In this embodiment, since the solder is directly supplied to a plurality of positions on the lead frame 5, the solder is supplied to a wide area on the island of the lead frame without agitating the solder.

The solder supply collet 2, the heater block 3 and the block 10 need to be moved at a high speed, and are therefore preferably small and light. Also, Solder 1
Must be supplied to the lead frame 5 in a molten state.
The block in which the solder supply holes 9 and the branch supply holes 11 are formed can be made of a metal such as stainless steel or copper having good heat conductivity in order to transfer the heat from the heater block 3 to the solder 1 with high efficiency. preferable.

Next, a second embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. In FIG. 2, the same components as those in FIG. FIG.
As shown in (a), the present embodiment differs from the first embodiment shown in FIG. 1 only in that a driving means for driving the solder supply collet 2 to rotate around its central axis is provided.

In this embodiment of the present invention, the molten solder discharged from the plurality of discharge holes is swung in the peripheral direction by the rotation of the solder supply collet 2, and is spread over a wider area of the lead frame 5. And, instead of being scattered on the lead frame, FIG.
As shown in (b), it is supplied uniformly to the circular area. Therefore, the solder supplied on the lead frame does not need to be stirred thereafter. That is, by rotating the solder supply collet 2, the molten solder is placed on the lead frame 5.
Not only can it be uniformly supplied to a wider area, but also the stirring step after the solder supply, which has been conventionally performed, can be omitted.

When the solder supply collet is rotated as in this embodiment, it is not always necessary to provide a plurality of solder discharge holes. The rotation of the solder supply collet causes the molten solder to expand by centrifugal force above the lead frame and to be supplied onto the lead frame, so that the molten solder is uniformly supplied over a wide area on the lead frame.

[0023]

As described above, according to the present invention, since the solder is melted in the solder supply collet, the molten solder can be supplied to the die bonding step of the semiconductor device. An object of the present invention is to reduce the variation in the solder supply position and the supply amount without the solder being caught in the supply hole.

Further, by supplying molten solder from a plurality of solder discharge holes to the lead frame, the solder can be supplied to a wide area of the lead frame,
Further, at this time, if the solder supply collet is rotated, the solder can be uniformly supplied to a wider area. Therefore, in the present invention, in the die bonding step of the semiconductor device, the step of agitating the solder on the lead frame after supplying the solder can be omitted.

[Brief description of the drawings]

FIG. 1 is a diagram showing a die bonding apparatus for a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a view showing a die bonding apparatus for a semiconductor device according to a second embodiment of the present invention.

FIG. 3 is a diagram showing a conventional die bonding apparatus for a semiconductor device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1; Solder 2; Solder supply collet 3; Heater block 4; Solder supply hole 5; Lead frame 6; Solder 7; Solder stirring collet 8; Heater block 9: Solder supply hole 10: Block 11: Solder branch supply hole

Claims (7)

(57) [Claims] 1. A die bonding apparatus used for die bonding of a semiconductor device, a solder supply collet having a solder supply hole, a heater block mounted on the solder supply collet and heating the solder in the solder supply hole, A plurality of solder discharge holes that are connected to the plurality of branch supply holes branched from the solder supply hole and discharge the solder, the die bonding apparatus for a semiconductor device. 2. The semiconductor according to claim 1, wherein the solder discharge hole includes a hole at a central portion and peripheral holes provided at equal positions around the hole. Equipment die bonding equipment. 3. A die bonding apparatus used for die bonding of a semiconductor device, a solder supply collet having a solder supply hole, a heater block mounted on the solder supply collet and heating the solder in the solder supply hole, And a driving unit for driving the solder supply collet to rotate about a center axis thereof. 4. The semiconductor device according to claim 3, further comprising a plurality of branch supply holes branched from said solder supply hole, wherein a plurality of said solder discharge holes are connected to each of said branch supply holes. 6. A die bonding apparatus for a semiconductor device according to claim 5. 5. The method according to claim 1, wherein the solder supply hole and the branch supply hole are formed in a block formed of stainless steel or copper.
Item 10. A die bonding apparatus for a semiconductor device according to item 1. 6. The heater block may be 300 to 400.
The die bonding apparatus for a semiconductor device according to any one of claims 1 to 5, wherein the apparatus generates heat at a temperature of ° C. 7. The apparatus according to claim 1, further comprising a supply unit configured to supply a predetermined amount of solder into the solder supply hole.
7. The die bonding apparatus for a semiconductor device according to claim 1.