JP3026077B2 - Chuck for brush scrubber - Google Patents
Chuck for brush scrubberInfo
- Publication number
- JP3026077B2 JP3026077B2 JP9367609A JP36760997A JP3026077B2 JP 3026077 B2 JP3026077 B2 JP 3026077B2 JP 9367609 A JP9367609 A JP 9367609A JP 36760997 A JP36760997 A JP 36760997A JP 3026077 B2 JP3026077 B2 JP 3026077B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- chuck
- operating piece
- pin
- holding pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体製造工程等
で使用されるブラシスクラバに関し、特に該ブラシスク
ラバにおいてウエ−ハを保持するチャックに関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brush scrubber used in a semiconductor manufacturing process or the like, and more particularly to a chuck for holding a wafer in the brush scrubber.
【０００２】[0002]
【従来の技術】ブラシスクラバは、半導体製造工程の各
所で使用され、回転するブラシを洗浄液をかけながらウ
エ−ハの洗浄面に押し当て該面に沿って移動し、ウエ−
ハ表面の付着物を除去し、洗浄後は高速でウエ−ハを回
転してスピン乾燥させるよう構成されている。この際、
上記ウエ−ハは、回転した際に飛び出さないようチャッ
クベ−ス上に設けた洗浄面より突出する長さのピンで周
縁部が保持されているので、従来のブラシスクラバでは
ウエ−ハの周縁部に突出する上記ピンに接触しないよう
にするため、該ウエ−ハの周縁領域までブラシを移動さ
せることができず、全面を洗浄することがむずかしかっ
た。2. Description of the Related Art A brush scrubber is used in various parts of a semiconductor manufacturing process. A rotating brush is pressed against a cleaning surface of a wafer while applying a cleaning liquid, and moves along the surface.
The cleaning device is configured to remove deposits on the surface of the wafer, rotate the wafer at high speed after washing, and spin dry the wafer. On this occasion,
The peripheral edge of the wafer is held by a pin having a length protruding from a cleaning surface provided on the chuck base so that the wafer does not pop out when rotated. In order not to contact the pins protruding into the portion, the brush could not be moved to the peripheral region of the wafer, and it was difficult to clean the entire surface.
【０００３】[0003]
【発明が解決しようとする課題】本発明の解決課題は、
上記のようにブラシを洗浄面に押し当てて洗浄するよう
にしたブラシスクラバにおいて、ウエ−ハの周縁領域ま
でスクラブ洗浄することができるようにしたブラシスク
ラバ用チャックを提供することである。The problem to be solved by the present invention is as follows.
An object of the present invention is to provide a brush scrubber chuck capable of performing scrub cleaning to a peripheral region of a wafer in a brush scrubber in which a brush is pressed against a cleaning surface as described above.
【０００４】また、本発明の解決課題は、ブラシスクラ
バにおいてウエ−ハを保持するピンの制御を電気的操作
で簡単に行うことができるようにしたブラシスクラバ用
チャックを提供することである。Another object of the present invention is to provide a brush scrubber chuck in which a pin for holding a wafer in a brush scrubber can be easily controlled by an electric operation.
【０００５】[0005]
【課題を解決するための手段】本発明によれば、ウエ−
ハを載置するチャックベ−スに該ウエ−ハを取り囲んで
上方に突出するピンを有する複数の作動片を揺動可能に
設け、該ピンがウエ−ハの周縁に接離する方向に上記作
動片を電磁作用により揺動させるよう電磁手段を形成
し、上記ピンをウエ−ハの洗浄面より上方に突出しない
長さの押えピンとウエ−ハの周縁を保持する保持ピンで
構成したことを特徴とするブラシスクラバ用チャックが
提供され、上記課題が解決される。According to the present invention, a wafer is provided.
A plurality of operating pieces having pins protruding upward and surrounding the wafer are provided on a chuck base on which the wafer is mounted so as to be swingable, and the operation is performed in such a direction that the pins come into contact with and separate from the peripheral edge of the wafer. An electromagnetic means is formed so as to swing the piece by electromagnetic action, and the pin is constituted by a holding pin having a length not protruding above the cleaning surface of the wafer and a holding pin for holding a peripheral edge of the wafer. The above-mentioned subject is solved.
【０００６】本発明のチャックを備えたスクラブ洗浄機
でウエ−ハをブラシ洗浄する際は、上記電磁手段を操作
して押えピンを有する作動片を揺動し、該押えピンをウ
エ−ハの周縁に当接させてウエ−ハを支持した状態で行
う。このとき、該ウエ−ハの周縁の上方には上記押えピ
ンが突出しないので、ウエ−ハの上面にブラシを押し当
ててその周縁領域までも洗浄することができる。スピン
乾燥する際は、上記保持ピンを有する作動片もウエ−ハ
の周縁に当接させてウエ−ハを支持すれば、ウエ−ハは
一層確実に保持され、高速で回転させても該チャックか
らウエ−ハが飛び出すおそれはない。When the wafer is brush-cleaned by the scrubber provided with the chuck according to the present invention, the electromagnetic means is operated to swing the operating piece having the holding pin, and the holding pin is moved to the wafer. This is performed in a state where the wafer is supported by being brought into contact with the peripheral edge. At this time, since the pressing pin does not protrude above the peripheral edge of the wafer, the brush can be pressed against the upper surface of the wafer to clean even the peripheral area. At the time of spin drying, if the working piece having the holding pin is also brought into contact with the peripheral edge of the wafer to support the wafer, the wafer is more securely held, and even when rotated at a high speed, the chuck is rotated. There is no risk that the wafer will jump out of the device.
【０００７】[0007]
【発明の実施の形態】図において、チャックベ−ス
（１）は、図示を省いた駆動源により回転されるよう回
転可能に設けられている。該チャックベ−ス（１）上に
突設した支持ピン（２）・・・上にはウエ−ハ（３）が
載置され、該ウエ−ハ（３）を取り囲むように複数の作
動片（４）・・・がチャックベ−スの円周方向に間隔を
あけて揺動可能に枢着（５）されている。In the drawings, a chuck base (1) is rotatably provided so as to be rotated by a drive source not shown. A wafer (3) is mounted on support pins (2) projecting from the chuck base (1), and a plurality of working pieces (3) are arranged so as to surround the wafer (3). 4) are pivotally mounted (5) so as to be swingable at intervals in the circumferential direction of the chuck base.
【０００８】上記作動片（４）の一端には、上方に突出
するピン（６）を設けてあるが、該ピンは作動片に応じ
て異なるものが設けられている。該ピン（６）として
は、押えピン(6a)・・・と保持ピン(6b)・・・があり、
作動片(4a)に設けた押えピン(6a)・・・はその先端がウ
エ−ハ（３）の洗浄面（上面）（７）より上方に突出し
ない長さ、すなわち上記洗浄面（７）と同じ高さ若しく
はそれより約0.１〜0.２mm程度低くなるように設けてあ
る。一方、作動片(4b)に設けた保持ピン(6b)・・・は、
上記ウエ−ハ（３）を確実に保持することができるよう
上記洗浄面（７）より上方に数mm程度突出する長さ若し
くは図に示すように適宜の係合縁（８）を有する形状に
形成することができる。なお、上記押えピン(6a)・・・
及び保持ピン(6b)・・・は円柱状に形成してあるが、三
角柱、六角柱その他の角柱状や段付の柱状に形成するこ
ともでき、上記作動片(4a)と作動片(4b)は円周方向に交
互に設けられている。At one end of the operating piece (4), a pin (6) projecting upward is provided, and the pin is different depending on the operating piece. As the pin (6), there are a holding pin (6a)... And a holding pin (6b).
The length of the holding pin (6a) provided on the operating piece (4a) does not protrude above the cleaning surface (upper surface) (7) of the wafer (3), that is, the cleaning surface (7). It is provided so as to be the same height as or about 0.1 to 0.2 mm lower than that. On the other hand, the holding pins (6b) ... provided on the operating piece (4b)
In order to securely hold the wafer (3), the wafer (3) has a length protruding about several mm above the cleaning surface (7) or a shape having an appropriate engaging edge (8) as shown in the figure. Can be formed. The presser pin (6a) ...
And the holding pin (6b) are formed in a columnar shape, but may be formed in a triangular prism, a hexagonal column or other prismatic or stepped columnar shapes. ) Are provided alternately in the circumferential direction.
【０００９】上記押えピン(6a)・・・及び保持ピン(6b)
・・・等のピン（６）は、上記作動片（４）に１本づつ
設けてもよいが、好ましくは図に示すように複数本の、
例えば２本のピンを基板（９）上に並列して設け、該基
板（９）を上記作動片（４）に枢軸(10)で回動可能に枢
着して設けるとよい（図６（Ａ），（Ｂ））。このよう
に回動可能に設ければ、図７に示すようにウエ−ハ
（３）のオリフラやノッチ(11)に一方のピン（６）が当
って入り込んでもウエ−ハ（３）の周縁に他方のピン
（６）を当接させることができ、ウエ−ハがどのような
位置で載置されていても三点保持が可能である。The holding pin (6a)... And the holding pin (6b)
The pins (6) such as... May be provided one by one on the operation piece (4), but a plurality of pins (6) are preferably provided as shown in the drawing.
For example, two pins may be provided in parallel on a substrate (9), and the substrate (9) may be provided so as to be pivotally attached to the operating piece (4) by a pivot (10) (FIG. A), (B)). With such a rotatable arrangement, as shown in FIG. 7, even if one of the pins (6) hits the orientation flat or the notch (11) of the wafer (3) and enters the same, the peripheral edge of the wafer (3) can be obtained. The other pin (6) can be brought into contact with the wafer, and three points can be held regardless of the position of the wafer.
【００１０】上記作動片（４）・・・を電磁作用により
揺動させるよう電磁手段が形成されている。該電磁手段
は、図においてはチャックベ−ス（１）側に電磁石(12)
を設け、作動片（４）側に永久磁石(13)を設け、上記電
磁石の極性を変えることにより上記作動片を電磁石側に
吸引し若しくは反発するようにしてある。上記永久磁石
と電磁石は上記の如き電磁作用を奏することができるの
であれば、いずれ側の部材に設けてもよいし、両部材に
電磁石を設けてもよい。また、上記作動片（４）に磁性
体を設け、若しくは磁性体で作り、外方に揺動する方向
にばね等で付勢しておけば、永久磁石を用いないで構成
することもできる（図示略）。Electromagnetic means is formed so as to swing the operating pieces (4)... By electromagnetic action. The electromagnetic means includes an electromagnet (12) on the chuck base (1) side in the figure.
The permanent magnet (13) is provided on the side of the operating piece (4), and the operating piece is attracted or repelled to the electromagnet side by changing the polarity of the electromagnet. The permanent magnet and the electromagnet may be provided on either side of the member, or the electromagnet may be provided on both members, as long as the permanent magnet and the electromagnet can exert the electromagnetic action as described above. Further, if a magnetic material is provided on the operating piece (4) or is made of a magnetic material and is urged by a spring or the like in a direction of swinging outward, it can be configured without using a permanent magnet ( Not shown).
【００１１】上記電磁手段は、上記押えピン(6a)を有す
る作動片(4a)の作動片群と、保持ピン(6b)を有する作動
片(4b)の作動片群ごとに独立して制御できるように制御
回路を設けてあり、適時に上記作動片(4a)，(4b)を操作
する。The electromagnetic means can be controlled independently for each of the operating piece group of the operating piece (4a) having the holding pin (6a) and the operating piece group of the operating piece (4b) having the holding pin (6b). A control circuit is provided to operate the operating pieces (4a) and (4b) at appropriate times.
【００１２】上記作動片(4a)，(4b)は、上記電磁手段に
より揺動されるが、さらに好ましくはチャックベ−スが
回転した際の遠心力で上記ピン(6a)，(6b)がウエ−ハの
周縁に近づく方向へ揺動するように枢着（５）されてい
る。この際、図においては中央から上記ピンを設けた側
に偏位した部分を枢着してあるが、適宜の重り等を設け
れば中央部で枢着することもできる。なお、上記チャッ
クベ−ス（１）には、先端が上記作動片の一端に当接す
るよう調整ねじ等の調整具(14)を設けてあり、該調整具
(14)により上記作動片の揺動範囲を調整している。The operating pieces (4a) and (4b) are rocked by the electromagnetic means. More preferably, the pins (6a) and (6b) are urged by centrifugal force when the chuck base rotates. Being pivotally mounted (5) so as to swing in a direction approaching the periphery of c; In this case, in the figure, a portion deviated from the center to the side where the pin is provided is pivoted, but if a suitable weight or the like is provided, the portion can be pivotally attached at the center. The chuck base (1) is provided with an adjusting tool (14) such as an adjusting screw so that an end of the chuck base (1) contacts one end of the operating piece.
(14) adjusts the swing range of the operating piece.
【００１３】図８に示すように、上記作動片(4a)，(4b)
の各ピン(6a)，(6b)が外方に移動している状態でウエ−
ハ（３）をロボット等でチャックに搬入し、上記支持ピ
ン（２）上に載置する。そして、上記押えピン(6a)を有
する作動片(4a)を電磁手段で揺動させ、該押えピン(6a)
をウエ−ハ（３）の周縁に当接し（図９）、ウエ−ハを
回転させながら図示を省いたブラシを上記ウエ−ハの洗
浄面に押し付け周縁部までブラシスクラバ洗浄する。そ
の後、リンス等を行い、スピン乾燥する際は、図１０に
示すように上記保持ピン(6b)を有する作動片(4b)を電磁
手段で揺動させ、ウエ−ハの周縁を確実に保持した状態
で該ウエ−ハを高速回転すればよい。ウエ−ハをチャッ
クから取り出す際は、上記電磁手段を操作して上記図８
に示す状態に上記作動片を揺動させて行えばよい。As shown in FIG. 8, the operating pieces (4a) and (4b)
While the pins (6a) and (6b) are moving outward,
C (3) is carried into the chuck by a robot or the like, and is placed on the support pins (2). Then, the operating piece (4a) having the holding pin (6a) is swung by electromagnetic means, and the holding pin (6a)
Is brought into contact with the peripheral edge of the wafer (3) (FIG. 9), and a brush (not shown) is pressed against the cleaning surface of the wafer while rotating the wafer to perform brush scrubber cleaning to the peripheral edge. Thereafter, when performing rinsing or the like and spin drying, the operating piece (4b) having the holding pin (6b) is rocked by electromagnetic means as shown in FIG. 10 to securely hold the peripheral edge of the wafer. The wafer may be rotated at high speed in this state. When the wafer is taken out of the chuck, the above-mentioned electromagnetic means is operated to operate the wafer as shown in FIG.
The operation piece may be swung to the state shown in FIG.
【００１４】[0014]
【発明の効果】本発明は上記のように構成され、ブラシ
スクラバにおいて、ウエ−ハの周縁部に当接するピンと
して該ウエ−ハの洗浄面より上方に突出しない長さの押
えピンと該ウエ−ハの周縁を確実に保持する保持ピンを
具備し、該押えピンをウエ−ハの周縁部に当接した状態
でブラシスクラバするようにしたから、ウエ−ハの周縁
領域までブラシを移動させて該ウエ−ハの全面を洗浄す
ることができ、スピン乾燥時には上記保持ピンでウエ−
ハの周縁を保持するようにしたので、該ウエ−ハを高速
回転しても該ウエ−ハがチャックから飛び出さないよう
にできる。また、上記ピンを有する作動片を電磁手段で
揺動させるようにしたから、従来のようにピンの開閉に
負荷となるような摩擦部や機械的な駆動部がなくなり、
ダストの発生がなく円滑な操作が可能であり、電磁手段
の電磁石に流す電流をコントロ−ルすることによりピン
の接触強さを強くしたり、ソフトにしたり適宜に調整す
ることもできる。According to the present invention, there is provided a brush scrubber having a holding pin having a length which does not protrude above a cleaning surface of a wafer as a pin which comes into contact with a peripheral edge of the wafer. Since a holding pin for securely holding the periphery of the wafer is provided, and the presser pin is brush-scrambled in a state of contact with the periphery of the wafer, the brush is moved to the peripheral area of the wafer. The entire surface of the wafer can be washed, and the wafer is held by the holding pin during spin drying.
Since the periphery of the wafer is held, the wafer can be prevented from jumping out of the chuck even when the wafer is rotated at a high speed. In addition, since the operating piece having the pin is rocked by the electromagnetic means, there is no frictional portion or mechanical drive portion that becomes a load for opening and closing the pin as in the related art,
Smooth operation is possible without generation of dust, and the contact strength of the pin can be increased or controlled as appropriate by controlling the current flowing through the electromagnet of the electromagnetic means.
【図１】本発明の一実施例を示す平面図。FIG. 1 is a plan view showing an embodiment of the present invention.
【図２】押えピンを有する作動片の平面図。FIG. 2 is a plan view of an operation piece having a holding pin.
【図３】保持ピンを有する作動片の平面図。FIG. 3 is a plan view of an operation piece having a holding pin.
【図４】押えピンを有する作動片の断面図。FIG. 4 is a sectional view of an operation piece having a holding pin.
【図５】保持ピンを有する作動片の断面図。FIG. 5 is a sectional view of an operation piece having a holding pin.
【図６】作動片を示し、（Ａ）は正面図、（Ｂ）は側面
図。6A and 6B show an operation piece, wherein FIG. 6A is a front view and FIG. 6B is a side view.
【図７】ウエ−ハのノッチにピンが接した状態を示す説
明図。FIG. 7 is an explanatory view showing a state in which a pin is in contact with a notch of a wafer.
【図８】ピンがウエ−ハに接していない状態の説明図。FIG. 8 is an explanatory view of a state in which a pin is not in contact with a wafer.
【図９】押えピンがウエ−ハに接した状態の説明図。FIG. 9 is an explanatory diagram of a state in which a holding pin is in contact with a wafer.
【図10】押えピン及び保持ピンがウエ−ハに接した状態
の説明図。FIG. 10 is an explanatory diagram of a state in which a holding pin and a holding pin are in contact with a wafer.
１ チャックベ−ス ３ ウエ−ハ ４，4a，4b 作動片 6a 押えピン 6b 保持ピン 12 電磁石 13 永久磁石 1 Chuck base 3 Wafer 4, 4a, 4b Working piece 6a Holding pin 6b Holding pin 12 Electromagnet 13 Permanent magnet
Claims (7)
ウエ−ハを取り囲んで上方に突出するピンを有する複数
の作動片を揺動可能に設け、該ピンがウエ−ハの周縁に
接離する方向に上記作動片を電磁作用により揺動させる
よう電磁手段を形成し、上記ピンはウエ−ハの洗浄面よ
り上方に突出しない長さの押えピンとウエ−ハの周縁を
保持する保持ピンで構成されているブラシスクラバ用チ
ャック。A chuck base for mounting a wafer is provided with a plurality of operating pieces having pins protruding upward and surrounding the wafer so as to be swingable, and the pins are provided on a peripheral edge of the wafer. Electromagnetic means is formed so as to swing the operating piece in the direction of contact and separation by electromagnetic action, and the pin holds the holding pin having a length not protruding above the cleaning surface of the wafer and the peripheral edge of the wafer. A brush scrubber chuck composed of pins.
を有する作動片は、チャックベ−スの円周方向に交互に
設けられ、押えピンを有する作動片群及び保持ピンを有
する作動片群ごとに電磁手段で制御される請求項１に記
載のブラシスクラバ用チャック。The operating piece having the holding pin and the operating piece having the holding pin are alternately provided in the circumferential direction of the chuck base, and each of the operating piece group having the holding pin and the operating piece group having the holding pin is provided. The chuck for a brush scrubber according to claim 1, wherein the chuck is controlled by electromagnetic means.
た際の遠心力で上記ピンがウエ−ハの周縁に近づく方向
へ揺動するように枢着されている請求項１に記載のブラ
シスクラバ用チャック。3. The brush according to claim 1, wherein the operating piece is pivotally mounted so that the pin swings in a direction approaching the peripheral edge of the wafer by centrifugal force when the chuck base rotates. Chuck for scrubber.
しくは反発する請求項１に記載のブラシスクラバ用チャ
ック。4. The brush scrubber chuck according to claim 1, wherein said electromagnetic means sucks or repels said operating piece.
含んでいる請求項４に記載のブラシスクラバ用チャッ
ク。5. The brush scrubber chuck according to claim 4, wherein said electromagnetic means includes an electromagnet and a permanent magnet.
作動片に並列状態で回動するによう複数本設けられてい
る請求項１または２に記載のブラシスクラバ用チャッ
ク。6. The brush scrubber chuck according to claim 1, wherein a plurality of said pressing pins or holding pins are provided so as to rotate in parallel with said operating piece.
揺動範囲を調整する調整具が設けられている請求項１に
記載のブラシスクラバ用チャック。7. A chuck for a brush scrubber according to claim 1, wherein said chuck base is provided with an adjusting tool for adjusting a swing range of said operating piece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9367609A JP3026077B2 (en) | 1997-12-26 | 1997-12-26 | Chuck for brush scrubber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9367609A JP3026077B2 (en) | 1997-12-26 | 1997-12-26 | Chuck for brush scrubber |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11195630A JPH11195630A (en) | 1999-07-21 |
| JP3026077B2 true JP3026077B2 (en) | 2000-03-27 |
Family
ID=18489745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9367609A Expired - Fee Related JP3026077B2 (en) | 1997-12-26 | 1997-12-26 | Chuck for brush scrubber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3026077B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100363326B1 (en) * | 2000-06-01 | 2002-11-30 | 한국디엔에스 주식회사 | Wafer chuck for spinning a wafer |
| US8714169B2 (en) | 2008-11-26 | 2014-05-06 | Semes Co. Ltd. | Spin head, apparatus for treating substrate, and method for treating substrate |
| KR101035984B1 (en) * | 2008-11-26 | 2011-05-23 | 세메스 주식회사 | Spin head |
| JP6630213B2 (en) * | 2016-03-30 | 2020-01-15 | 株式会社Ｓｃｒｅｅｎホールディングス | Substrate processing apparatus, substrate processing method, and program recording medium |
| JP2022045184A (en) * | 2020-09-08 | 2022-03-18 | 株式会社ディスコ | Washing device |
| CN117373953B (en) * | 2023-10-16 | 2024-08-16 | 沈阳晶润半导体材料有限公司 | High-efficient cleaning equipment of electronic device |
-
1997
- 1997-12-26 JP JP9367609A patent/JP3026077B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11195630A (en) | 1999-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |