JP3026464B2 - Solid-state imaging device and endoscope using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state imaging device for connecting a shielded cable and an endoscope using the same.

[0002]

2. Description of the Related Art In general, an endoscope in which a solid-state image pickup device is incorporated in a rigid end portion of a scope insertion section includes a solid-state image pickup device, a circuit board on which the solid-state image pickup device is mounted, and an electrically connected circuit board. A circuit board is provided for connecting and mounting electronic components, and these circuit boards are incorporated from the base end side of the scope insertion portion. In addition, the signal cable used here is a shielded cable with little electromagnetic interference since a high-frequency signal is generally transmitted in a long scope insertion portion.

Further, when a circuit board and a shielded cable are connected to each other in a configuration having such components, conventionally, a partially cutaway top view of FIG. 8 and a longitudinal sectional view of FIG. The ground electrode 1 on the circuit board (FPC) 102 extending to the base end side of the scope insertion portion 101
03 is connected to the shield wire 104, and the signal electrode 105 is connected to the signal core wire 106. In addition, 1 in the figure
07 is a shielded cable, 108 is an electronic component, 109
Is a tip rigid portion, 110 is a circuit board on which a solid-state imaging device is mounted, 111 is a prism, 112 is a filter, 113 is a lens system, 114 is an objective optical system, 115 is a forceps hole, 116
Is a main body member, 117 is a cover, and 118 is a mold resin. On the other hand, the insertion portion, particularly the rigid distal end portion, is required to be smaller in diameter and shorter in consideration of the insertability of the scope insertion portion and the pain of the subject. Therefore, the radial length of the scope insertion portion and the axial length of the scope insertion portion of the circuit board must be reduced.

[0004]

However, in the case of the above-mentioned conventional structure, when the circuit board is made small, the arrangement of the signal electrodes is complicated, and after connecting the shield wire to the ground electrode, Fine adjustment of the length is required for each core wire. In addition, since the signal core wire used in the endoscope is an extremely thin wire (AWG 30 or more), it is a difficult operation requiring skill to correctly position the electrodes on the electrodes. Also, depending on the superiority or the inferiority, stress is generated in the signal core wire and the shield wire, and there is a possibility that a failure such as disconnection may occur.

[0005] Therefore, in the conventional structure, reducing the electrode size and the electrode interval is problematic in terms of the above-described workability, disconnection of the signal core wire and shield wire, the signal core wires, or the signal core wire and other electrodes. This only increases the risk of causing a failure such as a short circuit or poor contact. Since these failures make it impossible for the operator to observe, an endoscope that is inserted into the body of the subject and inspected is extremely dangerous to the subject and must be avoided most. . For these reasons, conventionally, it has been difficult to shorten the circuit board in both the radial direction of the guiding tube and the axial direction of the guiding tube, and it has been difficult to reduce the diameter and length of the rigid portion at the distal end. Furthermore, depending on the arrangement of the signal electrodes, only the signal core wire without the shield wire is drawn out for a long time, so that it is susceptible to electromagnetic influence and noise is likely to be generated. Therefore, in many cases, a good observation image cannot be obtained.

The present invention has been made in view of the above circumstances, and an object thereof is to use a solid-state imaging device and a solid-state imaging device capable of reducing the diameter and length of a rigid portion at the distal end of a scope insertion portion. An endoscope is provided.

[0007]

According to a first aspect of the present invention, in order to achieve the above object, one of the plate surfaces has a ground electrode and the other has a plurality of signal electrodes. And a circuit board having a through-hole provided between both surfaces thereof, wherein signals are taken out from the signal electrode by a plurality of shielded signal lines. The solid-state imaging device is characterized in that the through hole is inserted from the electrode surface to the signal electrode surface side and connected to the signal electrode, and the shield wire is connected to the ground electrode.

According to the second aspect of the present invention, a ground electrode is provided on one surface of the plate, a plurality of signal electrodes are provided on the other surface, and a through hole is provided between both surfaces. An endoscope comprising a circuit board and a solid-state imaging device from which signals are taken out from the signal electrodes by a plurality of shielded signal lines is incorporated into a distal end rigid portion of a scope insertion portion. A plurality of shielded signal lines extending from the base end side of the scope insertion portion are connected to the signal electrode by inserting the through holes from the ground electrode surface to the signal electrode surface side, and connect the shield. An endoscope characterized in that a wire is connected to the ground electrode is a solution.

[0009]

The solid-state imaging device according to the first aspect of the present invention can cope with this limitation when it is desired to make the occupied space of the built-in portion as thin and short as possible.

The endoscope according to the second aspect of the present invention is advantageous in reducing the diameter and length of the distal end rigid portion of the scope insertion portion.

[0011]

FIG. 1 is a longitudinal sectional view schematically showing a rigid portion at the distal end of a guiding tube in an endoscope according to a first embodiment of the present invention.

The endoscope of the first embodiment has an appearance structure as shown in the perspective view of FIG. 2, and includes a scope insertion section 1 and an operation section 2 as main parts. As shown in FIG. 1, a circuit board 4 on which a solid-state image sensor is mounted, a circuit board 5 on which electronic components are mounted, and a signal cable are mounted on the distal end rigid section 3 of the scope insertion section 1 in this order from the distal end side of the scope insertion section 1. The circuit board 6 to which the circuit board 12 is connected is disposed substantially perpendicular to the axis of the scope insertion section, and is connected to a flexible printed circuit board (FPC) 7 substantially parallel to the axis of the scope insertion section. The solid-state imaging means which is sealed between the circuit boards and the signal cable connection portion by an insulating resin 8 and is electrically insulated from the main body is incorporated in the main body member 9.

Circuit board 6 to which signal cable 12 is connected
Provides a ground electrode 10 on the surface on the base end side of the scope,
A signal electrode 11 is provided on a surface on the distal end side of the scope. Furthermore, a through hole is provided between the two surfaces at the center of each of the electrodes 10 and 11. Then, as shown in FIG. 3, the distal end portion of the signal cable 12 stripped in the paragraph is connected as shown in FIG. That is, the signal cable 1
The second signal core wire 13 is connected to the signal electrode 11 by inserting a through hole from the ground electrode surface side to the signal electrode surface side with the insulator 13a covered on the conductor 13b, and the shield wire 14 is grounded. A circuit board 6 connected to the electrode 10 for
The connection state with the signal cable 12 is ensured. In this embodiment, the solder portion 15 is formed by soldering to secure the connection state. However, a connection structure using a conductive adhesive or the like may be used. The connection between the FPC 17 and each of the circuit boards 4, 5, and 6 is performed by connecting electrodes provided on the side surfaces of the circuit boards 4, 5, and 6 to the FPC.
17 electrodes are electrically connected. At this time, a signal cable is mounted on the circuit board 6, and an electronic component 19 is mounted on the circuit board 5.
By mounting the solid-state imaging device individually on the circuit board 4 and determining whether the solid-state imaging device is good or not, and finally connecting the FPC 17 to the FPC 17, high quality after assembly is obtained and the loss at the time of occurrence of a defect is minimized. it can. The connection means is connected by thermocompression bonding using an anisotropic conductive film, but may be another method such as heating connection using solder. Further, it may be an FPC or another circuit board. This connection can be made easily and in a short time, so that the thermal effect on the solid-state imaging device can be reduced. In addition, a lens system 20 for forming an image of a subject on the solid-state imaging device and a filter 17 for performing color correction and the like are provided on the main body member on the distal end side of the guide tube of the circuit board 6. In addition, forceps hole 1 for inserting forceps
8, illumination fibers (not shown), and air / water holes (not shown) extend from the base end of the scope and are fixed to the main body member 21. The signal cable 12 uses a coaxial cable in consideration of characteristics such as capacitance and characteristic impedance. In this embodiment, the ground electrode and the signal electrode are provided on the peripheral edge of the through hole in the circuit board 6, but may be provided near the through hole.

FIG. 5 is a longitudinal sectional view schematically showing the distal end rigid portion of the scope insertion portion in the endoscope of the second embodiment to which the present invention is applied.

The endoscope according to the second embodiment has an appearance structure as shown in the perspective view of FIG. 2, but the circuit board 4 on which the solid-state image pickup device is mounted is substantially parallel to the axis of the scope insertion portion. The second embodiment differs from the first embodiment in that a prism 22 is provided. The reason for adopting this structure is that when a solid-state imaging device having a large number of pixels is used for the purpose of obtaining a high-resolution image or the like, the circuit board 4 on which the solid-state imaging device is mounted is arranged vertically to the axis of the scope insertion section. Since the rigid portion 3 has a large diameter, the circuit board is disposed in parallel with the axis of the scope insertion portion to avoid the large diameter. Also in this case, as in the first embodiment, the signal cable is connected to a circuit board disposed perpendicular to the axis of the scope insertion portion, and the FPC 17 is connected by a side electrode. The FPC 17 is connected to an electrode on the substrate surface opposite to the imaging surface of the circuit board 4 on which the fixed imaging device is mounted. The electrode connection is sealed with a resin. In this embodiment, electronic components are mounted on a circuit board 6 to which a signal cable is connected. In this case, the side electrode side of the circuit board 6 is shown in FIG. (B), the signal side surface is as shown in FIG. 6 (C). When only the signal cable is connected to the circuit board 6,
FIG. 7 (A) shows the ground side surface, and FIG. 7 (B) shows the signal side surface.
And the side electrodes are the same as in the example of FIG.

If the circuit board has a circuit board connected to a signal cable as in the first and second embodiments,
The effects of (1) to (6) are obtained.

(1) Since the lead-out length of the signal core is uniform only by the thickness of the circuit board, it is not necessary to finely adjust the length of each signal core, and the adjustment concentrates stress. Problems such as disconnection have disappeared.

(2) The signal core wire can be easily positioned by penetrating the through hole of the circuit board, and can be accurately connected to the signal electrode.

(3) The signal core wire is insulated from the outside by passing through the through hole of the circuit board, and does not short-circuit with other electrodes or the signal core wire.

(4) Since the lead length of the signal core wire is as short as the thickness of the circuit board, noise is less likely to occur.

(5) The signal electrode and the ground electrode are separately arranged on the opposite surface, and the shield wire can be connected at the periphery or near the entrance of the through hole. Therefore, there is no possibility of causing a short circuit with the signal electrode or the signal core wire.

(6) From the above (1) to (6), it is possible to connect signal cables with high density because there is no danger of disconnection or short-circuit without any skill due to the elimination of assembly and no risk of short circuit. The circuit board can be downsized. As a result, the diameter and length of the tip rigid portion can be significantly reduced as compared with the conventional case. When the circuit board is substantially perpendicular to the guide tube axis, the effect of reducing the length of the rigid portion at the tip is particularly great, and when the circuit board is substantially parallel, the effect of reducing the diameter is great.

From the above, it is possible to construct a highly reliable endoscope without requiring skill, and to provide an endoscope with high insertability and less pain to a subject.

[0024]

As described above, according to the present invention,
Reliable reliability can be achieved in a single operation by avoiding complicated routing of signal core wires, simplifying cable alignment and connection, reducing the risk of failure such as disconnection and short circuit, and improving the electrode array density. It is possible to provide a fixed imaging device which is high and can reduce the exclusive space in the radial direction and the scope axis direction, and an endoscope using the solid-state imaging device.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view schematically showing a distal end rigid portion of a guiding tube in an endoscope according to a first embodiment to which the present invention is applied.

FIG. 2 is a perspective view schematically showing an appearance of an endoscope.

FIG. 3 is a view showing the structure of a shielded cable.

FIG. 4 is a diagram showing details of a connection portion between the shielded cable and the circuit board.

FIG. 5 is a longitudinal sectional configuration view schematically showing a distal end rigid portion of a guiding tube in an endoscope of a second embodiment applied to the present invention.

FIG. 6 is a diagram showing an example of an electrode layout when an electronic component and a signal cable are connected on a circuit board.

FIG. 7 is a diagram showing an example of an electrode layout when only a signal cable is connected on a circuit board.

FIG. 8 is a partially cutaway top view of a rigid distal end portion of a conventional endoscope.

FIG. 9 is a longitudinal sectional configuration diagram of a selective rigid portion in a conventional endoscope.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Scope insertion part 2 Operation part 3 Tip rigid part 4 Circuit board mounted with solid-state image sensor 5 Circuit board mounted with electronic components 6 Circuit board connected with signal cable 7 Flexible printed board (FPC) 10 Ground electrode 11 Signal for ground Electrode 12 Signal cable (cable with seal) 13 Signal core wire 14 Shield wire

──────────────────────────────────────────────────続 き Continued on the front page (58) Fields surveyed (Int. Cl. ⁷ , DB name) A61B 1/00-1/32

Claims (10)

(57) [Claims] 1. A has a ground electrode on one surface of the plate surface has become a plurality of signal electrodes on the other surface, and includes a circuit board formed by providing a through hole between the both sides, the signal
Multiple shielded signal lines from the
In the solid-state imaging device from which signals are taken out, the signal line is connected to the signal electrode by inserting the through hole from the ground electrode surface to the signal electrode surface side,
A solid-state imaging device, wherein the shield wire is connected to the ground electrode. 2. The solid-state imaging device according to claim 1, wherein
The solid-state imaging device according to claim 1, wherein both the ground electrode and the signal electrode are formed at or near a peripheral portion of the through hole. 3. A ground electrode is provided on one of the plate surfaces.
And has a plurality of signal electrodes on the other surface, and
A circuit board provided with a through hole between both surfaces, wherein the signal
Multiple shielded signal lines from the
In the endoscope Ri assembling a solid state imaging device signal is taken to the distal end rigid portion of the scope insertion portion, the solid-state imaging device, a plurality of signals Rusorezore shielded extending from the proximal end side of the scope insertion portion An endoscope, wherein a wire is inserted from the ground electrode surface to the signal electrode surface side through the through hole to be connected to the signal electrode, and a shield wire thereof is connected to the ground electrode. 4. The endoscope according to claim 3, wherein the ground electrode and the signal electrode are both formed at or near a periphery of the through hole. 5. The endoscope according to claim 3, wherein the circuit board is disposed substantially perpendicular to an axis of the scope insertion section , and a surface on which the ground electrode is provided is located on a base end side of the scope insertion section. An endoscope characterized in that the endoscope is fixed so that the surface on which the signal electrode is provided faces the distal end of the scope insertion portion. 6. The endoscope according to claim 3, wherein a part or all of the electronic component is mounted on the circuit board when the electronic component is incorporated into the rigid distal end portion. 7. The endoscope according to claim 3, wherein when the electronic component is incorporated in the rigid distal end portion, a part or all of the electronic component is mounted on a circuit board different from the circuit board. Endoscope. 8. The endoscope according to claim 3, wherein the circuit board is electrically connected to another circuit board by using electrodes provided on side surfaces. 9. The endoscope according to claim 5, wherein the circuit board on which the solid-state imaging device is mounted and the circuit board on which the electronic components are mounted are disposed substantially perpendicular to the axis of the scope insertion portion, and are respectively provided on side surfaces. The circuit board on which the solid-state imaging device is mounted is more electrically connected to the circuit board disposed substantially parallel to the axis of the scope insertion portion by using the provided electrodes, and the circuit board on which the electronic components are mounted is more scoped. An endoscope provided on a distal end side of an insertion portion. 10. The endoscope according to claim 5, wherein both electrodes of said circuit board and another circuit board are electrically connected by an anisotropic conductive film. .