JP7779259B2 - Imaging device - Google Patents

Description

The present disclosure relates to an imaging device.

Endoscope systems capable of observing the interior of body cavities or internal organs have been developed (see, for example, Patent Document 1). In conventional technology, endoscopes include an imaging element that captures images of the interior of body cavities or internal organs, and a cable for transmitting image data captured by the imaging element.

Patent No. 6622292

When the electrical contacts of the imaging element in an endoscope are directly connected to the cable, the contact area between the imaging element's electrical contacts and the cable is small. Therefore, the bond strength between the imaging element and the cable is thought to be low. Therefore, if force is applied to the joint between the imaging element and the cable, the joint can easily break, potentially affecting the function of the endoscope.

Therefore, the present disclosure aims to provide technology that improves the bonding strength between the imaging element and the cable.

To solve the above-mentioned problems, the present disclosure adopts the following configuration.

That is, an imaging device according to one aspect of the present disclosure comprises an imaging element having a plurality of terminals arranged on its rear end surface, metal wires that transmit electrical signals input to or output from the imaging element via the terminals, and a substrate that is arranged between the rear end surface of the imaging element and the metal wires and enables electrical continuity between the plurality of terminals and the metal wires, the substrate having a first connection portion that faces the rear end surface of the imaging element and that has a plurality of lands arranged thereon that are connected to the plurality of terminals, and a second connection portion that has a linear conductor portion arranged parallel to the optical axis of the imaging element and that can be connected to the metal wires.

With this configuration, the bonding area between the image sensor terminal and the substrate is increased at the first connection portion. Furthermore, the bonding area between the metal wire and the substrate is increased at the second connection portion. Therefore, compared to when the image sensor and the metal wire are directly connected, the bonding strength is improved at the connection portions between the image sensor and the substrate, and between the metal wire and the substrate.

Furthermore, when the terminals of the imaging element are directly connected to the metal wire, work efficiency decreases because the metal wire is flexible. Furthermore, the small bonding area between the terminals of the imaging element and the metal wire also reduces work efficiency when connecting the terminals of the imaging element and the metal wire. On the other hand, with this configuration, the board is more rigid than the metal wire, improving work efficiency when connecting the terminals of the imaging element to the board and the metal wire to the board. Furthermore, the large bonding area between the terminals of the imaging element and the board and the metal wire to the board also improves work efficiency when connecting the terminals of the imaging element to the board and the metal wire to the board.

In the imaging device relating to the above aspect, the substrate has a connection surface that faces the rear end surface of the imaging element and a side surface that is perpendicular to the connection surface, and the first connection portion may be the connection surface and the second connection portion may be the side surface.

With this configuration, the bonding area between the image sensor terminal and the substrate is increased at the first connection portion. Furthermore, the bonding area between the metal wire and the substrate is increased at the second connection portion. Therefore, compared to when the image sensor and the metal wire are directly connected, the bonding strength is improved at the connection portions between the image sensor and the substrate, and between the metal wire and the substrate.

Furthermore, when the terminals of the imaging element are directly connected to the metal wire, work efficiency decreases because the metal wire is flexible. Furthermore, the small bonding area between the terminals of the imaging element and the metal wire also reduces work efficiency when connecting the terminals of the imaging element and the metal wire. On the other hand, with this configuration, the board is more rigid than the metal wire, improving work efficiency when connecting the terminals of the imaging element to the board and the metal wire to the board. Furthermore, the large bonding area between the terminals of the imaging element and the board and the metal wire to the board also improves work efficiency when connecting the terminals of the imaging element to the board and the metal wire to the board.

In the imaging device relating to the above aspect, the linear conductor portion in the second connection portion may have a groove extending rearward from the connection surface of the substrate.

With this configuration, the groove guides the metal wire to be arranged in a straight line at the second connection portion of the substrate. This improves the work efficiency of connecting the metal wire to the substrate. Furthermore, because the metal wire is guided to be arranged in a straight line at the second connection portion, the bonding area between the metal wire and the substrate is easily increased. This makes it easy to improve the bonding strength between the metal wire and the substrate.

In the imaging device relating to the above aspect, a third connection portion may be formed on the linear conductor portion of the second connection portion to which an electrical element that adjusts the electrical signal transmitted by the metal wire connected to the linear conductor portion is connected.

With this configuration, if the electrical element is, for example, a capacitor, noise contained in the electrical signals input to or output from the imaging element, or in the power supplied to the imaging element, can be removed by the electrical element. This results in clearer images captured by the imaging element. Furthermore, there is no need to provide a new board to mount the electronic element. This allows for a more compact imaging device.

In the imaging device relating to the above aspect, the third connection portion may be provided on the back side of the connection surface, located rearward from the connection surface.

This configuration allows components to be positioned toward the rear end as viewed from the connection surface. In other words, the dimensions in the direction perpendicular to the rear end as viewed from the connection surface can be reduced. Therefore, when this configuration is used in, for example, an endoscope, the strain on the patient when the configuration is inserted into their body is reduced.

In the imaging device relating to the above aspect, the substrate may be a ceramic substrate.

This configuration increases the rigidity of the board, thereby improving the work efficiency of connecting the image sensor terminals to the board and connecting the metal wires to the board.

In the imaging device according to one aspect described above, the substrate has a bending portion that can be bent in a direction parallel to the mounting surface, and a first mounting portion and a second mounting portion provided on both sides of the bending portion, the first mounting portion has a predetermined mounting surface on which the multiple lands are arranged and which is positioned opposite the multiple terminals when the substrate is bent at the bending portion, the second mounting portion has the linear conductor portion arranged on the substrate when bent at the bending portion and extends further rearward from the terminals, and the first connection portion may refer to the first mounting portion, and the second connection portion may refer to the second mounting portion.

With this configuration, when the terminals of the image sensor are soldered to the substrate on a specified mounting surface, the bonding area between the terminals and the substrate is larger than when metal wires are directly connected to the terminals. The bonding area between the metal wires and the substrate is also increased. This improves the bonding strength between the terminals of the image sensor and the substrate, and between the metal wires and the substrate.

Furthermore, when the terminals of the imaging element are directly connected to the metal wire, the joining area between the imaging element terminals and the metal wire is small, which reduces the work efficiency of connecting the terminals of the imaging element to the metal wire. On the other hand, with this configuration, the joining area between the imaging element terminals and the board, and the joining area between the metal wire and the board, are large, which improves the work efficiency of connecting the terminals of the imaging element to the board and the metal wire to the board.

Furthermore, with this configuration, the bending of the board allows the second mounting section to be positioned so that it extends further toward the rear end when viewed from the terminal. This prevents the board from protruding in a direction perpendicular to the rear end, preventing the outer diameter of the insertion section from becoming too large. Therefore, when the insertion section of an endoscope including this configuration is inserted into the patient's body through the patient's mouth, for example, the burden on the patient is reduced.

In the imaging device according to one aspect described above, on the predetermined mounting surface of the first mounting portion, some of the plurality of lands may be connected to the linear conductor portion in the second mounting portion that is arranged on the same surface as the predetermined mounting surface of the substrate, and the remaining portion of the plurality of lands may be connected to the linear conductor portion in the second mounting portion that is arranged on the opposite surface of the second mounting portion to the predetermined mounting surface of the substrate.

This configuration allows the conductors to be connected to both sides of the board. Therefore, compared to connecting the conductors only to the same surface as the designated mounting surface, the dimensions in the direction perpendicular to the rear end direction as viewed from the connection surface can be reduced.

In the imaging device relating to the above aspect, the bent portion may have a portion whose cross-sectional area in a direction perpendicular to the arrangement direction of the first mounting portion and the second mounting portion is smaller than the cross-sectional area of the first mounting portion in that direction and the cross-sectional area of the second mounting portion in that direction.

This configuration reduces the bending rigidity of the bending section. This allows the curvature of the bending section to be reduced. This allows the substrate to be arranged compactly and prevents the outer diameter of the insertion section from becoming too large. This reduces the strain on the patient when inserting the insertion section of an endoscope including this configuration into the patient's body.

In the imaging device relating to the above aspect, the bent portion may have a slit that penetrates the substrate.

This configuration makes it easier to reduce the bending rigidity at the bending section. Therefore, the curvature of the bending section can be reduced. Therefore, the substrate can be arranged compactly, and the outer diameter of the insertion section is prevented from becoming larger. Therefore, when inserting the insertion section of an endoscope including this configuration into the patient's body, the burden on the patient is reduced. Furthermore, by adjusting the length of the slit, the area where bending rigidity is reduced can be easily adjusted. Therefore, it is easy to bend the substrate. Therefore, it is easy to arrange the substrate compactly.

In the imaging device relating to the above-mentioned aspect, a fourth connection portion may be formed on the linear conductor portion in the second mounting portion to which a second electrical element that adjusts the electrical signal transmitted by the metal wire connected to the linear conductor portion is connected.

With this configuration, if the second electrical element is, for example, a capacitor, noise contained in the electrical signal input to or output from the imaging element, or in the power supplied to the imaging element, can be removed by the second electrical element. This results in clearer images captured by the imaging element. Furthermore, there is no need to provide a new board to mount the second electrical element. This allows for a more compact imaging device.

In the imaging device relating to the above aspect, the second electrical element may be positioned in a position overlapping with the terminal in the rear end direction as viewed from the terminal.

This configuration reduces the dimensions of the imaging device in a direction perpendicular to the rear end direction, preventing the outer diameter of the insertion section from becoming too large. Therefore, when an insertion section of an endoscope including this configuration is inserted into the patient's body through the patient's mouth, for example, the burden on the patient is reduced.

In the imaging device relating to the above aspect, each of the multiple terminals may have a spherical solder portion protruding from the rear end surface of the imaging element.

With this configuration, the bonding area between the terminals of the imaging element and the substrate is increased, thereby improving the bonding strength between the imaging element and the substrate.

This disclosure provides technology that improves the bonding strength between the imaging element and the cable.

FIG. 1 shows an overview of an endoscope according to an embodiment. FIG. 2 shows a detailed view of the imaging device. FIG. 3A shows an example of a front view of a ceramic substrate. FIG. 3B shows an example of a plan view of a ceramic substrate. FIG. 3C shows an example of a bottom view of a ceramic substrate. FIG. 3D shows an example of a back view of a ceramic substrate. FIG. 4 shows an example of an imaging device according to a comparative example. FIG. 5 illustrates an overview of an imaging device according to the second embodiment. FIG. 6A is an example of a front view of an FPC. FIG. 6B is an example of a rear view of the FPC. FIG. 7 shows an outline of an FPC according to a first modified example. FIG. 8 shows an example of a cross-sectional view of a bent portion of an FPC according to a second modified example.

The following describes embodiments of the present disclosure. The embodiments described below are examples of embodiments of the present disclosure, and the technical scope of the present disclosure is not limited to the following aspects.

First Embodiment
FIG. 1 illustrates an overview of an endoscopic device 100 according to a first embodiment of the present disclosure. As illustrated in FIG. 1 , the endoscopic device 100 includes an insertion section 101 that is inserted into a patient's body. The insertion section 101 includes an irradiation section that irradiates light onto a body cavity or the lumen of an internal organ, and an image sensor (described later) that receives light reflected from the lumen of the body cavity or the internal organ and converts the incident light into an electrical signal. The endoscopic device 100 also includes an operation section 102 at the rear end of the insertion section 101 that operates the insertion section 101. The endoscopic device 100 also includes a cord 105. The cord 105 connects the operation section 102 to an external light source device 103 and an external information processing device 104. An optical fiber is provided within the cord 105. Light irradiated from the light source device 103 is transmitted to the irradiation section via the optical fiber. An electrical signal output from the image sensor is input to the information processing device 104 via the cord 105. An electronic image of the body cavity or the lumen of the internal organ is generated based on the input electrical signals in the information processing device 104. A general-purpose computer can be used as the information processing device 104, but it may also be equipped with a processor specifically for image processing.

Figure 2 shows a detailed view of the imaging device 111 provided inside the insertion section 101. In the following description, the diagonally upward left direction in Figure 2 is referred to as the tip direction (imaging direction), and the diagonally downward right direction in Figure 2 is referred to as the rear end direction or rear (the direction opposite to the imaging direction).

As shown in Figure 2, the tip of the imaging device 111 is provided with an imaging optical system 3 for collecting light reflected from the object of observation and forming an image on a solid-state imaging element 2 (described below). This imaging optical system 3 is held inside a lens barrel 4. The rear end of the lens barrel 4 is provided with a solid-state imaging element 2 onto which the light collected by the imaging optical system 3 is incident and forms an image. The incident light is converted into an electrical signal in the solid-state imaging element 2.

The solid-state imaging element 2 also has a ball grid array (BGA) 7 at its rear end. The BGA 7 is formed by adding spherical solder balls to each of four lands, and consists of four spherical terminals that protrude from the rear of the solid-state imaging element 2. Two of the four spherical terminals of the BGA 7 are terminals for power supply, one is a terminal for input signals, and the remaining one is a terminal for output signals. The BGA 7 is an example of the "terminals possessed by the imaging element" in this disclosure.

The imaging device 111 is also provided with a cable 5 that supplies power to the solid-state imaging element 2 and transmits input signals to and output signals from the solid-state imaging element 2. The cable 5 has a conductor portion 53, an insulator portion 52, and an exterior portion 51. The conductor portion 53 is made of metal and is conductive. The conductor portion 53 is exposed at its tip, but is covered at its rear by an insulator portion 52 that has insulating properties. The insulator portion 52 is further housed at its rear inside the exterior portion 51. The conductor portion 53 is formed from four bare wires. One of the four bare wires is an input line 531 through which an input signal input to the solid-state imaging element 2 is transmitted. The other of the four bare wires is an output line 532 through which an output signal output from the solid-state imaging element 2 is transmitted. The remaining two of the four lines are a power supply line 533 for transmitting power supplied from a power source to the solid-state imaging device 2, and a ground (GND) line 534.

A ceramic substrate 6 is disposed between the solid-state imaging element 2 and the cable 5. Figures 3A-3D are examples of projection views of the ceramic substrate 6. Figure 3A is a front view seen from the solid-state imaging element 2 side of Figure 2. Figures 3B-3D are a plan view, a bottom view, and a rear view, respectively. As shown in Figures 2 and 3, the ceramic substrate 6 is rectangular and has a thickness of, for example, approximately 0.5 mm-1.0 mm in the front-to-rear direction. The ceramic substrate 6 is disposed so that its first mounting surface 61 faces the solid-state imaging element 2. Four lands 62 that can come into contact with the BGA 7 are provided on the first mounting surface 61. The BGA 7 is soldered to the lands 62. The first mounting surface 61 is an example of a "first connection portion" in this disclosure.

In addition, linear grooves 63 are provided on the second mounting surface 64 shown in FIG. 3B and the third mounting surface 65 shown in FIG. 3C, which are located to the side of the first mounting surface 61, along the longitudinal axis direction of the endoscope device 100. Two grooves 63 are provided on each of the second mounting surface 64 and the third mounting surface 65. Castellations are formed in the grooves 63. Note that side patterns may be formed instead of castellations. Furthermore, power supply wiring 533 and GND wiring 534 of the cable 5 are soldered along the grooves 63 on the second mounting surface 64.

Meanwhile, the input wires 531 and output wires 532 of the cable 5 are soldered along the grooves 63 of the third mounting surface 65. As shown in FIG. 3, pattern wiring is formed between the castellations of the grooves 63 in which the input wires 531, output wires 532, power supply wiring 533, and GND wiring 534 are mounted, and the lands 62 to which the BGA 7 is soldered, providing electrical conductivity. The second mounting surface 64 and the third mounting surface 65 are examples of the "second connection portion" of the present disclosure.

Furthermore, a capacitor 8 (see FIG. 2) is mounted on a fourth mounting surface 66 (see FIG. 3D) on the backside of the first mounting surface 61 of the ceramic substrate 6. Here, pattern wiring is formed between the land on which the capacitor 8 is mounted and the castellation formed in the groove 63 of the second mounting surface 64, providing electrical conductivity. Therefore, the capacitor 8 can remove noise contained in the power passing through the power supply wiring 533 mounted in the groove 63 of the second mounting surface 64. The capacitor 8 is an example of an "electrical element" in the present disclosure. The fourth mounting surface 66 on which the capacitor 8 is mounted is an example of a "third connection portion" in the present disclosure.

Figure 4 shows an example of an imaging device 211 provided inside the insertion section 201 of an endoscopic device according to a comparative example. No ceramic substrate 6 is disposed between the solid-state imaging element 2 and the cable 5 of the endoscopic device according to the comparative example. In the comparative example, the input line 531, output line 532, power supply wiring 533, and GND wiring 534 of the cable 5 are directly bonded to the BGA 7 of the solid-state imaging element 2. In addition, the imaging device 211 does not include a capacitor 8.

[Actions and Effects]
In the endoscope device 100 described above, the spherical BGA 7 is soldered to the lands 62 on the first mounting surface 61 of the ceramic substrate 6 at four locations. This provides a sufficiently large bonding area between the BGA 7 and the ceramic substrate 6. Furthermore, the conductors 53 of the cable 5 (input line 531, output line 532, power supply wiring 533, and GND wiring 534) are mounted on castellations formed in linear grooves 63 on the second mounting surface 64 and the third mounting surface 65 of the ceramic substrate 6. This increases the bonding area between the conductors 53 and the ceramic substrate 6. This improves the bonding strength between the BGA 7 and the ceramic substrate 6 and between the conductors 53 and the ceramic substrate 6 compared to when the BGA 7 and the conductors 53 are directly connected, as in the image pickup device 211 according to the comparative example shown in FIG. 4 .

Furthermore, when the BGA 7 and the conductor portion 53 are directly connected as in the imaging device 211 of the comparative example, the flexibility of the conductor portion 53 reduces the efficiency of the connection work. Furthermore, the small bonding area between the BGA 7 and the conductor portion 53 also reduces the efficiency of the work of connecting the BGA 7 and the conductor portion 53. On the other hand, with the endoscope device 100 described above, the ceramic substrate 6 is more rigid than metal wires and printed circuit boards (made of paper phenol or glass epoxy), improving the efficiency of the work of connecting the BGA 7 and the ceramic substrate 6 and connecting the conductor portion 53 to the ceramic substrate 6.

In addition, since the bonding area between the BGA 7 and the ceramic substrate 6 and the bonding area between the conductor portion 53 and the ceramic substrate 6 are large, the work efficiency of connecting the BGA 7 and the ceramic substrate 6 and connecting the conductor portion 53 and the ceramic substrate 6 is improved.

Furthermore, with the endoscope device 100 as described above, the linear grooves 63 on the second mounting surface 64 and the third mounting surface 65 of the ceramic substrate 6 guide the conductor portion 53 to maintain its linear shape. This improves the work efficiency of connecting the conductor portion 53 to the ceramic substrate 6. Furthermore, the bonding area between the conductor portion 53 and the ceramic substrate 6 is increased. This makes it easy to improve the bonding strength between the conductor portion 53 and the ceramic substrate 6.

The conductor portion 53 is mounted so as to fit into linear grooves 63 provided on the second mounting surface 64 and the third mounting surface 65 of the ceramic substrate 6. This prevents the conductor portion 53 from protruding from the mounting portion. As a result, the size of the endoscope device 100 is made compact.

Furthermore, with the endoscope device 100 as described above, power supply noise contained in the power supply that drives the solid-state imaging element 2 can be removed by the capacitor 8. This improves the image quality of the image obtained by the solid-state imaging element 2. Furthermore, with the endoscope device 100 as described above, it is not necessary to provide a new board to mount the capacitor 8. This allows the size of the endoscope device 100 to be made compact.

Furthermore, in the above-described endoscopic device 100, the lens barrel 4, solid-state image sensor 2, ceramic substrate 6, and cable 5 are arranged along the direction from the tip to the rear end. Furthermore, the capacitor 8 is mounted on the fourth mounting surface 66, which is located rearward from the first mounting surface 61, and is arranged without protruding in a direction perpendicular to the direction from the tip to the rear end. Therefore, the above-described endoscopic device 100 can have a reduced dimension in the direction perpendicular to the direction from the tip to the rear end. Therefore, when the endoscopic device 100 is inserted into the patient's body, the burden on the patient is reduced.

On the other hand, in the imaging device 211 of the comparative example, a new substrate is required when installing the capacitor 8. This may increase the size of the insertion section 201. This increases the burden on the patient when the insertion section 201 is inserted into their body.

Second Embodiment
FIG. 5 illustrates an overview of an imaging device 111A included in an endoscopic device 100A according to the second embodiment. The endoscopic device 100A includes components similar to those included in the endoscopic device 100 according to the first embodiment, except for the imaging device 111A. As shown in FIG. 5 , the imaging device 111A includes a flexible printed circuit board (FPC) 26 disposed between the solid-state imaging element 2 and the cable 5. The FPC 26 has a rectangular shape, e.g., a width of approximately 1 mm and a length of approximately 5 mm. The FPC 26 is disposed in a bent state at a bending portion 20. A slit 9 is provided in the central portion of the bending portion 20, extending along the longitudinal axis.

The FPC 26 is a double-sided mountable board having a first mounting surface 61A and a second mounting surface 64A. As shown in FIG. 5, the tip of the first mounting surface 61A (an example of a "first mounting portion" in this disclosure) is positioned to face the BGA 7 of the solid-state imaging device 2. The rear end of the second mounting surface 64 is positioned to extend further rearward as viewed from the BGA 7. The tip of the first mounting surface 61A is an example of a "predetermined mounting surface" in this disclosure. The portion of the FPC 26 that includes the tip of the first mounting surface 61A and is on the BGA 7 side as viewed from the bent portion 20 is an example of a "first mounting portion" in this disclosure. The portion of the FPC 26 that includes the rear end of the second mounting surface 64A and is on the rear side as viewed from the bent portion 20 is an example of a "second mounting portion" in this disclosure.

Figures 6A and 6B are examples of projection views of FPC 26. Figure 6A is a front view of FPC 26. Figure 6B is a rear view of FPC 26. Note that the lower part of Figure 6 corresponds to the front end in Figure 5, and the upper part corresponds to the rear end in Figure 5.

As shown in FIG. 6A, the tip of the first mounting surface 61A is provided with lands 61A0, 61A1, 61A2, and 61A3 to which four BGAs 7 can be soldered. Here, land 61A0 is a land for output signals output from the solid-state imaging element 2. Land 61A1 is a land for input signals input to the solid-state imaging element 2. Meanwhile, land 61A2 is a land through which power supplied from the power supply to the solid-state imaging element 2 passes. Land 61A3 is a land for GND. When soldering lands 61A0, 61A1, 61A2, and 61A3 to the BGA 7, the lands are positioned using a jig, for example.

Also, as shown in FIG. 6A, the rear end of the first mounting surface 61A is provided with land 61A4 (for output signals) and land 61A5 (for input signals), to which input line 531 and output line 532 can be respectively mounted. Lands 61A4 and 61A5 are arranged to extend toward the rear end so that input line 531 and output line 532 can be mounted. Land 61A0 at the front end and land 61A4 at the rear end, and land 61A1 at the front end and land 61A5 at the rear end, are electrically connected by pattern wiring. Therefore, the input signal transmitted through input line 531 is input from land 61A5 and then input from land 61A1 to the solid-state imaging element 2 via the pattern wiring formed on the FPC 26. Meanwhile, the output signal output from the solid-state imaging element 2 is input to the pattern wiring formed on the FPC 26 via land 61A0. The output signal that has passed through the pattern wiring is output to output line 532 via land 61A4. The output signal that has passed through output line 532 is output to information processing device 104 shown in Fig. 1. In information processing device 104, an image showing the inner cavity of a body cavity or internal organ is generated based on the output signal.

On the other hand, as shown in Figure 6B, the second mounting surface 64A, which is the backside of the first mounting surface 61A, has power supply lands at its tip, namely, land 64A1 (for GND) and land 64A2 (for power supply). Here, lands 64A1 and 64A2 are electrically connected to lands 61A2 and 61A3, respectively, provided on the first mounting surface 61A, via vias.

The rear end of the second mounting surface 64A also includes a land 64A3 on which GND wiring 534 can be mounted and a land 64A4 on which power supply wiring 533 can be mounted. Lands 64A3 and 64A4 are arranged to extend toward the rear end so that power supply wiring 533 and GND wiring 534 can be mounted. Lands 64A1 at the front end and 64A3 at the rear end, and lands 64A2 at the front end and 64A4 at the rear end, are electrically connected by pattern wiring. Therefore, power supplied from a power source via power supply wiring 533 is input from land 64A4 and then input to the solid-state imaging element 2 from land 61A2 (first mounting surface 61A, see Figure 6A) via the pattern wiring formed on the FPC 26 and land 64A2.

Furthermore, lands 64A5 and 64A6 (an example of a "fourth connection portion" in this disclosure) are provided in the pattern wiring formed between lands 64A1 and 64A3 on the second mounting surface 64A, and between lands 64A2 and 64A4. Capacitor 8A (an example of a "second electrical element" in this disclosure, see Figure 5) is mounted on lands 64A5 and 64A6. Capacitor 8A mounted on lands 64A5 and 64A6 in this manner removes noise contained in the power supply signal passing through the pattern wiring. Mounting capacitor 8A on lands 64A5 and 64A6 also results in it being positioned in a portion that overlaps with BGA 7 in the rear end direction, as shown in Figure 5.

[Actions and Effects]
In the endoscope device 100A equipped with the imaging device 111A described above, the spherical BGA 7 is soldered to the lands 61A0, 61A1, 61A2, and 61A3 provided on the first mounting surface 61A of the FPC 26. This increases the bonding area between the BGA 7 and the FPC 26. The input line 531 and the output line 532 of the cable 5 are mounted along the first mounting surface 61A of the FPC 26 and bonded to the linear lands 61A5 and 61A4 (see FIG. 6A ). The power supply wiring 533 and the GND wiring 534 of the cable 5 are mounted along the second mounting surface 64A and bonded to the linear lands 64A4 and 64A3 (see FIG. 6B ). This increases the bonding area between the FPC 26 and each of the input lines 531, output lines 532, power supply wiring 533, and GND wiring 534 of the cable 5. This improves the bonding strength between the BGA 7 and the FPC 26, and between the FPC 26 and each of the input lines 531, output lines 532, power supply wiring 533, and GND wiring 534, compared to when the BGA 7 is directly connected to the input lines 531, output lines 532, power supply wiring 533, and GND wiring 534 as in the image pickup device 211 according to the comparative example shown in FIG.

Furthermore, when the BGA 7 is directly connected to the input line 531, output line 532, power supply wiring 533, and GND wiring 534 as in the imaging device 211 of the comparative example, the joining area between the BGA 7 and the input line 531, output line 532, power supply wiring 533, and GND wiring 534 is small, so the work efficiency of connecting the BGA 7 to the input line 531, output line 532, power supply wiring 533, and GND wiring 534 is reduced. On the other hand, with the endoscope device 100A as described above, the bonding area between the BGA 7 and the FPC 26, and the bonding area between the FPC 26 and the input line 531, the output line 532, the power supply wiring 533, and the GND wiring 534 are large, so the work efficiency of connecting the BGA 7 and the FPC 26, and connecting the FPC 26 and the input line 531, the output line 532, the power supply wiring 533, and the GND wiring 534 is improved.

Furthermore, according to the endoscope device 100A described above, a slit 9 is provided in the bending portion 20 of the FPC 26 (see FIG. 5). Therefore, the cross-sectional area of the bending portion 20 (in a direction perpendicular to the bending direction) is smaller than the cross-sectional area of the FPC 26 in locations other than the bending portion 20 (the portion where the BGA 7 is mounted and the portions where the input line 531, output line 532, power supply wiring 533, and GND wiring 534 are mounted). This reduces the bending rigidity of the bending portion 20, thereby reducing the curvature of the bending portion 20. This prevents the FPC 26 from protruding in a direction perpendicular to the direction toward the rear end as viewed from the BGA 7, and allows the FPC 26 to be positioned so that it extends toward the rear end as viewed from the BGA 7. In other words, the FPC 26 is positioned compactly. Therefore, when the insertion portion 101 is inserted into the body through the patient's mouth, for example, the patient's burden is reduced.

In addition, the provision of the slit 9 makes it possible to easily bend the bending portion 20. Furthermore, by changing the length of the slit 9, it is possible to easily adjust the area in the bending portion 20 where the rigidity against bending decreases. Therefore, it becomes easy to bend the FPC 26. Therefore, it becomes easy to arrange the FPC 26 compactly as described above.

Furthermore, with the endoscope device 100A described above, power supply noise contained in the power supply that drives the solid-state image sensor 2 can be removed by the capacitor 8A. This makes the image captured by the solid-state image sensor 2 clearer. Furthermore, with the endoscope device 100A described above, it is not necessary to provide a new board to mount the capacitor 8A. This allows the size of the endoscope device 100A to be made compact.

Furthermore, with the above-described endoscopic device 100A, the lens barrel 4, solid-state image sensor 2, FPC 26, and cable 5 are arranged in a direction from the tip to the rear end. Furthermore, the capacitor 8A is arranged in a position overlapping the BGA 7 in the rear end direction as viewed from the BGA 7. In other words, the capacitor 8A is arranged without protruding in a direction perpendicular to the direction toward the rear end as viewed from the BGA 7. Therefore, the above-described endoscopic device 100A can be said to have a small dimension in a direction perpendicular to the direction toward the rear end as viewed from the BGA 7. Therefore, when the endoscopic device 100A is inserted into the patient's body, the burden on the patient is reduced.

<Modification 1>
7 shows an outline of an FPC 26A according to a first modified example. In FIG. 7, the right side corresponds to the leading end, and the left side corresponds to the trailing end. The FPC 26A according to the first modified example does not have slits 9. Instead, the FPC 26A has holes 10 aligned in the width direction at the bent portion 20A. The holes 10 are positioned so as to avoid the pattern wiring provided on the FPC 26A.

Such an FPC 26A also reduces the cross-sectional area of the bending portion 20A in a direction perpendicular to the bending direction. This reduces the bending rigidity of the bending portion 20A, and as a result, the curvature of the bending portion 20A can be reduced. This prevents the FPC 26A from protruding in a direction perpendicular to the direction toward the rear end as viewed from the BGA 7, and allows the FPC 26A to be positioned so that it extends toward the rear end as viewed from the BGA 7. In other words, the FPC 26A is positioned compactly. This reduces the strain on the patient when the insertion portion 101A having the imaging device 111A is inserted into the patient's body through the patient's mouth, for example.

<Modification 2>
FIG. 8 shows an example cross-sectional view of a bent portion 20B of an FPC 26B according to a second modified example. The FPC 26B includes a base 11 at its center. Circuit layers 12A and 12B are formed on both sides of the base 11. The FPC 26B also includes coverlays 13A and 13B to protect the circuit layers 12A and 12B. The circuit layer 12A and the coverlay 13A are bonded together by adhesive layers 14A and 14B, respectively. Portions of the coverlays 13A and 13B are further covered by reinforcing plates 15A and 15B, respectively. The coverlay 13A and the reinforcing plate 15A are bonded together by adhesive layers 16A and 16B, respectively. At the bent portion 20B of the FPC 26B, holes 17A and 17B are formed in the coverlays 13A and 13B.

With this type of FPC 26B, the cross-sectional area of the bent portion 20B in the direction perpendicular to the bending direction is reduced by the holes 17A and 17B. This allows for the same effect as FPC 26A. In addition, with FPC 26B, the bending rigidity of the bent portion 20B can be reduced without reducing the circuit layers 12A and 12B. This allows the curvature of FPC 26B to be reduced without affecting the formation of the pattern wiring in circuit layers 12A and 12B, allowing FPC 26B to be bent for a compact arrangement.

<Other embodiments>
In the endoscope device 100 according to the first embodiment, the terminals of the solid-state imaging element 2 are spherical BGA 7, but the form of the terminals is not limited to BGA 7. It is sufficient that lands that can be soldered to the terminals of the solid-state imaging element 2 are provided on the ceramic substrate 6. The groove 63 does not have to be provided on the ceramic substrate 6. The surface on which the capacitor 8 is mounted may be a mounting surface different from the fourth mounting surface 66. The capacitor 8 may be built into the ceramic substrate 6. The capacitor 8 itself does not necessarily have to be provided. A printed circuit board made of a material other than ceramic may be provided instead of the ceramic substrate 6.

2, the input wires 531 and output wires 532 are mounted on a third mounting surface 65 located on the underside of the ceramic substrate 6, and the power supply wiring 533 and GND wiring 534 are mounted on a second mounting surface 64 located on the upper surface of the ceramic substrate 6. However, the mounting surfaces for the input wires 531, output wires 532, power supply wiring 533, and GND wiring 534 are not limited to this form. The input wires 531, output wires 532, power supply wiring 533, and GND wiring 534 may be soldered along either mounting surface of the ceramic substrate 6.

In the second embodiment, the capacitor 8A may be mounted in another location on the FPC 26. The capacitor 8A may also be built into the FPC 26. The capacitor 8A itself may not be provided. The slit 9 may not be provided in the bent portion 20 of the FPC 26. The bent portion 20 may also have a shape that narrows its width. Such a shape can also reduce the cross-sectional area of the bent portion 20.

In the second embodiment, the input line 531 and the output line 532 are mounted on the first mounting surface 61A, and the power supply line 533 and the GND line 534 are mounted on the second mounting surface 64A. However, the input line 531, the output line 532, the power supply line 533, and the GND line 534 may be mounted on either mounting surface of the FPC 26. Furthermore, the number of input lines 531 and output lines 532 is not limited to the examples of the first and second embodiments described above.

The embodiments and variations disclosed above can be combined with each other.

2: Solid-state image pickup element 3: Imaging optical system 4: Lens barrel 5: Cable 6: Ceramic substrate 6A: FPC
8, 8A: Capacitor 9: Slit 10: Hole 11: Base 12A, 12B: Circuit layer 13A, 13B: Cover layer 14A, 14B: Adhesive layer 15A, 15B: Reinforcing plate 16A, 16B: Adhesive layer 17A, 17B: Hole 20, 20A, 20B: Bent portion 26, 26A, 26B: FPC
51: exterior portion 52: insulator portion 53: conductor portion 61, 61A: first mounting surface 61A0-61A5: land 62: land 63: groove 64, 64A: second mounting surface 64A1-64A6: land 65: third mounting surface 66: fourth mounting surface 100, 100A: endoscope device 101, 101A: insertion section 102: operation section 103: light source device 104: information processing device 105: cord 111, 111A: imaging device 201: insertion section 211: imaging device 531: input line 532: output line 533: wiring for power supply 534: wiring for GND

Claims (5)

an imaging element having a plurality of terminals disposed on a rear end surface;
a metal wire that transmits an electrical signal input to or output from the imaging element via the terminal;
a substrate disposed between a rear end surface of the imaging element and the metal wire, the substrate enabling electrical continuity between the plurality of terminals and the metal wire;
The substrate is
a first connection portion facing a rear end surface of the imaging element and including a plurality of lands connected to the plurality of terminals;
a second connection portion in which a linear conductor portion connectable to the metal wire is arranged parallel to the optical axis of the imaging element,
the substrate has a bending portion that can be bent in a direction parallel to a mounting surface, and a first mounting portion and a second mounting portion that are provided on both sides of the bending portion;
the first mounting portion has a predetermined mounting surface on which the plurality of lands are arranged and which is disposed opposite the plurality of terminals in the substrate in a state where the substrate is bent at the bending portion;
the second mounting portion has the linear conductor portion disposed on the substrate in a bent state at the bent portion, and extends further rearward from the terminal;
the first connection portion refers to the first mounting portion,
the second connection portion refers to the second mounting portion,
the bent portion has a portion whose cross-sectional area in a direction perpendicular to the arrangement direction of the first mounting portion and the second mounting portion is smaller than the cross-sectional area of the first mounting portion in that direction and the cross-sectional area of the second mounting portion in that direction,
an imaging device in which the bending portion is provided with a base in a central portion of the substrate, the linear conductor portions are formed on both sides of the base, and a coverlay protecting the linear conductor portions is removed to provide areas where the conductor portions are exposed on both sides of the substrate . some of the lands on the predetermined mounting surface of the first mounting portion are connected to the linear conductor portion of the second mounting portion that is disposed on the same surface as the predetermined mounting surface of the substrate;
a remaining portion of the plurality of lands is connected to the linear conductor portion disposed on the surface of the second mounting portion opposite to the predetermined mounting surface of the board;
The imaging device according to claim 1 . a fourth connection portion is formed on the linear conductor portion of the second mounting portion, and a second electric element is connected to the fourth connection portion, the second electric element adjusting an electric signal transmitted by the metal wire connected to the linear conductor portion;
3. The imaging device according to claim 1 . the second electric element is disposed in a position overlapping the terminal in a rear end direction as viewed from the terminal;
The imaging device according to claim 3 . The imaging device according to claim 1 , wherein each of the plurality of terminals has a spherical solder portion protruding from a rear end surface of the imaging element.