JP3029239B2 - Chip and substrate image recognition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a chip and substrate image recognition apparatus in a bonding apparatus, and mainly develops focusing means for image recognition of a chip and a substrate in a flip chip bonding apparatus. It was done.

[0002]

2. Description of the Related Art Conventionally, in a bonding apparatus, a Z-axis for a recognition camera is provided separately from the Z-axis of a bonding tool, and a recognition camera is mounted on the Z-axis for the recognition camera, and focusing is performed manually or the recognition camera is used. A controllable motor such as a pulse motor or a servomotor and a ball screw are mounted on the Z-axis for use, and focusing is automatically performed by controlling the motor.

[0003]

However, even when the automatic focusing means is employed, the recognition camera, once every time the object to be recognized (substrate and chip) is different, focuses once according to the thickness of the object to be recognized. It had to be adjusted manually, and it took time to change the setup. In addition, Z of recognition camera
Since the shafts are driven separately, the cost is high, and the installation of the Z-axis and its drive motor is required, resulting in poor space.

According to the present invention, the board recognition camera is mounted on the Z-axis of the bonding tool and the board recognition camera is moved up and down by the bonding tool Z-axis driving device, thereby eliminating the need for a separate Z-axis or a separate driving device. In addition, the thickness data of the substrate and the chip are stored in advance in the bonding tool Z.
The present invention provides an image recognition device for a substrate and a chip in a bonding device that inputs the data to a control unit of an axis driving device, and enables the Z-axis driving device of the bonding tool to focus the substrate recognition camera and the chip recognition camera based on the data. Aim.

[0005]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides an image recognition apparatus in a bonding apparatus having a chip recognition camera and a board recognition camera. Attached to the Z-axis of the bonding tool so that it can be controlled by the controller, the board thickness data and chip thickness data are input in advance to the control unit of the Z-axis drive device. An object of the present invention is to provide an image recognition device for a chip and a substrate, characterized in that the distance between objects is controlled by a Z-axis driving device of a bonding tool, and both recognition cameras are focused.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view of a bonding apparatus to which the present invention is applied. The bonding apparatus shown in FIG. 1 is a flip chip bonding apparatus.

[0007] The flip chip bonding apparatus has a Z
A bonding tool 3 that moves up and down according to the axis driving device 1 and rotates according to the Θ axis driving device 2;
The substrate stage 6 and the chip which move left and right by the operation of the X-axis stage 4 enabled to move in the X-axis direction at 4 and the Y-axis stage 5 enabled to move in the Y-axis direction by the Y-axis drive motor 15 It has a board recognition camera 7 attached to the Z-axis driving device 1 together with the supply unit 16 and the bonding tool 3, and a chip recognition camera 8 installed on the Y-axis stage 5.

[0008] Z-axis drive device 1 for bonding tool 3
Has a tool Z-axis 10 and a Z-axis drive motor 11, and the resolution is set to 0.2 mm so as to be suitable for image recognition. This enables the board recognition camera 7 and the chip recognition camera 8 to be focused. still,
The Z-axis driving device 1 is provided with a control unit (not shown), and basic data such as substrate thickness data and chip thickness data can be input from an input device of the control unit.

FIG. 2 is a front view showing the relationship between the bonding tool 3 and the board recognition camera 7, and shows the tool Z axis 1
The board recognition camera 7 is fixed to the panel 9 fixed to the panel 9, and the bonding tool 3 is fixed to the panel 9 together with the Θ-axis driving device 2. That is, the bonding tool 3 and the board recognition camera 7 are integrally attached to the tool Z-axis 10. Reference numeral 12 in the figure denotes a Θ-axis drive motor of the bonding tool 3. Although not shown, the bonding tool 3 is provided with a chip suction hole, and has a function of sucking a chip to the bonding tool 3 by being sucked by a vacuum device through a connection port.

When using the present apparatus, basic data is input in advance to the control unit of the Z-axis driving mechanism 1 of the bonding tool 3, and the height position of the board recognition camera is calculated and determined based on the board thickness data. The height position of the chip sucked by the bonding tool 3 at the time of image recognition is also calculated and determined based on the chip thickness data.

[0011] The work procedure of the bonding apparatus is X
The axis stage 4 and the Y-axis stage 5 operate to position the bonding tool 3 above the chip supply unit 16. Thereafter, the bonding tool 3 is moved down by the operation of the Z-axis driving device 1 to suck the chip. After the chip is sucked, the bonding tool 3 is raised.

Further, an X-axis stage 4 and a Y-axis stage 5
Is operated, the board recognition camera 7 is positioned above the board, the distance of the board recognition camera 7 from the board is calculated based on the board thickness data input in advance, and the board recognition camera 7 is The position of 7 is controlled and determined, and the board is recognized.

Subsequently, the X-axis stage 4 and the Y-axis stage 5 are operated to position the chip adsorbed on the bonding tool 3 above the chip recognition camera 8. Thereafter, the chip distance between the chip recognition camera 8 and the chip is calculated based on the chip thickness data input in advance, and the position of the chip is controlled and determined by the bonding tool Z-axis driving device 1 to recognize the chip. Thereafter, bonding is performed to complete a series of procedures. In any case, the dimension between the two recognition cameras 7 and 8 and the object is controlled by the bonding tool Z-axis driving device 1 for the purpose of improvement.

[0014]

The present invention has the following effects because it is configured as described above. The Z-axis driving device 1 of the bonding tool 3 is used to move the board recognition camera 7 in the Z-axis direction.
In addition, since the Z-axis driving device 1 is also used for focusing with the chip of the chip recognition camera 8 and a separate Z-axis driving device is not required for the image recognition device, the manufacturing cost of the entire bonding device is reduced. The bonding device can be reduced and the space can be saved.

The bonding tool Z input in advance
Based on the substrate thickness data and chip thickness data input to the control unit of the axis driving device 1, the image recognition camera is focused by controlling the bonding tool Z-axis driving device 1. The time required for setup change can be saved in the event of a change. Further, when the substrate thickness data and the chip thickness data have already been input to the control unit of the Z-axis driving device 1 for bonding the chip to the substrate, without inputting data for image recognition separately,
Can be diverted.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a bonding apparatus to which the present invention is applied;

FIG. 2 is a front view showing a relationship between a bonding tool and a board recognition camera.

[Explanation of Codes] . . 1. Z-axis drive device . . Θ axis drive device 3. . . 3. Bonding tool . . X-axis stage . . 5. Y-axis stage . . Substrate stage 7. . . 7. Board recognition camera . . 8. Chip recognition camera . . Panel 10. . . Tool Z axis 11. . . 11. Z-axis drive motor . . Θ axis drive motor 14. . . X-axis drive motor 15. . . Y-axis drive motor 16. . . Chip supply unit

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/52 H01L 21/58

Claims (1)

(57) [Claims] An image recognition device in a bonding device having a chip recognition camera and a substrate recognition camera,
The board recognition camera is mounted on the bonding tool Z axis so that it can be controlled by the bonding tool Z axis drive device.
The thickness data of the substrate and the thickness of the chip are input in advance to the control unit of the Z-axis driving device, and the distance between the two recognition cameras and the object is Z-axis driven by the bonding tool based on the thickness data of the substrate and the chip. An image recognition device for a chip and a substrate, which is controlled by a device and focuses both recognition cameras.