JP3036683B2 - Card product manufacturing method and manufacturing apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for manufacturing a card product, in particular, a card incorporating an electric circuit having a predetermined function, such as an IC card.

[0002]

2. Description of the Related Art In recent years, IC cards having data writing and reading functions have been put to practical use. This IC card is formed by incorporating an IC chip or an IC module into a synthetic resin substrate.
Japanese Patent Application Laid-Open No. 8-72092 discloses a method of manufacturing a substrate of an IC card in which a synthetic resin substrate having a recess for embedding an IC module is molded by using an injection compression molding technique.

[0003]

However, according to the method disclosed in the above publication, a step of manufacturing a substrate and a step of bonding an IC module to the substrate are required, and both of these steps are required. High technology is required, which results in significantly higher manufacturing costs.

In recent years, as this type of IC card, a non-contact type IC card in which an IC chip is embedded in a substrate and signals are input / output to / from the chip via an antenna has been studied. I have. This type is formed by manufacturing a sheet-like electric circuit including an IC chip and an antenna in advance, and covering this circuit sheet with a synthetic resin layer. However, it cannot be manufactured by a method of bonding an IC module to a substrate formed in advance as described above.

Therefore, the present invention can efficiently manufacture a card product in which an electric circuit such as an IC card is incorporated, and can cover a circuit sheet with a synthetic resin layer like a non-contact type IC card. It is an object of the present invention to realize a method and an apparatus capable of manufacturing a card product.

[0006]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized in that it is configured as follows.

First, the invention according to claim 1 of the present application relates to a method of manufacturing a card product in which a circuit sheet-side surface of a circuit sheet forming an electric circuit is covered with a synthetic resin layer on a base film. First, using a first mold having a molten resin injection hole and a second mold having a piston provided with a recess having a constant depth on an end face facing the first mold, The first and second circuit sheets are supplied in such a state that the end face is retracted from the end face of the second mold by a predetermined amount, and the circuit sheet is supplied such that the base film side is in contact with the end face of the first mold facing the concave portion of the piston end face. The second mold is clamped, and an amount of molten resin substantially corresponding to the volume of the recess is provided in the space between the circuit sheet in contact with the end face of the first mold and the recess at the piston end face of the second mold. And then compressing the molten resin By moving the piston of the second mold forward and bringing the end face of the piston into contact with the end face of the first mold, the molten resin is poured into the cavity formed by the concave portion of the piston end face and the end face of the first mold. And then, after the resin is cured, opening the first and second molds. According to the present invention, a card product in which the surface of the circuit sheet on the circuit configuration side is covered with the synthetic resin layer can be obtained.

According to a second aspect of the present invention, in the method of the first aspect, the cover sheet is supplied to the bottom surface of the concave portion of the piston end surface in the second mold before the mold clamping. Features. According to this, a card product is obtained in which the circuit sheet-side surface of the circuit sheet is covered with the synthetic resin layer, and the cover sheet is adhered to the surface of the synthetic resin layer.

Further, a third aspect of the present invention is the method according to the first aspect of the present invention, wherein a transfer film is supplied to the end face side of the second mold before the mold is clamped. According to this, a card product is obtained in which the surface on the circuit configuration side of the circuit sheet is covered with the synthetic resin layer, and a predetermined design or the like is transferred from the transfer film to the surface of the synthetic resin layer.

On the other hand, the invention according to claim 4 relates to a method for manufacturing a card product in which both sides of a circuit sheet constituting an electric circuit are covered with a synthetic resin layer on a base film. Similarly to the method of the invention, a second mold having a first mold having an injection hole for molten resin and a piston having a recess having a constant depth on an end face facing the first mold.
First, the end face of the piston is retreated by a predetermined amount from the end face of the second mold, and the circuit sheet is placed so as to be in contact with the end face of the first mold facing the concave portion of the piston end face. In the supplied state, the first and second molds are clamped, and the volume of the recesses is provided in a space between the circuit sheet in contact with the end face of the first mold and the recess on the piston end face of the second mold. By injecting an amount of molten resin substantially corresponding to the above, and then advancing the piston of the second mold while compressing the molten resin to bring the end face of the piston into contact with the end face of the first mold, The above-mentioned molten resin is spread over a cavity formed by a concave portion of the piston end surface and an end surface of the first mold, and is cured to form a circuit sheet on which one surface is covered with a synthetic resin layer. Forming goods.

Next, the first and second molds are once opened, and the intermediate molded product is retracted again by a predetermined amount while the intermediate molded product is held in the recess of the piston of the second mold. A hollow protrusion having a constant height is provided on the end face of the mold so as to form a recess corresponding to the recess of the piston, and in this state, the mold is again clamped so that the end face of the second mold comes into contact with the protrusion. The space between the recess formed in the end face of the first mold and the intermediate molded product held in the recess of the piston of the second mold is substantially equal to the volume of the recess formed in the first mold. Inject a corresponding amount of molten resin, and then compress the molten resin for a second time.
The piston of the first mold is advanced again to bring the end face of the piston into contact with the projection of the end face of the first mold, whereby the first
Dispersing the molten resin in a cavity formed by a concave portion formed in the end surface of the mold and an intermediate molded product in the concave portion of the piston end surface, and thereafter, after the resin is cured, opening the first and second dies. It is characterized by.

According to the present invention, a card product in which both sides of the circuit sheet are covered with the synthetic resin layer can be obtained.

According to a fifth aspect of the present invention, in the method according to the fourth aspect, before the first mold clamping, the first cover sheet is provided on the bottom surface of the concave portion of the piston end surface in the second mold. In addition to supplying the second cover sheet, the second cover sheet is supplied to the bottom surface of the concave portion formed on the end surface of the first mold by the protrusion before the second mold clamping. According to this, a card product is obtained in which both surfaces of the circuit sheet are covered with the synthetic resin layers, and the first and second cover sheets are respectively adhered to the surfaces of the synthetic resin layers on both sides. .

According to a sixth aspect of the present invention, in the method of the fourth aspect, the first transfer film is supplied to the end face of the second mold before the first mold clamping. In addition, before the second mold clamping, the second transfer film is supplied to the end face side of the first mold. According to this, a card product in which both sides of the circuit sheet are covered with the synthetic resin layers, and a predetermined design or the like is transferred from the first and second transfer films to the surfaces of the synthetic resin layers on both sides, respectively. Will be obtained.

Further, the invention according to claim 7 relates to an apparatus for performing the method of the invention according to claim 4 described above.
A fixed mold having an injection hole for molten resin, a movable mold disposed to face the fixed mold and opposed to and separated from the fixed mold; and an end face of the fixed mold provided so as to be able to advance and retreat to the movable mold. A piston provided with a recess having a constant depth on an end surface facing the piston, and a piston for moving the piston between a position where the end surface is flush with the end surface of the movable die and a position retracted by a predetermined amount from the end surface Driving means and projection forming means for forming a hollow projection so that a recess corresponding to the recess of the piston end face is formed on the end face of the fixed die,
The piston is retracted, no protrusion is formed,
In addition, the fixed mold and the movable mold are clamped in a state where the circuit sheet is supplied to the end face of the fixed mold, and the above-mentioned is inserted into the space between the circuit sheet on the fixed mold side and the recess on the end face of the piston on the movable mold side. After the molten resin is injected from the injection hole, the piston is advanced, the compression molding of the synthetic resin layer on one surface of the circuit sheet is performed, and then, after the mold is once opened,
An intermediate molded product in which the piston is retracted and the mold is clamped again in a state where the protrusion is formed, and is held in the recess formed by the protrusion on the fixed mold side and the recess of the piston on the movable mold side. The molten resin is injected again into the space between
Thereafter, the piston is advanced again, and the compression molding of the synthetic resin layer on the other surface of the circuit sheet is performed.

According to the manufacturing apparatus of the present invention, a card product in which both surfaces of the circuit sheet are respectively coated with the synthetic resin layers can be obtained in the same manner as in the invention according to the fourth aspect.

It is to be noted that, in the manufacturing apparatus according to claim 7, as in the invention of claim 5 or claim 6, the first,
If it is configured to supply the second cover sheet or the first and second transfer films, a card product in which the cover sheet is adhered to the surface of the synthetic resin layer on both sides of the circuit sheet or the design or the like is transferred is obtained. Will be done.

[0018]

Embodiments of the present invention will be described below.

First, the configuration of an IC card manufactured by the method or the apparatus according to this embodiment will be described. As shown in FIGS.
IC chip 2b and antenna unit 2 on base film 2a
c, the first and second synthetic resin layers 3 and 4 are formed on both sides of the circuit sheet 2 forming an electric circuit including , Patterns, characters, figures, and the like are printed on the first and second cover sheets 5 and 6, and in the apparatus described below, four IC cards 1 can be taken as shown in FIG. The disk 7 is manufactured.

Next, an IC card manufacturing apparatus according to this embodiment will be described.

As shown in FIG. 4, this manufacturing apparatus 10
It has a pair of fixed molds 20 and a movable mold 30, these are arranged with their end faces facing each other, and the movable mold 30 is driven by a cylinder (not shown) to
It is designed to be opposed to and separated from.

On the back side of the fixed mold 20, an injection nozzle 21 for molten resin is attached.
An injection hole 22 is provided which communicates with the center of the end surface 20a of the fixed mold 20 from the tip of the fixed die 20. In addition, this fixed type 20
A ring-shaped groove 23 centering on the opening of the injection hole 22 is provided in the end surface 20a of the second member, and a ring-shaped spacer 24 is fitted and fixed to the groove 23 as well. Here, as the spacer 24, when fitted in the concave groove 23, the front end face thereof is fixed 20 as shown by a solid line.
The first spacer 24 ₁ that matches the end surface 20a, the front end face as indicated by the chain line is possible to replace the second spacer 24 ₂ projecting by a predetermined amount from the end face 20a of the fixed die 20. Then, when it mounted the second spacer 24 _2, the recess 25 of depth equal to the projection amount of the front end surface 24a ₂ is formed on the inner side, the depth, of the circuit sheet 2 in the IC card 1 shown in FIG. 2 This corresponds to the sum L1 of the thicknesses of the second synthetic resin layer 4 on the back side and the second cover sheet 6.

On the other hand, the movable mold 30 includes a base member 31.
A body 32 coupled to the front surface of the base member 31;
A piston 33 fitted in a cylinder 32a provided in the main body 32 so as to be able to advance and retreat. This piston 33
The fitting surface of the cylinder 32a and the cylinder 32a is stepped by a small-diameter portion at the front and a large-diameter portion at the rear, and a retreating operating pressure chamber 34 is formed in the stepped portion. The piston 33 is retracted by an operating pressure supplied from the outside via the piston 33. The piston 33 is set such that the front end surface 33a thereof is retracted by a predetermined amount from the end surface 32b of the main body 32 at a position shown in the drawing where the rear end surface contacts the base member 31.

A forward working pressure chamber 36 is provided between the rear end surface of the piston 33 and the base member 31.
The piston 33 is advanced to a position where at least its front end face 33a is flush with the end face 32b of the main body 32 by the operating pressure supplied from the outside to the chamber 36 through the passage 37.

Further, a circular concave portion 33b having a constant depth is provided in the front end surface 33a of the piston 33. The depth of the concave portion 33b corresponds to the thickness L2 from the base film 2a of the circuit sheet 2 to the first cover sheet 5 in the IC card 1 shown in FIG. Equal to the inner diameter of the spacer 24,
These correspond to the diameter L3 of the disk 7 shown in FIG.

The movable die 30 is provided with a plurality of eject pins 38 which penetrate the piston 33 in the front-rear direction and whose leading end reaches the bottom surface of the concave portion 33b. 38 is the base member 3
39 are arranged on the rear side of the unit 1 so as to protrude forward from the illustrated position.

As shown in enlarged form in FIG. 5, a small hole 33c for holding an intermediate molded product is provided in the periphery of the bottom surface of the concave portion 33b in the piston 33. In this embodiment, The bottom surface of the concave portion 33b of the piston 33 is constituted by a member 33d different from the piston main body.

Next, a method of manufacturing the disk 7 including the four IC cards 1 shown in FIG. 3 using the molding apparatus 10 will be described.

First, as shown in FIG. 5, the fixed mold 20 and the movable mold 30 are opened, and the piston 33 of the movable mold 30 is retracted.
The IC card 4 corresponding to the disk 7 in FIG.
A number of circular circuit sheets 2 ′ are supplied in a direction in which the base film side thereof is in contact with the end face 20 a, and a predetermined amount is provided in the concave portion 33 b of the piston 33 of the movable mold 30 so as to be attached to the bottom surface. A first cover sheet 5 ′ for four IC cards is also provided in which the colors, patterns, characters, symbols and the like are printed in advance.

Here, the spacer 24 in the fixed mold 20 is used.
The end faces 2 of the front face 24a ₁ is solid fixed 20
The first spacer 24 ₁ become flush with 0a is attached. A through hole 2a 'for molten resin is provided at the center of the circular circuit sheet 2' so as to correspond to the opening of the injection hole 22 on the end face 20a of the fixed die 20.

Next, in this state, the movable mold 30 is moved to the fixed mold 20.
To the movable mold 3 as shown in FIG.
The end face 32b of the main body 32 is fixed to the end face 20a of the fixed mold 20 and the front end face 24 of the spacer 24 ₁ flush with the end face 20a.
a ₁ At this time, the fixed mold 20 and the movable mold 3
0 between the movable mold 30 and the end face 20a of the fixed mold 20.
A space A having a depth corresponding to the sum of the depth of the concave portion 33b and the retreat amount of the piston 33 is generated between the piston 33 and the bottom surface of the concave portion 33b on the side.

Then, the molten resin X is injected from the nozzle 21 shown in FIG. 4, and the molten resin X is injected into the space A from the injection hole 22 provided in the fixed mold 20 through the central through hole 2a 'of the circuit sheet 2'. Inject X. In this case, the injection amount of the molten resin X is set to an amount substantially corresponding to the volume of the concave portion 33b of the piston 33.

Next, the piston 33 is advanced by introducing an operating pressure into the advance operating pressure chamber 36 of the movable mold 30 shown in FIG. 4, and as shown in FIG.
It is allowed to abut against the front end surface 24a ₁ of the spacer 24 ₁ of the stationary mold 20 side. At this time, the space A is the concave portion 3 of the piston 33.
3b, and the molten resin X injected into the space A is compressed and reaches the cavity B formed by the concave portion 33b and the end surface 20a of the fixed die 20. .

In this case, the fixed mold 2 of the cavity B is used.
The circuit sheet 2 ′ is supplied to the end surface 20 a of the piston 33, and the concave portion 33 b of the piston 33 is supplied to the movable die 30.
The first cover sheet 5 ′ is supplied along the bottom surface of the molten resin X in the cavity B.
Is compressed and filled between the circuit sheet 2 ′ and the first cover sheet 5 ′. Therefore, the molten resin X
When cured, the circuit sheets 2 ′ on both sides of the synthetic resin layer
And the first cover sheet 5 'are adhered to each other to obtain an intermediate molded product 8.

When the molten resin X is cured and the above-mentioned intermediate molded product 8 is obtained, the movable mold 30 is retracted and opened as shown in FIG. 8, and the movable mold 30 shown in FIG. The operating pressure is supplied to the retreating operating pressure chamber 34 of the mold 30 to retreat the piston 33 to a position where the rear end face contacts the base member 31. At this time, in the cavity B, the molten resin X flows into the small holes 33c provided in the peripheral portion of the bottom surface of the concave portion 33b of the piston 33 and is hardened, so that the intermediate molded product 8 is formed in the concave portion 33 of the piston 33.
The mold is opened while being held in b.

Further, in this mold opening condition, the ring-like spacer which is fitted in the recessed groove 23 is replaced with the second spacer 24 ₂ is thicker than the first spacer 24 ₁ at the end face 20a of the fixed mold 20, the the second front end face 24a of the spacer 24 _2
2 protrudes from the end face 20a of the fixed mold 20 by a predetermined amount. Furthermore, supplies to accompany the bottom surface of the recessed portion 25 formed on the end face 20a of the fixed mold 20, the second cover sheet 6 round IC card 4 sheets' by protrusion of the second spacer 24 _2. In this case, the second cover sheet 6 'is also provided with a through hole 6a' for molten resin in the center so as to correspond to the opening of the injection hole 22 in the end face 20a of the fixed die 20.

Next, the second mold clamping is performed in this state. As shown in FIG. 9, this time, the end face 32b of the movable mold main body 32 projects from the end face 20a of the fixed mold 20. It will be in contact with the front end face 24a ₂ of the spacer 24 _2, this time, between the fixed mold 20 and movable mold 30, the end face 20 of the fixed mold 20 by the second spacer 24 ₂
a of the intermediate molded product 8 held in the concave portion 33b of the piston 33 of the movable mold 30 from the bottom surface of the concave portion 25 formed in
Between the depth of the recess 25 and the piston 33
A space C having a depth corresponding to the sum of the retreat amount and the distance C is generated.

Then, the molten resin X is injected again from the nozzle 21 shown in FIG. 4, and from the injection hole 22 provided in the fixed mold 20 through the central through-hole 6a 'of the second cover sheet 6', the space is removed. C. Inject molten resin X into C. At this time, the injection amount of the molten resin X is substantially corresponding amount to the volume of the second spacer 24 ₂ by the recess 25 formed on the end face 20a of the fixed die 20.

Next, as shown in FIG. 10, the forward working pressure chamber 36 in the movable mold 30 is used similarly to the previous injection compression.
By introducing a hydraulic pressure to advance the piston 33, it is brought into contact with the front end surface 33a on the front end face 24a ₂ of the fixed mold 20 side of the second spacer 24 _2. At this time, is reduced only in the recess 25 in which the space C is formed by the second spacer 24 ₂ shown in FIG. 9, the molten resin X that have been injected into the space C is compressed along with this, and the recess 25 This extends to the cavity D formed between the movable mold 30 and the intermediate molded product 8 held in the concave portion 33b of the piston 33.

In this case, the fixed mold 2 of the cavity D is used.
The second cover sheet 6 ′ is attached to the bottom surface of the recess 25 on the 0 side.
Is supplied in the cavity D,
The molten resin X is composed of the intermediate molded product 8 and the second cover sheet 6 '.
And compressed between them.

When the eject pins 38... 38 of the movable mold 30 are protruded as shown in FIG. 11 when the molten resin X is hardened, the first surface of the circuit sheet 2 ′ is formed on the circuit structure side. A disk 7 comprising a synthetic resin layer 3 ', a second synthetic resin layer 4' formed on the base film side, and first and second cover sheets 5 ', 6' adhered to their surfaces, respectively. Is obtained.

Then, by cutting this disk 7 into a predetermined shape as shown in FIG. 3, four IC cards 1... 1 are obtained.

In the manufacturing apparatus 10 described above, when the first compression molding is completed and the mold is opened, the spacer 24 is formed such that the front end face is the same as the end face 20 a of the fixed mold 20. ₁ to front end face of fixed mold 20
It was to replace the second spacer 24 ₂ by a predetermined protrusion amount than 0a, may be to project the front end surface thereof to move the spacer.

That is, as shown in FIG.
In addition, a ring-shaped spacer 122 is fitted in a ring-shaped concave groove 121 formed on a front end surface 120a of the first member 120 so as to be able to protrude and retract.
Spring 124 mounted between 23 and fixed mold 120
Urges the spacer 122 rearward. Further, a cylinder 125 is provided on a side surface of the fixed mold 120, and the cylinder 1
When the 25 rods are protruded, the spacer 122 is pushed forward via the cam mechanism 126 against the urging force of the spring 124.

According to this, when the cylinder 125 is operated when the compression molding of the synthetic resin layer on one surface of the circuit sheet is completed and the mold is opened, the spacer 12
The front end face of the second circuit sheet protrudes from the end face 120a of the fixed mold 120 by a predetermined amount, and a required concave portion is formed inside the front end face. It is possible to perform compression molding of the synthetic resin layer on the surface.

In the above description, the first and second cover sheets 5 'and 6' are supplied before the first mold clamping and before the second mold clamping, respectively. A transfer film may be supplied, and a predetermined pattern or the like may be transferred from the film to the surface of the synthetic resin layer simultaneously with the compression molding.
When it is possible to directly print patterns, characters, figures, and the like, the supply of these cover sheets 5 'and 6' and the transfer film may be omitted.

On the other hand, when the product is taken out at the time when the mold is opened after the first compression molding is completed, a synthetic resin layer is formed only on the surface on the circuit configuration side of the circuit sheet 2 ′, and the surface of the synthetic resin layer is formed as required. Thus, an IC card having a cover sheet attached thereto or a design or the like transferred from a transfer film can be obtained.

Further, the above description relates to the case of manufacturing the disk 7 from which four IC cards can be taken.
The same may be applied to the case where one C card is manufactured at a time or a plurality of cards other than four are manufactured at the same time. In particular, in the case of taking a plurality of cards, the whole may be formed into a rectangular shape. The concave portion on the end face also becomes rectangular, and the spacer also has a rectangular hollow portion.

[0049]

As described above, according to the present invention, a card incorporating an electric circuit having a predetermined function, such as an IC card, particularly a circuit sheet constituting an electric circuit including an IC chip is covered with a synthetic resin layer. Thus, a card product such as a non-contact type IC card is manufactured efficiently, and the cost of this kind of card product is reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of an IC card to which the present invention is applied.

FIG. 2 is an enlarged sectional view of the IC card.

FIG. 3 is an explanatory diagram of a product obtained by the manufacturing apparatus according to the embodiment of the present invention.

FIG. 4 is an overall sectional view of the manufacturing apparatus.

FIG. 5 is a sectional view showing a state before the first mold clamping in a card manufacturing process by the same device.

FIG. 6 is a sectional view showing a state after the first mold clamping.

FIG. 7 is a sectional view showing a state at the time of first compression.

FIG. 8 is a cross-sectional view showing a state before a second mold clamping.

FIG. 9 is a cross-sectional view showing a state after a second mold clamping.

FIG. 10 is a sectional view showing a state at the time of a second compression.

FIG. 11 is a cross-sectional view showing a state when a product is taken out.

FIG. 12 is a cross-sectional view showing another embodiment of the fixed mold side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Manufacturing apparatus 20 Fixed type 22 Injection hole 24 Projection part formation means (spacer) 30 Movable type 33 Piston 33b Depression

────────────────────────────────────────────────── ─── Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI // B29L 31:34 (56) References JP-A-9-174619 (JP, A) JP-A-9-109581 (JP, A JP-A-8-25860 (JP, A) JP-A-7-81284 (JP, A) JP-A-9-123653 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) B29D 45/00-45/84 B42D 15/10 521 G06K 19/077

Claims (7)

(57) [Claims] 1. A method for manufacturing a card product comprising a circuit sheet on which an electric circuit is formed on a base film, the surface of the circuit sheet being covered with a synthetic resin layer, the first sheet having a molten resin injection hole. Using a mold and a second mold having a piston provided with a recess having a constant depth on an end face facing the first mold, retreating the end face of the piston by a predetermined amount from the end face of the second mold, The first and second dies are clamped in a state where the circuit sheet is supplied such that the base film is in contact with the end surface of the first die facing the concave portion of the piston end surface. An amount of molten resin substantially corresponding to the volume of the concave portion is injected into a space between the circuit sheet in contact with the end surface of the second mold and the concave portion on the piston end surface of the second mold, and then the molten resin is compressed. The piston of the second type is advanced and the end face of the piston is moved to the first position. By contacting the end surface of the first mold, the molten resin is spread over a cavity formed by the concave portion of the end surface of the piston and the end surface of the first mold. A method of manufacturing a card product, comprising: opening a mold to obtain a card product in which a circuit sheet side of a circuit sheet is covered with a synthetic resin layer. 2. A circuit sheet-side surface of the circuit sheet is covered with a synthetic resin layer by supplying a cover sheet to the bottom surface of the concave portion of the piston end surface in the second mold before the mold clamping, and The card product manufacturing method according to claim 1, wherein a card product obtained by attaching the cover sheet to a surface of the synthetic resin layer is obtained. 3. A transfer film is supplied to the end face of the second mold before the mold is closed, so that the circuit sheet-side surface of the circuit sheet is covered with the synthetic resin layer, and the synthetic resin layer is provided. 2. A card product manufacturing method according to claim 1, wherein a card product obtained by transferring a predetermined design or the like from the transfer film to the surface of the card product is obtained. 4. A method for producing a card product comprising a circuit sheet on which electric circuits are formed on a base film and both sides of which are covered with a synthetic resin layer, wherein the first sheet has a molten resin injection hole.
And a second mold having a piston provided with a recess having a constant depth on an end face opposed to the first mold, and retreating the end face of the piston by a predetermined amount from the end face of the second mold. The first and second dies are clamped in a state where the circuit sheet is supplied so as to be in contact with the end surface of the first die facing the concave portion of the piston end surface, and the end surface of the first die is closed. The molten resin is injected into the space between the circuit sheet in contact with the recess and the recess on the end face of the piston of the second mold in an amount substantially corresponding to the volume of the recess. By moving the piston of the first mold forward and bringing the end face of the piston into contact with the end face of the first mold, the concave portion of the piston end face and the first
The molten resin is spread over the cavity formed by the end surface of the mold, and the cured resin is cured to form an intermediate molded product in which one surface of the circuit sheet is covered with the synthetic resin layer. The first and second molds are once opened, and the piston is retreated a predetermined amount again in a state where the intermediate molded product is held in the recess of the piston of the second mold, and the piston is attached to the end face of the first mold. A hollow protrusion having a constant height is provided so as to form a concave portion corresponding to the concave portion, and in this state, the mold is clamped again so that the end surface of the second mold comes into contact with the protrusion, and the first protrusion is closed. An amount of molten resin substantially corresponding to the volume of the recess formed in the first mold in a space between the recess formed in the end face of the mold and the intermediate molded product held in the recess of the piston of the second mold. And then compressing the molten resin to form a second
The piston of the first mold is advanced again to bring the end face of the piston into contact with the projection of the end face of the first mold, whereby the first
Dispersing the molten resin in a cavity formed by a concave portion formed in the end surface of the mold and an intermediate molded product in the concave portion of the piston end surface, and thereafter, after the resin is cured, opening the first and second dies. A card product in which both sides of a circuit sheet are covered with a synthetic resin layer. 5. The first cover sheet is supplied to the bottom surface of the concave portion of the piston end surface of the second mold before the first mold clamping, and the first cover sheet is supplied by the projecting portion before the second mold clamping. By supplying the second cover sheet to the bottom surface of the concave portion formed on the end surface of the first mold, both surfaces of the circuit sheet are covered with the synthetic resin layers, and the surfaces of the synthetic resin layers on both sides are covered with the second cover sheet. The method for producing a card product according to claim 4, wherein a card product having the first and second cover sheets attached thereto is obtained. 6. The first transfer film is supplied to the end face of the second mold before the first mold clamping, and the end face of the first mold is supplied to the end of the first mold before the second mold clamping. By supplying the second transfer film, both sides of the circuit sheet are covered with the synthetic resin layers, and the surfaces of the synthetic resin layers on both sides are respectively provided with predetermined patterns from the first and second transfer films. 5. The method for producing a card product according to claim 4, wherein a card product obtained by transferring is obtained. 7. A card product manufacturing apparatus in which a circuit sheet having an electric circuit formed on a base film is coated on both sides with a synthetic resin layer, the fixed type having a molten resin injection hole, and the fixed type. A movable mold that is opposed to and fixed to the fixed mold, and is provided so as to be able to advance and retreat to the movable mold, and a concave portion having a constant depth is provided on an end face facing the end face of the fixed mold. A piston, piston driving means for moving the piston between a position where the end surface thereof is flush with the end surface of the movable die and a position retracted by a predetermined amount from the end surface, and a concave portion of the piston end surface on the end surface of the fixed die And a projection forming means for forming a hollow projection so that a recess corresponding to the projection is formed.First, the piston is retracted, the projection is not formed, and the end surface of the fixed mold is formed. With the circuit sheet supplied The fixed mold and the movable mold are clamped, and the molten resin is injected from the injection hole into the space between the circuit sheet on the fixed mold side and the recess on the end face of the piston on the movable mold side, and then the piston is advanced. The compression molding of the synthetic resin layer on one surface of the circuit sheet is performed, and then, after the mold is opened, the piston is retracted, and
The mold is clamped again in a state in which the protrusion is formed, and the space between the recess formed by the protrusion on the fixed mold and the intermediate molded product held in the recess of the piston on the movable mold is melted. An apparatus for manufacturing a card product, wherein a resin is injected again, and thereafter, a piston is advanced again to perform compression molding of a synthetic resin layer on the other surface of the circuit sheet.