JP3037931B2 - Thermosiphon, method for manufacturing thermosiphon, and information processing apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosiphon, a method for manufacturing the same, and an information processing apparatus, and more particularly, to releasing heat generated by a heating element of a portable information processing apparatus to the outside.

[0002]

2. Description of the Related Art Conventionally, techniques in such a field include:
Japanese Patent Application Laid-Open No. 9-6481 is known. The conventional portable information processing apparatus described in this publication is shown in FIG.
As shown in FIG. 3, the heat pipe 3 and the heat radiating plate 5 are incorporated in the lid 51, and the heating element (CP
The heat of U) 1 is released from the radiator plate 5 via the heat conduction block 2 and the heat pipe 3. Other conventional techniques are disclosed in Japanese Patent Application Laid-Open Nos. 8-87354 and 8-2354.
04373 and JP-A-8-261672.

FIG. 33 is an exploded perspective view of the lid 51.
The liquid crystal display panel 7, the backlight 10, and the backlight optical system 62 are provided between the front panel 60 and the external housing 12.
And a backlight inverter board 95.

FIG. 34 is a view showing a conventional method for manufacturing a thermosiphon used for heat radiation. FIG.
This is the manufacturing process indicated in the instruction manual of the roll bond heat pipe of Showa Aluminum Co., Ltd. Roll bond is
The aluminum plate is cut (S10), a circuit serving as a flow path is printed thereon with an anti-pressing agent (S12), another sheet is stacked and rolled (S13, S14), and the flow path is pressurized with high-pressure air. It is expanded and cut into a desired shape (S1
5, S16). The working fluid is injected into this flow path (S17),
Manufacture thermosiphon.

[0005]

In the conventional portable information processing apparatus, heat transmitted from the heat pipe 3 is conducted to the entire surface of the heat sink 5 because heat conduction in the surface direction of the heat sink 5 is not sufficient. It was difficult. As a result, of the portions of the heat radiating plate 5, only the portion close to the heat pipe 3 could contribute to heat radiation, and the heat radiation effect was not sufficient.

A conventional thermosiphon is manufactured by pressing two aluminum plates. However, since the specific gravity of the aluminum plate is large, the weight of the thermosiphon increases, and as a result, heat is radiated using the thermosiphon. However, there is a problem that the weight of the information processing apparatus for performing the above operation increases.

The present invention has been made to solve such a problem, and has as its object to reduce the weight of a thermosiphon. Another object of the present invention is to improve the heat generation efficiency of the information processing apparatus and reduce the weight.

[0008]

A thermosiphon according to the present invention is a thermosiphon provided with a radiator plate and a flow path for circulating hydraulic fluid, wherein the radiator plate has a thick portion and a thin portion. It is characterized by.

[0009] The heat radiating plate is characterized in that the thick portion is arranged closer to the flow path than the thin portion.

The flow path has a closed loop, the thick part is formed around the inside of the closed loop, and the thin part is formed inside the thick part.

[0011] The heat radiating plate is a plywood plate in which a first flat plate and a second plate having a cutout portion are overlapped.

One of the first and second plates has an end protruding from an end of the other plate, and the protruding end is bent.

The first and second plates are characterized by having different thicknesses.

The thin part has a fin efficiency of 0.7 or more and 1
It is characterized by the following.

[0015] The thin portion is formed of an aluminum plate having a thickness of 0.4 mm, and is formed within 6 cm from the nearest flow path.

The thermosiphon is used for heat radiation of electronic equipment.

The electronic device is a portable computer.

The electronic device includes a main body in which a heating element is incorporated, and a lid that covers the main body, and the thermosiphon is provided on the lid.

An information processing apparatus according to the present invention comprises: a main body in which a heating element is incorporated; a lid covering the main body; and a heat sink provided on the lid and having a thick portion and a thin portion. A thermosiphon having a flow path for a hydraulic fluid and releasing heat generated by the heating element.

[0020] The lid has a housing for covering the lid, and the heat sink is at least a part of the housing of the lid.

[0021] The information processing apparatus further includes a heat conducting member for transmitting heat generated by the heating element from the heating element to the thermosiphon.

[0022] The heat conducting member may include a heat pipe between the heating element and the thermosiphon for transmitting heat generated by the heating element to the thermosiphon.

The thermosiphon has a liquid reservoir for storing a hydraulic fluid, and the heat pipe is in contact with the liquid reservoir of the thermosiphon.

The heat conducting member includes a heat conducting block having a hinge portion between the heating element and the heat pipe,
The heat pipe is inserted into a hinge provided on the heat conduction block.

A method for manufacturing a thermosiphon according to the present invention includes the following steps. (A) a step of cutting two plates from a material serving as a heat sink, (b) a step of forming a cutout in one of the two cut plates, and (c) a cut two plates A step of printing a flow path on any one of the plates using an anti-pressing agent, (d) a step of superposing two plates, (e) a step of rolling and pressing the two superposed plates, (F) a step of expanding the flow path of the press-bonded plate, and (g) a step of enclosing the working fluid in the expanded flow path.

In the cutting step, one plate is cut to a size larger than the size of the other plate. The method for manufacturing a thermosiphon further includes, after the step of crimping, the other plate of the large plate. A step of bending the protruding portion is provided.

[0027]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, preferred embodiments of a thermosiphon and an information processing apparatus according to the present invention will be described with reference to the accompanying drawings.

The configuration of the portable information processing apparatus will be described with reference to FIG. 50 is a main body of the notebook personal computer, 51 is a cover for covering the main body, 52 is a main body 50
And the lid 51 are engaged with each other and have a hinge structure. Reference numeral 1 denotes a CPU (Central) as a heating element.
A processing unit (2) is a heat conduction block with a hinge 13 for efficiently collecting heat of the CPU and transmitting the heat to the heat pipe 3. Heat conduction block 2
Is not limited to metal as long as it is a heat conductive material, and may be carbon or the like. The axis of the hinge portion 13 of the heat conduction block 2 is on the same axis as the engagement shaft 52. A heat pipe is made by filling an appropriate amount of liquid (hereinafter referred to as working fluid) that evaporates at a predetermined temperature in an exhausted metal pipe, deprives it of heat of vaporization at a high temperature end, and releases heat of condensation at a low temperature end. The heat transfer is performed efficiently, and the working fluid is circulated by utilizing a vertical groove provided on the inner wall of the tube or a capillary phenomenon of a porous structure (wick). Reference numeral 4 denotes a fixing plate for effectively thermally connecting the heat pipe 3 and the heat radiating plate 5, and 6 denotes a thermosiphon integrally formed with the heat radiating plate 5. The thermosiphon 6 also performs highly efficient heat transfer on the same principle as the heat pipe 3. However, usually, the thermosiphon 6 does not have a vertical groove or a porous structure (wick) provided on the inner wall of the tube, and does not circulate the hydraulic fluid by utilizing the capillary phenomenon. Therefore, the thermosiphon 6 circulates the working fluid along the flow path using gravity. For example, a roll bond plate 58 manufactured by Showa Aluminum Co., Ltd. can be used as the thermosiphon 6. The roll bond plate is a member having a hollow channel 59 inside an aluminum plate as shown in FIG. The use of a roll bond plate is effective because the heat sink 5 and the thermosiphon 6 are integrally formed. 7
Denotes a liquid crystal display panel, and 10 denotes a backlight. Reference numeral 12 denotes a housing outside the lid 51.

FIG. 3 is a sectional view taken along line BB of FIG. The radiator plate 5 is formed by pressing or bonding a first plate 31 and a second plate 32. The first plate 31 and the second plate 32 are, for example, 4 mm-thick aluminum plates. The first plate 31 is a flat plate. Second
The plate 32 has an opening which is an example of the missing part. The portion of the heat sink 5 where the first plate 31 and the second plate 32 overlap each other becomes a thick portion 33 having a thickness of 8 mm. The portion of only the first plate 31 of the radiator plate 5 becomes a thin portion 34 having a thickness of 4 mm. The thickness of a portion of the flow channel 59 is 1 mm to 2 mm.

The flow channel 59 has a closed loop, the thick portion 33 is formed around the inside of the closed loop, and the thin portion 34 is formed inside the thick portion 33.

The heat radiation process of the portable information processing device will be described with reference to FIG. FIG. 5 is a cross-sectional view taken along line CC of FIG. The thermosiphon 6 has a liquid reservoir 55 for storing the hydraulic fluid 9.
have. The thermosiphon 6 is provided with a hydraulic fluid 19.
Flow path first flow path 5 for circulating water in the surface direction of the heat sink
3. It has a second channel 54. In the case shown in FIG.
There is a first flow path 53 orbiting the peripheral portion of the heat sink 5 and a second flow path 54 extending in a direction orthogonal to the engagement shaft 52 and having both ends merging with the first flow path 53. Shows the case.
The heat generated by the CPU 1 is transmitted to the heat pipe 3 via the heat conduction block 2 and is transmitted to the radiator plate 5 by two-layer flow heat transport. In the heat sink 5 on which the thermosiphon 6 is formed,
The heat is diffused very efficiently by the two-layer flow, and is finally radiated to the outside air by the effect of convection and heat radiation.

Usually, a liquid such as a florinate system or water is injected into the liquid reservoir and the flow channel of the thermosiphon 6 as the working fluid 9 and is depressurized and sealed. The hydraulic fluid 9 is collected downward by gravity, but heat is transferred to the hydraulic fluid 9 by bringing a high-temperature heat source such as a heat pipe into contact with the lower liquid reservoir and closely contacting it.
The working fluid 9 becomes a vapor flow and rises to a low temperature part. Thus, heat transport is performed, and the steam flow condenses and releases heat in the steam flow path. The condensed and liquefied working fluid 9 falls down the steam flow path by its own weight. In other words, the thermosiphon can effectively conduct heat transfer and uniform heat by the heat transfer process by the circulation and reflux of the working fluid using gravity, and the heat transfer process by condensation heat dissipation, compared to the heat conduction of metal only. A significant improvement in cooling performance can be expected.

FIG. 6 is a flowchart showing a heat dissipation method. If the CPU 1 does not generate heat in step S0, no heat radiation processing is performed. When the CPU 1 is generating heat, in step S1, the C
Heat moves from PU 1 to thermosiphon 6 via heat pipe 3. Next, in step S2, the heat moved via the heat pipe 3 heats the working fluid 9.
Step S3 is a step of transporting the heat of evaporation. This step S3 is a step of vaporizing the working fluid 9 (S3
1) and the step of circulating the steam flow inside the steam flow path (S
32). Next, step S4 is a process of condensing the vapor flow and releasing heat. Step S4 includes a step (S41) in which the vaporized working fluid 9 is liquefied and a step (S42) in which the working fluid 9 circulates through the vapor flow path and returns to the liquid reservoir. As described above, the operations in steps S1 to S4 are continuously performed as long as heat generation continues. Since the thickness of the thermosiphon 6 can be set to 1 mm to 2 mm, it can be made thinner than mounting a fan. Further, even when a CPU for which use of a fan is desired is used, a fan is not required, and a heat radiation effect higher than that of the fan can be obtained.

FIG. 7 is a characteristic diagram of the fin efficiency depending on the length L when the radiation fin 35 having the thickness B and the length L as shown in FIG. In the figure, black squares indicate the characteristics of the fin efficiency of an aluminum plate having a thickness B of 1 mm. In the drawing, △ indicates the fin efficiency characteristics of an aluminum plate having a thickness B of 0.8 mm. In the figure, black circles
Is a magnesium plate having a thickness B = 1 mm or a thickness B = 0.4.
4 shows the characteristics of the fin efficiency of an aluminum plate of mm. In the figure, * indicates fin efficiency characteristics of a resin plate having a thickness B of 1 mm. Fin efficiency is the ratio of the actual heat dissipation from the entire heat transfer surface of the fin to the heat dissipation assuming that the total heat transfer surface of the fin is equal to the temperature of the heating element. Fin efficiency is 1
In the case of (100%), the case where the heat radiation effect is maximum is shown. As can be seen from the characteristics of FIG. 7, the longer the length of heat transmission, that is, the longer the length L, the lower the fin efficiency. Further, when the thickness of the heat radiation fins 35 is reduced, the fin efficiency is reduced. In order to maintain sufficient heat radiation efficiency, the fin efficiency is desirably 0.8 or more. Therefore,
For example, when an aluminum plate having a thickness B = 0.8 mm is used as a heat sink, the length L of the heat sink must be about 9 cm or less in order to make the fin efficiency 0.8 or more. When an aluminum plate having a thickness B of 0.4 mm is used as a heat sink, the length L must be about 6 cm or less.

FIG. 9 shows a thermosiphon in which the distance between the channels 59 is 12 cm. The flow path 59 has a closed loop, the thick part 33 is formed around the inside of the closed loop, and the thin part 34 is formed inside the thick part 33. The length of the thick part 33 is 3cm
When taken, the length of the thin portion 34 is 6 cm.
The center portion X of the thin portion 34 exists at a position 6 cm from the end of the flow channel 59. Assuming that the thermosiphon is made of an aluminum plate, the thickness of the thick portion 33 is 0.8 mm, and the thickness of the thin portion 34 is 0.4 mm, the characteristics of the fin efficiency are as shown in FIG. It will exhibit a characteristic like the arrow shown at the bottom. That is, the thick portion 33 has the characteristic of the thickness of 0.8 mm shown in FIG. 7, and the thin portion 34 has the characteristic of the fin efficiency of the thickness 0.4 mm shown in FIG. Will show. If the central portion X of the thin portion 34 is more than 6 cm away from the closest flow path 59, the fin efficiency may be reduced to 0.8 or less, and a desired heat radiation effect may be expected. It may not be possible.

FIG. 10 shows a case where the distance between the flow paths 59 is 10 cm. The central portion X is connected to the flow path 59 by 5c.
m away. Therefore, the fin efficiency at the central portion X where the fin efficiency is lowest is about 0.85,
The fin efficiency of the central portion X shown in FIG. 9 is a value higher than about 0.8.

As described above, the fin efficiency is reduced by reducing the thickness of the heat sink, but the fin efficiency is preferably at least 0.7 (70%) or more by shortening the distance from the flow path 59 as much as possible. The pattern of the thick portion 33 and the thin portion 34 may be designed so as to keep 0.8 or more and 0.9 or more.

As described above, the provision of the thin portion 34 on the heat radiating plate 5 has a disadvantage that the heat radiating effect is reduced, but has an advantage that the weight of the heat radiating plate 5 can be reduced. I have. In particular, in the case of a portable information processing device, it is necessary to reduce the weight, and the heat sink 5 of this embodiment is provided with a thin portion 34 to reduce the weight. For example, a first plate 31 and a second plate 32
When the size, thickness, and material of the second plate 32 are the same, and the second plate 32 is provided with a 30% opening (missing portion), the first plate 31 and the second plate 32
00, the heat radiation plate 5 to be formed is (100 + 7)
0) / (100 + 100) = 0.85, which is 85% of the weight without the opening. Alternatively, when the openings are provided at 50%, (100 + 50) / (100+
100) = 0.75, which is 75 times that of the case without the provision.
% Weight.

FIG. 11 and FIG. 12 are views showing a method of manufacturing the thermosiphon of this embodiment. First, S10
In, two plates are cut from an aluminum plate serving as a heat sink. Next, in S11, an opening is formed in one of the two cut plates by punching. Next, in S12, the flow path pattern is printed on the other of the two cut plates using a pressure-resistant agent. Note that this printing may be performed on a plate on which an opening is formed. Next, in S13, the two plates are overlaid. Next, S14
In 2, the two superposed plates are rolled and pressed. Next, in S15, high-pressure air is blown into the flow path of the pressed plate to expand the tube. Next, in S16, the plate is cut into a desired shape. Next, S17
In the above, the working fluid is injected into the expanded channel, and the working fluid inlet is sealed. In this way, a thermosiphon is manufactured.

FIGS. 13 to 17 show the second plate 32.
FIG. 4 is a view showing various patterns of openings provided in the hologram.
FIG. 13 shows that 1
This shows a case in which one is provided at a time. FIG. 14 shows a case where a plurality of openings are provided in a flow path forming a closed loop. In the case where a large opening as shown in FIG. 13 is provided, the strength of the second plate 32 is weakened, and as a result, the strength of the thermosiphon is weakened. In the case of FIG. 14, the strength is reduced as small as possible by providing a plurality of openings with a small size. FIG. 15 shows a case where flow paths are provided around all the openings. FIG. 16 shows a case where the portion where the strength of the first plate 31 is weakened is changed by changing the pattern of the opening. FIG.
The case where the shape of the opening is formed in a sawtooth shape is shown.
The shape of the opening may be other than those shown in FIGS.

FIGS. 18 and 19 show a case where the cutout is not an opening but a cutout. FIG.
The thermosiphon formed when a comb-shaped notch is provided in the second plate 32 is shown. FIG.
Shows a thermosiphon when the second plate 32 is cut out in a hand shape. FIG. 20 shows a case where only one opening is provided at the center portion. The thin portion 34 is formed large at the center by the opening, and the size of the thin portion 34 is equal to or larger than the size of the liquid crystal display panel 7. In order to reduce the thickness of the lid 51, it is desirable to make the thermosiphon as thin as possible in the portion where the liquid crystal display panel 7 exists. Therefore, the thin portion 34, which is the thinnest portion of the thermosiphon, is arranged behind the liquid crystal display panel 7, and the thick portion 33 and the flow path 59 are arranged in a portion where the liquid crystal display panel 7 does not exist, so that the thickness of the lid portion 51 is reduced. Can be made thinner.

FIG. 21 is a perspective view of the outside of the lid 51. FIG. 22 is a sectional view taken along the line CC of FIG. In FIG. 21, reference numeral 12 denotes a housing outside the lid 51. Heat sink 5
Is provided so as to be exposed on a part of the housing 12 outside the lid 51.

The above-described thermosiphon is shown in FIGS.
Can be used inside the housing 12 as shown in FIG. 2, but as shown in FIGS. 21 and 22, the heat dissipation effect is improved by providing the heat sink 5 itself to be exposed in a part of the housing. Further improve.

FIGS. 23 and 24 are views showing another example of the opening. As shown in FIGS. 23 and 24, the shape, size, size, and number of the openings may be any. FIGS. 23 and 24 are diagrams showing a case where the size of the first plate 31 is larger than that of the second plate 32. First plate 3 at fold line 37
By bending or drawing the end of the first part, a strong box-shaped thermosiphon as shown in FIG. 25 can be produced. In the case shown in FIG. 25, the case where the bending process is performed at 90 ° C. or the drawing process is performed at the bending line 37, but the bending process may be performed at 180 ° C. FIG. 26 shows a case where the casing 12 is formed by drawing the first plate 31. That is, FIG.
The case where the housing 12 is used as the heat sink 5 is shown. The housing 12 can also be made of an aluminum plate. Therefore, the housing 12 can be used as the heat sink 5. Alternatively, the housing 12 can be used as the thermosiphon 6.

FIG. 27 shows the thickness W1 of the first plate 31.
Is made thicker than the thickness W2 of the second plate 32. In the case of FIG. 27, there is an advantage that the strength of the thermosiphon is not reduced even if a large number of openings are provided in the second plate 32. FIG. 28 shows the first plate 31
3 is smaller than the thickness W4 of the second plate 32. In the case shown in FIG. 28, there is an advantage that the weight of the thermosiphon can be made lighter than in the case of FIG.

FIG. 29 shows a case where an opening serving as a missing portion is provided not in the second plate 32 but in the first plate 31. FIG. 30 shows a case where the same opening is provided in the first plate 31 and the second plate 32.
FIG. 31 shows a case where openings are provided in both the first plate 31 and the second plate 32, and openings having different patterns are provided. As described above, the opening may be provided in one or both of the first plate 31 and the second plate 32.

Instead of the heat pipe shown in FIG. 1, a flexible sheet having high thermal conductivity, a metal rod having high thermal conductivity, or a carbon material having high thermal conductivity may be used. By using such a heat conductive member having a high heat conductivity such as a soft sheet, a metal rod, or a carbon material, the same effect as the heat pipe can be obtained.

Further, instead of a notebook personal computer, a handheld information processing device, a portable telephone, or a portable facsimile device may be used.

[0049]

As described above, according to the present invention, a thin portion is provided on the heat sink of the thermosiphon.
The weight of the thermosiphon can be reduced.

Further, according to the present invention, since the weight of the thermosiphon can be reduced, the weight of the information processing apparatus using the thermosiphon can be reduced.

According to the present invention, the weight of the thermosiphon can be reduced only by adding a simple step of providing a notch in the plate in addition to the conventional manufacturing method.

[Brief description of the drawings]

FIG. 1 is a perspective view of a mounting structure according to an embodiment of the present invention.

FIG. 2 is a partially cutaway perspective view of the thermosiphon showing one embodiment of the present invention.

FIG. 3 is a sectional view taken along line BB of FIG. 2;

FIG. 4 is a perspective view of a mounting structure showing one embodiment of the present invention.

FIG. 5 is a sectional view taken along line CC of FIGS. 1 and 2;

FIG. 6 is a flowchart showing an embodiment of the heat radiation method of the present invention.

FIG. 7 is a characteristic diagram of a radiation fin length and a fin efficiency.

FIG. 8 is a view showing a radiation fin.

FIG. 9 is a diagram showing fin efficiency according to an embodiment of the present invention.

FIG. 10 is a diagram showing fin efficiency according to an embodiment of the present invention.

FIG. 11 is a flowchart showing one embodiment of a method for manufacturing a thermosiphon of the present invention.

FIG. 12 is a flowchart illustrating an embodiment of a method for manufacturing a thermosiphon according to the present invention.

FIG. 13 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 14 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 15 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 16 is a diagram showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 17 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 18 is a diagram showing an embodiment of the thermosiphon of the present invention.

FIG. 19 is a diagram showing an embodiment of the thermosiphon of the present invention.

FIG. 20 is a diagram showing an embodiment of the thermosiphon of the present invention.

FIG. 21 is a perspective view of a lid showing one embodiment of the present invention.

FIG. 22 is a cross-sectional view of a mounting structure according to an embodiment of the present invention.

FIG. 23 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 24 is a diagram showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 25 is a diagram showing a processed second plate 32 of the present invention.

FIG. 26 is a view in which a heat sink 5 of the present invention is used as a housing 12;

FIG. 27 is a diagram showing a case where the first plate 31 and the second plate 32 of the present invention have different thicknesses.

FIG. 28 is a diagram showing a case where the first plate 31 and the second plate 32 of the present invention have different thicknesses.

FIG. 29 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 30 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 31 is a view showing an example of a first plate 31 and a second plate 32 of the present invention.

FIG. 32 is a conventional heat dissipation structure diagram.

FIG. 33 is an exploded perspective view of a lid.

FIG. 34 is a flowchart showing a conventional method for manufacturing a thermosiphon.

FIG. 35 is a flowchart showing a conventional method for manufacturing a thermosiphon.

[Explanation of symbols]

1 CPU, 2 heat conduction blocks, 3 heat pipes,
4 fixing plate, 5 heat sink, 6,69 thermosiphon,
7 liquid crystal display panel, 8 flexible sheet, 9 hydraulic fluid, 1
0 backlight, 11 heat conductive sheet, 12 housing, 13 hinge part, 31 first plate, 32 second plate, 33 thick part, 34 thin part, 35 radiating fin, 36 heating element, 37 bending line 50 body part, 51 lid part, 52 engagement shaft, 53 first flow path, 5
4 Second flow path, 55 liquid reservoir, 56 third flow path, 5
7 fourth flow path, 58 roll bond plate, 59 flow path,
60 front panel, 62 optical system for backlight,
95 Inverter board.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 7/20 F28D 15/02 F28D 15/02 101 F28D 15/02 106 G06F 1/20

Claims (16)

(57) [Claims] In a thermosiphon provided with a heat radiating plate and a flow path for circulating a hydraulic fluid, the heat radiating plate forms an opening with the first flat plate.
Plywood pre-stacked two plates with the second plate
Wherein the flow path is between the first and second plates.
Having a closed loop formed therein, wherein the heat sink has a first and a second
Thick portion where second plate is stacked and opening of second plate
And a thin portion consisting only of the first plate
The thick portion is formed around the inside of the closed loop.
The thin portion is formed inside the thick portion.
Thermo siphon to be a sign. 2. The pre-press of one of the first and second plates.
The plate has an edge protruding from the edge of the other plate.
And the protruding end is bent.
The thermosiphon according to claim 1. 3. The first and second plates have different thicknesses.
The thermosiphon according to claim 1, wherein: 4. The thin part has a fin efficiency of 0.7 or more.
2. The thermosa according to claim 1, wherein the value is 1 or less.
Ihon. 5. The thin part has a thickness of 0.4 mm.
Made of minium plate, within 6 cm from the nearest flow path
The thermostat according to claim 4, wherein the thermometer is formed.
Siphon. 6. The heat siphon according to claim 1, further comprising:
2. The thermosa according to claim 1, wherein the thermosa is used.
Ihon. 7. The electronic device is a portable computer.
7. The thermosiphon according to claim 6, wherein: 8. The electronic device according to claim 1, further comprising a main body in which a heating element is incorporated, and a lid covering the main body, wherein the thermosiphon is provided on the lid.
Sa Mosaihon according to claim 6. 9. A main body in which a heating element is incorporated, a lid covering the main body , and a radiator plate and a hydraulic fluid flow path provided on the lid.
A thermosiphon that releases heat generated by the heating element.
Provided, the heat dissipation plate forms a first plate and the openings of the plate
Plywood pre-stacked two plates with the second plate
Wherein the flow path is between the first and second plates.
Having a closed loop formed therein, wherein the heat sink has a first and a second
Thick portion where second plate is stacked and opening of second plate
And a thin portion consisting only of the first plate
The thick portion is formed around the inside of the closed loop.
The thin portion is formed inside the thick portion.
Information processing device to be referred to. 10. A housing for covering the lid, wherein the lid has a cover.
Wherein the heat sink is at least part of a housing of the lid.
The information processing apparatus according to claim 9, wherein: 11. The information processing apparatus further comprises:
Generated by the heating element from the body to the thermosiphon
A heat transfer member for transmitting heat.
An information processing apparatus according to claim 9. 12. The heat conductive member is connected to the heating element.
Before the heat generated by the heating element between the thermosiphon and
To have a heat pipe that communicates to the thermosiphon
The information processing apparatus according to claim 11, characterized in that: 13. The thermosiphon stores a hydraulic fluid.
A heat reservoir, and the heat pipe
2. A liquid storage part of the telephone is in contact with the liquid storage part.
2. The information processing apparatus according to item 2. 14. The heat conducting member is connected to the heating element.
A heat conduction block with a hinge is provided between
The heat pipe is provided on the heat conduction block.
Wherein the hinge is inserted into the hinged part.
13. The information processing device according to item 13. 15. A thermosiphon having the following steps :
Manufacturing method (a) Cut two plates from a material to be a heat sink
Step, (b) one of the play of the cut the two plates
Forming an opening in bets, (c) one of the play of the cut the two plates
Closed loop flow path around the opening using a crimp inhibitor
The step of printing, or (d) superimposing the two plates, the two plates
Thick part and only one plate where the opening is located
And (e) rolling and pressing the two superposed plates.
And (f) a process of expanding a flow path in a thick portion of the press-fitted plate.
Degree, the step of enclosing the hydraulic fluid flow path and (g)膨管. 16. The method according to claim 16, wherein the cutting is performed on one plate.
Cut to a size larger than the size of the other plate,
The method for producing a thermosiphon further includes the step of crimping
After the process, the other plate of the large plate
That there is a process to bend the part protruding from
The method for producing a thermosiphon according to claim 15, wherein
Law.