JP3058024B2 - Electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic apparatus for collectively reflowing a printed circuit board on which a frame and electronic components are mounted.

[0002]

2. Description of the Related Art A conventional electronic device will be described below. As shown in FIG. 6, a conventional electronic device includes a metal frame 1, a hole 3 having a rotation preventing convex portion 2 provided on the frame 1, The connector 5 has a connector 5 having a recess 4 to be fitted into the connector 2, and a caulking portion 7 provided in an insertion portion 6 of the connector 5 and provided in a portion where the recess 4 is not formed.
Then, the plug 5 was inserted into the hole 3 of the frame 1, and the caulking portion 7 was caulked to the frame 1 as shown in FIG. 9A or 9B. After that, as shown in FIG. 6, the frame 1 was placed in a reflow furnace with the surface of the hole 3 facing upward, and the plug 5 and the frame 1 were soldered with cream solder. In this way, the plug 5 is attached to the frame 1.
After fixing the printed circuit board by soldering, the printed circuit board having the electronic components was mounted in the frame 1 and the printed circuit board was fixed again by soldering.

[0003]

However, in such a conventional structure, the plug 5 is first soldered to the frame 1 and then the printed circuit board having the electronic components is mounted on the frame 1.
As shown in FIG. 8, there is a problem that the frame must be leveled and soldered again in the reflow furnace. Also, when the plug 5 is soldered to the frame 1, as shown in FIG. 6, simultaneous soldering with the frame 1 is also difficult above the partition plate 1 a provided vertically to the frame 1 having the holes 3. Was.

In order to solve this problem, as shown in FIG. 7, a printed circuit board 8 having electronic components is inserted into a frame 1 and a plug 5 is inserted into a hole 3, so that the frame 1 is set horizontally. Therefore, batch soldering in a reflow furnace can be considered. In this case, as shown in FIG. 9, assuming that the convex portion 2 formed in the hole 3 provided in the frame 1 is located above, the caulking portion 7 of the plug 5 is caulked as shown in FIG. Since the concave portion 4 has a wave shape, it is not caulked. Therefore, in this state, when the cream solder is applied to the solder application section 9 shown in FIG. 9 and passed through an oven furnace, the cream solder is melted by heat, wraps around under its own weight, and goes down first. Almost no cream solder remains, and most of the cream solder accumulates below the hole 3 as shown in FIG. 9B. Then, almost no cream solder remains on the upper portion 3b of the hole 3, and no caulking is performed. Therefore, there is a problem that the attachment strength between the plug 5 and the frame 1 is weakened in the direction of the recess 4 of the plug 5.

An object of the present invention is to solve such a problem, and an object of the present invention is to mount a printed circuit board in a frame and improve the mounting strength of a plug of an electronic device to be collectively soldered. .

[0006]

In order to achieve this object, an electronic device according to the present invention comprises a frame and a plug in a reflow furnace.
Is an electronic device to be soldered with cream, and
In the reflow furnace, make the holed surface of the frame vertical
In the state, the protrusion provided in the hole is below the hole.
It is configured to be formed upward from one side .

[0007]

According to this configuration, when the printed circuit board is mounted in the frame and the package is soldered, the concave portion of the plug is located below the hole when the frame and the plug are fitted. . Therefore, when soldering the frame and the plug with cream solder in a reflow furnace,
Since the cream solder wraps around and accumulates under its own weight in the recess provided below, strong soldering is performed. Therefore, the plug has a strong mounting strength in all directions by caulking and soldering.

[0008]

【Example】

(Embodiment 1) Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an assembly view of an electronic device according to an embodiment of the present invention.

In FIG. 1, an electronic device according to the present invention includes a metal frame 11, a hole 13 having a rotation preventing projection 12 provided on the frame 11, and a print having an electronic component mounted on the frame 11. The connector includes a substrate 18 and a plug 15 having a concave portion 14 inserted into the hole 13 and fitted into the convex portion 12.
6 and a caulking portion 17 provided in a portion where the concave portion 14 is not formed. When the surface having the holes 13 of the frame 11 is installed vertically in a reflow furnace, the design is such that the projections 12 come below the holes 13 provided in the frame 11.

Here, in the present embodiment, the frame 1
1 is made of a turn sheet, and the material thereof is 0.6 mm. Further, the diameter of the hole 13 is 7.6 mm, the height of the convex portion 12 provided below the hole 13 is approximately 0.6 mm, the width thereof is approximately 1.0 mm, and the radius of the tip is 0.
65 mm. Only one convex portion 12 is provided in the hole 13, and its shape may be a “U” shape, a “V” shape, or the like as long as it fits into the concave portion 14.

The operation of the electronic device configured as described above will be described below. First, the frame 11
Then, the printed circuit board 18 is inserted, and the plug 15 is inserted into the hole 13 of the frame 11 by aligning the concave portion 14 with the convex portion 12. Next, cream solder is applied to the solder application section 19 as shown in FIG. Then, it is passed through an oven furnace. At this time, the temperature of the oven furnace was approximately 240 ° C.
It is. After passing through this oven furnace, the solder is under its own weight
3 and adheres to a boundary surface between the frame 11 and the plug 15 at this time. Then, the fluid flows further to reach a fitting portion between the convex portion 12 and the concave portion 14. And this hole 13
3B, a large amount of solder 20a accumulates in the concave portion 14 due to surface tension as shown in FIG. 3B.
Therefore, the concave portion 14 of the plug 15 which was weak against the stress only by the caulking 17 is reinforced by the accumulated solder. The portions other than the concave portions 14 are originally at a level that can withstand the stress by the caulking 17, but are further reinforced by the solder 20b. Therefore, the mounting strength can be maintained in the entire direction.

Even if there is a metal partition plate 11a provided vertically with the frame 11 having the holes 13 as shown in FIG. 4, the partition plate is provided below the horizontally provided frame as in the conventional example. Unlike the configuration provided with, the soldering is easy.

Here, a solder receiving portion 11 is provided above the partition plate 11a at a joint portion between the partition plate 11a and the frame 11.
b is provided. Therefore, this solder receiving portion 11b
By applying the cream solder to the reflow furnace and applying it to the reflow oven, reliable soldering can be obtained.

(Embodiment 2) FIG. 5 shows another embodiment of the present invention. In FIG. 5, a discoidal capacitor 23 is mounted on a surface above a metal frame 22, and a metal plug 24 is provided on a vertical surface 22a.
Also in this case, as shown in FIG. 5B, a projection 26 that fits into the recess of the plug 24 is provided below the hole 25 into which the plug 24 is inserted.

With the above configuration, the discoidal capacitor 23 provided on the upper surface of the frame 22 and the frame 22
Can be collectively soldered to the plug provided on the vertical surface 22a.

[0016]

As described above, according to the electronic device of the present invention , the frame and the plug are connected with the cream solder in the reflow furnace.
An electronic device to be attached, wherein the reflow furnace
With the surface with the holes of the frame vertical,
The convex portion provided in the hole is directed upward from below the hole.
When the printed circuit board is mounted in the frame and batch soldering is performed by adopting the formed configuration, when the frame and the plug are fitted, the concave portion of the plug is located below the frame. become. Therefore, when the frame and the plug are soldered with a cream solder in a reflow furnace, the cream solder goes around and accumulates in the recess provided below by its own weight, so that strong soldering is performed. Therefore, the plug can have strong mounting strength in all directions by caulking and soldering.

[Brief description of the drawings]

FIG. 1 is an assembled perspective view of a main part of an electronic device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a main part of the same.

FIG. 3A is a side view of the same as seen from the inside of the frame, and FIG. 3B is a sectional view of the same.

FIG. 4 is a perspective view of an essential part of the frame and the partition plate.

5A is a perspective view of the present invention according to another embodiment, and FIG.

FIG. 6 is a perspective view of a frame of a conventional electronic device.

FIG. 7 is an assembled perspective view of a main part of a conventional electronic device.

FIG. 8 is a perspective view of an essential part of the same.

FIG. 9 (a) is a side view of the same as seen from the inside of the frame, and FIG. 9 (b) is a cross-sectional view thereof.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Frame 12 Rotation stop convex part 13 hole 14 concave part 15 plug 16 insertion part 17 crimping part 18 printed circuit board

Continuation of the front page (56) References JP-A-6-152122 (JP, A) JP-A-61-142795 (JP, A) JP-A-63-157923 (JP, U) JP-A-1-123394 (JP) , U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 3/34 507

Claims (1)

(57) [Claims] 1. A metal frame, a hole having a rotation preventing projection provided on the frame, and a frame mounted on the frame.
Wherein the printed circuit board having an electronic component while being worn, a plug connector insertion portion into the hole in the insert portion while being inserted having a recess to be fitted to the convex portion is provided in an the insertion portion A caulking portion provided in a portion where the concave portion is not formed, and the frame and the plug in a reflow furnace
Is an electronic device to be soldered with cream, wherein a surface having holes of the frame is vertical in the reflow furnace .
In the state, the protrusion provided in the hole is
An electronic device formed from below to above .