JP3064756B2 - Manufacturing method of ceramic laminated electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a ceramic laminated electronic component using a sintered body obtained by laminating and firing a plurality of ceramic green sheets, and more particularly, to a method for producing a ceramic laminated electronic component. The present invention relates to a method for manufacturing a ceramic laminated electronic component capable of controlling the thickness of a ceramic layer in a body with high accuracy.

[0002]

2. Description of the Related Art When manufacturing ceramic multilayer electronic components such as multilayer capacitors, a sintered body is obtained by laminating a plurality of ceramic green sheets and firing the obtained laminate. For example, in manufacturing a multilayer capacitor, a plurality of ceramic green sheets having internal electrodes formed on one main surface are laminated, and further, if necessary, ceramic green sheets having no internal electrodes formed thereon are laminated. Obtain a laminate. Then, after pressing the obtained laminate in the thickness direction, by firing,
A sintered body is obtained in which the internal electrodes are separated so as to overlap in the thickness direction via the ceramic layer.

[0003] The acquisition capacity of a multilayer capacitor is as follows.
It is determined by the ceramic material used, the thickness of the ceramic layer between the internal electrodes, the facing area between the internal electrodes, and the like.
In order to obtain a smaller and larger-capacity multilayer capacitor, it is necessary to reduce the thickness of the ceramic layer between the internal electrodes, and therefore, a thinner ceramic green sheet must be used. In order to mass-produce a multilayer capacitor having stable characteristics, the thickness of the ceramic green sheet must be controlled with high precision.

In ceramic multilayer electronic components other than the multilayer capacitor, similarly, if the thickness of the ceramic layer separated by the internal electrodes is not controlled with high precision, a component having similarly stable characteristics cannot be obtained. There is a strong demand for controlling the thickness of a ceramic green sheet to be used with high precision and for forming a ceramic layer having a desired thickness.

An example of a conventional method for manufacturing a ceramic green sheet will be described with reference to FIG. A support film 2 made of a polyethylene or polypropylene film is wound around the supply reel 1. The support film 2 is unreeled from the supply reel 1 and immersed in the ceramic slurry 4 via the rollers 3. The ceramic slurry 4 is obtained by kneading a ceramic powder, a binder, water and the like. In the ceramic slurry 4, the support film 2 is turned by a roller 5 and pulled up. As a result, the ceramic slurry adheres to both main surfaces of the support film 2. Thereafter, the support film 2 to which the ceramic slurry is attached is
The ceramic green sheets 7 and 8 are formed on both main surfaces of the support film 2 by being pulled out through the rollers 6 and drying the ceramic slurry. After a while
The ceramic green sheets 7 and 8 are peeled off from the support film 2 and are used for manufacturing the ceramic laminated electronic component.

As described above, in order to obtain a ceramic laminated electronic component having stable characteristics, it is necessary to precisely control the thickness of the ceramic layer interposed between the internal electrodes, that is, the thickness of the ceramic green sheet before firing. there were. Therefore, conventionally, the thickness of the ceramic green sheets 7, 8 formed as described above is measured using a dial gauge, and it is confirmed whether or not the ceramic green sheet having a desired thickness is obtained. The production of the green sheets 7 and 8 was performed.

[0007]

However, in the conventional method for manufacturing a ceramic green sheet, the speed at which the support film 2 is moved in the ceramic slurry 4 fluctuates or the composition of the ceramic slurry 4 fluctuates. The thickness of the ceramic green sheets 7 and 8 formed on both main surfaces of the film 2 may vary. As a result, there is a problem that the average thickness of the ceramic layer corresponding to the ceramic green sheet in the sintered body formed using the ceramic green sheet easily deviates from a target value.

Therefore, it has been attempted to increase the number of measuring points of the thickness of the ceramic green sheet using a dial gauge to thereby obtain a ceramic layer having a desired thickness. However, the thickness of the ceramic green sheet has to be measured at a very large number of measurement points, so that the measurement operation is very complicated, and there is a problem that extra time is required for the measurement.

It is an object of the present invention to provide a method of manufacturing a ceramic laminated electronic component having a process capable of controlling the thickness of a sintered ceramic layer constituted by ceramic green sheets with high accuracy.

[0010]

SUMMARY OF THE INVENTION The present invention relates to a method of manufacturing a ceramic laminated electronic component using a sintered body obtained by laminating and firing a plurality of ceramic green sheets. In manufacturing
A step of obtaining a ceramic green sheet while controlling the weight of the ceramic green sheet so as to have a weight corresponding to the thickness of the ceramic layer in the target sintered body; and using the obtained ceramic green sheet, a plurality of ceramics. A method for manufacturing a ceramic multilayer electronic component, comprising: a step of obtaining a laminate in which green sheets are laminated; and a step of obtaining a sintered body by firing the laminate.

[0011]

According to the present invention, when measuring the thickness of a ceramic green sheet directly using a dial gauge, in view of the complicated work and time required for measuring the thickness of the ceramic green sheet, the present invention uses the weight of the ceramic green sheet as a reference. Thus, the thickness of the ceramic layer in the sintered body after firing is controlled. That is, the present invention
The weight of the ceramic green sheet having a certain area is found to have a certain relationship with the thickness of the ceramic layer based on the ceramic green sheet in the sintered body after firing, and the ceramic layer having the target thickness is determined based on the relationship. The feature is that the formation of is possible.

[0012]

According to the present invention, the final thickness of the ceramic layer is controlled by controlling the weight of the ceramic green sheet so as to have a weight corresponding to the thickness of the ceramic layer in the sintered body after firing. Is done. Therefore, in manufacturing the ceramic green sheet, only the weight of the ceramic green sheet needs to be controlled, and the weight of one ceramic green sheet need only be measured once. Therefore, the operation can be simplified and the time required for the thickness management can be reduced as compared with the conventional thickness management using a dial gauge. Moreover, as is apparent from the examples described later, since there is a certain relationship between the weight of the ceramic green sheet and the thickness of the fired ceramic layer, it is possible to form a ceramic layer having a desired thickness with high precision. it can.

Therefore, it is possible to provide a ceramic laminated electronic component having a small variation in characteristics through a relatively simple process.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be clarified by describing non-limiting embodiments of the present invention.

This embodiment is applied to a method for manufacturing a multilayer capacitor. When the thickness of the ceramic layer in the sintered body after firing is 14 μm, the average thickness of the ceramic green sheet for forming the ceramic layer having such a thickness is conventionally 20 to 20 by an empirical rule.
It is known that it is about 30 μm.

Now, the thickness is 15, 20, 30, and 37 μm
Was formed and processed to have a certain area, and the weight of each ceramic green sheet was measured. For each of the obtained ceramic green sheets, the weight of 20 to 50 sheets was measured,
The average weight was determined.

Next, a sintered body was obtained using each of the above four types of ceramic green sheets. That is, a plurality of ceramic green sheets are laminated so as to form a laminate having a thickness of about 2 mm, and then pressed by a hydrostatic press or the like, and then cut so that the planar shape becomes a rectangle of 5 mm × 5 mm. A body chip was obtained.

The obtained green chip was fired under predetermined firing conditions to obtain a sintered body. The thickness of the obtained sintered body is measured, and the thickness of the ceramic layer (thickness of the sintered body / number of laminated bodies) caused by each ceramic green sheet is calculated based on the number of ceramic green sheets laminated. did.

The above average weight of the ceramic green sheet having a certain area and the thickness of the ceramic layer in the sintered body after firing were plotted on XY coordinates to obtain a regression equation. An example is shown in FIG.

In FIG. 2, the vertical axis indicates the thickness of the ceramic layer in the sintered body after firing, and the horizontal axis indicates the weight of the used ceramic green sheet. From the results of FIG. 2, the average thickness Y (μm) of the ceramic layer and the weight X (g) of the ceramic green sheet are:

[0021]

(Equation 1)

It has been found that the following relationship is satisfied. Therefore, the weight of the ceramic green sheet for realizing a ceramic layer having an average of 14 μm can be determined. Therefore, by managing the weight of the ceramic green sheet calculated in this way, a sintered body having a ceramic layer having an average thickness of 14 μm can be obtained.

In the conventional example, the thickness of the ceramic layer finally obtained is controlled by measuring the thickness of the ceramic green sheet at a number of points.
In this embodiment, the thickness of the ceramic layer can be controlled by the weight of the ceramic green sheet obtained as described above. On the other hand, when measuring the weight of the ceramic green sheet, it is only necessary to measure the weight of the ceramic green sheet having a certain area once. Therefore,
The work required for controlling the thickness of the ceramic layer can be performed extremely easily and in a short time.

In the above embodiment, the ceramic green sheet was formed by setting the thickness of the ceramic layer in the sintered body to 14 ± 0.3 μm and setting the weight width of the ceramic green sheet according to the above range. . Thereafter, a laminate is obtained using the obtained ceramic green sheet,
And many ceramic sintered bodies were obtained in the same manner as above.
When 50 ceramic sintered bodies were produced per lot as described above, the thickness of the ceramic layers in the sintered bodies in the first to third lots was the first lot ... 14.
1 μm, second lot ... 14.2 μm, third lot ...
It was 14.1 μm. Therefore, it is understood that the thickness of the ceramic layer in the obtained sintered body can be controlled with high accuracy by measuring the weight of the ceramic green sheet as described above.

The present invention is characterized in that the thickness of the ceramic layer in the sintered body is controlled by the weight of the ceramic green sheet as described above. After that, the formation of the external electrodes and the like can be performed according to a conventionally known method of manufacturing a ceramic laminated electronic component. Also, the forming of the ceramic green sheet, the specific steps of obtaining the laminate, and the like can be performed according to a conventionally known method of manufacturing a ceramic laminated electronic component.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view for explaining a process for manufacturing a conventional ceramic green sheet.

FIG. 2 is a diagram showing the relationship between the weight of a ceramic green sheet and the thickness of a ceramic layer in a sintered body.

Claims (1)

(57) [Claims] 1. A method for producing a ceramic laminated electronic component using a sintered body obtained by laminating and firing a plurality of ceramic green sheets, the method comprising: A step of obtaining a ceramic green sheet while controlling the weight of the ceramic green sheet so as to have a weight corresponding to the thickness of the ceramic layer in the body; and using the obtained ceramic green sheet, a plurality of ceramic green sheets are laminated. A method for manufacturing a ceramic multilayer electronic component, comprising: a step of obtaining a laminated body; and a step of obtaining a sintered body by firing the laminated body.