JP3076902B2 - Contact pressure measuring device for socket contacts - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact pressure measuring device for a contact of a socket, and more particularly to a contact pressure measuring device for connecting an electric component such as an IC package to an external circuit. The present invention relates to a measuring device for measuring in a state close to a use state of the device.

[0002]

2. Description of the Related Art In the case of an IC socket for inspecting an electric component such as an IC package, when the contact pressure between the contact pin and the electrode portion of the electric component changes, the electric resistance between the contact pin and the electrode portion of the electric component changes. It is important to accurately measure the contact pressure between the contact pin and the electrode part of the electric component, since the measurement result may affect the inspection result.

Conventionally, as an example of a method of measuring the contact pressure, a material similar to the lead is brought into contact with the contact pin instead of the lead of the IC package, and in this state, a material similar to the lead is placed in the IC socket. Pulled from
There has been a method of measuring the strength of the above-mentioned contact pressure by measuring the pulling force at this time. However, in this method, the actual contact pressure cannot be known, and I
It was only possible to compare and measure the strength of the contact pressure between the C sockets.

As another method, a so-called strain body is brought into contact with the contact pin in place of the electrode portion of the electric component, and the strain body is deformed by the contact pressure of the contact pin. The method of measuring the contact pressure by detecting the amount of the connected substance that transmits the deformation amount to the outside of the IC socket and detecting the amount of the movement by the movement amount detector installed outside the IC socket. there were. However, in this method, since the flexure element must be mounted in the IC socket, the size and shape of the flexure element are limited by the shape of the IC socket, and the deformation of the flexure element is moved out of the IC socket. The shape of the substance to be transmitted was also limited, and it was difficult to measure the contact pressure accurately. In particular, measurement accuracy varies between IC sockets having different shapes, which is very inconvenient.

[0005]

If the actual contact pressure between the contact pin and the electrode part of the electric component can be accurately measured easily with any kind of IC socket, the quality control of the IC socket becomes easy and the IC package becomes easy. Inspection errors of electrical components such as the above can be reduced, and design becomes easier when designing a new IC socket.

An object of the present invention is to provide a contact pressure measuring device for a socket contact which can measure the actual contact pressure between a contact pin of various sockets and an electrode portion of an electric component simply and accurately. With the goal.

[0007]

According to the contact pressure measuring device for a socket contact of the present invention, a plurality of flexible sheets each having a thin elastic resistor disposed on the surface thereof are attached so that the resistors come into contact with each other and overlap each other. Fits a probe with a matching detection unit, a fixing jig with the same shape as the electrical component mounted on the socket, and the distance between the contact pins of the socket when the fixing jig fixing the detection unit is mounted on the socket And a plurality of electrode portions disposed on the detecting portion, and the plurality of electrode portions are positioned on the contact portions of the contact pins of the socket and pressed to reduce the contact pressure between the contact pins of the socket and the electrode portions. Measured. Also,
In order to fix the detection unit in the socket, a pin is provided on a fixing jig having the same shape as the electrical component housed in the socket to be measured, and the pin is inserted through a hole provided in the detection unit. Is fixed to a fixing jig, and the fixing jig is accommodated in the socket, thereby fixing the detecting section in the socket. The electrode section of the detection section is formed in each row pattern with the spacing changed to multiple types for each row, and the electrode spacing to be used at that time is selected from each row pattern electrode section and fixed to the fixing jig I can do it.

[0008]

Since the detecting section is constituted by a flexible sheet, the detecting section can be fixed to various kinds of sockets by changing a fixing jig to be fixed, and the interval of the electrode section of the detecting section can be reduced. Since it is formed in a pattern of each row changed into a plurality of types for each row, an electrode interval to be used at that time can be selected and fixed to a fixing jig, so that arrangement intervals of contact pins are different. It can also handle sockets.

[0009]

FIG. 1 is a plan view showing an example of a probe of a contact pressure measuring device for an IC socket according to the present invention. In the figure, 1
Is a detection unit, 2 is a connector, 3 is a detection unit 1 and a connector 2
And 4 are holes used for positioning and fixing the detection unit 1. The detection unit 1 is configured by laminating two flexible sheets. On one of the sheets, as shown in FIG. 2, a plurality of elongated thin plates having an elastic thin resistor provided on top of a conductor are provided. The electrode portions 5a are arranged so that the distance between the electrode portions 5a increases stepwise as the electrode portion 5a approaches the tip of the detection portion 1. On the other sheet, as shown in FIG. In this embodiment, three wide electrode portions 5b provided with thin resistors are provided. Then, the detecting unit 1 overlaps the sheet shown in FIG. 2 and the sheet shown in FIG. 3 by contacting each other at right angles to each of the electrode portions 5b at portions where the intervals of the electrode portions 5a are gradually changed. It is made by being stuck to. The detecting unit 1 is described in Japanese Patent Application Laid-Open Nos. Sho 62-502665 and Hei 3-50
1221 etc. The connector 2 is connected to a circuit device (not shown) for detecting a change in electric resistance between the electrode portions 5a and 5b. The circuit device comprises:
The plurality of electrode portions 5a are sequentially electrically scanned, and the resistance value of each electrode portion 5a is automatically measured to indicate the contact resistance.

With the above-described configuration, the electrode portion 5a
Is pressed, the electrode portions 5a and 5b are elastically deformed, and the degree of close contact between the surfaces of the resistors that are in contact with each other increases in accordance with the pressing force. That is, since the surface of the resistor has not been subjected to any special treatment, it has fine irregularities. Therefore, if the degree of adhesion is improved, the contact area between the resistors increases. When the current is concentrated on the small contact portion, the electric resistance increases, that is, the so-called concentration resistance increases. Therefore, as the contact area increases, the concentrated resistance decreases, and the electric resistance at this portion decreases. By electrically detecting the amount of decrease in the electrical resistance one by one with respect to each of the electrode portions 5a, the pressing force applied to each of the electrode portions 5a can be measured.

Next, an actual method of use will be described. FIG.
1 is a perspective view showing an example of a so-called IC socket for a flat type IC package. In the figure, reference numeral 6 denotes a large number of contact pins implanted in an IC socket. Reference numeral 7 denotes an opening 7a for releasing heat from the IC package, and pressing of a lead of the IC package against the contact portion of the contact pin 6. And a pressing portion 7b. FIG.
FIG. 4 is a perspective view showing an example of a fixing jig for fixing the probe shown in FIG. In the drawing, reference numeral 8 denotes a mounting portion having the same shape as the IC package mounted on the IC socket shown in FIG. 4, and reference numeral 9 denotes a plurality of pins that can be inserted into the holes 4 of the probe shown in FIG.

First, the wiring section 3 of the probe shown in FIG.
Through the opening 7a of the IC socket shown in FIG.
Next, the probe 9 shown in FIG. 1 is fixed on the mounting portion 8 of the fixing jig by inserting the pin 9 of the fixing jig shown in FIG. 5 into the hole 4 of the probe. Then, the fixing jig is moved to I
When the IC package is mounted in the same manner as the mounting of the IC package on the C socket, each electrode portion 5a comes to be located on the contact portion of the contact pin 6. That is, the pin 9 of the fixing jig is located at a position at which the detection unit 1 can be fixed such that the portion of the electrode unit 5 a disposed at the interval corresponding to the interval of the contact pin 6 comes on the contact portion of the contact pin 6. It is provided in.

When the cover 7 is closed in this state, the pressing portion 7
b presses the electrode portion 5a against the contact portion of the contact pin 6, and the same state as when the IC package is mounted on the IC socket can be obtained. At this time, the electrode portions 5a,
If the entire thickness of the portion 5b is made substantially the same as that of the lead pin of the IC package, the force applied to the electrode portion 5a can be measured by the above-described method, so that the contact between the lead of the IC package and the contact portion of the contact pin 6 can be obtained. The contact pressure can be known.

Further, by changing the pins 9 inserted into the holes 4 of the probe, the same measurement can be performed for all the contact pins 6 planted on one side of the IC socket.
Further, if the direction of the fixing jig is changed, the measurement can be similarly performed on the contact pins 6 on all sides implanted in the IC socket. For an IC socket for mounting a rectangular IC package, pins 9 may be provided on two sides of the fixing jig. In the case of the IC socket shown in FIG. 4, a bridging portion 7 for reinforcement is provided at the center of the opening 7a of the cover.
c, if the wiring portion 3 is formed in a bent shape in advance as shown in FIG.
Insertion becomes easy, and there is no trouble in measurement.

When the electrode section 5a near the tip of the detecting section 1 is not used, the detecting section 1 may be cut off from the unused electrode section 5a. By doing so, the tip portion of the detection unit 1 that is not used does not need to be in the way, and in the case of a small IC socket, the probe can be easily mounted. Of course, since the detection unit 1 is configured by contacting and overlapping the electrode units 5a and 5b of two sheets,
Even when the tip of the detection unit 1 is cut, the probe does not lose power. Further, the electrode portion 5b may be provided only in a portion corresponding to the step portion where the interval between the electrode portions 5a is the smallest.

FIG. 7 shows another embodiment of the arrangement pattern of the electrode sections 5 provided in the detection section 1 of the probe. In this case, the electrode portions 5 are provided in a lattice shape, and the interval between the electrode portions 5c of the electrode portions 5c forming one stripe changes in the middle. On the other hand, the electrode portions 5d forming the other stripe are all arranged at the same interval, and only the endmost electrode portion 5d 'is configured to be wide. The detection unit 1 is configured by overlapping the two electrode units 5c with 5d and 5d '. The detection unit 1 of the probe is configured as described above, and the electrode units 5c and 5d
Any of the above patterns may be used to correspond to various IC sockets provided with contact pins 6 having different intervals. Further, the measurement of an IC socket having a contact pin having a special shape can be performed using the electrode portion 5d '.

In the case of the detecting section shown in FIG. 7, the interval of the electrode portion 5c changes only once in the middle and the interval of the electrode portion 5d does not change at all. Of course, the change of the interval between the electrode portions 5c and 5d does not change. May be changed to more than one according to the purpose of use.

In the above-described embodiment, only the type of IC socket in which the lead of the IC package is pressed by the pressing portion 7b of the cover has been described. However, the present invention is not limited to this type, and other types of IC sockets can be obtained by changing the fixing jig. Of IC sockets. Further, the electrode portions 5a and 5c, 5d
It is possible to measure even an IC socket in which contact pins are provided at intervals of an integral multiple of the distance by using only some of all the electrode portions 5a, 5c, and 5d. Furthermore, in the above embodiment, the portions of the respective electrode portions 5 that are in contact with the electrode portions of the contact pins 6 are arranged in parallel on the surface of the flexible sheet. However, in some cases, the electrode portions 5 are radially arranged. Or may be provided in an arc shape.

[0019]

As described above, in the contact pressure measuring device for socket contacts according to the present invention, since the detecting portion is constituted by a flexible sheet, various types of sockets can be obtained by changing the fixing jig. The electrode portions can be formed in each row pattern in which the interval is changed into a plurality of types for each row, and the electrode interval to be used at that time can be selected from each row pattern electrode portion and fixed to the fixing jig. As a result, it is compatible with various sockets having different contact pin intervals, and when applied to an IC socket, the contact pressure can be measured in a state very close to the actual use state of the IC socket, so that reliability is improved. The measured value of the contact pressure of the highly reliable contact can be obtained.

In addition, since the detector is positioned and fixed on the fixing jig by the holes provided on the detector and the pins provided on the fixing jig, the detector can be easily positioned on the fixing jig. It is.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a probe according to the present invention.

FIG. 2 is a partially enlarged view showing an electrode unit provided on one sheet constituting a detection unit of the probe shown in FIG. 1;

FIG. 3 is a partially enlarged cross-sectional view showing an electrode unit provided on a sheet different from the sheet shown in FIG. 2 of the detection unit of the probe shown in FIG. 1;

FIG. 4 is a perspective view showing an example of an IC socket.

FIG. 5 is a perspective view showing an example of a fixing jig for fixing the probe shown in FIG.

FIG. 6 is a partially enlarged view showing another example of the shape of the wiring portion of the probe according to the present invention.

FIG. 7 is a partially enlarged view showing another example of the pattern of the electrode unit provided in the detection unit of the probe according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Detection part 2 Connector 3 Wiring part 4 Hole 5 Electrode part 6 Contact pin 7 Cover 8 Placement part 9 pin

Claims (2)

(57) [Claims] 1. A contact pressure measuring device for a contact for a socket, which is applied to a socket for receiving an electric component and performing an electrical continuity test of the electric component, wherein a flexible thin resistor is provided on the surface. A probe having a detection unit in which a plurality of sheets are attached to each other so that the resistors are in contact with each other and overlapped with each other; a fixing jig having the same shape as an electric component mounted on the socket; and A plurality of electrode portions disposed on the detection portion so as to match the intervals between the contact pins of the socket when the fixing jig is mounted on the socket, and the plurality of electrode portions are provided with contact pins of the socket. A contact pressure between the contact pin of the socket and the electrode portion being measured by being pressed on the contact portion of the socket. Point contact pressure meter. 2. The electrode section of the detection section is formed in each row pattern in which the interval is changed into a plurality of types for each row, and an electrode interval to be used at that time is selected from the row pattern electrode section. The contact pressure measuring device for a socket contact according to claim 1, wherein the contact pressure measuring device can be fixed to a fixing jig.