JP3087619B2 - Chip mounting device and mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounting apparatus and method for bonding chips to a display panel used as a display of an electronic device.

[0002]

2. Description of the Related Art A display panel used as a display of an electronic device has a structure in which two transparent plates are bonded to each other, and outer leads of a chip which is a driver for driving the display panel are provided on electrodes provided at an edge of the transparent plate. It is set up by bonding. A large number of electrodes and outer leads are provided at a narrow pitch, and they must be correctly aligned and bonded. Therefore, immediately before bonding the outer leads to the electrodes, these are observed by a camera to detect their positions.

FIG. 4 is a partial side view of a conventional chip mounting apparatus. Reference numeral 1 denotes a display panel, which is formed by bonding two transparent plates 2 and 3 together. Although not shown, a large number of electrodes are formed at an edge of the lower transparent plate 2 at a narrow pitch, and a first mark M for detecting the position of the electrode is provided.
1 is formed. The display panel 1 is positioned on the holder 4, and is driven by a movable table (not shown) to move in an arbitrary direction.

Reference numeral 5 denotes a chip, which is a film carrier 6
The film carrier 6 is formed by bonding a bare chip 7 thereon, and a second mark M2 is formed at an end of the film carrier 6. Also, a large number of outer leads 6a are formed on the film carrier 6 at a narrow pitch. 8 is chip 5
Is a transfer head provided with a nozzle 9 for holding by vacuum suction. The transfer head 8 is driven by a moving table (not shown) and moves in an arbitrary direction. Reference numeral 10 denotes a camera for observing the first mark M1 and the second mark M2 from below.

Next, a method of mounting a chip will be described. The display panel 1 moves horizontally by driving the movable table, and the first mark M1 is positioned in the field of view of the camera 10. Further, the transfer head 8 picks up the chip 5 provided in the feeder (not shown) by vacuum suction to the nozzle 9, transfers the chip 5 above the camera 10, and positions the second mark M 2 in the visual field of the camera 10. I do. In this way, the first mark M1 and the second mark M2 are observed by the camera 10.

Based on the image obtained by the camera 10, the positions of the first mark M1 and the second mark M2 are precisely detected by a computer (not shown). Then, based on this detection result, the electrodes of the transparent plate 2 are aligned with the outer leads 6a of the chip 5, and the outer leads 6a are bonded to the electrodes. In the figure, the arrow N indicates the movement of the chip 5 with respect to the transparent plate 2 for performing this bonding. That is, after detecting the positions of the electrodes and the outer leads 6a as described above, the chip 5 is slightly raised above the transparent plate 2, the chip 5 is advanced toward the transparent plate 2, and then the chip 5 is lowered. By doing so, the outer lead 6a lands on the electrode and is bonded. The outer lead 6a is strongly pressed against the electrode by a crimping element (not shown) and bonded. The arrow N indicates a relative movement, and either the display panel 1 or the chip 5 may be moved.

[0007]

As described above, after the positions of the electrodes and the outer leads 6a are detected by the camera 10, the chip 5 rises relative to the display panel 1 as indicated by the arrow N. Since the bonding is performed by performing the forward / downward movement, there is a problem that the tact time is long due to the upward / forward / downward movement, and the working efficiency is not improved.

As means for solving such a problem, as shown by a virtual line in the figure, the chip 5 is stopped at a position higher than the transparent plate 2, and in this state, the first mark M1 and the second mark M1 are stopped. What is necessary is just to observe the mark M2 with the camera 10. In this way, after the position is detected by the camera 10, bonding is performed only by advancing the chip 5 onto the transparent plate 2 as shown by the chain arrow (that is, without performing the raising operation and the lowering operation). be able to.

However, if there is a height difference between the first mark M1 and the second mark M2, the defocus of the camera 10 occurs, and the position of the first mark M1 and the second mark M2 cannot be accurately detected. Occurs. Especially in recent years, bonding with higher position accuracy has been required more and more,
The magnification of the camera 10 must be increased, but as the magnification of the camera 10 increases, the depth of focus of the camera 10 becomes shallower and the defocus becomes more serious.

Accordingly, the present invention provides a chip mounting apparatus and a mounting method capable of detecting a position of a display panel and a chip with a high-precision camera with high accuracy and bonding the chip to an electrode of the display panel at a high speed. The purpose is to provide.

[0011]

For this purpose, the present invention comprises a movable table for positioning a display panel, a transfer head for transferring chips onto electrodes at the edge of the display panel, and an outer lead for the chips. A crimping element for crimping the electrode, a camera for observing the electrode and the outer lead and detecting their positions, and a refracting element for positioning the outer lead disposed in the optical path below the outer lead at the same focal length as the electrode Thus, a chip mounting device was constructed.

Further, the chip held by the transfer head is brought closer to the display panel positioned on the movable table, the outer lead of this chip is positioned above the electrode at the edge of the display panel, and the position of the electrode is determined by the camera. And by observing the outer lead through the light refracting element, the position of the outer lead is detected at the same focal length as the electrode. Based on the detection result, the electrode and the outer lead are aligned, and the outer lead is positioned. Was bonded to the electrode.

[0013]

In the above arrangement, since the outer leads of the chip are observed by the camera through the light refracting element, the outer leads are located at a position closer to the actual position (that is, at substantially the same focal length as the electrodes of the display panel). To be observed. From this, the outer leads of the chip can be observed at a position higher than the display panel, and therefore, when the position detection by the camera is completed, the outer leads of the chip can be moved to the electrodes of the display panel at a high speed by a simple moving operation. Can be bonded.

[0014]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a chip mounting apparatus according to one embodiment of the present invention, and FIG. 2 is a partial side view of the same. In the drawings, the same elements as those in the above-described conventional example are denoted by the same reference numerals, and description thereof will be omitted.

In FIG. 1, reference numeral 11 denotes a movable table, on which a display panel 1 is mounted on a holder 4 provided on the upper surface thereof. When the movable table 11 is driven, the display panel 1 moves in the X direction, the Y direction, and the horizontal rotation direction. A large number of electrodes 12 are provided on the edge of the transparent plate 2 at a narrow pitch. The outer leads 6 a of the chips 5 which are vacuum-adsorbed to the nozzles 9 of the transfer head 8 are provided on the electrodes 12.
Bonding.

A crimping member 13 is provided above the edge of the transparent plate 2. The crimping member 13 has a built-in heater, and is driven by a vertical movement mechanism (not shown) to perform a lifting operation. In front of the transparent plate 2, a long table 14 parallel to the edge of the transparent plate 2 is provided. As shown in FIG. 2, a light refracting element 15 is mounted on the table 14. The light refracting element 15 is made of a material having a large light refractive index, such as glass or transparent resin.

When driven by a moving table (not shown), the transfer head 8 moves in an arbitrary direction, and the tip 5 vacuum-adsorbed to the lower end of the nozzle 9 lands on the table 14 (FIG. 2). In this state, the second mark M2 provided at the end of the film carrier 6 is positioned within the field of view of the camera 10 provided below. The camera 10 acquires the images of the first mark M1 and the second mark M2 simultaneously or separately. a and b are the first marks M, respectively.
The light incident on the camera 10 from the first and second marks M2 is shown. The image data 12 obtained by the camera 10 is sent to a computer (not shown), and the first mark M1 and the second
Of the mark M2 is detected. FIG. 3 shows an image diagram obtained by a camera according to an embodiment of the present invention. From this image, the computer calculates the difference between the relative positions of the first mark M1 and the second mark M2 in the X and Y directions. It should be noted that such a method of calculating a position by a computer is well known, and therefore, detailed description thereof is omitted.

This chip mounting device has the above-described configuration, and the overall operation will be described next. In FIG.
The movable table 11 is driven to move the display panel 1 in the horizontal direction and position the display panel 1 so that the electrode 12 of the transparent plate 2 is located within the field of view of the camera 10. Further, the transfer head 8 uses the nozzle 9 to feed the chip 5 of the feeder (not shown).
The chip 5 is picked up by vacuum suction at the lower end thereof, is driven by a moving table (not shown), moves in the horizontal direction, and transfers and lands the chip 5 on the table 14.

FIG. 2 shows a state in which the display panel 1 and the chip 5 are positioned above the camera 10 in this manner. As shown in FIG. 2, the height of the table 14 is set such that the outer leads 6 a of the chip 5 are slightly higher than the upper surface of the transparent plate 2. Then, the first mark M1 and the second mark M2 are observed by the camera 10, and the image shown in FIG. 3 is obtained. In this case, camera 1
The focus of 0 is focused on the first mark M1. Then, the second mark M2 located at a position slightly higher than the first mark M1
Causes defocus as it is, and its position cannot be detected accurately. Therefore, a light refracting element 15 is provided in the optical path between the outer lead 6a and the camera 10, and the light b incident on the camera 10 from the first mark M1 is refracted, so that the second mark M2 is separated from the first mark M1. The position is detected by pretending to be at the same height.
Therefore, according to this method, the first mark M1 and the second mark M1
Are positioned at substantially the same focal length, and these positions can be accurately determined.

After the positions of the first mark M1 and the second mark M2 have been obtained as described above, the transfer head 8 is moved in FIG.
(See arrow N '). At this time, the first
The outer lead 6a and the electrode 12 are aligned by moving the chip 2 in the X direction and the Y direction relative to the electrode 12 based on the position detection results of the mark M1 and the second mark M2. This movement may be performed by moving either the transfer head 8 or the movable table 11. Further, in this case, since the outer lead 6a is located at a position slightly higher than the electrode 12 of the transparent plate 2, the outer lead 6a may be moved linearly as indicated by an arrow N ', and the ascending operation is performed as in the conventional example shown in FIG. It is not necessary to perform the lowering operation.

Next, the crimping member 13 descends to press the outer lead 6a against the electrode 12 for bonding. When the bonding is completed, the crimping member 13 rises and returns to the original position, and the transfer head 8 releases the vacuum suction state of the chip 5 and then returns to the feeder to pick up the next chip 5. Move towards. By repeating the above operation, a large number of chips 5 are bonded to the display panel 1 one after another.

[0022]

According to the present invention, the light refracting element is provided in the optical path below the outer lead of the chip, so that the outer lead can be connected to the electrode even if there is a height difference between the electrode of the display panel and the outer lead of the chip. Can be observed at substantially the same focal length, and accurate position detection can be performed with a high-magnification camera. Therefore, the outer leads of the chip can be positioned higher than the electrodes of the display panel to accurately detect the position, and after the position detection is completed, the outer leads and the electrodes are aligned by a simple moving operation. Thus, the outer leads can be bonded to the electrodes, and the chip can be mounted on the display panel at a high speed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a partial side view of a chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is an image diagram obtained by a camera according to an embodiment of the present invention.

FIG. 4 is a partial side view of a conventional chip mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Display panel 2, 3 Transparent plate 5 Chip 6a Outer lead 8 Transfer head 10 Camera 11 Movable table 12 Electrode 13 Crimper 14 Table 15 Photorefractive element

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 311

Claims (4)

(57) [Claims] 1. A movable table for positioning a display panel, a transfer head for transferring a chip onto an electrode at an edge of the display panel, a crimping member for pressing an outer lead of the chip to the electrode, and the electrode And a camera for observing the outer lead and detecting these positions, and a light refracting element disposed in an optical path below the outer lead and positioning the outer lead at the same focal length as the electrode. A chip mounting device characterized by the above-mentioned. 2. A table for positioning the chip in a height direction by grounding the chip held by the transfer head, wherein the table is provided with the photorefractive element. A chip mounting device according to claim 1. 3. A chip held by a transfer head is brought close to a display panel positioned on a movable table, and an outer lead of the chip is positioned above an electrode at an edge of the display panel. While detecting the position of the electrode, the position of the outer lead is detected at the same focal length as the electrode by observing the outer lead through a light refracting element, and based on the detection result, the position of the electrode and the outer lead is determined. A method of mounting a chip, comprising positioning and bonding the outer leads to the electrodes. 4. A position of the outer lead through the photorefractive element is determined by the camera with the chip being grounded to a table in a state where the chip is brought close to the display panel. The method for mounting a chip according to claim 3, wherein the detection is performed.