JP3097490B2 - Flat cable manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flat cable in which a base film and a cover lay film are laminated with a conductor pattern sandwiched therebetween and a conductor exposed portion is formed in a part thereof.

[0002]

2. Description of the Related Art As shown in FIG. 25, a flat cable has a predetermined conductor pattern 52 formed of a conductor foil 52a or the like sandwiched between a base film 51 and a coverlay film 53 to be laminated. And usually at both ends (and sometimes in the middle)
The base film 5 for connection with equipment and connectors
One or a part of the coverlay film 53 or both are cut off to form a conductor exposed portion 54 in which a part of the conductor pattern 52 is exposed.

Incidentally, such a type of flat cable is generally manufactured through the following steps.
First, as shown in FIG.
A portion corresponding to the conductor exposed portion 54 of the base film 51 having the adhesive layer 51b on the upper surface is cut off in advance, and as shown in FIG. 2B, on the base film 51 (more precisely, on the adhesive layer 51b). 3), a predetermined conductor pattern 52 is formed by laying a linear conductor foil 52a.

Next, the base film 51 on which the conductor pattern 52 is formed is conveyed to a heating laminating apparatus. In this heating laminating apparatus, FIG.
As shown in (a), a coverlay film 53 having an adhesive layer 53b on the lower surface of the insulating film 53a is adhered on the base film 51, and this is pressed by a heating press 60 as shown in FIG. Then, the base film 51 and the cover lay film 53 are laminated.
The base film 5 on which the conductor pattern 52 is formed
In some cases, the cover lay film 53 may be conveyed to a heating laminating apparatus in a state where the cover lay film 53 is adhered on the sheet lamination sheet 1 in advance.

[0005] Through a series of these steps, a predetermined conductor pattern 52 is sandwiched between the base film 51 and the cover lay film 53, and a conductor exposed portion 54 in which the conductor pattern 52 is partially exposed at a cut portion of the base film 51. It is formed.

[0006] If necessary, a reinforcing plate may be finally attached to the conductor exposed portion 54 on the cover lay film 53 side.

[0007]

When the flat cable is manufactured by the above-described method, when the conductor pattern 52 is formed on the base film 51, as shown in FIG. The conductor foil 52a is not supported at all in a portion previously cut off as a portion corresponding to the conductor exposed portion 54, and is in a state of floating in the air.

Accordingly, when the base film 51 in such a state is conveyed to the above-described heating laminating apparatus, various unintended external forces, impacts, and the like are applied thereto, so that the conductor pattern 5 in the cut portion of the base film 51 is applied.
2 may be damaged or cut, or the pitch between conductor patterns 52 may be disturbed.

Further, when the coverlay film 53 is adhered on the base film 51 and heated and pressed, the conductor exposed portion 54 is thinner than other portions. There is also a problem that pressure cannot be obtained and the adhesive strength decreases.

Accordingly, an object of the present invention is to provide a flat cable in which a conductor pattern in an exposed portion of the conductor is not disturbed or damaged in a manufacturing process, and a predetermined adhesive strength can be uniformly obtained in the finished flat cable. It is to provide a method.

[0011]

According to the present invention, a base film and a coverlay film are laminated with a conductor pattern sandwiched therebetween, and a conductor exposed portion is formed on the base film side. Forming a cut surrounding the portion corresponding to the conductor-exposed portion on the base film on which the release paper is adhered via an adhesive layer on an insulating film. The release paper is peeled off from the base film except for a portion corresponding to the conductor exposed portion surrounded by the conductor, and a conductor is laid at a predetermined position on the base film to form a predetermined conductor pattern. A coverlay film is stuck on the base film on which the pattern is formed, and the base film and the coverlay film are laminated with a hot press. Providing a method of manufacturing a flat cable in which a portion of the base film surrounded by the cut is removed to form a conductor exposed portion in which a part of the conductor pattern is exposed on the base film side. It is.

In the case of manufacturing this kind of flat cable, a release paper is placed on a portion corresponding to the conductor exposed portion of the flat cable on a base film provided with an adhesive layer on an upper surface of an insulating film, A conductor is laid at a predetermined position on the base film to form a predetermined conductor pattern, a coverlay film is adhered on the base film on which the conductor pattern is formed, and the base film and the coverlay film are heated and pressed. And surrounding a portion corresponding to the conductor exposed portion of the base film.
A cut may be formed as described above, and the base film at that portion may be removed together with the release paper to form a conductor exposed portion where a part of the conductor pattern is exposed on the base film side.

Furthermore, if necessary, a step of attaching a reinforcing plate to the cover lay film side of the formed conductor exposed portion can be added.

In the case of manufacturing a flat cable in which a conductor exposed portion is formed on both the base film side and the cover lay film side, the flat cable on the base film provided with an adhesive layer on the upper surface of the insulating film. A release paper is placed on a portion corresponding to the conductor exposed portion, a conductor is laid at a predetermined position on the base film to form a predetermined conductor pattern, and a portion corresponding to the conductor exposed portion has A release paper is further placed on the conductor, a coverlay film is adhered on the base film on which the conductor pattern is formed, and the base film and the coverlay film are laminated by a heat press, and the insulating film and the coverlay are laminated. Surround the area corresponding to the exposed conductor on the film
A conductor exposed portion in which a part of the conductor pattern is exposed on both the base film side and the cover lay film side by forming a cut as described above and removing the base film and the cover lay film of that part together with the release paper May be formed.

When a similar flat cable is manufactured, release paper is placed on a portion corresponding to the conductor exposed portion of the flat cable on a base film provided with an adhesive layer on the upper surface of an insulating film. A conductor is laid out at a predetermined position on the base film to form a predetermined conductor pattern, and a coverlay film in which a portion corresponding to the conductor exposed portion is cut in advance is pasted on the base film on which the conductor pattern is formed. By laminating a base film and a coverlay film by heating and pressing, a portion corresponding to the conductor exposed portion of the base film is removed together with the release paper, whereby a part of the conductor pattern is formed on the base film. A conductor exposed portion exposed on both the side and the coverlay film side may be formed.

Further, a cut is formed in the base film on which the release paper is adhered via an adhesive layer on the insulating film, so as to surround a portion corresponding to the conductor exposed portion, and the conductor surrounded by the cut is formed. Except for the portion corresponding to the exposed portion, the release paper was peeled off from the base film, a conductor was laid at a predetermined position on the base film to form a predetermined conductor pattern, and the conductor pattern was formed. A coverlay film in which a portion corresponding to the conductor exposed portion is cut in advance is pasted on the base film, and the base film and the coverlay film are laminated by a heat press, and corresponds to the conductor exposed portion of the base film. By removing the portion together with the release paper, a part of the conductor pattern is formed on the base film side and the coverlay film side. It may be formed a conductor exposed portion exposed to a person.

Further, in the case of a flat cable having conductor exposed portions formed on both the base film side and the cover lay film side, when the conductor exposed portion on one side is not used, the unused base film side or cover lay film side is used. A reinforcing plate may be attached to the exposed conductor.

[0018]

In the method of manufacturing a flat cable having a conductor exposed portion formed on the base film side as configured above, the portion corresponding to the conductor exposed portion on the base film is maintained until the heating press step is completed. Since a base film having release paper is always present, the conductor pattern is not exposed until that time, and the pressing pressure of the portion corresponding to the conductor exposed portion does not decrease during hot pressing.

In addition, due to the presence of the release paper, a portion of the base film corresponding to the conductor exposed portion is not adhered to the conductor pattern by the heating press, and a certain interval is formed between the base film and the conductor pattern.

Further, in the method of manufacturing a flat cable in which exposed conductors are formed on both the base film side and the coverlay film side, a release paper is placed on the conductor pattern corresponding to the exposed conductors. Due to the presence of the release paper, the coverlay film in the portion corresponding to the conductor exposed portion does not adhere to the conductor pattern due to the heating press process, and a certain interval is formed between the coverlay film and the conductor pattern. Is done.

Further, in the method using the cover lay film from which the portion corresponding to the conductor exposed portion has been cut in advance, it is not necessary to cut the cover lay film after the hot press.

[0022]

Embodiments will be described below with reference to the drawings. The flat cable 1 shown in FIG. 1 is obtained by laminating both films 11 and 12 with a conductor pattern 13 interposed between a base film 11 having an adhesive layer 11b and a coverlay film 12 having an adhesive layer 12b. The base film 1 is provided at both ends and an intermediate portion thereof.
A portion of the conductor pattern 13 is cut away to form a conductor exposed portion 14 exposing the conductor pattern 13. This conductor exposed portion 14
Is a portion connected to a device or a connector, and a reinforcing plate 15 for connector connection is adhered to the cover lay film 12 side on conductor exposed portions 14 formed at both ends.

A method of manufacturing the flat cable 1 configured as described above will be described in detail below. First,
As shown in FIGS. 2A and 2B, one base film 11 in which a release paper 11c is adhered to an insulating film 11a having an adhesive layer 11b is prepared. On the base film 11, the release paper 11c is peeled off, and the adhesive layer 1 is removed.
Before forming the conductor pattern 13 on the substrate 1b, as shown in FIGS. 3A and 3B, a portion corresponding to the conductor exposed portion 14 when the conductor pattern 13 is formed is formed. A cut 11d is formed so as to surround it. In this state, the portion surrounded by the cut 11d is theoretically considered to be completely separated from the other portions, as shown in FIG. They will not fall off unless they are forcibly removed.

The base film 11 in which the cut 11d is formed in the portion corresponding to the conductor exposed portion 14 in this way is set in a conductor wiring device (not shown). In addition, a large number of holes are formed on the installation surface of the base film 11 of this conductor wiring device, and the base film 11 set by sucking air from the holes by the suction device is completely adsorbed on the ground surface. It is supposed to be. And FIG.
As shown in (a) and (b), the release paper 11c is peeled off leaving a portion corresponding to the conductor exposed portion 14 surrounded by the cut 11d.

Next, as shown in FIGS. 5A and 5B,
A conductor pattern 13 is formed by laying a linear conductor foil 13a on the adhesive layer 11b and the remaining release paper 11c by a conductor wiring device. Thus, the conductor pattern 1
The base film 11 on which the base film 3 is formed is set as it is in a heat laminating apparatus, but since a portion of the base film 11 which should be cut off as the conductor exposed portion 14 remains, the conductor film passing through the portion is thereby removed. The foil 13a is protected, and when the base film 11 is moved, there is no problem that the conductor foil 13a is damaged or its wiring pitch is disturbed.

As shown in FIG. 6, the base film 11 set in the heat laminating apparatus includes a coverlay film 12 having an adhesive layer 12b on one side of an insulating film 12a. 1
7, the base film 11 and the cover lay film 12 are laminated by pressing with a heating press 20 as shown in FIG. At this time, unlike the conventional case, the base film 1
1, the portion to be cut off as the conductor exposed portion 14 remains, so that the portion to be the conductor exposed portion 14 does not have a lower press pressure than the other portions, and the conductor pattern 13 and the coverlay The adhesive strength with the film 12 becomes uniform throughout.

Then, as shown in FIG. 8, after cutting this laminated film into a predetermined product shape, as shown in FIG. 9, the portion of the base film 11 surrounded by the cut 11d is removed. As shown in FIG. 10, the cover lay film 1 of the conductor exposed portions 14 at both ends thereof
When the reinforcing plate 15 having the adhesive layer 15a on the two sides is attached,
A flat cable 1 as shown in FIG. 1 is completed.

In this embodiment, the laminated film is cut into a product shape after hot pressing. Alternatively, the laminated film may be hot pressed after cutting into a product shape. In addition, by forming the base film 11 and the coverlay film 12 in a product shape in advance, the cutting step can be omitted.

The reinforcing plate 15 may be attached as necessary, such as when the conductor exposed portion 14 is connected to a connector, and is not always necessary.

FIGS. 11 to 16 show another embodiment for manufacturing the flat cable 1 in the above embodiment. First, as shown in FIGS. 11A and 11B,
Release paper 11 is applied to insulating film 11a having adhesive layer 11b.
One base film 11 having c is attached is prepared, and as shown in FIGS. 12A and 12B, the release paper 11c is peeled off to expose the adhesive layer 11b.

Next, as shown in FIGS. 13 (a) and 13 (b), the release paper 11c is placed on the portion corresponding to the conductor exposed portion 14, and then as shown in FIGS. 14 (a) and 14 (b). Then, a conductor pattern 13 is formed by laying a linear conductor foil 13a on the adhesive layer 11b and the placed release paper 11c by a conductor wiring device (not shown).

Then, as shown in FIG. 15, this was set in a heating laminating apparatus, and the cover lay film 12 was overlaid in the same manner as in the previous embodiment.
Base film 11 and coverlay film 12
And laminate.

As shown in FIG. 16, a cut 11d is formed from the base film 11 so as to surround a portion corresponding to the conductor exposed portion 14 of the base film 11, as shown in FIG. The portion surrounded by the cut 11d is removed together with the release paper 11c. Finally, as shown in FIG. 10, when the reinforcing plate 15 is attached, the flat cable 1 shown in FIG. 1 is completed.

In the above-described manufacturing method, the portion corresponding to the conductor exposed portion 14 of the base film 11 is cut off after the hot pressing.
Is not damaged, and the press pressure does not decrease only in the portion corresponding to the conductor exposed portion 14. Further, since the release paper 11c exists between the adhesive layer 11b of the base film 11 and the conductor pattern 13 in the portion corresponding to the conductor exposed portion 14, the portion corresponding to the conductor exposed portion 14 of the base film 11 is provided. When cutting, the conductor pattern 13 is hardly damaged.

FIGS. 17 to 20 show a manufacturing process for manufacturing a flat cable in which the conductor exposed portions 14 are formed on both the base film 11 side and the cover lay film 12 side, unlike the flat cable 1 in the above embodiment. 3 shows an embodiment of the method. In this manufacturing method, the same steps as those in the above-described embodiment shown in FIGS. 11 to 14 are performed up to the middle. Therefore, the description of these steps will be omitted, and only different post-steps will be described. explain.

As shown in FIG. 14, a linear conductor foil 13a is laid on the adhesive layer 11b and the release paper 11c placed thereon to form a conductor pattern 13, and as shown in FIG. On the portion of the conductor pattern 13 corresponding to the conductor exposed portion 14, a release paper 11c is further placed thereon, and as shown in FIG. The conductor pattern 13 is sandwiched by the release paper 11c.

Next, as shown in FIGS. 18A and 18B, an adhesive layer 12b is formed on one side of the insulating film 12a.
Are laminated, and the base film 11 and the cover lay film 12 are laminated by the heating press 20.

As shown in FIG. 19, the laminated film thus formed was placed on the base film 11 and the cover lay film 12 from the base film 11 side.
And cuts 11 d and 12 so as to surround portions of the coverlay film 12 corresponding to the respective conductor exposed portions 14.
When a portion d surrounded by the cuts 11d and 12d is removed together with the release paper 11c, as shown in FIG. 20, conductor exposed portions 14 are formed on both the base film 11 side and the coverlay film 12 side. The completed flat cable is completed.

FIGS. 21 and 22 show another embodiment of a manufacturing method for manufacturing a flat cable in which a conductor exposed portion is formed on both the base film 11 side and the cover lay film 12 side as in the above embodiment. Is shown. In addition,
In this manufacturing method, up to the middle of FIG.
Since steps similar to those of the embodiment shown in FIGS. 1 to 14 and FIG. 17 are performed, description of these steps is omitted, and only different post-steps will be described.

As shown in FIG. 17, the conductor exposed portion 14
In a state where the portion of the conductor pattern 13 corresponding to the above is sandwiched by the release paper 11c, as shown in FIG. (B)
As shown in (1), the base film 11 and the cover lay film 12 are laminated by pressing with a heating press 20.

Then, as shown in FIG. 22, a cut 11d is formed from the base film 11 side so as to surround a portion corresponding to the conductor exposed portion 14 of the base film 11, and a portion surrounded by the cut 11d is formed. Release paper 1
When it is removed together with 1c, as shown in FIG. 20, a flat cable in which the conductor exposed portions 14 are formed on both the base film 11 side and the coverlay film 12 side is completed.

In the above-described flat cable manufacturing method in which the conductor exposed portions 14 are formed on both the base film 11 side and the cover lay film 12 side, a portion corresponding to the conductor exposed portions 14 of the base film 11 is heated and pressed. Although the cut is made later, for example, as shown in the first embodiment, a cut 11d may be formed in advance, and the cut 11d may be removed after hot pressing.

As described above, in the method of manufacturing a flat cable in which the conductor exposed portions 14 are formed on both the base film 11 side and the coverlay film 12 side, the base film 11 on which the conductor pattern 13 is formed is heated. When the base film 11 is set in the laminating apparatus, a portion of the base film 11 which should be cut off as the conductor exposed portion 14 remains, so that the conductor foil 13a passing through the portion is protected. The portion corresponding to the conductor exposed portion 14 can be easily removed by the release paper 11c existing in the portion corresponding to the conductor exposed portion 14 without breaking the conductor foil 13a or disturbing the wiring pitch thereof. There is no problem such as damage to the conductor pattern 13 at the time of cutting.

In the case of a flat cable in which the exposed conductor 14 is formed on both the base film 11 and the cover lay film 12, when one of the exposed conductors is not used, the unused base film 11 or cover is not used. A reinforcing plate may be attached to the lay film 12 side.

[0045]

As described above, in the method of manufacturing a flat cable according to the present invention, the base film having the release paper is provided in a portion corresponding to the exposed conductor on the base film until the heating press step is completed. Is always present, the conductor pattern is not exposed in the meantime, and the press pressure of the portion corresponding to the conductor exposed portion does not decrease during hot pressing, so the external force applied when transported to the heating laminating device Thus, it is possible to effectively prevent damage to the conductor pattern and disturbance in the pitch between conductor patterns due to the above-mentioned factors, and thus the predetermined flat cable as a whole can have a predetermined adhesive strength.

Further, since the base film of the portion corresponding to the conductor exposed portion does not adhere to the conductor pattern by the heating press due to the release paper, the portion corresponding to the conductor exposed portion can be easily removed, and the production efficiency can be improved. Does not decrease. Furthermore, in the method of cutting off the portion of the base film corresponding to the conductor exposed portion after the heat press, since a certain interval is formed between the base film and the conductor pattern, the conductor pattern is cut when the base film is cut. There is also an effect that it is hard to hurt.

Further, in order to manufacture a flat cable having conductor exposed portions on both the base film side and the cover lay film side, release paper is also placed on the conductor pattern corresponding to the conductor exposed portion. In the method described above, the coverlay film of the portion corresponding to the conductor exposed portion does not adhere to the conductor pattern due to the heat press process due to the presence of the release paper, and the coverlay film and the conductor pattern are cut when the coverlay film is cut. Since a certain distance is formed between them, the conductor pattern is not easily damaged when the coverlay film is cut, and the conductor pattern can be easily removed.

In the method of using a coverlay film in which a portion corresponding to a conductor exposed portion has been cut in advance, it is not necessary to cut the coverlay film after hot pressing. A flat cable having conductor exposed portions formed on both sides of the film can be efficiently manufactured.

[Brief description of the drawings]

FIG. 1 is a diagram showing a flat cable.

FIG. 2 is a process chart showing one embodiment of a method for manufacturing a flat cable according to the present invention.

FIG. 3 is a process chart of the above.

FIG. 4 is a process chart of the above.

FIG. 5 is a process drawing of the above.

FIG. 6 is a process chart of the above.

FIG. 7 is a process chart of the above.

FIG. 8 is a process chart of the above.

FIG. 9 is a process drawing of the above.

FIG. 10 is a process chart of the above.

FIG. 11 is a process chart showing another embodiment.

FIG. 12 is a process chart of the above.

FIG. 13 is a process chart of the above.

FIG. 14 is a process chart of the above.

FIG. 15 is a process chart of the above.

FIG. 16 is a process chart of the above.

FIG. 17 is a process chart showing another embodiment.

FIG. 18 is a process drawing of the above.

FIG. 19 is a process chart of the above.

FIG. 20 is a process drawing of the above.

FIG. 21 is a process chart showing another embodiment.

FIG. 22 is a process chart of the above.

FIG. 23 is a process chart showing a conventional example.

FIG. 24 is a process chart of the above.

FIG. 25 is a sectional view showing a flat cable.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flat cable 11 Base film 11c Release paper 11d Cut 12 Cover lay film 13 Conductive pattern 14 Conductor exposed part 15 Reinforcement plate 20 Heat press

Claims (7)

(57) [Claims] 1. A base film and a coverlay film are laminated with a conductor pattern sandwiched therebetween,
A method for manufacturing a flat cable in which a conductor exposed portion is formed on the base film side, wherein a portion corresponding to the conductor exposed portion is provided on the base film in which release paper is adhered on an insulating film via an adhesive layer. A release line is formed on the base film except for a portion corresponding to the conductor exposed portion surrounded by the cut line, and a conductor is wired at a predetermined position on the base film. A predetermined conductor pattern is formed, a cover lay film is adhered on the base film on which the conductor pattern is formed, the base film and the cover lay film are laminated by a heat press, and are surrounded by the cuts of the base film. The exposed portion is removed so that a portion of the conductor pattern is exposed to the base film to form a conductor exposed portion. Method of manufacturing a flat cable. 2. A base film and a cover lay film are laminated with the conductor pattern sandwiched therebetween,
A method of manufacturing a flat cable in which a conductor exposed portion is formed on the base film side, wherein a release paper is formed on a portion corresponding to the conductor exposed portion of the flat cable on a base film provided with an adhesive layer on an upper surface of an insulating film. Is placed, a conductor is laid at a predetermined position on the base film to form a predetermined conductor pattern, a coverlay film is adhered on the base film on which the conductor pattern is formed, and the base is heated by a press. A film and a coverlay film are laminated, and a portion corresponding to the conductor exposed portion of the base film is
A method of manufacturing a flat cable in which a cut is formed so as to surround and a portion of the base film is removed together with the release paper to form a conductor exposed portion in which a part of the conductor pattern is exposed on the base film side. . 3. A base film and a cover lay film are laminated with the conductor pattern sandwiched therebetween,
A method of manufacturing a flat cable in which a conductor exposed portion is formed on both the base film side and the cover lay film side, the conductor exposed portion of the flat cable on a base film provided with an adhesive layer on an upper surface of an insulating film. A release paper is placed on a portion corresponding to the above, a conductor is laid at a predetermined position on the base film to form a predetermined conductor pattern, and a portion corresponding to the conductor exposed portion is further provided on the conductor. A release paper is placed, a coverlay film is adhered on the base film on which the conductor pattern is formed, and the base film and the coverlay film are laminated by a heat press, and the conductor exposure of the insulating film and the coverlay film is performed. the cut is formed so as to surround a portion corresponding to the part, the release base film and a cover lay film of the part Method of manufacturing a flat cable so as to form a conductor exposed portion in which a part of the conductor pattern is removed together with the paper is exposed to both the base film side and the cover lay film side. 4. A base film and a cover lay film are laminated with the conductor pattern sandwiched therebetween,
A method of manufacturing a flat cable in which a conductor exposed portion is formed on both the base film side and the cover lay film side, the conductor exposed portion of the flat cable on a base film provided with an adhesive layer on an upper surface of an insulating film. A release paper is placed on a portion corresponding to the above, a conductor is laid at a predetermined position on the base film to form a predetermined conductor pattern, and the conductor exposed portion is formed on the base film on which the conductor pattern is formed. A cover lay film whose corresponding portion has been cut off in advance is adhered, a base film and a cover lay film are laminated by a heat press, and a portion corresponding to the conductor exposed portion of the base film is removed together with the release paper. by, to expose part of the conductor pattern on both the base film side and the cover lay film side Method of manufacturing a flat cable so as to form a conductor exposed portion. 5. A base film and a cover lay film are laminated with the conductor pattern sandwiched therebetween,
A method of manufacturing a flat cable in which a conductor exposed portion is formed on both the base film side and the cover lay film side, wherein the base film in which release paper is adhered to an insulating film via an adhesive layer, Forming a cut surrounding the portion corresponding to the conductor exposed portion, excluding the release paper from the base film except for the portion corresponding to the conductor exposed portion surrounded by the cut, a predetermined position on the base film; A conductor is wired to form a predetermined conductor pattern, and a coverlay film in which a portion corresponding to the conductor exposed portion is cut in advance on a base film on which the conductor pattern is formed, is heated and pressed. A base film and a coverlay film are laminated, and a portion corresponding to the conductor exposed portion of the base film is shared with the release paper. By removing method of the flat cable portion of the conductor pattern so as to form a conductor exposed portion exposed to both the base film side and the cover lay film side. 6. The method for manufacturing a flat cable according to claim 1, further comprising a step of attaching a reinforcing plate to the cover lay film side of the formed exposed conductor portion. 7. A step of attaching a reinforcing plate to one of the cover lay film side and the base film side of the formed conductor exposed portion is added.
3. The method for manufacturing a flat cable according to item 1.