JP3101209B2 - Butt bonding equipment for plate materials by high frequency heating - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for joining two plate materials together and heating and bonding an adhesive surface coated with an adhesive by high-frequency dielectric heating. As a specific example, in a ceramic siding material that forms the outer wall of a building, a device that abuts two plates at a substantially right angle to construct a corner and heat-bonds it while maintaining an accurate constant angle It is the invention which concerns on.

[0002]

2. Description of the Related Art Conventionally, in order to process a corner member of a ceramic siding material, for example, an epoxy-based adhesive is applied to a butt portion, and the two plate materials are set in a mold for holding the plate at a predetermined angle. 1 to pressure state (cold press)
Hold for two days and wait for the adhesive to cure. Recently, a method has been proposed in which a high-frequency current is applied while pressing a plate material, which is a workpiece, with an electrode formed in an adhesive shape having a fixed angle, and the adhesive is heated by high-frequency dielectric heating.

[0003]

In the conventional cold pressing method, a long time is required for processing, and the corner member cannot be efficiently manufactured. In the method of applying a high-frequency current while pressing with an electrode formed in a fixed shape, heating and bonding can be performed in a short time, but the adhesive applied to the bonding surface at the time of pressing protrudes, and this is a mold that is an electrode. Along the side, and hardens in that state. Therefore, there is a disadvantage that the adhesive adheres to both the left and right sides of the bonding surface of the workpiece.

[0004] In view of the above disadvantages of the prior art, the present invention provides:
The adhesive that has protruded due to the pressure can be heated and bonded without spreading to the side, the finishing process after bonding can be simplified, and a high-quality butt-bonded product that does not generate dirt can be efficiently manufactured. It is an object of the present invention to provide a butt bonding apparatus for plate materials by high-frequency heating. A case in which a ceramic siding material is used as an example of a plate material as a workpiece and a corner member is manufactured by abutting substantially at right angles will be described. However, the invention can also be applied to a butt-bonding on a certain plane.

[0005]

SUMMARY OF THE INVENTION A butt bonding apparatus for a plate material in which two plate materials are pressed against each other in a position to be bonded, and the adhesive applied to the bonding surface is bonded by high-frequency dielectric heating. The left and right end faces of the open end of the upper electrode having a substantially U-shaped cross section are brought into contact with the upper surface of the plate material with the bonding position interposed therebetween.
Also, on the lower surface of the plate material, the left and right end surfaces of the open end of the lower electrode having a substantially U-shaped cross section with the bonding position interposed therebetween are brought into contact. In this state, a high-frequency current is applied between the upper electrode and the lower electrode to heat the adhesive applied to the bonding surface.

The combination of the electrodes is such that the electrodes to be brought into contact with the upper surface of the plate material have a substantially U-shaped cross section, and the electrodes to be brought into contact with the lower surface are metal plate materials having elasticity protruding from both right and left sides of the bonding position. It is formed and is brought into contact with the surface of the plate material by the elasticity of the electrode. A high-frequency current is applied between the upper electrode having a substantially U-shaped cross section and the lower electrode that is in contact with the surface of the plate material by the elasticity, and is applied to the bonding surface. The heated adhesive may be heated.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a butt-bonding apparatus for plate materials by high-frequency heating according to the present invention will be described below with reference to the accompanying drawings. 1 is a front view schematically showing an operation state, FIG. 2 is a front view showing a state before the operation of FIG. 1, and FIG. 3 is a side view of FIG.

A pedestal 2 for holding two plate materials A, A to be processed, at a fixed angle, approximately 90 degrees in the drawing, on a surface plate 1.
Is placed. Above the cradle 2, the lifting frame 3
The upper electrode 4 supported by the first electrode 4 and a pressing member 6 disposed on the side of the upper electrode 4 and pressing the plate material A are disposed. Cradle 2
A lower electrode 5 that moves up and down toward the pedestal 2 is arranged below the bottom.

The cradle 2 is formed by bending a durable metal plate at an angle at which the two plates A are to be abutted with each other at an angle of 90 degrees in the drawing, as shown in FIG. Except for both ends in the direction, the ridge is cut off. Then, bolts are fixed to the surface plate 1 at both ends where the ridge portion is not cut off. By cutting off the ridge portion of the bent pedestal 2, the electrodes can be brought into contact with both butted surfaces of the plate materials A, A placed on the pedestal 2.

The upper electrode 4 has a rod shape continuous in the longitudinal direction, has a substantially U-shaped cross section, and has an open end facing downward. The rod-shaped upper electrode 4 is supported by a plurality of guide rods 7, and is urged downward by a spring 8 in such a manner that the rod-shaped upper electrode 4 can be moved up and down by a certain dimension downward from the lifting frame 3. The lifting frame 3 itself is raised and lowered by the cylinder 9. In addition, pressing members 6 and 6 are arranged on the left and right sides of the upper electrode 4 at three positions at both ends and the center in the longitudinal direction. This pressing member 6
Is driven up and down by a cylinder 10 fixed to the lifting frame 3.

A lower electrode 5 arranged below the cradle 2
Is a rod shape having a substantially U-shaped cross section like the above-mentioned upper electrode, the open end is directed upward, and is disposed at a position facing the upper electrode 4 so as to be driven up and down by two cylinders 11, 11. It is.

In order to bond the two plate members at substantially right angles, the plate members A, A having an adhesive applied to the bonding surface on the receiving table 2 with the lifting frame raised upward as shown in FIG. Is placed. At this time, care should be taken that the bonding surface is in a contact position, and when the width of the plate material does not match, it is preferable to interpose spacers 12 at both hem portions of the receiving base 2 as shown in FIG.

Then, when the lifting frame is lowered,
First, the upper electrode 4 contacts the plate material. At this time, the left and right end portions having a substantially U-shaped cross section are in contact with the adhesive surface interposed therebetween, and are pressed with a constant force by the elastic force of the spring 8. This pressing acts to bring the upper electrode 4 as close as possible to the plate material surface.
Subsequently, when the cylinder 10 is extended and the pressing members 6 and 6 are lowered, the pressing member 6 presses the plate material A at an inclined angle as shown in FIG. A component force is generated in the direction, and the bonding surfaces of the plate members are pressed and pressed against the surface of the cradle to maintain a stable state.

In this state, when the cylinder 11 is extended and the lower electrode 5 is brought into contact with the lower surface of the plate material, the lower electrode 5 has the open end of the U-shape sandwiching the bonding surface like the upper electrode 4. Then, it comes into contact with the left and right sides of the plate material surface. When a high-frequency current is applied between the upper electrode 4 and the lower electrode 5 in this state, the entire bonding surface including the adhesive is heated and bonded. At this time, the adhesive protruding from the bonding surface is located in the U-shaped groove of the upper electrode 4 and the lower electrode 5 and does not spread along the surface of the plate material A. Even if a relatively large amount of adhesive overflows, there is no danger of maintaining the same state in the groove of the electrode or falling into the groove of the lower electrode, thereby contaminating the surface of the plate material. The adhesive adhered in the grooves of the upper electrode and the lower electrode may be cleaned after the operation is completed.

FIG. 6 is a front view of an embodiment in which the lower electrode is changed. That is, the lower electrode 5 formed of a conductive metal plate material having elasticity from both left and right sides of the bonding position of the plate material.
a and 5b are projected. In this embodiment,
As shown in FIG. 7, when plate materials A, A to be processed are placed on the cradle 2, the lower electrodes 5a, 5b abut against the surface of the plate material due to the elasticity of the lower electrodes 5a, 5b themselves, and the tips thereof approach the bonding surface. .
Thus, the adhesive extruded downward from the bonding surface falls between the electrodes 5a and 5b and falls onto the surface plate 1.

In the embodiment shown in FIG. 4, a plurality of the bonding apparatuses shown in FIG. 1 are mounted on one apparatus so that a plurality of processes can be performed at one time. On a large surface plate 1 fixed to the main body frame, a plurality of (six in the drawing) receiving stands 2 are arranged at regular intervals. Cylinders 9, 9 which are fixed to the main body frame facing the surface plate 1
An elevating frame 3 which is driven to move up and down is provided, and an upper electrode and a pressing member are arranged on the elevating frame at positions facing the receiving tables 2 and 2. The specific structure of each pedestal and lower electrode, and the upper electrode and pressing member is as described in FIG. In this embodiment, the large lifting frame moves up and down while maintaining the horizontal state.
An elevating guide mechanism 13 including a rack and a pinion mechanism is provided.

The present invention can be applied to a method in which plate materials are butted at a constant angle including horizontal, an adhesive is applied to the abutted portions, and heat bonding is performed. The adhesive that has overflowed from the butted portion and is not spread over the surface of the plate material by the pressing member and remains in the same state, and thus may be wiped off after processing. In the case of a corner member made of a ceramic siding material, the corner ridge portion is usually subjected to chamfering after heat bonding. For this reason, the adhesive that has protruded and hardened outside is completely removed by a slight chamfering process.

[0018]

According to the butt-bonding apparatus for plate materials by high-frequency heating according to the first aspect of the present invention, in the case where plate-shaped members are butt-bonded, an adhesive is applied to the butt portion and heat-bonded by high-frequency dielectric heating, The adhesive that has protruded from the bonding surface is heated and bonded as it is or accumulated in the grooves of the upper and lower electrodes, and the adhesive spreads on the surface of the plate material as in a conventional high-frequency dielectric heating bonding device using a pressing die There is no. Therefore, the product can be finished neatly, post-processing is easy, and the butt-bonding of the plate material can be performed efficiently without producing defective products.

According to the second aspect of the present invention, since the lower electrode is in close contact with the surface of the plate material to be processed by its own elasticity, it is possible to uniformly heat the bonding surface.
And even if there is a lot of adhesive that overflows from the adhesive surface and runs down, there is no possibility that this will fall directly onto the surface plate and be spread over the surface of the plate material, and the butt bonding of the plate material should be performed efficiently. Can be.

[Brief description of the drawings]

FIG. 1 is a front view of an operating state of a butt bonding apparatus for plate materials by high-frequency heating according to the present invention;

FIG. 2 is a front view showing a state before operation of FIG. 1;

FIG. 3 is a side view of FIG. 2;

FIG. 4 is a front view of a mode in which a plurality of heat bonding processes can be simultaneously performed;

FIG. 5 is an enlarged front view of only a butt-bonded portion of a plate material,

FIG. 6 is a front view of only a pedestal portion showing an aspect in which the lower electrode is formed of an elastic plate material;

FIG. 7 is a front view showing an operation state in which the plate material is heated and bonded using the lower electrode of FIG. 6;

[Explanation of symbols]

1 ... surface plate, 2 ... cradle, 3 ... lifting frame, 4 ...
Upper electrode, 5, 5a, 5b: Lower electrode, 6: Pressing member,
7: Guide rod, 8: Spring, 9, 10, 11: Cylinder, 12: Spacer, 13: Elevating guide mechanism, A: Plate material.

Continuation of the front page (51) Int.Cl. ⁷ Identification code FI B29C 65/48 B29C 65/48 (56) References JP-A-8-176516 (JP, A) JP-A-1-200937 (JP, A) JP-A-57-44685 (JP, A) JP-A-59-16750 (JP, A) JP-A-56-99271 (JP, A) JP-A-54-159922 (JP, A) JP-A-63-186700 (JP, A) JP-A-63-308080 (JP, A) JP-A-4-277581 (JP, A) JP-A-5-340058 (JP, A) JP-A-7-137140 (JP, A) JP 8-73818 (JP, A) JP-A 8-143825 (JP, A) JP-A 8-143824 (JP, A) JP-A 9-125013 (JP, A) (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) C09J 1/00-201/10 H05B 6/46-6/80 B29C 65/00-65/82 B27D 1/00-5 / 00

Claims (2)

(57) [Claims] 1. A butt-bonding apparatus for a plate material in which two plate materials are pressed against each other in a position to be bonded, and the adhesive applied to the bonding surface is bonded by high-frequency dielectric heating. The left and right end surfaces of the open end of the upper electrode having a substantially U-shaped cross section are brought into contact with the left and right end surfaces of the open end of the lower electrode having a substantially U-shaped cross section across the bonding position on the lower surface of the plate material. A high-frequency heating plate material butt bonding apparatus characterized in that a high-frequency current is applied between the upper electrode and the lower electrode to heat the adhesive applied to the bonding surface. 2. A butt-bonding apparatus for a plate material in which two plate materials are pressed against each other in a position to be bonded, and the adhesive applied to the bonding surface is bonded by high-frequency dielectric heating. The upper and lower ends of the open end of the upper electrode having a substantially U-shaped cross section are brought into contact with each other, and the lower electrode made of an elastic metal plate is projected from both the left and right sides of the lower surface of the plate with the bonding position interposed therebetween. The lower electrode is brought into contact with the surface of the plate by elasticity, a high-frequency current is applied between the lower electrode and the upper electrode, and the adhesive applied to the bonding surface is heated. Bonding equipment.