JP3530658B2 - High frequency heating bonding machine - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION In a wall panel of a prefabricated house or the like, as shown in FIG. 6, a wall-shaped unit such as plywood or ceramic siding is adhered to the surface of a wooden frame formed into a square of a certain size. There is something to use as such. The present invention relates to a high-frequency heat-bonding machine that heat-bonds a frame and a plate as described above, and that can bond efficiently in a short time.

[0002]

2. Description of the Related Art Conventionally, an epoxy resin-based material has been used to bond a plate-like material such as plywood or ceramic siding to the surface of a wooden frame.
24 with urethane resin-based and other various resin-based adhesives
After curing for about a time to reach a certain adhesive strength, various processing such as hole processing was performed as the next step. Further, in order to shorten the bonding time, a method of using a thermosetting adhesive and heating and bonding by heating with a heater or steam while applying a bonding pressure is also practiced.

[0003]

In order to heat and bond the frame and the plate-shaped material such as plywood or ceramic siding in a shorter time, it is efficient to directly generate heat by high frequency dielectric heating. However, plate-shaped materials such as plywood or ceramic siding generally have a high water content, and when the high-frequency electrodes are directly contacted, there is a possibility that high-frequency current will flow in a short-circuited manner, making it difficult to uniformly heat the entire surface. Met. In some cases, it is not preferable to bring the high-frequency electrode into contact with the work piece for another reason. In such a case, high-frequency heat bonding cannot be performed.

In view of the above points, the present invention provides a plate having a relatively high water content such as a plywood or a plate-shaped material such as ceramic siding, and other workpieces which cannot be brought into contact with a high-frequency electrode in the related art. An object of the present invention is to obtain a high-frequency heat bonding machine capable of uniformly heating the entire surface by high-frequency dielectric heating and strongly bonding the frame and the plate in a short time. Depending on the adhesive, it is necessary to cure for a certain period of time until the final adhesive strength is obtained. Even with such a material, it is possible to obtain at least an adhesive strength to the extent that the work of the next step such as hole processing can be performed.

In order to firmly bond the frame and the plate to each other, it is necessary to heat them while applying a constant bonding pressure, and a high frequency current is applied while pressing the entire surface of the plate almost uniformly. However, as shown in FIG. 6, when the frame and the plate are not the same size and the plate is larger than the plane area of the frame, the pressing force applied to the peripheral portion of the plate acts as a bending moment to damage the plate. However, there is a possibility that the pressing force (bonding pressure) on the contact surface between the frame and the plate will be unbalanced, and the entire surface cannot be bonded uniformly. Focusing on such a point, another object of the present invention is a high-frequency heat bonding capable of performing heat bonding by applying a uniform bonding pressure to the whole without damaging a plate having a size protruding from the frame. To get the opportunity.

[0006]

A frame 1 is coated with a thermosetting adhesive 3, and a work A having a plate 2 to be adhered thereon is supplied onto a lower surface plate 4. Above the lower surface plate 4 to which the work A is supplied, a grid electrode 5 that is moved up and down toward the work A by a cylinder 6 is provided. The grid electrode 5 is composed of a plus electrode 9, a minus electrode 10 and a pressing piece 11 made of an insulating material. The plus electrodes 9 and the minus electrodes 10 are alternately arranged at regular intervals on the same plane, and the pressing pieces 11 are made to protrude between the plus electrodes 9 and the minus electrodes 10 slightly beyond the tips of the plus electrodes 9 and the minus electrodes 10. Deploy. Then, when the grid electrode 5 is lowered toward the workpiece A with a constant force, the pressing pieces 11 arranged at regular intervals come into contact with the surface of the plate 2 of the workpiece A to frame the plate 2. Press to 1, plus electrode 9 and minus electrode
The plate 10 maintains a constant gap with the plate 2 and does not come into contact with it. When a high-frequency current is applied to the plus electrode 9 in this state, high-frequency dielectric heating between the adjacent plus electrode 9 and minus electrode 10 causes a relatively shallow area, that is, the adhesive applied between the plate and the plate and the frame. 3 is efficiently and promptly heated by internal heat generation, the adhesive is hardened, and the frame 1 and the plate 2 are bonded.

If the plate 2 is larger than the frame 1,
The pressing force of the pressing piece 11 that contacts the plate protruding from the frame acts on the plate 2 as a bending moment that is proportional to the distance from the outer peripheral edge of the frame 1. In order to avoid the occurrence of this bending moment, the work surface of the workpiece is heat-bonded and the front portion in the feeding direction is projected and retracted from the lower surface plate 4 to a height substantially the same as the height of the frame 1 of the workpiece, Plate 2 projecting forward of the frame
A front receiving frame 12 that supports the bottom surface of the plate is provided, and the bottom surface of the plate that protrudes from the lower surface plate 4 to approximately the same height as the frame 1 of the workpiece at the rear of the feeding direction and that projects to the rear of the frame is supported. A rear receiving frame 13 for receiving is provided. In addition, a plate that advances and retreats toward the workpiece A to the side of the processing position, moves to the bottom surface of the plate 2 that is placed on the frame 1 and projects laterally, and projects laterally from the frame 1 A slide receiving frame 14 for supporting the bottom surface of the second base 2 is provided.

In order to be able to deal with a combination of a frame and a plate of various sizes and a product having a different positional relationship between the frame and the plate adhered to the upper surface thereof, the lower surface plate 4 is projected above the surface. And a rear receiving frame for supporting the rear end of the work A while providing stoppers 15 and 16 that engage with the front end of the frame 1 of the work A conveyed at different positions from the front receiving frame 12. 13 can be moved in the feed direction according to the size (length) of the plate of the workpiece.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of the high-frequency heating and bonding machine of the present invention will be described below with reference to the accompanying drawings.
FIG. 6 is a perspective view showing an example of the workpiece A, in which the rectangular frame 1 and the plate 2 are shown separately. The rectangular frame 1 is, for example, made of wood, and has vertical and horizontal crosspieces. The surface of the rectangular frame 1 is coated with a thermosetting adhesive 3 shown by dots, and the plate 2 is adhered by the adhesive 3. On the other hand, the plate 2 is a plate-shaped material such as plywood or ceramic siding, and has a length of
The length L ₂ and the width W ₂ are larger than the length L ₁ and the width W ₁ of the frame 1, and the peripheral portion of the plate protrudes from the frame in 2 to 4 directions depending on the combination method when the frame 1 and the frame 1 are bonded.

FIG. 1 is a front view of the entire high-frequency heating and bonding machine,
2 is a side view, FIG. 3 is a partially enlarged front view, and FIG. 4 is a partially enlarged side view. Above the fixed lower surface plate 4 to which the workpiece A is supplied, a grid electrode 5 that is moved up and down toward the workpiece A on the lower surface plate 4 by the cylinders 6 is provided, and below the lower surface plate 4. Is moved up and down by the cylinders 7 and 7, the roller conveyor 8 which is projected and retracted from the through hole on the lower surface plate 4 is arranged, the workpiece A is supplied to the processing position of the lower surface plate 4, and the bonded product is processed. It is designed so that it can be discharged.

As shown in FIGS. 1 and 3, the grid electrode 5 is composed of a linear plus electrode 9 extending in the width direction, a minus electrode (earth electrode) 10 and a pressing piece 11, and the plus electrode 9 and the minus electrode. 10 are alternately arranged at regular intervals, and a pressing piece 11 is arranged between the plus electrode 9 and the minus electrode 10. The pressing piece 11 is made of an electrical insulator (for example, a synthetic resin material), and the negative electrode 10 and the pressing piece 11 are directly fixed to the electrode substrate 17 which is an electrically good conductor, and the plus electrode 9 is an insulator. Fixed on the side surface of the pressing piece 11,
It connects with the high frequency power supply through the lead plate 18 arranged on the side surface of 11 or by directly connecting the lead wire from the high frequency power supply to the end of the plus electrode 9. Electrode board 17
Is a box-shaped upper platen 19 that moves up and down by cylinders 6 and 6.
And the whole grid electrode 5 can be raised and lowered toward the workpiece A.

In the illustrated embodiment, the plus electrode 9
Each of the negative electrode 10 and the negative electrode 10 employs a cylindrical pipe made of a known conductive material as an electrode and is arranged on the same plane. On the other hand, the pressing piece 11 is made to project from the plus electrode 9 and the minus electrode 10 by a slight dimension t. Therefore, the pressing piece 11 comes into contact with the plate 2 of the work piece A, and the positive electrode 9 and the negative electrode 10 and the work piece are not always in contact with each other with the small gap t maintained therebetween.
Therefore, the short circuit phenomenon does not occur due to the moisture in the plate 2 of the workpiece A, and the plus electrode 9 and the minus electrode 10
Induction current flows in the workpiece (plate) between the plates, and the plate 2 and the adhesive 3 are heated (heated) in a short time due to internal heat generation, and the frame 1
The plate 2 is quickly bonded. If the size t of the gap between the plus electrode 9 and the minus electrode 10 and the work piece is too large, the air layer functions as an insulator, and if they are in contact with or too close to each other, a short circuit phenomenon may occur due to water in the work piece. There is. Therefore, it is preferable that the size t of the gap between the electrode and the work piece is about 3 mm, for example.

In FIGS. 1 and 3, the workpiece A is supplied from right to left. That is, the left side of the drawing is the front part in the feed direction of the workpiece, and the right side is the rear part. On the left side, which is the machining position of the workpiece A and its front portion, a front receiving frame 12 is provided at the front end extending in the same direction as the plus electrode 9 and the minus electrode 10, and the workpiece A is also fed. On the right side, which is the rear part in the direction, a rear receiving frame 13 is provided so as to extend in the same direction as the plus electrode 9 and the minus electrode 10. Stoppers 15 and 16 are arranged at positions separated from the front receiving frame 12 by constant dimensions X ₁ and X ₂ . The front receiving frame 12, the rear receiving frame 13, and the stoppers 15 and 16 are arranged so as to project and retract upward from a position below the surface of the lower surface plate 4.

The front receiving frame 12 is made to stand by at the same level as or below the surface of the lower surface plate 4, and after the workpiece is supplied to the processing position, the cylinder 20 gives a height substantially equal to the height of the frame 1 of the workpiece. The bottom surface of the plate 2 protruding forward from the frame 1 is supported. For example, the work piece stopped at a predetermined position is pressed by the grid electrode 5, and in this state, the front receiving frame 12 and the rear receiving frame 13 are pushed upward by a constant force so that no bending moment is generated at the end of the plate 2. Thus, the forces are balanced so that at least an excessive bending moment does not occur.

The front receiving frame 12 and one of the pressing pieces 11 of the grid electrode 5 face each other and are positioned so as to sandwich the plate 2 from above and below.
Similar to the front receiving frame 12, the rear receiving frame 13 is made to stand by at the same level as or below the surface of the lower surface plate 4, and after the workpiece is supplied to the processing position, the rear receiving frame 13 is moved to the height of the frame 1 of the workpiece by the cylinder 21. The bottom surface of the plate 2 protruding rearward from the frame 1 is supported by protruding the same height. Specifically, the plate of the workpiece, which is supplied in the same manner as the front receiving frame and is pressed by the grid electrode, is pushed upward by a constant force to keep the force balance so that a bending moment is not generated.
The rear receiving frame 13 including the cylinder 21 can be moved in the feed direction of the workpiece by, for example, the feed screw 22, and even if the length of the plate 2 of the workpiece A supplied is different, The rear end of the plate 2 can be supported. In the illustrated embodiment, the front receiving frame 12 is also configured to be slightly movable in the feed direction of the workpiece by the cylinder 25.

The stoppers 15 and 16 arranged at positions X ₁ and X ₂ respectively from the front receiving frame 12 are cylinders, respectively.
It is made to project a little upward from the lower platen 4 by 23 and 24, and is engaged with the frame 1 of the workpiece A conveyed on the lower platen 4 to stop the workpiece at a fixed position. The reason why the stoppers are provided at two places and the front receiving frame 12 and the rear receiving frame 13 can be moved in the advancing direction of the workpiece is that they correspond to heat bonding of the workpieces of various modes and sizes. With reference to FIG. 7, an example of a processed state of a combination of different sizes of the frame 1 and the plate 2 will be described.

FIG. 7A shows an example in which the plate 2 projects from the frame 1 by a relatively small size in the front and rear of the workpiece feed direction. In this example, the front receiving frame 12 is moved to a position as close as possible to the stopper 15, and the stopper 15 is lifted to be fed to the workpiece A.
After blocking the frame 1, the front receiving frame is raised just before the stopper 15 to support the bottom surface of the plate 2 protruding forward. The rear receiving frame 13 is raised after the workpiece is supplied, and supports the bottom surface of the plate 2 protruding rearward from the frame 1.

At the front end portion of the work A, the plate 2 is
Is not protruding from the frame 1, it is not necessary to support the bottom surface of the plate 2 by the front receiving frame 12, and the plate 2 is not supported at the rear end.
Is not projected from the frame 1, it is not necessary to support the bottom surface of the plate 2 by the rear receiving frame 13, and when the sizes of the frame 1 and the plate 2 are the same, both the front receiving frame 12 and the rear receiving frame 13 are not supported. There is no need to use it as a receiving frame. Then, at least when the plate 2 does not project to the front of the frame 1, it suffices to simply stop the workpiece A at a predetermined position by the stopper 15 or 16.

FIG. 7B is an example in which the plate 2 projects from the frame 1 by a dimension X ₁ in the front of the workpiece in the feeding direction. In this example, the stopper 15 is raised to block the frame 1 of the workpiece to be fed, and then the front receiving frame 12 and the rear receiving frame 13 are moved up to project the bottom surface of the plate in front of and behind the frame 1. Support. FIG. 7C is an example in which the plate 2 projects from the frame 1 by a dimension X ₂ in the front of the workpiece in the feeding direction. In this example, the stopper 16 is raised to block the frame 1 of the workpiece to be fed, and then the front receiving frame 12 and the rear receiving frame 13 are raised, and the bottom surface of the plate projecting to the front and rear of the frame 1 is raised. Support.

FIG. 7 (d) shows that the plate 2 projects from the frame 1 by the dimension X ₁ as in the case of (b), but the size (length L ₂ ) of the plate 2 is small. is there. In this case, the rear receiving frame 13 is moved forward in advance according to the size of the plate 2, and the operation is performed in the same procedure as described in (b) above. In addition to the illustrated embodiment, by changing the position of the front receiving frame 12 by the cylinder 25 and selecting the stoppers 15 or 16, more dimensions of the plate 2 protruding forward from the frame 1 can be accommodated.

As shown in FIGS. 2 and 4, on both left and right sides of the work piece A in the traveling direction, there are plate 2 which slides on the lower platen toward the work piece and projects to the side of the frame 1. A sliding receiving frame 14 that supports the bottom surface is arranged. As shown in FIG. 2, one of the sliding receiving frames 14, 14 from the left and right sides has a rack and pinion mechanism 26.
The other end is moved forward and backward by the cylinder 27 toward the workpiece A. FIG. 4 shows a structure in which the slide receiving frame 14 moves forward and backward toward the workpiece A by the rack and pinion mechanism 25.

The sliding receiving frame 14 which moves forward and backward from the left and right sides with respect to the feed direction of the workpiece is pushed out when the workpiece is supplied to a predetermined position of the lower turn table and slightly lifted by the front and rear receiving frames. That is, first, one slide receiving frame 14 is pushed out to a predetermined position by the rack and pinion mechanism. After that, when the other sliding receiving frame 14 at the opposite position is pushed out by the cylinder 27, the work piece is stabilized at a predetermined position by the pressing force of the cylinder 27, for example, the frame 1 of the work piece A has a large size. Even if there are variations, it is processed in a fixed state so that it does not always move. An elastic material 28 such as rubber is attached to the upper surface of the sliding receiving frame 14, and even if the height of the frame 1 of the workpiece varies, the elasticity of the elastic material 28 causes the protruding portion to the side. Is available.

As is clear from the above description, the selection of the stopper to be operated and the position movement of the rear receiving frame are determined by the shape and size of the workpiece. Therefore, it is not necessary to change the setting once set when the workpieces of the same shape and the same size are supplied one after another. However, many kinds of combinations of frame and board adhesion as building materials are required. Therefore, as an actual and efficient machining method, as shown in FIG. 8, a plurality of setting positions 30a to 30 are set for the supply line 29 for supplying the workpiece A.
It is advisable to arrange f so that various workpieces are supplied to the supply line 29 from the respective setting positions.

In the entire manufacturing process shown in FIG. 8, a bar code indicating the form and size of the work is attached to the work A supplied from the setting positions 30a to 30f to the supply line 29. Every time, the bar code reader 31 installed immediately before the introduction into the high-frequency heating and bonding machine B reads the type of the work piece, and automatically selects the stopper to be activated immediately and the position setting of the rear receiving frame 13. Good to do.

In order to smoothly supply the workpiece to one supply line 29 from the plurality of setting positions 30a to 30f, the supply line 29 upstream of the ready setting position is stopped and the downstream supply line 29 is supplied. Only the line is driven, and the workpiece A is fed to the driving supply line 29.
To supply. For example, in the case where the workpiece to be prepared is supplied from the setting position 30c in FIG. 8 to the supply line as shown by the arrow, the supply line in the range of l ₃ downstream from the setting position 30c is driven, Stop the supply line upstream. By doing this, even if the work piece is located on the immediately preceding supply line, the work piece in front of the supply position will be sent to the other side by the next drive, and if the work time has passed at least once The work piece can be supplied on the line.
That is, when supplying the workpiece from the setting position 30a, set the range of l ₁ to the setting position 30a.
The range of l ₂ when supplying workpieces from b, sequentially l ₃ to l
The supply line in the range of ₅ is driven, and the entire supply line 29 is driven only when supplying from the most upstream setting position 30f.

In this way, in the example production line shown in FIG. 8, it is not necessary to prepare the workpieces of the respective standards at the plurality of setting positions 30a to 30f and wait for as long as possible after the preparation is completed. It can be promptly supplied to the supply line 29. A plurality of types of workpieces are randomly supplied onto the supply line 29. By reading the bar code with the bar code reader 31 installed immediately before the introduction into the high frequency heating / bonding machine B, the high frequency heating / bonding machine B is read. Since the processing conditions are set, the processing can be performed extremely smoothly.

[0027]

According to the high-frequency heating and bonding machine of the present invention as set forth in claim 1, the positive electrode and the negative electrode do not come into contact with the object to be processed, and moreover, a constant adhesive pressure is applied to the frame and the plate by the pressing piece. Since high-frequency dielectric heating is used to perform heat-bonding, even if the work piece has a high water content and causes problems when the electrodes are brought into contact with the work piece, the work piece is heated to a uniform temperature in a short time to form a frame. The boards can be glued.

According to the second aspect of the present invention, even if the plate adhered to the frame is of a size projecting forward and backward in the feed direction, the pressing force acting on the portion of the plate protruding from the frame is the front receiving frame. It is supported by the rear support frame and does not act as a bending moment on the periphery of the plate. Therefore, a uniform bonding pressure is exerted on the entire bonding surface between the frame and the plate, and the frame and the plate can be bonded in a state in which there is no risk of defective bonding and there is no uneven bonding.

According to the third aspect of the present invention, even if the plate to be bonded to the frame is larger than the frame and the combination of the sizes is different, the bonding surface between the plate and the frame is uniformly bonded. It is possible to bond the frame and the plate in a state where there is no uneven bonding and there is no risk of defective bonding by applying pressure.

According to the fourth aspect of the present invention, the plate adhered to the frame is larger than the frame, and the plate protruding in the width direction slides the pressing force acting on the protruding portion from the frame. It is possible to support the frame and the plate by applying a uniform bonding pressure to the bonding surface of the frame and the plate, and to bond the frame and the plate in a state where there is more even bonding.

[Brief description of drawings]

FIG. 1 is a schematic front view of the entire high-frequency heating and bonding machine of the present invention,

FIG. 2 is a schematic side view showing a high-frequency heating and bonding machine of the present invention with a part cut away;

FIG. 3 is an enlarged front view of a grid electrode and a lower platen portion of the high-frequency heating bonding machine according to the present invention,

FIG. 4 is an enlarged side view of a grid electrode and a lower platen portion of the high-frequency heating bonding machine according to the present invention,

FIG. 5 is a partially enlarged cross-sectional view of a grid electrode of a high frequency heating and bonding machine according to the present invention,

FIG. 6 is a perspective view showing an example of a workpiece.

FIG. 7 is a schematic diagram showing the relationship between the front receiving frame, the rear receiving frame, the stopper, and the workpiece.

FIG. 8 is a plan view showing an example of a production line using the high-frequency heating and bonding machine of the present invention.

[Explanation of symbols]

A ... Workpiece, B ... High frequency heat bonding machine, 1 ... Frame,
2 ... Board, 3 ... Adhesive, 4 ... Lower surface plate, 5 ... Grid electrode, 6, 7 ... Cylinder, 8 ... Roller conveyor,
9 ... Plus electrode, 10 ... Negative electrode, 11 ... Pressing piece, 12 ... Front receiving frame, 13 ... Rear receiving frame, 14 ... Sliding receiving frame, 15, 16 ... Stopper, 17 ... Electrode base, 18 ... Lead plate, 19 ... Top Surface plate, 20, 21 ... Cylinder, 22 ...
Feed screw, 23, 24 ... Cylinder, 25 ... Cylinder,
26 ... Rack and pinion mechanism, 27 ... Cylinder, 28 ... Elastic material, 29 ... Supply line, 30a-30f ... Setting position, 31 ... Bar code reader.

─────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-54-159922 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) C09J 5/00-5/10 B29C 65 / 04 B29C 65/48-65/52

Claims (4)

(57) [Claims] 1. A grid electrode which moves up and down toward a work piece above a lower surface plate 4 to which a work piece A having a plate 2 to be adhered placed on a frame 1 coated with an adhesive 3 is supplied. 5, the grid electrode 5 is composed of a plus electrode 9, a minus electrode 10 and a pressing piece 11, and the plus electrodes 9 and the minus electrodes 10 are alternately arranged on the same plane at regular intervals. Between the positive electrode 9 and the negative electrode 10
A pressing piece 11 made of an insulating material is disposed so as to slightly protrude from the workpiece A and contact the workpiece A. The workpiece A pressed by the pressing piece 11 is placed between the plus electrode 9 and the minus electrode 10 adjacent to each other. A high-frequency heat-bonding machine, which heats and bonds the frame 1 and the plate 2 by heating by dielectric heating. 2. At the processing position for heat-bonding the work piece A and at the front part in the feed direction, the work surface A protrudes from the lower surface plate 4 to a height substantially the same as the height of the work piece frame 1, and the front side of the work frame 1 appears. The front receiving frame 12 that supports the bottom surface of the plate 2 that protrudes to the rear is provided at a processing position for heat-bonding the workpiece A and at a rear portion in the feeding direction at a height substantially equal to the height of the frame 1 of the workpiece from the lower surface plate 4. Frame 1 that appears at the same height
2. The high-frequency heating and bonding machine according to claim 1, further comprising a rear receiving frame 13 for supporting a bottom surface of the plate 2 protruding rearward. 3. The front surface of the lower surface plate 4 in the feeding direction of the workpiece A is conveyed to the front surface of the lower surface plate 4 at a plurality of positions having different sizes from the front receiving frame 12. 3. The high frequency heating and bonding machine according to claim 2, wherein stoppers 15 and 16 for engaging with the frame 1 of the workpiece to be processed are provided, and the rear receiving frame 13 is movable in the feeding direction of the workpiece A. 4. A bottom surface of a plate 2 of a work piece, which advances and retreats toward the work piece A, is mounted on the frame 1 and projects laterally to the side of the processing position of the work piece A. The high-frequency heating and bonding machine according to any one of claims 1 to 3, further comprising a sliding support frame (14) for supporting the sliding support frame (14).