JP3112328B2 - Thick film chip resistors - Google Patents
Thick film chip resistorsInfo
- Publication number
- JP3112328B2 JP3112328B2 JP04013870A JP1387092A JP3112328B2 JP 3112328 B2 JP3112328 B2 JP 3112328B2 JP 04013870 A JP04013870 A JP 04013870A JP 1387092 A JP1387092 A JP 1387092A JP 3112328 B2 JP3112328 B2 JP 3112328B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- resistor
- conductor
- substrate
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、厚膜チップ抵抗器（特
に角板型精密級厚膜チップ抵抗器）の改良に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a thick-film chip resistor (particularly, a square-plate precision-grade thick-film chip resistor).
【０００２】[0002]
【従来の技術】厚膜チップ抵抗器は基本的に、アルミナ
等からなる絶縁基板の対向両側に導体膜が設けられ、こ
の導体膜に接触する抵抗体膜が基板上に形成され、抵抗
体膜及び基板上の導体膜の一部分を被覆する保護膜が基
板に施された構造を有する。この基本構成を備えた角板
型精密級厚膜チップ抵抗器として、図２に示すものがあ
る。この抵抗器は、アルミナ基板２０と、基板２０の対
向両側に設けられたＡｇ／Ｐｄ導体膜２２と、基板２０
上に形成された抵抗体膜２１と、導体膜２２上に順に成
膜されたＮｉ皮膜２３及びハンダ皮膜２４と、抵抗体膜
２１及び基板２０上の導体膜２２の一部分を被覆する保
護膜２９とで構成される。導体膜２２、Ｎｉ皮膜２３及
びハンダ皮膜２４で電極２５が構成され、保護膜２９は
アンダーコートガラス２６、ミドルコートガラス２７及
びオーバーコートガラス２８からなる。2. Description of the Related Art A thick film chip resistor is basically provided with a conductor film on both sides of an insulating substrate made of alumina or the like, and a resistor film in contact with the conductor film is formed on the substrate. And a structure in which a protective film covering a part of the conductive film on the substrate is provided on the substrate. FIG. 2 shows a square-plate precision-grade thick-film chip resistor having this basic configuration. This resistor comprises an alumina substrate 20, an Ag / Pd conductor film 22 provided on both sides of the substrate 20 facing each other,
The resistor film 21 formed thereon, the Ni film 23 and the solder film 24 sequentially formed on the conductor film 22, and the protection film 29 covering a part of the resistor film 21 and the conductor film 22 on the substrate 20. It is composed of The electrode 25 is composed of the conductor film 22, the Ni film 23 and the solder film 24, and the protective film 29 is composed of the undercoat glass 26, the middle coat glass 27 and the overcoat glass 28.
【０００３】[0003]
【発明が解決しようとする課題】上記のような抵抗器で
は、抵抗体膜２１がその縁部において導体膜２２にオー
バーラップしており、このオーバーラップ部分で抵抗体
膜２１と導体膜２２との導通が図られている。ところ
で、抵抗体膜２１は、Ａｇ／Ｐｄペーストを用いて導体
膜２２が形成された後に直ちに印刷・焼成により形成さ
れるが、この時に導体膜２２中の銀が抵抗体膜２１中に
拡散してしまう。銀が抵抗体膜２１中に混入すると、抵
抗温度特性がばらつくだけでなく、抵抗温度特性の低温
と高温における抵抗値の差（変動）が著しくなる。更に
は、銀拡散により抵抗温度特性が劣化するため、抵抗器
の製造歩留りが非常に低くなる。In the resistor as described above, the resistor film 21 overlaps the conductor film 22 at the edge thereof, and the resistor film 21 and the conductor film 22 are overlapped at the overlap portion. Is achieved. The resistor film 21 is formed by printing and baking immediately after the conductor film 22 is formed using the Ag / Pd paste. At this time, silver in the conductor film 22 diffuses into the resistor film 21. Would. When silver is mixed in the resistor film 21, not only the resistance-temperature characteristics vary, but also the difference (fluctuation) in the resistance values of the resistance-temperature characteristics between low and high temperatures becomes remarkable. Furthermore, since the resistance temperature characteristic deteriorates due to silver diffusion, the production yield of the resistor becomes extremely low.
【０００４】従って、本発明の目的は、導体膜の成分で
ある銀が抵抗体膜中に拡散するのを防止できる厚膜チッ
プ抵抗器を提供することにある。Accordingly, it is an object of the present invention to provide a thick film chip resistor which can prevent silver which is a component of a conductor film from diffusing into a resistor film.
【０００５】[0005]
【課題を解決するための手段】前記目的を達成するため
に、本発明の厚膜チップ抵抗器は、従来の厚膜チップ抵
抗器において、Ａｇ／Ｐｄ導体膜と抵抗体膜とのオーバ
ーラップ部分にて、導体膜と抵抗体膜との間にＡｕ膜を
介設したことを特徴とする。Means for Solving the Problems] To achieve the above object, thick film chip resistor of the present invention, over the in the conventional thick film chip resistor, a Ag / Pd conductor film and resistor film
At Rappu portion, characterized that you have interposed an Au film between the conductive film and resistor film.
【０００６】この厚膜チップ抵抗器では、Ａｇ／Ｐｄ導
体膜と抵抗体膜とは直接接触せず、両膜はＡｕ膜を介し
て電気的に接続されることになる。このため、導体膜中
の銀が抵抗体膜中に拡散しなくなり、抵抗温度特性のば
らつき及び低温と高温による抵抗値の差が改善され、製
造歩留りも良くなる。In this thick film chip resistor , the Ag / Pd conductor film and the resistor film are not in direct contact, and both films are electrically connected via the Au film. For this reason, silver in the conductor film does not diffuse into the resistor film, the variation in resistance temperature characteristics and the difference in resistance between low and high temperatures are improved, and the production yield is improved.
【０００７】なお、本発明の抵抗器では、抵抗温度特性
が良好になるが、具体的には抵抗温度係数を±５０ｐｐ
ｍ／℃以内にし、温度変化による抵抗値変動の許容差も
±０．５％以内にすることが好ましい。In the resistor of the present invention, although the resistance-temperature characteristic is improved, specifically, the resistance temperature coefficient is set to ± 50 pp.
m / ° C., and the tolerance of the resistance value fluctuation due to the temperature change is preferably within ± 0.5%.
【０００８】[0008]
【実施例】以下、本発明の厚膜チップ抵抗器を実施例に
基づいて説明する。図１は、その一実施例に係る角板型
精密級厚膜チップ抵抗器の断面図を示す。この抵抗器
は、本発明の特徴であるＡｕ膜以外は図２に示す従来の
ものと全く同じ構成である。即ち、アルミナ基板１０の
対向両側にＡｇ／Ｐｄ導体膜１２、Ｎｉ皮膜１３及びハ
ンダ皮膜１４が順に成膜され、導体膜１２に接触する抵
抗体膜１１が基板１０上に形成され、膜１２、１３、１
４で電極１５が構成される。抵抗体膜１１と基板１０上
の導体膜１２の一部分とは保護膜１９で被覆され、保護
膜１９は基板１０上に順に設けたアンダーコートガラス
１６、ミドルコートガラス１７及びオーバーコートガラ
ス１８からなる。DESCRIPTION OF THE PREFERRED EMBODIMENTS A thick film chip resistor according to the present invention will be described below with reference to embodiments. FIG. 1 is a cross-sectional view of a square plate type precision thick film chip resistor according to one embodiment. This resistor has exactly the same configuration as the conventional one shown in FIG. 2 except for the Au film which is a feature of the present invention. That is, an Ag / Pd conductor film 12, a Ni film 13 and a solder film 14 are sequentially formed on opposite sides of the alumina substrate 10, and a resistor film 11 in contact with the conductor film 12 is formed on the substrate 10, and the film 12, 13,1
4 constitutes the electrode 15. The resistor film 11 and a part of the conductor film 12 on the substrate 10 are covered with a protective film 19, and the protective film 19 is composed of an undercoat glass 16, a middle coat glass 17, and an overcoat glass 18 provided on the substrate 10 in order. .
【０００９】抵抗体膜１１とＡｇ／Ｐｄ導体膜１２とが
接触する部分（オーバーラップ部分）には、Ａｕ膜１が
施されており、抵抗体膜１１と導体膜１２が直接接触し
ないようになっている。この実施例では、抵抗器は角板
型であるため、抵抗体膜１１は平面矩形状を呈し、Ａｕ
膜１は抵抗体膜１１と導体膜１２とのオーバーラップ部
分に沿って延在する。The Au film 1 is applied to a portion (overlap portion) where the resistor film 11 and the Ag / Pd conductor film 12 are in contact with each other so that the resistor film 11 and the conductor film 12 do not directly contact each other. Has become. In this embodiment, since the resistor is a square plate type, the resistor film 11 has a planar rectangular shape, and Au
The film 1 extends along an overlapping portion between the resistor film 11 and the conductor film 12.
【００１０】かかる構造の抵抗器は、アルミナ基板１０
にＡｇ／Ｐｄペーストを印刷・焼成して導体膜１２を形
成した後、基板１０上に在る導体膜１２の縁部上にＡｕ
ペーストを印刷・焼成してＡｕ膜１を形成し、次いでＡ
ｕ膜１及び基板１０上に抵抗ペーストを印刷・焼成して
抵抗体膜１１とすることにより作製されるものであるた
め、抵抗体膜１１の形成時に導体膜１２の成分である銀
がＡｕ膜１によって抵抗ペースト中に拡散しない。しか
も、抵抗体膜１１と導体膜１２との電気的接続は良導電
性であるＡｕ膜１を介して行われるため、両膜１１、１
２の導電性も良好である。A resistor having such a structure is used for an alumina substrate 10
After the conductive film 12 is formed by printing and baking an Ag / Pd paste on the substrate 10, Au is formed on the edge of the conductive film 12 on the substrate 10.
The paste is printed and fired to form an Au film 1,
Since the resistor film 11 is formed by printing and baking a resistor paste on the u film 1 and the substrate 10, silver which is a component of the conductor film 12 when the resistor film 11 is formed is replaced with the Au film. 1 does not diffuse into the resistance paste. In addition, since the electrical connection between the resistor film 11 and the conductor film 12 is made via the Au film 1 having good conductivity, both the films 11, 1
The conductivity of No. 2 is also good.
【００１１】[0011]
【発明の効果】【The invention's effect】
本発明の厚膜チップ抵抗器は、以上説明The thick film chip resistor of the present invention has been described above.
したようにＡｇ／Ｐｄ導体膜と抵抗体膜とのオーバーラAs described above, the overlay between the Ag / Pd conductor film and the resistor film is
ップ部分にて、導体膜と抵抗体膜との間にＡｕ膜を介設Au film is interposed between the conductor film and the resistor film at the gap
したので、下記の効果を有する。Therefore, the following effects are obtained.
（１）導体膜中の銀がＡｕ膜によって抵抗体膜中に拡散(1) Silver in the conductor film diffuses into the resistor film by the Au film
しなくなるので、抵抗温度特性のばらつきを抑えることSuppress variations in resistance-temperature characteristics
ができるだけでなく、抵抗温度特性の低温と高温におけNot only at low and high temperature
る抵抗値の差（変動）を少なくすることができる。Resistance difference (fluctuation) can be reduced.
（２）Ａｕ膜はオーバーラップ部分にて導体膜と抵抗体(2) Au film is a conductor film and a resistor at the overlapped part
膜との間に介設される３層構造であるので、Ａｕ膜を設Since it has a three-layer structure interposed between the Au film and the
けたとしても抵抗器の二次元方向のサイズは殆ど変わらThe size of the resistor in the two-dimensional direction is almost the same
ない。Absent.
（３）Ａｕ膜はオーバーラップ部分にて導体膜と抵抗体(3) Au film is a conductor film and a resistor at the overlapped part
膜との間に介設される３層構造であるので、Ａｕ膜と抵It has a three-layer structure interposed between the Au film and the Au film.
抗体膜との接触面積を十分に確保できるにもかかわらDespite sufficient contact area with antibody membrane
ず、抵抗器の二次元方向のサイズは殆ど変わらない。The size of the resistor in the two-dimensional direction is hardly changed.
【００１２】[0012]
【発明の効果】本発明の厚膜チップ抵抗器は、以上説明
したように態様又は態様としたので、下記の効果を
有する。 （１）態様では導体膜中の銀がＡｕ膜によって抵抗体
膜中に拡散しなくなるので、態様では導体膜がＡｕか
らなるため、いずれも抵抗温度特性のばらつきを抑える
ことができるだけでなく、抵抗温度特性の低温と高温に
おける抵抗値の差（変動）を少なくすることができる。 （２）態様では、態様に比べて金の使用量が少ない
ため、生産コストを下げることが可能となる。The thick-film chip resistor according to the present invention has the following effects because it has the mode or mode as described above. (1) In the embodiment, since the silver in the conductor film is not diffused into the resistor film by the Au film, in the embodiment, the conductor film is made of Au. The difference (fluctuation) in the resistance value between the low and high temperature characteristics can be reduced. (2) In the mode, the amount of gold used is smaller than in the mode, so that the production cost can be reduced.
【図１】本発明の態様に係る角板型精密級厚膜チップ
抵抗器の断面図である。FIG. 1 is a cross-sectional view of a square-plate precision grade thick film chip resistor according to an embodiment of the present invention.
【図２】従来例に係る角板型精密級厚膜チップ抵抗器の
断面図である。FIG. 2 is a cross-sectional view of a square-plate precision-grade thick-film chip resistor according to a conventional example.
１ Ａｕ膜 １０ アルミナ基板 １１ 抵抗体膜 １２ Ａｇ／Ｐｄ導体膜 １５ 電極 １９ 保護膜 Reference Signs List 1 Au film 10 Alumina substrate 11 Resistor film 12 Ag / Pd conductor film 15 Electrode 19 Protective film
Claims (1)
け、この導体膜に一部がオーバーラップして接触する抵
抗体膜を基板上に形成し、抵抗体膜と基板上に在る導体
膜の一部分とを被覆する保護膜を基板上に施した厚膜チ
ップ抵抗器において、前記 Ａｇ／Ｐｄ導体膜と抵抗体膜とのオーバーラップ部
分にて、導体膜と抵抗体膜との間にＡｕ膜を介設したこ
とを特徴とする厚膜チップ抵抗器。An Ag / Pd conductor film is provided on both sides of a substrate, and a resistor film partially overlapping and in contact with the conductor film is formed on the substrate, and the resistor film and the resistor film are present on the substrate. a protective film covering a portion of the conductive film in the thick film chip resistor subjected on the substrate, the overlap portion between the Ag / Pd conductor film and resistor film
Min at a thick film chip resistor, characterized in that the through setting the Au film between the conductive film and resistor film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04013870A JP3112328B2 (en) | 1992-01-29 | 1992-01-29 | Thick film chip resistors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04013870A JP3112328B2 (en) | 1992-01-29 | 1992-01-29 | Thick film chip resistors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05205903A JPH05205903A (en) | 1993-08-13 |
| JP3112328B2 true JP3112328B2 (en) | 2000-11-27 |
Family
ID=11845276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04013870A Expired - Fee Related JP3112328B2 (en) | 1992-01-29 | 1992-01-29 | Thick film chip resistors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3112328B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2674523B2 (en) * | 1993-12-16 | 1997-11-12 | 日本電気株式会社 | Ceramic wiring board and manufacturing method thereof |
| JP3142232B2 (en) * | 1995-12-21 | 2001-03-07 | 釜屋電機株式会社 | Low resistance chip type resistor and method for manufacturing the resistor |
| CN100562949C (en) * | 2003-05-08 | 2009-11-25 | 松下电器产业株式会社 | Electronic component and manufacturing method thereof |
-
1992
- 1992-01-29 JP JP04013870A patent/JP3112328B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05205903A (en) | 1993-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |