JP3115161B2 - Temperature measuring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a temperature measuring device for measuring the temperature of a semiconductor resin-sealed mold.

[0002]

2. Description of the Related Art A resin-encapsulated semiconductor device is formed by arranging a lead frame after a bonding step in a mold, pouring a mold resin into the mold, and sealing the resin. The mold is composed of an upper mold and a lower mold. Particularly, the lower mold has a pot for supplying the resin, a cavity in which the lead frame is placed and the resin is injected, and a runner for pouring the resin from the pot into the cavity. And Such a mold is set at a predetermined temperature during resin sealing. Usually, the temperature of the mold is measured before starting the work or at the time of changing the type, and the mold is heated to the predetermined temperature.

Conventionally, the temperature of a mold has been measured at several points using a surface thermometer with the upper and lower molds opened and the resin sealing surface opened. Since the resin sealing surface is exposed to the outside air, the surface temperature is affected by the surrounding environment (temperature, wind flow, etc.). The surface temperature continued to drop and required a considerable amount of time to stabilize, and it took time to start the measurement. In addition, since the measurement is performed at several points, a large difference occurs in the measurement temperature between the first measurement point and the last measurement point.

[0004]

As described above, since the upper mold and the lower mold of the mold are opened to measure the temperature of the resin sealing surface, the measured temperature depends on the environment in which the mold is installed. Greatly affected. However, the temperature at the time of resin sealing, which should be originally managed, is a state in which the upper mold and the lower mold are closed. That is,
The temperature measured using the surface thermometer is different from the temperature required at the time of resin sealing. Therefore, the temperature measured by the surface thermometer is only a rough guide when the mold is set at a predetermined temperature, and the environment must be considered in order to heat the mold. Therefore, an object of the present invention is to provide a temperature measuring device that can accurately measure the temperature of a resin sealing surface of a semiconductor resin sealing mold.

[0005]

A temperature measuring device according to the present invention comprises a plurality of blocks mounted on a lower resin sealing surface of a semiconductor resin sealing mold and in contact with the upper resin sealing surface. A rail for holding the plurality of blocks and arbitrarily setting the positions of the respective blocks, a plurality of thermocouples inserted into the respective blocks to detect the temperature, and displaying the measured temperature by the thermocouples. And a temperature indicator. The plurality of blocks are made of Al or the like having good thermal conductivity, and each of the blocks is set so as to be in contact with a measurement point.

[0006]

According to the temperature measuring device, the upper and lower surfaces of each block are in contact with the resin sealing surfaces of the upper and lower dies, and the heat of the upper and lower dies is conducted to the respective blocks. The temperature of the resin sealing surface is measured by each of the thermocouples detecting the temperature of the block. Further, the temperature of the resin sealing surface is measured with the upper mold and the lower mold closed, so that the temperature of the resin sealing surface can be accurately measured. Furthermore, since the number and positions of the measurement points can be set arbitrarily, measurement can be performed with higher accuracy.

[0007]

An embodiment according to the present invention will be described below with reference to the drawings. FIG. 1 shows a semiconductor resin sealing mold runner.
The figure shows a case where three parts are measured, and only the lower mold part is shown with the mold opened to clearly show the temperature measuring device. However, it goes without saying that the upper die (not shown) corresponds to the lower die.

In the temperature measuring device according to the present invention, a cavity 11 is mounted on a runner 12 provided on the left and right sides.
Block 13, a rail 14 for holding each block 13, and a thermocouple 15 inserted inside each block 13.
And a temperature indicator (not shown) for displaying the temperature measured by each thermocouple 15. The thermocouple 15 is inserted so as to be located substantially at the center of the block 13.
The thermocouple 15 and the temperature indicator are connected via a thermocouple cable 16. The rail 14 holds a groove provided on the side surface of each block 13. The block 13 is made of, for example, aluminum having a high thermal conductivity, and the height of the block 13 is the height of the combination of the depth of the runner portion 12 and the wire diameter of the thermocouple cable 16.

Next, a method of using the above temperature measuring device will be described. Before starting the heating of the mold, the temperature measuring device is installed in the lower mold of the mold as shown in the figure, and then the lower mold and the upper mold are closed. However, a thermocouple cable 16 is provided between the lower mold and the upper mold.
In order to prevent disconnection, there is a gap about the diameter of the thermocouple cable 16. In other words, each block 13 supports the upper die so as to come into contact with the upper die and not completely adhere to the lower die. After heating the mold to a predetermined temperature while watching the temperature displayed on the temperature indicator, the temperature measuring device is taken out of the mold and a resin sealing step is performed. Further, even after the mold is heated, the same method as described above can be used even when the predetermined temperature is changed by changing the type or the like.

The lower surface of each block 13 is in direct contact with the lower die, and the upper surface is in direct contact with the upper die. The temperature of each block 13 is the same as the temperature of the upper and lower molds due to the heat conducted from the upper and lower surfaces. Measuring the temperature of each block 13 is the same as measuring the temperature of the mold. It is.

FIG. 2 shows a comparison between the measurement result of the present invention and the measurement result obtained by a conventional surface thermometer with the resin sealing surface opened. The vertical axis indicates the measurement temperature (° C.), and the horizontal axis indicates the measurement method. The set temperature of the mold is 190 ° C. When using this device, about 6.5 ° C around 190 ° C
If the surface thermometer is used, at least 1
It is measured in the range from 76 ° C to about 11 ° C. in this way,
Since a plurality of measurement points are measured at the same time when this apparatus is used than when a surface thermometer is used, measurement can be performed with great accuracy without errors due to measurement order and time difference.

Each block can be set at an arbitrary position in the longitudinal direction of the rail. The number of blocks is not limited to three, and the location for measurement is not limited to the runner part. Absent. In the resin sealing step, for example, when using only a half region from the pot side (not shown) in the cavity portion, each block can be installed in the runner portion in the half region, and the temperature can be more efficiently increased. Can be measured.

[0013]

According to the present invention, it is possible to measure the temperature of a resin sealing surface of a semiconductor resin sealing mold while the resin sealing surface is closed. Therefore, the temperature can be accurately measured without being affected by the environment. Furthermore, after the mold is heated to the set temperature with the device installed, the device is taken out and sealed with resin, so the time required for temperature measurement is almost equal to the time required to heat the mold, and it is much larger than before. Time is reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a configuration of a temperature measuring device according to the present invention.

FIG. 2 is a graph showing a comparison between a temperature measured by a temperature measuring device according to the present invention and a temperature measured by a conventional method.

[Explanation of symbols]

11: cavity, 12: runner 13: block, 14: rail, 15: thermocouple, 16:
Thermocouple cable

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-4-189120 (JP, A) JP-A-5-138706 (JP, A) JP-A-5-318549 (JP, A) 75023 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/56 B29C 45/78

Claims (1)

(57) [Claims] 1. A temperature measuring device for measuring a temperature of a resin sealing surface of a semiconductor resin sealing mold, wherein the temperature measuring device is mounted on a lower mold of the semiconductor resin sealing mold and is mounted on a resin sealing surface of an upper mold. A plurality of blocks in contact with each other, and a rail holding the plurality of blocks and arbitrarily setting the positions of the respective blocks;
A temperature measuring device, comprising: a plurality of thermocouples inserted into each of the blocks to detect a temperature; and a temperature indicator for displaying a measured temperature of each of the thermocouples.