JP4062782B2 - Plate-shaped body temperature measuring device and plate-shaped body recess forming method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention forms a recess for embedding a thermocouple temperature detection part in a plate-like body such as a silicon wafer, and fills the adhesive material in a state where the thermocouple temperature detection part is inserted into the recess, The present invention relates to a temperature measuring device for a solid plate and a method for forming a concave portion of the plate.
[0002]
[Prior art]
For example, the temperature transmitted to the silicon wafer is detected by a thermocouple temperature detection unit via an adhesive material, and the temperature is confirmed during heat-up heat treatment of the wafer and the temperature is confirmed during thin film generation (film formation). I am doing so.
Conventionally, as shown in FIG. 9, a recess 23 for embedding a hot junction 22 as a temperature detection unit provided at the tip of the thermocouple wires 20, 21 is formed in a wafer (plate-like body) 25. The concave portion 23 is formed in a rectangular cross-sectional shape having a bottom surface 23C parallel to the surface of the wafer (plate-like body) 25 and a side surface 23B along the vertical direction from the rim 23A to the bottom surface 23C of the upper end opening. Was.
[0003]
After inserting the hot junction 22 of the thermocouple into the recess 23, the temperature is detected by fixing it with an adhesive material 24 such as ceramic cement. If it is used repeatedly especially when the detection temperature is high, it will solidify. In the case where the adhesive material 24 and the wafer 25 are partially peeled off due to the difference in thermal expansion coefficient between the adhesive material 24 and the wafer 25, and the wafer 25 having a thermocouple is moved to another location in that state. The inconvenience that the hot junction 22 of the thermocouple comes out of the concave portion 23 of the wafer 25 together with the adhesive material 24 has occurred.
Further, the temperature measurement accuracy varies due to the difference in the mounting position of the hot junction 22 at the time of assembly.
[0004]
As a solution to the above inconvenience, the one shown in FIG. 8 has been proposed. That is, the recess 23 of the wafer 25 has a cross section having an annular projecting groove 23T projecting outward from the rim 23A at the lower portion of the side surface 23B formed downward from the rim 23A at the upper end opening thereof. The shape is an inverted T-shape. Therefore, even if a gap is generated between the adhesive material 24 and the wafer 25 during repeated use, it is possible to prevent the hot junction 22 of the thermocouple from coming off together with the adhesive material 24 from the recess 23 of the wafer 25. At the same time, variations in temperature measurement accuracy have been improved.
However, in either of the above two cases, if a gap is generated between the adhesive material 24 and the wafer 25 during repeated use, the hot junction 22 of the thermocouple rotates with the adhesive material 24 relative to the recess 23. The strands 20 and 21 of the thermocouple in the vicinity drawn from the adhesive material 24 may break.
[0005]
Incidentally, it is conceivable that the thermal expansion coefficient of the adhesive material 24 is the same as or substantially the same as that of the wafer 25. However, in the case where a large temperature gradient is applied in the wafer thickness direction during the heating process of the wafer, Since the temperature transmitted to the wafer 25 differs depending on the part of the wafer 25, the temperature transmitted to the wafer 25 and the temperature of the adhesive material 24 transmitted from the wafer 25 are different, and the thermal expansion coefficient is actually the same or almost the same. Even if the same material is used, a gap is generated between the two during repeated use, and the hot junction 22 of the thermocouple rotates around the vertical axis together with the adhesive material 24 with respect to the recess 23 as described above. This could not be completely resolved.
[0006]
[Problems to be solved by the invention]
In view of the above-mentioned situation, the present invention intends to solve the problem that the temperature detecting portion of the thermocouple can be prevented from coming off together with the adhesive material from the concave portion of the plate such as a wafer. It is possible to prevent the temperature detecting portion of the thermocouple from rotating together with the adhesive material with respect to the concave portion of the plate, and to provide a plate-like temperature measuring device capable of improving the detection temperature accuracy. .
[0007]
[Means for Solving the Problems]
In the present invention, in order to solve the above-mentioned problem, a bottomed recess for embedding a thermocouple temperature detector in a plate-like body is formed, and the thermocouple temperature detector is inserted into the recess. In the temperature measuring device for a plate-shaped body that is filled with an adhesive material and solidified, in the upper end opening of the concave portion in one or a plurality of locations, rather than over the entire circumferential direction of the side surface of the concave portion. A recessed portion that protrudes outward from the rim is also formed with a bottom . Therefore, when the thermocouple temperature detection part is inserted into the concave part of the plate-like body and the adhesive material is filled into the concave part, the adhesive material is also filled into the concave part, and the concave part is filled and solidified. The adhesive material can prevent the adhesive material from coming out of the concave portion of the plate-like body, and can reliably prevent the adhesive material from rotating with respect to the concave portion of the plate-like body. Although it is more effective to provide the recessed portion at a plurality of locations on the side surface of the recessed portion, the purpose can be sufficiently achieved even when the recessed portion is provided at one location.
[0008]
Here, it is preferable that the recessed portion is formed so as to extend obliquely outward and downward from the one-direction place or a plurality of places so that the bottom portion of the recessed portion is located below the bottom surface of the recessed portion. . Moreover, it is preferable to arrange | position the temperature detection part of the said thermocouple in the said recessed part. By using a material having the same or almost the same thermal expansion coefficient as that of the plate-like body as the adhesive material, even when a large thermal expansion occurs, the adhesive material adheres to the recess compared to the case where a material having a different thermal expansion coefficient is used. Since the gap with the material can be reduced, an error between the temperature transmitted to the plate-like body and the temperature transmitted from the plate-like body to the adhesive material can be reduced.
[0009]
By forming the recessed portion so that the bottom portion of the recessed portion is located below the bottom surface of the recessed portion, and disposing the temperature detecting portion of the thermocouple in the recessed portion, as shown in FIG. The wiring path length L can be increased and the measurement accuracy can be improved. In addition, since the thermocouple temperature detector can be positioned in the recessed portion, it is possible to prevent the thermocouple temperature detector from moving unexpectedly, and it is not necessary to position the moved temperature detector again. become.
[0010]
A first cutting step of cutting from a direction perpendicular to the surface of the plate-like body, and a cutting operation from a direction inclined by a set angle with respect to a vertical line with respect to the surface of the plate-like body after the completion of the first cutting step And forming a recess for embedding the temperature detecting portion of the thermocouple in the plate-like body from the second cutting step for forming the recessed portion, so that the outer side of the mouth at the upper end opening of the recessed portion Compared to a case where a concave portion with a complicated shape having a concave portion projecting into the die is cut all at once while controlling the position of the tip of the cutting blade of the cutting machine, the desired concave portion can be cut easily and quickly. .
[0011]
DETAILED DESCRIPTION OF THE INVENTION
1A and 1B show a temperature measuring device 1. FIG. This temperature measuring device 1 has a recess 3 formed on one side surface in the thickness direction of a wafer (plate-like body) 2 made of silicon or transparent or opaque quartz, and constitutes a thermocouple 2 for measuring temperature in the recess 3. A thermocouple can be attached to the wafer 2 by filling the adhesive material 6 with the tip ends of the seed wires 4 and 5 inserted. A hot contact 7 serving as a temperature detection unit is provided at the tip of the strands 4 and 5. In this embodiment, the strands 4 and 5 are directly attached to the wafer 2. Although not shown in the figure, the surface of the thermocouple wires 4 and 5 and the hot junction 7 that are inserted into the recess 3 of the wafer 2 and may come into contact with the wafer 2 are made of the same material as the adhesive material 6. Insulating coating is used to protect the wafer 2 made of silicon or the like. Further, as shown in FIG. 3, the inside of a sheath 8 as a protective covering is filled with magnesia (MgO) 9 as an insulating powder, and the wires 4 and 5 are arranged in the magnesia (MgO) 9. The formed thermocouple may be attached (embedded) to the wafer 2.
[0012]
By forming the concave portion 3 in the shape as shown in FIGS. 1A and 1B, the hot contact 7 is removed from the concave portion 3 together with the adhesive material 6, and the hot contact 7 is connected to the concave portion 3. The rotation with the adhesive material 6 can be prevented. That is, as shown in FIG. 2 (a), first, cutting is performed from a direction a perpendicular to the surface of the wafer 2, thereby obtaining a circle in plan view as shown in FIG. 1 (b). As shown in FIG. 1, a first recess 10 having a rectangular shape in a longitudinal sectional view is formed (first cutting step). The first recess 10 may have any shape such as an ellipse other than a circle, a square, a rectangle, a triangle, a diamond, or a trapezoid. Next, as shown in FIG. 2B, the upper end of the first recess 10 is cut by cutting the side surface of the recess 10 from a direction b inclined by a set angle (45 ° in the figure) from the direction a. The recessed portion 3 is formed by forming one recessed portion 11 as a second recessed portion that protrudes outward from the lip 10A of the opening (second cutting step). The recessed portion 11 is formed in a range extending from the lip 10A to the bottom surface of the recessed portion 10 in the vertical direction of the recessed portion 10 and at one circumferential position on the side surface of the recessed portion 10. In addition to forming one, two or more may be formed, and the recessed portion 11 is shown in, for example, FIGS. 5 (a) and (b) and FIGS. 6 (a) and (b). It may be configured as described above, and the shape and size of the recessed portion 11 may be set in any way. That is, in FIGS. 5 (a) and 5 (b), the formation angle of the recessed portion 11 is longer than 45 ° shown in FIG. As shown in (b), four recessed portions 11 are formed that are formed at gentle corners that do not have sharp corners. 6 (a) and 6 (b), the recessed portion 11 is smaller than that of FIGS. 5 (a) and 5 (b), and a part of the bottom surface of the first recessed portion 10 is cut, and FIG. As in (a) and (b), four recessed portions 11 are formed which are formed at gentle corners that do not have sharp corners. Although the angle when forming the recessed portion 11 is set to 45 ° in FIG. 2 (b), it is not limited to 45 °, and any angle can be set as long as it can be cut. However, 5 ° to 90 ° is desirable. Although the larger the angle, the harder it is to cut, the greater the effect of preventing the hot contact 7 from coming out of the recess 3 together with the adhesive material 6.
[0013]
As the adhesive material 6, a material having the same or almost the same thermal expansion coefficient as that of the wafer 2, for example, silica, alumina or the like is mixed in the ceramic cement so as to have the same or almost the same thermal expansion coefficient as that of the wafer 2. Alternatively, silica, alumina or the like may be mixed using a glass material or an organic resin as a base material.
[0014]
In the said Example, although the strands 4 and 5 extended from the hot junction 7 were fixed to the recessed part 3 via the adhesive material 6 in the state raised up with respect to the hot junction 7, as shown in FIG. After the strands 4 and 5 extending from the hot junction 7 are aligned with the bottom surface 10B of the recess 3, the wire is once returned to the hot junction 7 side and then raised upward, thereby further improving the accuracy of the temperature detection value. It may be possible to improve.
[0015]
As shown in FIGS. 7A and 7B, a hot junction 7 may be disposed in the recessed portion 11. That is, the bottom portion 11A of the recessed portion 11 forms a recessed portion 11 that falls below the bottom surface 10B of the recessed portion, and the hot junction 7 is inserted into the recessed portion 11, thereby increasing the wiring path length L of the thermocouple. In addition, the hot junction 7 is prevented from moving unexpectedly. In the figure, the size of the recessed portion 11 is exaggeratedly expressed in the vertical direction, the left-right direction, and the front-rear (depth) direction so that the hot junction 7 can easily enter. By setting a slightly larger value, positioning of the hot junction 7 with respect to the recessed portion 11 can be performed more reliably. In the figure, the shape of the bottom 11A of the recessed portion 11 is formed in a substantially triangular shape, but it may be a semicircular shape into which the hot junction 7 is fitted, and the shape of the bottom 11A may be any shape. In the drawing, the diameter of the hot junction 7 is larger than the diameter of the wire 4 or 5, but it may be the same size.
[0016]
【The invention's effect】
According to the first aspect, the adhesive material from the concave portion of the plate-like body can be obtained simply by forming the concave portion protruding outward from the lip at the upper end opening of the concave portion at one or a plurality of locations on the side surface of the concave portion. Can be prevented from rotating, and the adhesive material can be reliably prevented from rotating with respect to the concave portion of the plate-like body, and contact with the adhesive material integrated with the thermocouple temperature detection section. By increasing the area and improving the heat conduction from the wafer to the adhesive material, there is no trouble such as disconnection as in the past, and the accuracy of the detection temperature can be improved, so it can be used well over a long period of time. It is possible to provide a temperature measuring apparatus that can
[0017]
According to claim 4 , when a material having a coefficient of thermal expansion that is the same as or substantially the same as that of the plate-like body is used as the adhesive material, even when a material having a different coefficient of thermal expansion is used, In comparison, since the gap between the recess and the adhesive material can be reduced, the error between the temperature transmitted to the plate-like body and the temperature transmitted from the plate-like body to the adhesive material can be reduced. This can further improve the accuracy of the detected temperature.
[0018]
According to the third aspect, the concave portion is formed so that the bottom portion of the concave portion is positioned below the bottom surface of the concave portion, and the temperature detecting portion of the thermocouple is disposed in the concave portion. The length of the wiring path can be increased to improve the accuracy of detection and measurement as a temperature measuring device. In addition, since the thermocouple temperature detection unit can be positioned in the recessed portion, the thermocouple temperature detection unit does not move unexpectedly, facilitating the assembly work of the thermocouple and high product perfection. Can be planned.
[0019]
According to claim 5 , the first cutting step of cutting from the direction perpendicular to the surface of the plate-like body, and the vertical line with respect to the surface of the plate-like body after the first cutting step is set. By forming a recess for inserting the temperature detection part of the thermocouple into the plate-like body from the second cutting step of cutting the angle-inclined direction to form the recessed portion, the angle with respect to the plate-like body is Since it is only necessary to consider only the depth to be cut as it is, the concave portion having a complicated shape having a concave portion protruding outward from the lip at the upper end opening of the concave portion as shown in FIG. Compared to the case of cutting all at once while controlling the position of the tip of the cutting blade, it is possible to cut a desired recess easily and quickly, and a plate-shaped recess formation method that is particularly advantageous for mass production etc. Can be provided.
[Brief description of the drawings]
1A is a longitudinal side view of a temperature measuring device, and FIG. 1B is a plan view of the temperature measuring device. FIG. 2A is a view in which a recess is cut from a direction perpendicular to the surface of a plate-like body. A vertical side view of the plate-like body showing the state, (B) is a plate-like body showing the state in which the recessed portion is cut from a direction inclined at a set angle with respect to a vertical line with respect to the surface of the plate-like body from the state of (A) Fig. 3 is a vertical side view showing another form of the thermocouple. Fig. 4 is a vertical side view showing another form of the temperature measuring device. (B) is a plan view of (a); (b) is a longitudinal side view of a plate-like body showing another form; (B) is a plan view of (A). [FIG. 7] (A) is a vertical side view of a temperature measuring device showing a state where a hot junction is arranged in a recessed portion, and (B) is shown in (A). Plan view of the degree measuring apparatus [Description of Reference Numerals] longitudinal side sectional view showing another conventional form of a conventional vertical cross sectional side view of the embodiment 9 the temperature measuring device 8 the temperature measuring device
1 Temperature measuring device 2 Plate body (wafer)
3 Concave parts 4,5 Wire 6 Adhesive material 7 Hot junction (temperature detection part)
8 Sheath 9 Magnesia
10 First recess 10A Mouth
10B Bottom 11 Recessed part
11A bottom
20,21 Wire 22 Hot junction
23 Recess 23A Mouth
23B Side 23C Bottom
23T Protruding groove
24 Adhesive material 25 Plate (wafer)
L Length of wiring path

Claims (5)

A plate formed by forming a bottomed recess for embedding a thermocouple temperature detection part in a plate-like body, filling the adhesive with the thermocouple temperature detection part inserted in the recess, and solidifying In the temperature measuring device for a body, a recessed portion extending outward from the lip at the upper end opening of the recessed portion is provided in one or a plurality of locations, rather than extending over the entire circumferential direction of the side surface of the recessed portion. A plate-like temperature measuring device, also having a bottom . The said recessed part is formed so that the bottom part of this recessed part may be located below rather than the bottom face of the said recessed part extended toward an outward diagonally downward side from the said one direction place or several places. Temperature measuring device for plate. The plate-shaped body temperature measuring device according to claim 1 or 2, wherein a temperature detecting unit of the thermocouple is disposed in the recessed portion. The plate-like temperature measuring device according to any one of claims 1 to 3, wherein the adhesive material is made of a material having the same or substantially the same thermal expansion coefficient as that of the plate-like body. A first cutting step of cutting from a direction perpendicular to the surface of the plate-like body, and a cutting operation from a direction inclined by a set angle with respect to a vertical line with respect to the surface of the plate-like body after the completion of the first cutting step The temperature according to any one of claims 1 to 4, wherein a concave portion for embedding a temperature detecting portion of a thermocouple is formed in the plate-like body from the second cutting step for forming the concave portion. A method for forming a recess in a measuring device .

Images