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JP3588873B2 - Printed board - Google Patents
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JP3588873B2 - Printed board - Google Patents

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Publication number
JP3588873B2
JP3588873B2 JP25270395A JP25270395A JP3588873B2 JP 3588873 B2 JP3588873 B2 JP 3588873B2 JP 25270395 A JP25270395 A JP 25270395A JP 25270395 A JP25270395 A JP 25270395A JP 3588873 B2 JP3588873 B2 JP 3588873B2
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JP
Japan
Prior art keywords
printed circuit
circuit board
board
connector
individual
Prior art date
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Expired - Fee Related
Application number
JP25270395A
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Japanese (ja)
Other versions
JPH0997960A (en
Inventor
敬人 上島
正則 小川
斡次 南岡
尚英 佃
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP25270395A priority Critical patent/JP3588873B2/en
Priority to MYPI96004018A priority patent/MY126639A/en
Publication of JPH0997960A publication Critical patent/JPH0997960A/en
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Publication of JP3588873B2 publication Critical patent/JP3588873B2/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

【0001】
【産業上の利用分野】
本発明は、電子制御装置の信頼性を向上することのできるプリント基板に関するものである。
【0002】
【従来の技術】
従来の集合プリント基板は、原板から金型で打ち抜くことにより、部品挿入穴と、ミシン目と、スリットをつけて複数の個別プリント基板を接続、一枚化していた。この集合プリント基板にプンリト基板間接続用のボードtoボードコネクタを搭載した場合、電子制御装置としての製造時に、コネクタの接続信頼性を低下させる可能性があった。
【0003】
【発明が解決しようとする課題】
プリント基板同士をリード線を介することなく直接接続することのできるボードtoボードコネクタを搭載する電子制御装置において、前記ボードtoボードコネクタの接続端子部はプリント基板取り付け面より側面に突出したオーバーハング形状となっている。こ
のコネクタを実装する複数の、個別プリント基板と異種の個別プリント基板をミシン目とスリットにて接続し、一枚化した集合プリント基板において、前記コネクタの配置により、前記集合プリント基板の、電子制御装置としての製造の際、部品の搭載後、はんだ付け装置でのはんだ付け時に塗布されるフラックスが前記スリットを抜け、前記コネクタの接続端子部へ飛散し、付着する可能性がある。この時、フラックス含有の塩素分による端子の劣化や、固形成分による接触抵抗の増加等、接続信頼性の低下を発生し得るという課題があった。また、フラックス飛散防止のため、一枚化した集合プリント基板の一部をプッシュバック工法にて嵌戻す際のストレスにより、プリント基板に歪や、反りが発生するという課題があった。この課題解決のための従来技術として特開平3−60091号公報があるがこの従来技術においては嵌戻すプリント基板の周辺にストレス吸収のためのスリットを設ける必要がある。すなわち、スリットを設けるための余分なプリント基板および、そのスペースを必要とし、当然スリットの周辺には回路パターンを設定できないという規制があるなどの課題がある。また、集合プリント基板の一部をプッシュバック工法による嵌合接続した場合、インサートマシンによる部品挿入ストレスなどのストレスに対し、個別プリント基板同士の接続強度が低下する課題があった。また、集合プリント基板を個別プリント基板に分割する時に発生する、ミシン目のバリによりボードtoボードコネクタによるプリント基板間の接続に支障が発生する可能性があるため、バリをカットするなど工数をかける必要があった。本発明は上記の課題を解決するもので、ボードtoボードコ ネクタを実装する個別プリント基板と異種の個別プリント基板を一枚化する際、一枚化した個別プリント基板間を接続するミシン目間の、スリット部分を嵌戻したものである。また、個別プリント基板と隣接する異種の個別プリント基板間をミシン目のないスリットにより分離形成し、前記スリットのうち前記コネクタの接続端子部の下部において、少なくともコネクタ幅以上の長さにわたってスリット部分をプッシュバック工法にて、嵌戻ししたものである。
【0004】
【課題を解決するための手段】
上記課題を解決するために本発明は、複数の個別プリント基板と異種の個別プリント基板を一枚化した集合プリント基板においてボードtoボードコネクタを実装する個別プリント基板と異種の個別プリント基板の接続ミシン目とスリットにおいて、ボードtoボードコネクタの端子部下部に位置するミシン目間のスリット部分をプッシュバック工法にて嵌戻したものである。また本発明は、上記コネクタを実装する個別プリント基板と隣接する異種の個別プリント基板間をミシン目のないスリットにより分離形成し、前記スリットのうち、前記ボードtoボードコネクタの接続端子部下部において少なくともコネクタ幅以上の長さにわたってプッシュバック工法により嵌戻したものである。
【0005】
【作用】
本発明は、本構成によってプリント基板同士をリード線を介さず直接に接続するボードtoボードコネクタを搭載する電子制御装置の製造過程において、ボードtoボードコネクタの接続端子へフラックスが飛散し、付着することを防止し、かつプッシュバック工法にて、集合プリント基板の一部を嵌戻す際のストレスにより発生する集合プリント基板の歪、反りを軽減し、かつ集合プリント基板の一枚化の強度を向上し、電子制御装置としての製造過程でインサートマシンの部品挿入ストレス等により発生し得る、嵌戻したプリント基板のはずれ・ミシン目の割れ等を防止し、かつミシン目を割る際に発生するバリをカットする工数を削減することができる。
【0006】
【実施例】
以下本発明の第1の実施例について、図面を参照しながら説明する。図5(a)はボードtoボードコネクタを使用して平行接続した場合のプリント基板の接続図である。同図において1は前記コネクタのメス端子側、2は前記コネクタのオス端子側である。3、4はコネクタ1あるいは2を搭載する個別プリント基板である。ここでボードtoボードコ
ネクタ1は、直接コネクタ間を接続するため、接続端子部がプリント基板取り付け面より側面に突出したオーバーハング形状となっている。図5(b)は従来例における一枚化された集合プリント基板の外形図で、図5(c)は従来例におけるコネクタ搭載部分の集合プリント基板断面図である。プリント基板は一定の大きさの原板から金型により打ち抜いて、必要な外形を得、また抵抗、ICなど各種部品を挿入するための穴を開ける。同図は、この様に金型で打ち抜いて得られた集合プリント基板であり、5aはボードtoボードコネクタを実装する個別プリント基板3を一枚化したもの、5bは生産効率向上のため個別プリント基板5aと一枚化された異種の個別プリント基板で、それぞれは金型により打ち抜かれたミシン目とスリットにより接続され、一枚の集合プリント基板5を構成している。ここでコネクタ1の搭載位置は、個別プリント基板5aの端面に配置されているが、そのコネクタ側面に突出した接続端子部分は個別プリント基板5aと5bの接続スリット上に交差している。この様な集合プリント基板の電子制御装置としての製造時において、部品搭載後のはんだ付け時に行われるフラックス塗布の際、フラックスは発泡またはスプレー方式などでプリント基板のはんだ付け面に一様に塗布されるが、この時図5(c)の様に、前記スリット部分からフラックスが飛散しコネクタ1の接続端子部分に付着する可能性がある。フラックスが接触端子に付着した場合、フラックスに含有する塩素分による端子の腐食、あるいは固形分による絶縁により、ボードtoボードコネクタの接続信頼性が低下するという課題があった。
【0007】
図1(a)はプッシュバック工法によるプリント基板の参考例である。同図において、集合プリント基板5は金型により外形、部品挿入穴、および複数の個別プリント基板を接続するミシン目とスリットが打ち抜かれている。ここで、個別プリント基板5bは金型による打ち抜きではなく、プッシュバック工法により嵌戻されている。図1(b)は、コネクタ1の接続端子部下部に位置する個別プリント基板5aと5bの境界部分の断面図である。ここで、前記した様に個別プリント基板5bは嵌合により集合プリント基板本体と接続一枚化されているため、個別プリント基板5aとの間には隙間が存在しない。このことにより、電子制御装置としての製造時におけるフラックス塗布において、個別プリント基板間の隙間からコネクタ端子へのフラックス飛散を防止することができ、従って、フラックスがコネクタ端子へ付着することによる信頼性低下を防止することができる。
【0008】
尚、プッシュバック工法とは、金型にて一度打ち抜いた部分を再度金型にて、打ち抜かれた空間に嵌戻す工法である。
【0009】
さらに図2を用いて、別のプリント基板の参考例を説明する。前のプリント基板の参考例において、嵌戻される個別プリント基板5bの全周端面は、個別プリント基板5aおよび、外形を整えるための捨て基板5cと嵌合接触している。この様な構成において、個別プリント基板5bを嵌戻す際、いったん打ち抜いたものを集合プリント基板本体へ押し込んで嵌合させるため、前記集合プリント基板本体5へストレスがかかり、その結果集合プリント基板5全体に歪や反りが発生する可能性がある。この様な歪や反りは、部品挿入穴の相対的位置ずれや、反りの中心にはんだが付かないなど電子制御装置製造の際に不具合を生じるものである。図2(a)は、本発明におけるプリント基板の外形図である。本図において、個別プリント基板5bは、プッシュバック工法にて嵌戻されるが、個別プリント基板5aと捨て基板5cとの接触部分は全周ではなく、四辺の内二辺はスリット、残り二辺の内ボードtoボードコネクタ1を実装する個別プリント基板5a側は、コネクタ1の接続端子部へのフラックス飛散を防止するに必要な部分のみ嵌合接触され、その対向する一辺はコネクタ側と相対する様にスリットを設け、残りを嵌合接続している。以上のように、接続部分を必要最小限とすることにより、同図ab方向の嵌戻しストレスはスリットにより、同図cd方向の嵌戻しストレスは、部分接続により分散される。このことにより、嵌戻しの際のプリント基板の歪や反りを、軽減することができる。
【0010】
次に本発明の第1の実施例について図3を用いて説明する。前記のプリント基板例では、集合プリント基板を構成する個別プリント基板の一部をプッシュバック工法にて嵌戻し、嵌合にて接続していた。一方、電子制御装置の製造においては、インサートマシンによる部品挿入ストレスやコンベアー移動時の振動がプリント基板に印加される。この様な状況下では、個別プリント基板同士を接続する嵌合力では耐えきれず、前記ストレスにより嵌戻された個別プリント基板の抜けや接続ミシン目の割れ等が発生し、集合プリント基板の構成を保つことができない可能性がある。図3は本発明により一枚化された個別プリント基板5aと5bの接続境界を拡大した図である。それぞれの個別プリント基板は金型で打ち抜かれて形成されたミシン目とスリットにより接続されている。さらにプッシュバック工法により、通常捨て去られるスリット部分を嵌戻している。嵌戻されるスリットは、コネクタ1の接続端子部下部に設けており、フラックス飛散防止と共に、ミシン目による、個別プリント基板同士の接続強度を向上し製造時のストレスに十分耐え得ることができる。
【0011】
さらに第2の実施例を図4を用いて説明する。図5(a)で説明した様に、本発明はプリント基板同士を直接、接続するボードtoボードコネクタを使用する電子制御装置のプリント基板に関するものである。その特徴として、直接接続であるためコネクタ1、2の配置により、プリント基板の端面間にはコネクタの嵌合距離にて規制される隙間が必要となる。ここで、第1の実施例において、個別プリント基板5aと5bはミシン目により接続されているが、この集合プリント基板を個別プリント基板に分割する際、ミシン目の割れ方によっては、大きなバリが発生し得る。このバリは、前記したコネクタ嵌合時に規制される、隙間以下にする必要があり、従って個別プリント基板への分割後、バリのカットなど、後処理の必要があり、工数の増加という課題があった。また、ミシン目間の閉じたスリットの空間を嵌戻すため、嵌合ストレスによるプリント基板の歪を生じる可能性があった。図4は、本発明における、個別プリント基板5aと5bの接続部分の拡大図である。本図において、個別プリント基板同士を接続する境界端面部分はミシン目なしのスリットで分離形成しており、前記スリットの中でもコネクタ端子へのフラックス飛散防止に必要な部分である、少なくともコネクタ1の長さ以上のスリット部分をプッシュバック工法にて嵌戻している。この様な構成では、ミシン目を設けていないため、個別プリント基板への分割時にバリの発生はなく、従ってバリ取りの工数が削減できる。また、ミシン目による閉じられた空間の規制がなく、従って嵌戻す際の、ab方向ストレスが分散されるため、スリットを嵌戻す際に発生し得るプリント基板の歪が緩和することができる。
【0012】
【発明の効果】
上記説明より明らかなように本発明は、プリント基板に部品の搭載後、はんだ付け装置でのはんだ付け前に塗布されるフラックスが、一枚化された個別プリント基板間のスリットを抜け、プリント基板同士を直接接続可能で、その接続端子部分が側面に突出するオーバーハング形状のボードtoボードコネクタの接続端子部へ飛散し、付着することを防止することができる。
【0013】
また、本発明はプッシュバック工法にて嵌戻す際のストレスにより発生する、集合プリント基板の歪や、反りを軽減することができると共に、従来技術において歪防止のためのスリット設置に伴う、余分なプリント基板の発生あるいはパターン設計上の規制などの課題を緩和することができる。
【0014】
また、本発明は嵌合接続により一枚化された集合プリント基板において、インサートマシンによる部品挿入ストレスなどのストレスに対し、個別プリント基板同士を接続する強度を向上することができる。
【0015】
また、本発明は集合プリント基板を複数の個別プリント基板に分割する時に発生する、
ミシン目のバリをカットする工数を削減できると同時に、スリットを嵌戻す際に発生し得るプリント基板の歪を緩和することができるなど優れた効果を有するものである。
【0016】
尚、本発明はコネクタを対象として行ったが、スイッチなど接点を有する機構部品など、フラックスの付着がその部品の信頼性に影響する可能性のある部品を搭載するプリント基板についても同様の効果を有する。
【0017】
また、本発明のプリント基板を生産にあたり、抜き金型による部品挿入穴と、ミシン目での個別プリント基板接続、およびプッシュバック金型による個別プリント基板の嵌戻しの混在工法により外部ストレスに強く、且つ効率的に生産することができる。また、抜き金型とプッシュバック金型を1つの金型に実現することで本発明のプリント基板を少ない工数でさらに効率的に生産することができる。
【図面の簡単な説明】
【図1】(a)プッシュバック工法を使用したプリント基板参考例の外形図
(b)プッシュバック工法を使用したプリント基板参考例の断面図
【図2】プッシュバック工法を使用したプリント基板参考例の外形図
【図3】本発明の第1の実施例によるプリント基板の接続部位図
【図4】本発明の第2の実施例によるプリント基板の接続部部位図
【図5】(a)本発明が対象とする電子制御装置図
(b)従来例によるプリント基板外形図
(c)従来例によるプリント基板の断面図
【符号の説明】
1 ボードtoボードコネクタのメス側
2 ボードtoボードコネクタのオス側
3 コネクタ1が搭載される電子制御装置
4 コネクタ2が搭載される電子制御装置
5 一枚化されたプリント基板
5a ボードtoボードコネクタを実装する個別プリント基板
5b 個別プリント基板5aと接続する異種の個別プリント基板
5c 外形整形のため接続される捨て基板
[0001]
[Industrial applications]
The present invention relates to a printed circuit board that can improve the reliability of an electronic control device.
[0002]
[Prior art]
A conventional collective printed circuit board has been punched out of a base plate with a mold to connect and integrate a plurality of individual printed circuit boards with component insertion holes, perforations, and slits. When a board-to-board connector for connection between punlit boards is mounted on the collective printed circuit board, there is a possibility that the connection reliability of the connector may be reduced during manufacture of the electronic control device.
[0003]
[Problems to be solved by the invention]
In an electronic control device equipped with a board-to-board connector capable of directly connecting printed circuit boards to each other without using a lead wire, the connection terminal portion of the board-to-board connector has an overhang shape projecting to the side from the printed circuit board mounting surface. It has become. A plurality of individual printed boards and different kinds of individual printed boards on which this connector is mounted are connected by perforations and slits, and in a single integrated printed board, the arrangement of the connectors allows electronic control of the integrated printed board. During manufacturing as a device, there is a possibility that a flux applied at the time of soldering with a soldering device after mounting the components passes through the slit, scatters and attaches to the connection terminal portion of the connector. At this time, there has been a problem that the connection reliability may be reduced, such as deterioration of the terminal due to chlorine contained in the flux and increase in contact resistance due to solid components. Further, in order to prevent the scattering of the flux, there is a problem in that the printed circuit board is distorted or warped due to stress when a part of the integrated printed circuit board is fitted back by the pushback method. As a prior art for solving this problem, there is Japanese Patent Application Laid-Open No. 3-60091. However, in this prior art, it is necessary to provide a slit for absorbing stress around a printed board to be fitted back. That is, there is a problem that an extra printed board for providing a slit and a space for the extra printed board are required, and there is a restriction that a circuit pattern cannot be set around the slit. Further, when a part of the collective printed circuit board is fitted and connected by the pushback method, there is a problem that the connection strength between the individual printed circuit boards is reduced due to stress such as component insertion stress by an insert machine. Further, since there is a possibility that the connection between the printed boards by the board-to-board connector may be hindered by the perforation burrs generated when the collective printed board is divided into the individual printed boards, it takes time to cut the burrs. Needed. The present invention has been made to solve the above problems, when one of the individual printed circuit board of the individual printed circuit board and a heterologous implementing the board to Bodoko connector, between perforations for connecting between the individual printed circuit board that is one of , And the slit portion is fitted back. Further, an individual printed circuit board and a different type of individual printed circuit board adjacent thereto are separately formed by a slit without perforations, and a slit portion is formed at least over a length of at least a connector width in a lower portion of the connection terminal portion of the connector. It has been fitted back by the pushback method.
[0004]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, the present invention provides a connection sewing machine for connecting an individual printed board on which a board-to-board connector is mounted and a different individual printed board to a collective printed board in which a plurality of individual printed boards and different individual printed boards are integrated. In the eye and the slit, the slit portion between the perforations located below the terminal portion of the board-to-board connector is fitted back by the pushback method. Further, according to the present invention, an individual printed circuit board on which the connector is mounted and a different type of individual printed circuit board adjacent to each other are separated and formed by slits without perforations, and at least a portion of the slits below a connection terminal portion of the board-to-board connector. It is fitted back by the pushback method over the length of the connector.
[0005]
[Action]
According to the present invention, in the manufacturing process of an electronic control device equipped with a board-to-board connector that directly connects printed circuit boards without using lead wires by this configuration, the flux scatters and adheres to the connection terminals of the board-to-board connector. And reduce the distortion and warpage of the collective printed circuit board caused by the stress when fitting back a part of the collective printed circuit board by the pushback method, and improve the strength of the integrated printed circuit board in one sheet In addition, in the manufacturing process of the electronic control device, it is possible to prevent detachment of the fitted printed circuit board, cracking of the perforation, etc., which can occur due to stress of parts insertion of the insert machine, and to prevent burrs generated when breaking the perforation. The number of steps for cutting can be reduced.
[0006]
【Example】
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. FIG. 5A is a connection diagram of a printed circuit board when parallel connection is performed using a board-to-board connector. In the figure, 1 is a female terminal side of the connector, and 2 is a male terminal side of the connector. Reference numerals 3 and 4 denote individual printed circuit boards on which the connector 1 or 2 is mounted. Here, the board-to-board connector 1 has an overhang shape in which connection terminals protrude to the side from the printed circuit board mounting surface in order to directly connect the connectors. FIG. 5B is an external view of a unitary printed circuit board in a conventional example, and FIG. 5C is a sectional view of the connector mounted portion in the conventional example. The printed circuit board is punched out from an original plate having a predetermined size by a mold to obtain a necessary external shape, and holes are formed for inserting various components such as a resistor and an IC. The figure shows a collective printed circuit board obtained by punching with a mold in this way. 5a is a single printed circuit board 3 on which a board-to-board connector is mounted. 5b is an individual printed circuit board for improving production efficiency. The printed circuit board 5a is made of one type of individual printed circuit board, and is connected to each other by a perforation punched by a die and a slit, thereby forming one collective printed circuit board 5. Here, the mounting position of the connector 1 is arranged on the end face of the individual printed circuit board 5a, and the connection terminal portion protruding from the connector side surface intersects the connection slit of the individual printed circuit boards 5a and 5b. When manufacturing such an integrated printed circuit board as an electronic control unit, the flux is applied uniformly to the soldering surface of the printed circuit board by foaming or spraying when the flux is applied at the time of soldering after mounting components. However, at this time, as shown in FIG. 5C, there is a possibility that the flux scatters from the slit portion and adheres to the connection terminal portion of the connector 1. When the flux adheres to the contact terminal, there is a problem that the connection reliability of the board-to-board connector is reduced due to corrosion of the terminal due to chlorine contained in the flux or insulation due to solid content.
[0007]
FIG. 1A is a reference example of a printed circuit board by a pushback method . In the drawing, the collective printed circuit board 5 is punched by a metal mold with an outer shape, component insertion holes, and perforations and slits for connecting a plurality of individual printed circuit boards. Here, the individual printed circuit board 5b is fitted back by a pushback method, not by punching with a die. FIG. 1B is a cross-sectional view of a boundary portion between the individual printed circuit boards 5 a and 5 b located below the connection terminal portion of the connector 1. Here, as described above, since the individual printed circuit board 5b is connected to the collective printed circuit board main body by fitting, the gap is not present between the individual printed circuit board 5a and the individual printed circuit board 5a. As a result, during the application of the flux during the manufacturing of the electronic control device, it is possible to prevent the scattering of the flux to the connector terminals from the gaps between the individual printed circuit boards, and therefore the reliability is reduced due to the flux adhering to the connector terminals. Can be prevented.
[0008]
In addition, the pushback method is a method in which a part once punched by a mold is fitted back into a punched space by a mold again.
[0009]
Further, a reference example of another printed circuit board will be described with reference to FIG. In the reference example of the previous printed circuit board, the entire peripheral end face of the individual printed circuit board 5b to be fitted back is in contact with the individual printed circuit board 5a and the discarded board 5c for adjusting the outer shape. In such a configuration, when the individual printed circuit board 5b is fitted back, the once-punched one is pushed into the collective printed circuit board main body to be fitted, so that stress is applied to the collective printed circuit board body 5, and as a result, the entire collective printed circuit board 5 May be distorted or warped. Such distortions and warpages cause problems in the production of electronic control devices, such as relative displacement of the component insertion holes and no solder at the center of the warp. FIG. 2A is an external view of a printed circuit board according to the present invention. In this drawing, the individual printed circuit board 5b is fitted back by the pushback method, but the contact portion between the individual printed circuit board 5a and the discarded substrate 5c is not the entire circumference, two of the four sides are slits, and the remaining two sides are slits. On the side of the individual printed circuit board 5a on which the inner board-to-board connector 1 is mounted, only a portion necessary to prevent the scattering of the flux to the connection terminal portion of the connector 1 is fitted and contacted. Are provided with slits, and the rest are fitted and connected. As described above, by minimizing the connection portion, the fitting-back stress in the ab direction in the drawing is distributed by the slit, and the fitting-back stress in the cd direction in the drawing is dispersed by the partial connection. Thereby, distortion and warpage of the printed circuit board at the time of fitting can be reduced.
[0010]
Next, a first embodiment of the present invention will be described with reference to FIG. In the above-described example of the printed circuit board, a part of the individual printed circuit boards constituting the collective printed circuit board is fitted back by the pushback method and connected by fitting. On the other hand, in the manufacture of an electronic control device, a component insertion stress by an insert machine and a vibration at the time of moving a conveyor are applied to a printed circuit board. In such a situation, the fitting force for connecting the individual printed circuit boards cannot withstand the individual printed circuit boards, and the separated printed circuit boards that have been fitted back due to the stress may be disconnected or the connection perforations may be cracked. May not be able to keep. FIG. 3 is an enlarged view of the connection boundary between the individual printed circuit boards 5a and 5b integrated by the present invention. Each individual printed circuit board is connected to a perforation formed by punching with a die and a slit. Further, the slit portion which is usually discarded is fitted back by the pushback method. The slit to be fitted back is provided below the connection terminal portion of the connector 1 to prevent the scattering of the flux, improve the connection strength between the individual printed circuit boards due to perforations, and sufficiently withstand the stress during manufacturing.
[0011]
Further, a second embodiment will be described with reference to FIG. As described with reference to FIG. 5A, the present invention relates to a printed circuit board of an electronic control device using a board-to-board connector for directly connecting printed circuit boards. As a feature, because of direct connection, a gap is required between the end faces of the printed circuit board, which is regulated by the fitting distance of the connector, due to the arrangement of the connectors 1 and 2. Here, in the first embodiment, the individual printed boards 5a and 5b are connected by perforations. However, when dividing the collective printed board into individual printed boards, large burrs may be formed depending on how the perforations are broken. Can occur. The burrs need to be smaller than the gap, which is regulated at the time of the connector fitting described above. Therefore, after division into individual printed circuit boards, post-processing such as cutting of burrs is required, and there is a problem of an increase in man-hours. Was. Further, since the space of the closed slit between the perforations is fitted back, there is a possibility that the printed circuit board may be distorted due to the fitting stress. FIG. 4 is an enlarged view of a connection portion between the individual printed circuit boards 5a and 5b in the present invention. In this drawing, a boundary end face portion connecting the individual printed circuit boards is formed separately by a slit without perforations, and at least the length of the connector 1 which is a portion of the slit necessary for preventing the flux from scattering to the connector terminal. The slits above this are fitted back by the pushback method. In such a configuration, since no perforation is provided, no burrs are generated at the time of division into individual printed circuit boards, and thus the number of steps for deburring can be reduced. In addition, since the closed space is not regulated by the perforation, and the stress in the ab direction at the time of refitting is dispersed, the distortion of the printed circuit board that may occur when the slit is refitted can be reduced.
[0012]
【The invention's effect】
As is clear from the above description, according to the present invention, after the components are mounted on the printed circuit board, the flux applied before the soldering by the soldering device passes through the slit between the individual printed circuit boards, and The connection terminals can be directly connected to each other, and the connection terminal portions can be prevented from scattering and adhering to the connection terminal portions of the overhang-shaped board-to-board connector projecting from the side surface.
[0013]
In addition, the present invention can reduce the distortion and warpage of the collective printed circuit board caused by the stress at the time of fitting back by the pushback method, and in the prior art, due to the slit installation for preventing distortion, Issues such as generation of a printed circuit board or regulation on pattern design can be eased.
[0014]
Further, according to the present invention, in a collective printed circuit board integrated by fitting connection, the strength of connecting the individual printed circuit boards to a stress such as a component insertion stress by an insert machine can be improved.
[0015]
Further, the present invention occurs when the collective printed circuit board is divided into a plurality of individual printed circuit boards,
This has excellent effects such as reducing the number of steps for cutting perforated burrs and reducing the distortion of the printed circuit board that may occur when the slit is fitted back.
[0016]
Although the present invention has been applied to a connector, the same effect can be obtained for a printed circuit board on which a component such as a mechanical component having a contact point such as a switch may have an influence on the reliability of the component due to the adhesion of flux. Have.
[0017]
Also, in producing the printed circuit board of the present invention, a component insertion hole by a punching die, an individual printed circuit board connection at a perforation, and a mixed method of fitting back an individual printed circuit board by a pushback die, are resistant to external stress, And it can be produced efficiently. In addition, by realizing the punching die and the pushback die in one die, the printed circuit board of the present invention can be more efficiently produced with a small number of steps.
[Brief description of the drawings]
[1] (a) Outline drawing (b) cross-sectional view of the printed circuit board reference example using the pushback method [2] PCB reference example using the pushback method of the printed circuit board reference example using the pushback method the first connection portion view of a printed board according to an embodiment of the connecting portions site view of the printed circuit board according to a second embodiment of the invention, FIG 5 (a) present in the outline drawing Figure 3 the present invention (B) Outline view of printed circuit board according to conventional example (c) Cross-sectional view of printed circuit board according to conventional example [Description of References]
Reference Signs List 1 Female side of board-to-board connector 2 Male side of board-to-board connector 3 Electronic control unit 4 mounted with connector 1 Electronic control unit 5 mounted with connector 2 Integrated printed circuit board 5a Board-to-board connector Individual printed circuit board 5b to be mounted Different kind of individual printed circuit board 5c connected to individual printed circuit board 5a Discarded board connected for external shape shaping

Claims (2)

接続端子部がプリント基板取り付け面よりオーバーハングした形状のボードtoボードコネクタを実装する個別プリント基板と異種の個別プリント基板とをミシン目およびスリットにて接続一枚化した集合プリント基板において、前記個別プリント基板に実装されるボードtoボードコネクタの接続端子部の下部に位置する、個別プリント基板と異種の個別プリント基板を接続するミシン目間のスリット部分を、プッシュバック工法にて嵌戻すことを特徴とするプリント基板。 In a collective printed circuit board in which an individual printed circuit board for mounting a board-to-board connector having a shape in which a connection terminal portion is overhanged from a printed circuit board mounting surface and a different kind of individual printed circuit board are connected by a perforation and a slit, The slit portion between the perforations connecting the individual printed circuit board and the different individual printed circuit board, which is located below the connection terminal portion of the board-to-board connector mounted on the printed circuit board, is fitted back by a pushback method. And printed circuit board. 上記コネクタを実装する個別のプリント基板と異種の個別プリント基板をミシン目およびスリットにて接続一枚化した集合プリント基板において、ボードtoボードコネクタを実装する個別プリント基板と隣接する、異種の個別プリント基板間の少なくとも一辺をミシン目のないスリットにより分離形成し、前記スリットの内、前記ボードtoボードコネクタの接続端子部の下部で、少なくともコネクタ幅以上の長さにわたってスリット部分をプッシュバック工法にて、嵌戻すことを特徴とした請求項1記載のプリント基板。In a collective printed circuit board in which the individual printed circuit board on which the connector is mounted and a different type of individual printed circuit board are connected by perforations and slits, a different type of individual printed board adjacent to the individual printed circuit board on which the board-to-board connector is mounted At least one side between the substrates is separated and formed by a slit without perforations, and a slit portion of the slit is formed by a pushback method over a length at least equal to or greater than the connector width at a lower portion of the connection terminal portion of the board-to-board connector. The printed circuit board according to claim 1 , wherein the printed circuit board is fitted back.
JP25270395A 1995-09-29 1995-09-29 Printed board Expired - Fee Related JP3588873B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP25270395A JP3588873B2 (en) 1995-09-29 1995-09-29 Printed board
MYPI96004018A MY126639A (en) 1995-09-29 1996-09-27 Printed circuit board aggregate.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25270395A JP3588873B2 (en) 1995-09-29 1995-09-29 Printed board

Publications (2)

Publication Number Publication Date
JPH0997960A JPH0997960A (en) 1997-04-08
JP3588873B2 true JP3588873B2 (en) 2004-11-17

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JP (1) JP3588873B2 (en)
MY (1) MY126639A (en)

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JP5052290B2 (en) * 2007-10-26 2012-10-17 京セラ株式会社 Manufacturing method of circuit board with metal fittings
JP2014197621A (en) * 2013-03-29 2014-10-16 東洋電装株式会社 Hall ic substrate, method of manufacturing hall ic substrate

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MY126639A (en) 2006-10-31

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