JP3129174B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting a chip on a substrate such as a liquid crystal panel using an anisotropic conductor.

[0002]

2. Description of the Related Art In recent years, in mounting a chip on a substrate such as a liquid crystal panel, an electronic component mounting apparatus using an anisotropic conductor has been put to practical use.

By the way, in a conventional electronic component mounting apparatus,
A first device for attaching an anisotropic conductor to a substrate; and a second device for mounting a chip on the substrate to which the anisotropic conductor is attached by the first device. Each of the first device and the second device was assigned a unique installation space.

[0004]

However, the electronic component mounting apparatus is, for example, like a clean room.
Since the electronic component mounting apparatus is installed in a facility where the unit price of the installation space is high, the conventional electronic component mounting apparatus has a problem that the installation space becomes large.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that can save installation space.

[0006]

An electronic component mounting apparatus according to the present invention comprises a plurality of mounting heads for holding chips and mounting the chips on a substrate, and the mounting heads set up a pickup station for picking up the chips. The mounting head where the mounting head mounts the chip on the substrate is set at a position away from the pickup station, and a table is provided for reciprocating the mounting head between the pickup station and the mounting station. set the pasting station pasting an anisotropic conductor in a chip picked up by the mounting head, the attachment stay
Anisotropic conductive adhesive bonded to a leader tape
The body is pressed and attached to the chip held by the mounting head.
Then remove the anisotropic conductor from the leader tape.
And sea urchin.

Further, in the electronic component mounting method of the present invention, the step of holding the chip on the mounting head at the pickup station, the step of moving the mounting head holding the chip to the attaching station, and the heat of the heater built in the mounting head are performed. Glue the leader tape to the chip while adding it to the chip
A step of pasting crimp the anisotropic conductive,
Peeling the anisotropic conductor from the leader tape; and moving the mounting head to the mounting station and bonding the anisotropic conductor attached to the chip to the electrode of the substrate.

[0008]

According to the first aspect of the present invention, a pick-up station,
A sticking station and a mounting station are set, and a plurality of mounting heads reciprocate between these stations. Then, in a single electronic component mounting apparatus, pickup of the chip, attachment of the anisotropic conductor to the chip, and mounting of the chip to which the anisotropic conductive band is attached are performed. As described above, since necessary steps can be performed in a single electronic component mounting apparatus, installation space can be saved as compared with a conventional electronic component mounting apparatus.

According to the second aspect of the present invention, the mounting head for mounting the chip on the substrate can also serve the function of attaching the anisotropic conductor to the chip. The two processes performed by the device of
It can be completed during a series of operations from chip pickup to mounting.

Next, an embodiment of the present invention will be described with reference to the drawings. (First Embodiment) FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a horizontal base, and 2 denotes a substrate positioning unit provided at the front of the base 1.

In the substrate positioning section 2, 3 and 4 are arms that move in the X direction by an arm moving shaft 5 that is long in the X direction. The arms 3 and 4 support the lower surface of the substrate 6 and 6 can be transferred.

In the present embodiment, a liquid crystal panel is used as the substrate 6, and a second chip P2 is mounted on the first side A and the third side C of the substrate 6, and a first chip P1 is mounted on the second side B. Is to be implemented. And these first chips P
The first and second chips P2 are flip chips having bumps on the lower surface.

Reference numeral 7 denotes a holder for holding the center of the lower surface of the substrate 6, 8 denotes a θ table for rotating the holder 7 in the θ direction, 9 denotes an X table for moving the θ table 8 in the X direction, and 10 denotes a base. This is a Y table provided on the table 1 to move the X table 9 in the Y direction. These θ tables 8, X
By driving the table 9 and the Y table 10, any one of the first side A, the second side B, and the third side C of the substrate 6 to be mounted next can be positioned at a mounting station described later. it can.

A first chip supply unit 11 for supplying the first chip P1 and a second chip supply unit 12 for supplying the second chip P2 are arranged symmetrically at the rear of the base 1.

In the first chip supply section 11, 13 is a magazine for accommodating the trays 16 in multiple stages, and 14 is a magazine 13
And a claw for taking the tray 16 in and out of the tray holding table 15. On the tray holding table 15, a tray 16 for storing the first chips P1 in a matrix with the bumps facing upward is placed. Also nail 1
4 allows the tray holding table 15 pulled out of the magazine 13 to be moved in the Y direction by the tray Y table 17. Reference numeral 18 denotes a magazine elevating mechanism for elevating the magazine 13.

Similarly to the first chip supply section 11, the second chip supply section 12 includes a magazine 19, a claw 20, a tray holding table 21, a tray 22 for storing the second chip P2, a tray Y table 23, and a magazine elevating mechanism. 24.

Reference numeral 25 denotes a chip reversing unit which rotates in a vertical plane as shown in FIG. On the peripheral surface of the chip reversing part 25, holding heads 25a to 25d protrude radially.

In FIG. 1, reference numerals 26 and 27 denote first and second chips P1 and P2 from trays 16 and 22, respectively.
2 is an extraction head for extracting 2. Take-out heads 26, 27
Are driven by the moving shaft 28 to move in the X direction. The take-out heads 26 and 27 are connected to the tray Y
The first chip P1 or the second chip P2 is taken out of the trays 16 and 22 positioned in the Y direction by the tables 17 and 23, and the holding head 2 of the chip reversing unit 25 is taken out.
The first chip P1 or the second chip P2 that has been taken out is transferred to the currently upward one of 5a to 25d.

Reference numeral 29 denotes a holding head 25 of the chip reversing unit 25.
a to 25d, the first chip P1 or the second chip P2 held at the current downward one is received, and the first chip P1 or the second chip P2 is received by the chuck claw 29a.
It is a pre-center table for positioning the chip P2. The pre-center table 29 is placed on the reciprocating table 30, and the center of the pre-center table 29 reciprocates between directly below the chip reversing unit 25 and the pickup station S1 (solid line and broken line in FIG. 3).

Reference numeral 31 denotes a turntable provided at the center of the base 1. The turntable 31 rotates in a horizontal plane about an axis 32, and is provided on the outer periphery of the turntable 31 at every 90 degrees. The mounting heads 33 to 36 are provided downward. 37 is a first attaching station S
2 is a first conductor supply unit provided on the shaft 32;
Is a second conductor supply unit provided in the second pasting station S3 which is symmetrical to the first pasting station S2 with respect to the first pasting station S2. The configurations of the first conductor supply unit 37 and the second conductor supply unit 38 will be described later in detail.

Now, as shown in FIG.
A cylinder 39 as an elevating mechanism corresponding to the mounting heads 33 to 36 on a one-to-one basis is provided on the upper part of the mounting head 1, and the mounting heads 33 to 36 move up and down independently by driving the cylinder 39. It has become. Reference numeral 40 denotes a lower support for receiving the lower surface of the substrate 6;
Reference numeral 1 denotes a camera for observing the substrate 6 and the first chip P1 or the second chip P2 upward from below at the mounting station S4. Based on the image data obtained by the camera 41, the positioning between the substrate 6 and the first chip P1 or the second chip P2 is performed by control means (not shown).

Next, the configuration of the first conductor supply section 37 will be described. Note that the second conductor supply unit 38 has the same configuration as the first conductor supply unit 37, and thus the description is omitted.

In FIG. 4, reference numeral 43 denotes a vertical support plate for supporting each element of the first conductor supply section 37. A supply reel 44 for winding a leader tape 46 to which an anisotropic conductor 47 is adhered is supported below the support plate 43. Reference numeral 45 denotes a take-up reel for winding the leader tape 46 after the anisotropic conductor 47 has been peeled off. The leader tape 46 is wound on the take-up reel 45 from the supply reel 44 via a vertical guide 48, a guide roller 49, a horizontal guide 50, and a guide roller 51 as indicated by an arrow N1. .

The anisotropic conductor 47 guided to the leader tape 46 maintains a vertical posture while in contact with the vertical guide 48, and the cutter 52 moves in the direction of arrow N2, thereby causing the first chip P1 to move. It is cut at a predetermined length according to the size, and is in the form of a tape. When the cut anisotropic conductor 47 is in contact with the horizontal guide 50, the mounting head 34 descends and is pressed against the bump 42 of the first chip P <b> 1 adsorbed by the mounting head 34, and the anisotropic conductive material 47 is pressed. Affixed to body 47. Here, the mounting heads 33 to 3
6 is the heater H and the first chip P1 or the second chip P
2 is provided. The first chip P1 and the bumps 42 are heated by the heat of the heater H. When the first chip P1 is pressed against the anisotropic conductor 47 as shown in FIG. The anisotropic conductor 47 is transmitted to the anisotropic conductor 47 and adheres to the first chip P1. When the mounting head 33 is raised, the anisotropic conductor 47 is peeled off from the leader tape 46 and rises together with the first chip P1.

Next, an outline of the operation of the electronic component mounting apparatus according to the present embodiment will be described with reference to FIG. Here, it is assumed that the second chip P2 is mounted on the first side A of the substrate 6.

First, the take-out head 27 is driven to drive the tray 2
2 to the top. The tray 22 is a tray Y table 23
Is positioned just below the moving path of the take-out head 27. Then, as shown by the arrow M, the take-out head 2
7 picks up the second chip P2 from the tray 22,
The second chip P2 is transferred to the holding head 25a of the chip reversing unit 25 which is currently facing upward.

Next, when the tip reversing unit 25 rotates and the holding head 25a faces downward, the pre-center table 2
9 reaches directly below the holding head 25a as shown by the solid line in FIG. At this time, the holding force of the holding head 25a is released, and the second chip P2 is dropped between the chuck claws 29a. Then, the chuck claw 29a is closed to position the second chip P2. Then, as shown by the chain line in FIG. 6, the pre-center table 29 chucking the second chip P2 is moved to the pickup station S1, and the chuck claws 29a are moved.
To release the chuck.

At this time, the pickup station S1
It is assumed that the mounting head 33 has arrived. Then, the cylinder 39 is driven to lower the mounting head 33, and the second chip P2 is sucked by the suction path V of the mounting head 33.

Next, the mounting head 33 is moved to the second attaching station S3 via the path L3. And
By the above-described attaching operation, the anisotropic conductor 47 is attached to the lower surface (the surface where the bumps 42 are exposed) of the second chip P2 (FIG. 5A).

When the pasting is completed, via the path L4,
The mounting head 33 is moved to the mounting station S4. At this time, the θ table 8, the X table 9, and the Y table 10 position the first side A of the substrate 6 such that the area to be mounted this time is on the mounting station S4.

Then, as shown in FIG. 5B, the mounting head 33 is lowered at the mounting station S4, and the bump 42 and the electrode 53 on the first side A are sandwiched by the anisotropic conductor 47.
Crimp. At this time, the second chip P2 is formed by the anisotropic conductor 47 by the heat of the heater H built in the mounting head 33.
And the first side A are strongly adhered. Then, when the suction of the suction path V is released and the mounting head 33 is raised, the mounting of the second chip P2 is completed as shown in FIG. 5C. it can.

As described above, according to the electronic component mounting apparatus of the present embodiment, the step of attaching the anisotropic conductor and the step of mounting the chip in the conventional electronic component mounting apparatus are performed within a single electronic component mounting apparatus. And the installation space can be saved as compared with the case where the first device and the second device are separately installed. Although the second chip P2 has been described above, the first chip P1 can be similarly mounted by changing the path.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment, the first TCP (Tape C
(arrier Package) P3, 2nd TCP P
4 is attached. The following description focuses on the differences from the first embodiment.

In FIG. 7, reference numeral 60 denotes a first carrier tape which is fed in the direction of arrow N3 and holds the first TCP P3. 61 is sent in the direction of arrow N4, and the second TCP
It is a second carrier tape holding P4. The mold 62 punches out the first TCP P3 from the first carrier tape 60, and the first TCP P3 is taken out. Further, the mold 63 punches the second TCP P4 from the second carrier tape 61, and the second TCP P4 is taken out.

The extracted first TCP P3 or second TCP P4 is transferred to the pre-center table 29 by the extraction head 64. Also, 65 to 68
Similar to the mounting heads 33 to 36 in the first embodiment, the mounting head is provided with a motor H and a suction path V to transfer the first TCP P3 or the second TCP P4.

Hereinafter, as in the first embodiment, the first TC
P P3 is transferred to the mounting station S4 via paths L1 and L2, and for the second TCP P4,
It is transferred to the mounting station S4 via the paths L3 and L4. Reference numeral 70 denotes the substrate 6 at the mounting station S4.
9 is a camera for observing the first TCP P1 or the second TCP P2 from below.

A first conductor supply section 37 is provided at the first attaching station S2, and a second conductor supply section 38 is provided at the second attaching station S3. Here, the first conductor supply unit 37 and the second conductor supply unit 38 are, like the first embodiment, the first TCP P.
3. Second TCP An anisotropic conductor 47 is attached to the P4. Unlike a flip chip, TCP has an extremely thin film carrier and is easily deformed.
In the embodiment, the following additional elements are added.

That is, in FIG. 8A, a box 71 is fixed to the upper side of the support plate 43 on the side opposite to the horizontal guide 50, and a rod 7 is provided inside the box 71.
2 is inserted so as to be able to move up and down. The lower end of the rod 72 is a wide flange portion 72a, and the flange portion 72a is
3 upwardly urged. And rod 7
A horizontal receiving base 74 is mounted on the upper end of 2, and the upper surface of the receiving base 74 is usually set to be higher than the anisotropic conductor 47 on the horizontal guide 50.

The second TCP P4 is attached to the mounting head 68.
Will be described when the mounting head 68 reaches the second attaching station S3. First, FIG.
As shown in (2), when the mounting head 68 reaches the second attaching station S3, the lower surface of the second TCP P4 held by the mounting head 68 is located slightly above the upper surface of the receiving table 74.

Next, when the mounting head 68 is lowered, a portion of the second TCP P4 to which the anisotropic conductor 47 is not attached is brought into contact with the receiving base 74 and is received. When the mounting head 68 is further lowered, a portion of the second TCP P4 that is not in contact with the pedestal 74 is pressed against the anisotropic conductor 47 as shown by an arrow N5 in FIG. 8B. At this time, when the spring 73 is contracted, the receiving table 74 becomes the second TCP.
With contact with P4, it descends slightly.

When the attachment of the anisotropic conductor 47 is completed, the mounting head 68 is raised as shown by an arrow N6 in FIG. Even after peeling off, the cradle 74 remains in the second TCP P
It rises while touching 4. That is, the second TCP P4 is
Before and after attaching the anisotropic conductor 47,
The posture is forced to be constant. Therefore, when the mounting head 68 moves up, the second TCP P4 can be prevented from being displaced or dropped by being pulled toward the leader tape 46 side.

[0042]

According to the electronic component mounting apparatus of the present invention, a plurality of mounting heads for holding chips and mounting them on a substrate are provided, and these mounting heads set up a pickup station for picking up the chips. The mounting station that mounts the chip on the substrate is set at a position away from the pickup station, and a table that reciprocates the mounting head between the pickup station and the mounting station is provided. Since the sticking station for sticking the conductive conductor is set, it is not necessary to provide an independent installation place for each of the temporary bonding step and the final bonding step, and the installation space can be saved.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a view taken in the direction of arrows in FIG. 1a-a.

FIG. 3 is a view taken in the direction of arrows in FIG. 1b-b.

FIG. 4 is a front view of a second conductor supply unit according to the first embodiment of the present invention.

FIG. 5A is an explanatory diagram of a pasting operation according to the first embodiment of the present invention. FIG. 5B is an explanatory diagram of an attaching operation according to the first embodiment of the present invention. Of pasting operation in the form of

FIG. 6 is an overall operation explanatory diagram of the electronic component mounting apparatus according to the first embodiment of the present invention.

FIG. 7 is an overall operation explanatory view of an electronic component mounting apparatus according to a second embodiment of the present invention.

FIG. 8A is an explanatory diagram of a pasting operation according to a second embodiment of the present invention. FIG. 8B is an explanatory diagram of an attaching operation according to a second embodiment of the present invention. FIG. 8C is a second embodiment of the present invention. Of pasting operation in the form of

[Explanation of symbols]

 6 Substrate 31 Turntable 33-36 Mounting Head 47 Anisotropic Conductor H Heater P1 First Chip P2 Second Chip S1 Pickup Station S2 First Pasting Station S3 Second Pasting Station S4 Mounting Station

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-61-93697 (JP, A) JP-A-59-129499 (JP, A) JP-A-6-77690 (JP, A) JP-A-6-77690 35000 (JP, A) JP-A-55-132098 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 13/04 H05K 3/32

Claims (4)

(57) [Claims] A mounting station for holding a chip and mounting the chip on a substrate is provided. A plurality of mounting heads are provided for setting up a pickup station for picking up the chip. A table which is set at a position away from the pickup station and reciprocates the mounting head between the pickup station and the mounting station is provided, and is picked up by the mounting head between the pickup station and the mounting station. set the pasting station pasting an anisotropic conductor in a chip, in the pasting station,
Place the anisotropic conductor adhered to the leader tape on the mounting head.
Crimping and sticking to the chip held by the chip, then anisotropically
An electronic component mounting apparatus characterized in that a conductive conductor is peeled off from a leader tape . 2. The electronic component mounting apparatus according to claim 1, wherein a plurality of the pasting stations are set. 3. The electronic component mounting apparatus according to claim 1, wherein said table is provided on a turntable. 4. A step of holding a chip on a mounting head at a pick-up station, moving the mounting head holding the chip to a sticking station, and applying a heat of a heater built in the mounting head to a reader. Pressure bonding the anisotropic conductor adhered to the tape <br/> and applying the anisotropic conductor to a leader tape
And a step of moving the mounting head to a mounting station and bonding an anisotropic conductor attached to a chip to an electrode of a substrate.