JP3132041B2 - Substrate transfer device - Google Patents
Substrate transfer deviceInfo
- Publication number
- JP3132041B2 JP3132041B2 JP03134642A JP13464291A JP3132041B2 JP 3132041 B2 JP3132041 B2 JP 3132041B2 JP 03134642 A JP03134642 A JP 03134642A JP 13464291 A JP13464291 A JP 13464291A JP 3132041 B2 JP3132041 B2 JP 3132041B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- suction
- substrate transfer
- suction port
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Controlling Sheets Or Webs (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を基板上に実
装するための基板搬送装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board transfer device for mounting electronic components on a board.
【０００２】[0002]
【従来の技術】従来、電子部品を基板に実装するために
基板を搬送する基板搬送装置は図３に示すような構成が
一般的であった。2. Description of the Related Art Conventionally, a board transfer apparatus for transferring a board in order to mount an electronic component on the board has generally been configured as shown in FIG.
【０００３】以下、その構成について図３を参照しなが
ら説明する。図に示すように、電子部品の基板１（以
下、基板という）はその両端部が搬送ベルト２上に載置
され、搬送ベルト２はモータに連結されたプーリ３とロ
ーラ４により一方向に駆動されて基板１を搬送するよう
になっている。基板１の両側面１ａは搬送ベルト２の側
方に立設されたガイドレール５でガイドされ、搬送方向
にズレが生じないようになっている。Hereinafter, the configuration will be described with reference to FIG. As shown in the drawing, a substrate 1 (hereinafter, referred to as a substrate) of an electronic component is mounted on a conveyor belt 2 at both ends, and the conveyor belt 2 is driven in one direction by a pulley 3 and a roller 4 connected to a motor. Then, the substrate 1 is transported. Both side surfaces 1a of the substrate 1 are guided by guide rails 5 erected on the side of the conveyor belt 2, so that no deviation occurs in the conveyance direction.
【０００４】[0004]
【発明が解決しようとする課題】このような従来の基板
搬送装置では、基板１の搬送中に基板１の側面１ａがガ
イドレール５に擦過して削られ、削り屑が発生して電子
部品実装の信頼性を低下させるという問題があった。In such a conventional substrate transfer apparatus, the side surface 1a of the substrate 1 is scraped by the guide rail 5 while the substrate 1 is being transferred, and shavings are generated to mount electronic components. There is a problem that the reliability of the device is reduced.
【０００５】たとえば、ガラス基板にベアＩＣをダイレ
クト実装するＣＯＧ工法では、ガラス基板の搬送中に発
生したガラス屑が空気中を浮遊してベアＩＣの実装面に
付着することがある。そして、もしそのまゝボンディン
グが行われるとボンディング不良を引起すという問題が
あった。[0005] For example, in the COG method in which a bare IC is directly mounted on a glass substrate, glass chips generated during the transportation of the glass substrate may float in the air and adhere to the mounting surface of the bare IC. Then, there is a problem that if the bonding is performed, a bonding failure occurs.
【０００６】本発明は上記問題を解決するもので、電子
部品の実装時のボンディング不良を引起す原因を除去す
ることができる基板搬送装置を提供することを目的とす
る。An object of the present invention is to solve the above-mentioned problem, and an object of the present invention is to provide a substrate transfer apparatus capable of removing a cause of a bonding failure when mounting an electronic component.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本願の第１発明の基板搬送装置は、基板を載置して
搬送する搬送手段と、前記搬送手段により搬送する基板
の側面をガイドするガイド手段とを備えた基板搬送装置
であって、基板側面と前記ガイド手段とが擦過すること
により発生する削り屑を吸引する吸引手段を、前記ガイ
ド手段の全域に渡って、搬送される基板の側面に吸引口
を向けて備えたことを特徴とする。また、上記目的を達
成するために、本願の第２発明の基板搬送装置は、前記
搬送される基板の表面および裏面の少なくともいずれか
の面に向けて備えた吸引手段の吸引口を、基板へのボン
ディング工程の前に備えたことを特徴とする。 [MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
According to a first aspect of the present invention, there is provided a substrate transfer apparatus including: a transfer unit configured to mount and transfer a substrate; and a substrate transferred by the transfer unit.
Transfer device provided with guide means for guiding the side surface of the substrate
Wherein the side surface of the substrate and the guide means are rubbed.
Suction means for sucking shavings generated by
A suction port is provided on the side of the substrate being transported over the entire area of the
Characterized in that it is oriented toward In addition,
In order to achieve this, the substrate transfer apparatus of the second invention of
At least one of the front and back sides of the substrate being transported
The suction port of the suction means provided facing the
It is provided before the loading step.
【０００８】[0008]
【作用】本願の第１発明によると、上記した構成によ
り、搬送される基板の側面をガイドするガイド手段の全
域に削り屑を吸引するための吸引手段を備えたため、搬
送経路中のガイド手段の何れの箇所で発生した削り屑も
発生し次第吸引除去でき、発生した削り屑が空気中を浮
遊し基板上に付着することがないので、クリーンな環境
を保つことができ、ボンディング不良を防ぐことができ
る。 また、本願の第２発明によると、上記した構成によ
り、本願の第１発明の吸引口で吸引しきれなかった削り
屑が極く微量でも基板上に付着した場合でも、半導体チ
ップをボンディングする工程の前で基板上から完全に吸
引できるため、クリーンな環境を損なうことを回避で
き、より良好な環境での実装を実現できる。 According to the first aspect of the present invention, according to the above configuration,
Guide means for guiding the side of the substrate to be conveyed.
The area is equipped with suction means for sucking shavings.
Any shavings generated in any part of the guide means in the transport route
Suction can be removed as soon as it is generated, and the generated shavings float in the air.
Clean environment because there is no play and no adhesion on the substrate
Can be maintained and bonding failure can be prevented
You. Further, according to the second invention of the present application, according to the above configuration,
The shaving that could not be completely sucked by the suction port of the first invention of the present application
Even if a very small amount of debris is attached to the substrate,
Before the bonding process
To avoid damaging the clean environment.
And implementation in a better environment can be realized.
【０００９】[0009]
【実施例】以下、本発明の一実施例について図２および
図３を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS.
【００１０】なお、従来例に示したものと同一部品には
同じ符号を付して説明を省略する。 （実施例１）図１は本発明の第１の実施例を示し、基板
１の両側面１ａをガイドするガイド手段であるガイドレ
ール５には、基板１の両側面１ａに臨む１つまたは複数
の吸引手段である吸引口６が設けられ、チューブ７を介
して図示しない吸塵容器および吸引機に接続されてい
る。The same parts as those shown in the conventional example are denoted by the same reference numerals, and the description will be omitted. (Embodiment 1) FIG. 1 shows a first embodiment of the present invention. A suction port 6 is provided as a suction means, and is connected via a tube 7 to a not-shown dust suction container and a suction machine.
【００１１】上記構成において、基板１は搬送ベルト２
による搬送中に、その側面１ａとガイドレール５とが擦
過して削り屑（塵埃）を発生するが、発生した削り屑は
側面１ａに臨んで設けられた吸引口６から吸引されて除
去される。In the above configuration, the substrate 1 is provided with the transport belt 2
During transportation by the, the side surface 1a and the guide rail 5 rub against each other to generate shavings (dust), and the generated shavings are sucked and removed from the suction port 6 provided on the side surface 1a. .
【００１２】吸引口６をガイドレール５に複数列設すれ
ば、ガイドレール５の何れの部分で発生した削り屑も発
生の都度吸引して除去することができる。If a plurality of suction ports 6 are provided on the guide rail 5, shavings generated at any part of the guide rail 5 can be removed by suction each time they are generated.
【００１３】このように本発明の第１の実施例によれ
ば、基板１をガイドするガイドレール５に基板１の側面
１ａに臨ませて吸引口６を設けているので、基板１の側
面１ａとガイドレール５との擦過によって発生する削り
屑を浮遊させることなく、また、基板１に付着させるこ
となく吸引して除去することができるという効果があ
る。As described above, according to the first embodiment of the present invention, since the guide rail 5 for guiding the substrate 1 is provided with the suction port 6 so as to face the side surface 1a of the substrate 1, the side surface 1a of the substrate 1 is provided. There is an effect that the shavings generated by the rubbing between the shavings and the guide rails 5 can be removed by suction without floating and without adhering to the substrate 1.
【００１４】（実施例２）図２は本発明の第２の実施例
を示し、搬送される基板１の上下には、基板１の表面に
臨む吸引手段である吸引口８ａと裏面に臨む吸引口８ｂ
とが配設され、図示しない吸塵容器および吸引機に接続
されている。(Embodiment 2) FIG. 2 shows a second embodiment of the present invention. Above and below a substrate 1 to be conveyed, a suction port 8a serving as a suction means facing the front surface of the substrate 1 and a suction opening facing the back surface. Mouth 8b
And are connected to a dust container and a suction device (not shown).
【００１５】上記構成において、基板１の側面１ｂとガ
イドレール５との擦過によって発生し、浮遊して基板１
上に付着した削り屑は吸引口８ａ，８ｂから吸引されて
除去される。In the above configuration, the substrate 1 is generated by the friction between the side surface 1b of the substrate 1 and the guide rail 5 and floats.
The shavings adhering to the upper portion are sucked and removed from the suction ports 8a and 8b.
【００１６】吸引口８ａ，８ｂはボンディング工程の前
に配設しても、また、複数配設してもよく、さらに、基
板１の表裏面の一方の面に配設してもよいものである。The suction ports 8a and 8b may be provided before the bonding step, a plurality of suction ports may be provided, and one of the front and back surfaces of the substrate 1 may be provided. is there.
【００１７】このように本発明の第２の実施例によれ
ば、基板１の面に臨ませて吸引口８を配設しているの
で、基板１の面に付着した削り屑や、その他の塵埃を吸
引して除去することができるという効果がある。As described above, according to the second embodiment of the present invention, since the suction port 8 is provided so as to face the surface of the substrate 1, shavings adhering to the surface of the substrate 1 and other There is an effect that dust can be removed by suction.
【００１８】[0018]
【発明の効果】以上の実施例の説明から明らかなよう
に、本発明によれば、搬送される基板の側面をガイドす
るガイド手段の全域に削り屑を吸引するための吸引手段
を備えたため、搬送経路中のガイド手段の何れの箇所で
発生した削り屑も発生し次第吸引除去でき、発生した削
り屑が空気中を浮遊し基板上に付着することがないの
で、クリーンな環境を保つことができ、ボンディング不
良を防ぐことができる。 また、ガイド手段に設けた吸引
口で吸引しきれなかった削り屑が極く微量でも基板上に
付着した場合でも、半導体チップをボンディングする工
程の前で基板上から完全に吸引できるため、クリーンな
環境を損なうことを回避でき、より良好な環境での実装
を実現できる。 As is apparent from the above description of the embodiment, according to the present invention, the side surface of the substrate to be conveyed is guided.
Suction means for sucking swarf throughout the guide means
Provided at any point of the guide means in the transport path.
The generated shavings can be removed by suction as soon as they are generated.
The chips do not float in the air and adhere to the substrate
Clean environment and no bonding
Good can be prevented. In addition, suction provided in the guide means
Even a very small amount of shavings that could not be sucked in by the mouth remain on the substrate
Even if it adheres, the process of bonding the semiconductor chip
It is possible to completely aspirate from the substrate just before
Avoid environmental damage and implement in a better environment
Can be realized.
【図１】（ａ）は本発明の基板搬送装置の第１の実施例
の正面断面図 （ｂ）は同側断面図FIG. 1A is a front sectional view of a first embodiment of a substrate transfer apparatus of the present invention, and FIG.
【図２】（ａ）は同第２の実施例の平面図 （ｂ）は同正面断面図FIG. 2A is a plan view of the second embodiment, and FIG.
【図３】（ａ）は従来例の基板搬送装置の正面断面図 （ｂ）は同側断面図FIG. 3A is a front sectional view of a conventional substrate transfer device, and FIG.
【符号の簡単な説明】１ 電子部品の基板 ２ 搬送ベルト（搬送手段） ５ ガイドレール（ガイド手段） ６，８ 吸引口（吸引手段）[Brief description of reference numerals] 1 Substrate for electronic components 2 Transport belt (conveying means) 5 Guide rail (guide means) 6, 8 Suction port (suction means)
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭51−28366（ＪＰ，Ａ) 特開 昭59−190730（ＪＰ，Ａ) 実開 昭60−140683（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 13/00 - 13/04 B65G 21/20 B65G 45/22 B08B 5/00 - 5/04 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-51-28366 (JP, A) JP-A-59-190730 (JP, A) Real opening Sho-60-140683 (JP, U) (58) Field (Int.Cl. 7 , DB name) H05K 13/00-13/04 B65G 21/20 B65G 45/22 B08B 5/00-5/04
Claims (4)
記搬送手段により搬送する基板の側面をガイドするガイ
ド手段とを備えた基板搬送装置であって、基板側面と前
記ガイド手段とが擦過することにより発生する削り屑を
吸引する吸引手段を、前記ガイド手段の全域に渡って、
搬送される基板の側面に吸引口を向けて備えたことを特
徴とする基板搬送装置。1. A conveying means for conveying and placing the substrate, before
A guide that guides the side of the substrate transported by the transport means
And a substrate transfer device having a substrate side and a front side.
Shavings generated by rubbing with the guide means
Suction means for sucking, over the entire area of the guide means,
It is characterized in that the suction port is
Substrate transfer apparatus according to symptoms.
に渡って所定の間隔で複数備えた請求項１記載の基板搬
送装置。2. The suction port of the suction means is connected to the entire area of the guide means.
2. The substrate transfer device according to claim 1, wherein a plurality of the substrate transfer devices are provided at a predetermined interval .
表面および裏面の少なくともいずれかの面に向けて備え
た請求項１または請求項２記載の基板搬送装置。3. A suction port of a suction means is connected to a substrate to be conveyed.
Prepared for at least one of the front and back sides
3. The substrate transfer device according to claim 1 or claim 2 .
くともいずれかの面に向けて備えた吸引手段の吸引口
を、基板へのボンディング工程の前に備えた請求項３記
載の基板搬送装置。 4. The substrate transfer apparatus according to claim 3, wherein a suction port of a suction means provided toward at least one of a front surface and a back surface of the substrate to be transferred is provided before the bonding step to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03134642A JP3132041B2 (en) | 1991-06-06 | 1991-06-06 | Substrate transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03134642A JP3132041B2 (en) | 1991-06-06 | 1991-06-06 | Substrate transfer device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04359598A JPH04359598A (en) | 1992-12-11 |
| JP3132041B2 true JP3132041B2 (en) | 2001-02-05 |
Family
ID=15133142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03134642A Expired - Fee Related JP3132041B2 (en) | 1991-06-06 | 1991-06-06 | Substrate transfer device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3132041B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6188111B1 (en) | 1997-03-31 | 2001-02-13 | Nec Corporation | Dual gate semiconductor device for shortening channel length |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6928720B2 (en) * | 2018-05-18 | 2021-09-01 | ヤマハ発動機株式会社 | Board transfer device and component mounting device |
-
1991
- 1991-06-06 JP JP03134642A patent/JP3132041B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6188111B1 (en) | 1997-03-31 | 2001-02-13 | Nec Corporation | Dual gate semiconductor device for shortening channel length |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04359598A (en) | 1992-12-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000232080A (en) | Workpiece division system and pellet transfer device | |
| KR100319118B1 (en) | Component mounting apparatus | |
| JP3132041B2 (en) | Substrate transfer device | |
| WO2004034757A1 (en) | Substrate cleaner | |
| JP3410050B2 (en) | Electronic component transfer device | |
| JPH08155753A (en) | Dust removal device for printed circuit boards | |
| JP3425101B2 (en) | Holding and conveying device and inspection device for lightweight articles | |
| KR100990886B1 (en) | Material supply device of automation equipment | |
| JPH01172120A (en) | Wafer carrier | |
| JPS6043895A (en) | Substrate cleaning equipment | |
| JP3540773B2 (en) | Cleaning machine | |
| JP3298463B2 (en) | Substrate transfer device and transfer method | |
| JP2889388B2 (en) | Soldering equipment | |
| JP4053756B2 (en) | Printed wiring board and transfer method | |
| KR102696380B1 (en) | An apparatus and method for peeling protective film of substrate | |
| JPS6176262A (en) | Polishing device | |
| JP2005194060A (en) | Substrate transport device | |
| KR101255182B1 (en) | Printed circuit board feeder | |
| JPH0311648A (en) | Semiconductor-wafer conveyer apparatus | |
| JPH0745939A (en) | Method of automatically soldering printed-wiring board | |
| JP2001274179A (en) | Chip mounter and method of manufacturing semiconductor device | |
| JPH02128493A (en) | Conveying device of printed wiring board | |
| JPH07106734A (en) | Manufacturing device, drying device, and carrying device for printed wiring board | |
| JP4130041B2 (en) | Component mounter | |
| JP4294151B2 (en) | Electronic component mounting method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |