JP3158798B2 - Manufacturing method of multilayer chip component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer chip component, and more particularly to a method for manufacturing a multilayer chip component such as a multilayer LC filter.

[0002]

2. Description of the Related Art Conventionally, in the production of laminated chip parts,
When joining two or more types of materials, as shown in FIG.
Joining was done by one press.

[0003]

However, if two or more types of materials are joined by a single press, defects such as warpage, peeling and cracking may occur if the shrinkage behavior of the materials during firing differs. Was. In the case of joining two or more materials, the sintering state is different from that of the simple substance.
It cannot be completely shrunk during firing, and has pores, ie, pores.
e) remains. As described above, if defects such as warpage, peeling, cracks, etc. occur in the material to be laminated, or if pores remain, this may cause a defective product of the laminated chip component.

[0004] Therefore, a main object of the present invention is to provide a method of manufacturing a laminated chip component which is less likely to cause a product defect.

[0005]

According to the present invention, there is provided a pre-pressing step for adjusting the heat shrinkage of at least one of two or more materials having different heat shrinkages, and And a step of main-pressing the material that has been pre-pressed for adjustment and joining the same.

[0006]

[Function] Of two or more materials having different heat shrinkage rates, 1
Pre-press for adjusting the heat shrinkage of more than one kind of material, and then press the pre-pressed material to the main press and join. Therefore, it is difficult for defects such as warpage, peeling and cracks to occur in the laminated chip parts. Pore decreases.

[0007]

According to the present invention, it is possible to obtain a laminated chip component in which defects such as warpage, peeling, and cracks are less likely to occur, pores are reduced, and product defects are less likely to occur.

The above and other objects, features and advantages of the present invention will become more apparent from the following detailed description of embodiments with reference to the drawings.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a method for manufacturing a laminated chip component. In this embodiment, particularly, a method for manufacturing a laminated LC filter will be described.

FIG. 1 is a flowchart showing an embodiment of the present invention. In the manufacturing process of the laminated LC filter, the L material (coil) and the C material (capacitor) are pressed and joined. The L material is formed by printing a coil electrode on a magnetic ceramic green sheet with a silver paste. Similarly, the C material is formed by printing a capacitor electrode on a dielectric ceramic green sheet with a silver paste.

When pressing and joining L material and C material,
First, only the L material is pre-pressed at a pressing pressure of 1500 kgf / cm ² . Next, the pre-pressed L material and C material are fully pressed at 1000 gf / cm ² . In FIG.
Press 1 corresponds to the preliminary press, and press 2 corresponds to the main press.

FIG. 2 is a graph showing the relationship between the pressing pressure of the L material and the C material and the heat shrinkage in the case of firing at 900 ° C. in this embodiment. As is clear from FIG.
Thermal shrinkage rate L material when the press pressure is 1500 kgf / cm ^2, the press pressure is approximately equal to C material thermal shrinkage when the 1000 kgf / cm ^2.

Accordingly, only the L material is pressed at a pressing pressure of 150
After pre-pressing at 0 kgf / cm ² , the L and C materials are fully pressed at 1000 gf / cm ² ,
The difference in the heat shrinkage between the L material and the C material when sintering is eliminated.

As described above, the L material and the C material are pressed and pressed, and then the pressed material is cut to form external electrodes.
The firing is performed to obtain a laminated LC filter.

According to this embodiment, since there is no difference in the thermal shrinkage between the L material and the C material when fired, defects such as warpage, peeling and cracks are less likely to occur. Further, the sinterability of the L material is improved, and pores are reduced. In addition, it is possible to reduce product defects of the laminated LC filter.

In the above embodiment, in order to adjust the thermal shrinkage of the L material and the C material, the pre-press is performed only on the L material. However, the pre-press may be performed on each of the L material and the C material. In this case, the pre-press is performed by changing the number of times, pressure, temperature, and time of the pre-press of the L material and the C material. Further, in the above embodiment, two types of materials, L material and C material, are joined, but the present invention is also applicable to a case where three or more materials are joined.

In the above embodiment, the laminated LC filter has been described, but the present invention can be applied to other laminated chip components.

[Brief description of the drawings]

FIG. 1 is a flowchart showing one embodiment of the present invention.

FIG. 2 is a graph showing the relationship between the pressing pressure and heat shrinkage of the L and C materials when fired at 900 ° C.

FIG. 3 is a flowchart showing a part of a conventional method for manufacturing a laminated chip component.

Continued on the front page (72) Inventor Hiroshi Komatsu 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Co., Ltd. Inside Murata Manufacturing Co., Ltd. (72) Inventor Shigeaki Goto 2-26-10 Tenjin, Nagaokakyo-shi, Kyoto Stock (56) References JP-A-4-290414 (JP, A) JP-A-64-61905 (JP, A) JP-B-54-40737 (JP, B1) (58) Fields investigated ( Int.Cl. ⁷ , DB name) H01G 4/00-4/40 H01G 13/00-13/06

Claims (1)

(57) [Claims] 1. A pre-pressing step for adjusting the heat shrinkage of one or more materials among two or more materials having different heat shrinkages, and a pre-press for adjusting the heat shrinkage. A method for manufacturing a laminated chip component, comprising a step of main-pressing and joining the formed materials.