JP3202190B2 - Method for forming bump, template used in method for forming bump, and method for manufacturing same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a bump used for forming a conductive bump on an electronic component, a template used for the method, and a method for manufacturing the same.

[0002]

2. Description of the Related Art It is widely practiced to form a metal bump such as a solder bump on an electronic component such as an LSI and bond the electronic component to a printed circuit board by the metal bump.
In one method for forming a metal bump, a metal ball is formed in advance and stored in a metal ball container, and the metal ball is taken out of the metal ball container and attached to an electrode of an electronic component to form a metal bump on the electronic component. I do. For example, Japanese Patent Application Laid-Open No. HEI 8-112671 discloses such a metal bump forming apparatus.

In a conventional metal bump forming apparatus,
A suction head is used to remove a metal ball from a metal ball container and attach it to an electrode of an electronic component. A metal ball mounting template (suction pad) having through holes arranged in the same arrangement as the electrodes of the electronic component is attached to the suction head. A suction groove connected to a vacuum source is provided on the surface of the suction head, and a through hole of the metal ball mounting template is connected to the suction groove of the suction head, so that the metal ball can be sucked.

When the metal ball mounting template comes into contact with the metal balls of the metal ball container, the metal balls are attracted to the through holes of the metal ball mounting template. Then, when the suction head is moved over the electronic component, the metal balls sucked into the through holes of the metal ball mounting template are respectively positioned above the electrodes of the electronic component. Then, when the metal ball is thermocompression-bonded to the electrode of the electronic component, the metal ball is joined to the electrode of the electronic component to form a metal bump. Then, the suction head is separated from the electronic component, and the metal balls are transferred from the suction head to the electronic component.

[0005] The metal ball mounting template is usually made of an inorganic material that is hardly distorted and has low chargeability, such as glass. Plastic is not suitable as a material for a metal ball mounting template because plastic is easily distorted and has chargeability. If the metal ball mounting template is made of a plate of easily distorted material,
When the metal ball is pressed against the electrode of the electronic component, the metal ball mounting template may be distorted and the position of the through hole may be shifted from the position of the electrode of the electronic component. Also, if the metal ball mounting template has an electrostatic property, when the metal ball mounting template is brought to the metal ball container and the metal ball is attracted to the through-hole, the metal ball is electrostatically charged to the metal ball mounting template. There is a possibility that it may adhere to a position other than the through hole.

[0006]

The through-hole of the metal ball mounting template made of glass is formed by etching. Alternatively, the through holes can be formed by machining such as drill electric discharge machining. However, when the metal ball mounting template is made of an inorganic material such as glass, when forming the through hole, the side wall of the through hole is not smooth, and irregular burrs may be generated.

If the side wall of the through hole is not smooth, when the metal ball mounting template is pressed toward the electronic component in order to join the metal ball to the electrode of the electronic component, the metal ball is pressed through the through hole of the metal ball mounting template. When the suction head is cut off from the electronic component and the suction head is separated from the electronic component, the metal ball adheres to the metal ball mounting template, and the metal ball is peeled off from the electrode of the electronic component.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a metal ball mounting template capable of securely bonding a metal ball to an electrode pad of an electronic component, and a method of manufacturing the same. It is another object of the present invention to provide a method for forming a bump using a metal bump array template for a semiconductor electrode. It is another object of the present invention to provide a method and an apparatus for manufacturing a perforated plate that can be used as a metal bump array template for a semiconductor electrode.

[0009]

According to the present invention, there is provided a method of forming a bump, comprising forming a through-hole corresponding to an electrode of a chip on which a bump is to be formed, and using a template in which the side wall of the through-hole is smoothed. Vacuum-suctioning the conductive ball to be a bump in the through hole, positioning the conductive ball sucked by the template on the electrode, pressing the conductive ball against the electrode with the template, and releasing the suction. Features.

The method for producing a template according to the present invention comprises:
A hole forming step of forming a through hole for suction-supporting the conductive ball in the plate; and a smoothing step of smoothing a side wall of the through hole formed in the hole forming step. . Preferably, the through-hole is formed by etching. Smoothing is performed by irradiating a laser beam. Preferably, the step of irradiating the side wall of the through hole with a laser beam irradiates the laser beam through a mask having an opening substantially equal to or slightly larger than the diameter of one through hole.

The template according to the present invention has a through hole for supporting the conductive ball by suction, and the side wall of the through hole is smoothed. In these configurations, the side wall of the through hole of the template is preferably smoothed by irradiation with a laser beam. Therefore, the conductive ball does not bite into the end of the through hole of the template, and when the conductive ball is bonded to the electrode pad of the electronic component and the suction head is separated from the electronic component, the conductive ball is securely separated from the template, The conductive balls are securely bonded to the electrode pads of the electronic component.

Further, according to the present invention, an inorganic material layer and an organic material layer are laminated, and a through hole for sucking and supporting a conductive ball penetrates the inorganic material layer and the organic material layer to form a bump. An object of the present invention is to provide a template formed at a position corresponding to an electrode of a chip to be formed , wherein a static prevention film is provided on a surface of an organic material layer . In this configuration, the inorganic material layer imparts sufficient strength to the template to make it difficult to bend. The through hole is formed through the inorganic material layer and the organic material layer, and the through hole portion of the organic material layer can be formed more smoothly than the through hole portion of the inorganic material layer. The conductive balls are adsorbed by the through holes in the organic material layer. Therefore, the conductive ball does not bite into the end of the through hole of the template,
When the conductive ball is bonded to the electrode pad of the electronic component and the suction head is separated from the electronic component, the conductive ball is reliably separated from the template, and the conductive ball is securely bonded to the electrode pad of the electronic component.

Further, according to the present invention, a gas-permeable material layer and a resin layer are bonded to each other , and a through-hole for sucking and supporting a conductive ball in the resin layer corresponds to an electrode of a chip forming a bump. It is another object of the present invention to provide a template, wherein the template is formed at a position and the air-permeable material layer is made of a porous material or a fibrous material. The air-permeable material layer allows the suction groove of the suction head to communicate with the through hole of the resin layer, and the through hole can suck the conductive ball. Again, in this case,
The conductive balls do not bite into the ends of the through holes of the template, and when the conductive balls are joined to the electrode pads of the electronic component and the suction head is separated from the electronic component, the conductive balls are surely separated from the template, and the conductive balls are removed. Is securely bonded to the electrode pad of the electronic component.

Still another feature of the present invention is that a through hole is formed by irradiating a glass plate with a laser beam. That is, the method for forming a bump according to the present invention uses a glass template that absorbs light in the ultraviolet band formed by a laser having a wavelength in the ultraviolet band through the through hole corresponding to the electrode of the chip on which the bump is formed. Vacuum suction of the conductive ball which becomes a bump in the through hole of the template , and smoothing of the bump suction portion of the through hole of the template.
The conductive ball sucked by the template is positioned on the electrode, the conductive ball is pressed against the electrode by the template, and the suction is released.

[0015]

[0016]

[0017]

[0018]

FIG. 5 is a diagram showing a metal bump forming apparatus 10 including a metal ball (conductive ball) mounting template according to the present invention. The metal bump forming apparatus 10 includes a stage 14 for supporting an electronic component 12 such as an LSI, a metal ball container 18 containing metal balls 16 formed in advance, and a suction head 22 having a metal ball mounting template 20 mounted thereon. And

The stage 14 has a suction hole 14a, and holds the electronic component 12 by vacuum suction.
The electronic component 12 has an electrode 24 formed in a predetermined pattern. The suction head 22 has a suction hole 22a and a suction groove 22b.
And FIG. 6 is a diagram showing the suction head 22. The suction holes 22 a extend in the suction head 22, and the suction grooves 22 b are provided on the surface of the suction head 22. Further, a plate suction hole 22 c is opened on the surface of the suction head 22.

FIG. 7 shows a template 2 for mounting a metal ball.
FIG. Metal ball mounting template 2
0 has a through hole 26. The through holes 26 are provided in the same arrangement as the electrodes 24 of the electronic component 12. It is possible to prepare the metal ball mounting template 20 having the through holes 26 arranged differently according to the type of the electronic component 12. The through hole 26 is arranged so as to be located within the range of the suction groove 22b when the metal ball mounting template 20 is sucked by the suction head 22 by the plate suction hole 22c. Therefore, all the through holes 26 communicate with the suction grooves 22b.

Accordingly, as shown in FIG. 5, the metal balls 16 can be attracted to the through holes 26 of the metal ball mounting template 20. The metal bump forming apparatus 10 shown in FIG. 5 further includes a transfer device 28 for moving the suction head 22 on the metal ball container 18 and the electronic component 12.
The suction head 22 can be moved so as to be positioned above.

FIG. 8 is a diagram showing the operation of the metal bump forming apparatus 10. FIG. 3A is a view showing a state in which the suction head 22 is moved above the metal ball container 18 to suck the metal balls 16 into the through holes 26 of the metal ball mounting template 20. FIG. 3B is a view showing a state where the suction head 22 is moved over the electronic component 12 on the stage 14. FIG. 2C is a view showing a state where the metal ball 16 is thermocompression-bonded to the electrode 24 of the electronic component 12. (D) is a diagram showing a state where the suction head 22 is separated from the electronic component 12. In this case, the vacuum to the suction hole 22c is continuously supplied, and the vacuum to the suction hole 22a is cut off. Thereby, the metal ball 16 is joined to the electrode 24 of the electronic component 12 to form a metal bump. After this, metal ball 1
6 can be pressed against a glass plate and leveled to attach silver paste. (E) is the electronic component 1
FIG. 2 is a diagram showing a state where No. 2 is bonded to a printed circuit board 30 using metal bumps. In this case, the electronic component 12 and the printed circuit board 30 can be bonded with an insulating adhesive.

In FIG. 8D, as described above,
If the through hole 26 of the metal ball mounting template 20 is not smooth, the metal ball mounting template 2
0 is pressed toward the electronic component 12, the metal ball 16 bites into the burr 42 at the end of the through hole 26,
When the suction head 22 is separated from the electronic component 12, the metal ball 16 is
And the metal ball 16 is peeled off from the electrode 24 of the electronic component 12 to which the metal ball 16 has been joined. Therefore, it is desirable that the metal ball 16 does not bite into the end of the through hole 26.

FIGS. 1 and 2 show a first embodiment of the present invention. The metal ball mounting template 20 is made of glass which is an inorganic material. In FIG. 1A,
The through hole 26 is formed by etching the metal ball mounting template (glass plate) 20. In this case, etching is performed by immersing the glass plate with the mask 40 in an etching solution containing fluoride. As shown in FIG. 1B, when the through hole 26 is formed by etching the glass plate, the side wall of the through hole 26 is not smooth, and the burr 42 is formed.

Therefore, as shown in FIG. 2A, the side wall of the through hole 26 is irradiated with a laser beam LB to smooth the side wall of the through hole. FIG. 2B schematically shows that the burr 42 on the side wall of the through hole 26 in FIG. 1B is eliminated and the side wall of the through hole is smoothed. Through hole 26
Irradiation of the laser beam LB to the side wall is desirably performed only on a very limited area around the through hole 26. If the laser beam LB is excessively applied to the portion of the metal ball mounting template 20 between the two adjacent through holes 26, inconveniences such as deformation of the surface of the metal ball mounting template 20 occur. The laser used is preferably an excimer laser. The YAG laser has too much energy and is not suitable for fine processing, and the CO ₂ laser is not suitable for processing glass.

In the embodiment, the laser beam LB is irradiated on the mask 44. The diameter of the through hole 26 is 24 μm
In this case, the diameter of the opening of the mask 44 was 26 μm. That is, it is preferable that the laser beam LB be applied to a range larger than the diameter of the through hole 26 by about 2 μm. The output condition of the laser is such that when the thickness of the metal ball mounting template 20 is 300 μm, the output is 300 mJ / 200.
Hz and the number of pulses was 1000 pulses. In addition, krypton gas and fluorine gas were used. in this case,
He or Ne was added as an assist gas. Further, as a pretreatment of the glass plate, carbon (C) was deposited on the glass plate.

FIG. 3 is a diagram showing an end portion of the through hole 26 (the portion of the through hole 26 near the surface of the metal ball mounting template 20) which has been smoothed by irradiating the laser beam LB. Burrs 4 of through holes 26 formed by etching
2 (FIG. 1B) is melted by irradiating the laser beam LB, and the surface becomes smoother. The state in which the burrs 42 are present in the through holes 26 and the state in which the burrs are removed as shown in FIG. 3 can be seen by microscopic observation and photographs.

In FIG. 1A, the through hole 26 of the metal ball mounting template 20 is shown to have a substantially uniform diameter, but in FIG. 4, the through hole 26 of the metal ball mounting template 20 is tapered. It is a figure showing the example formed with. In the metal ball mounting template 20 formed by etching to form the through holes 26, the through holes 26 are often tapered as shown in FIG. Also in this case, since burrs are formed in the through holes 26, the through holes 26 are formed.
Is irradiated with the laser beam LB to smooth the side wall of the through hole. In this case, the laser beam LB is irradiated to the end of the through hole 26 having the smaller diameter, and the laser beam LB is directed toward the metal ball 16 in use.

In the above example, the through hole 26 of the metal ball mounting template 20 was formed by etching. However, the through hole 26 can be formed by machining such as drill electric discharge machining. Is formed, a laser beam LB is irradiated. FIG. 9 is a diagram showing a second embodiment of the present invention. In this embodiment, the metal ball mounting template 20 is formed by laminating an inorganic material layer 50 and an organic material layer 52, and the through holes 26 (50a, 52a) for sucking and supporting the metal balls 16 are formed of the inorganic material layer. 5
0 and the organic material layer 52. The organic material layer 52 is made of an inorganic material layer 5 using a prepreg or an adhesive.
0.

The inorganic material layer 50 is made of a glass plate, and the through holes 50a are formed by etching. The inorganic material layer 50 provides a necessary strength for the metal ball mounting template 20. The organic material layer 52 is made of a fluorine-based resin such as polyimide or PTFE, or a plastic having excellent heat resistance such as nylon. Compared with the case where the through holes 50a are formed in the inorganic material layer 50, the through holes 52a can be easily formed in the organic material layer 52 by laser processing or the like. The through hole 52 a is used so as to face the metal ball 16.

Therefore, the inorganic material layer 50 and the organic material layer 52
The metal ball mounting template 20 made of the metal ball mounting template 20 has sufficient strength, and the metal ball 16 does not bite into the through-hole 26. A bump can be formed. In addition, the inorganic material layer 50 and the organic material layer 52 may be bonded to each other after forming the through holes 50a and 52a, respectively, or the through hole 26 may be formed after bonding both. Further, an antistatic film may be provided on the surface of the organic material layer 52.

FIG. 10 is a view showing a modification of the metal ball mounting template 20 of FIG. This metal ball mounting template 20 is the same as that of FIG. 9 except that the through-hole 26 is formed to be tapered. FIGS. 11 to 13 show a third embodiment of the present invention.
As shown in FIG. 11, the metal ball mounting template 20 is formed by laminating a gas permeable material layer 60 and a resin layer 62, and a through hole 62a is formed in the resin layer 62. The breathable material layer 60 and the resin layer 62 are bonded to each other. The air-permeable material layer 60 is, for example, a porous material or a fibrous material (glass fiber or the like) having a sufficient strength, and air can pass through the air-permeable material layer 60. In FIG. 11, the air-permeable material layer 60 is made of a porous material plate, and a minute hole 61 is formed inside the plate.

FIG. 12 is a view showing the air-permeable material layer 60 of the metal ball mounting template 20. At the center of the surface of the air-permeable material layer 60 on the side opposite to the resin layer 62,
An impermeable holding member 64 is provided. FIG. 13 is a diagram illustrating the suction head 22. The suction head 22 is provided with the suction hole 2.
2a, a suction groove 22b, and a plate suction hole 22c. The plate suction hole 22 c is provided at the center of the suction head 22, and the holding member 64 provided on the air-permeable material layer 60 is provided.
And thereby the entire metal ball mounting template 20 can be sucked and held. Suction groove 22b
Is formed annularly around the plate suction hole 22c, and the suction hole 22a opens inside the suction groove 22b. Resin layer 6
The two through holes 62a are arranged in the range of the suction groove 22b.

Therefore, also in this case, the air-permeable material layer 6
The metal ball mounting template 20 composed of the metal ball 16 and the resin layer 62 has sufficient strength,
Does not bite into the through-hole 62a, and the metal bump mounting template 20 can be used to reliably form a metal bump on the electronic component 12. The air-permeable material layer 60 and the resin layer 62 may be bonded to each other after forming the through-hole 62a, or may be formed after bonding both.

FIG. 14 shows a breathable material layer 60 and a resin layer 62.
The example in which the through-hole 62a is formed after the bonding is performed is shown. (A) shows that the surface of the air-permeable material layer 60 is coated or impregnated with the ultraviolet curable resin 62p.
(B) shows that a mask 66 is formed at a position where the through hole 62a is to be formed in the ultraviolet curable resin 62p, and the ultraviolet light (UV) is irradiated. (C) shows that the ultraviolet curable resin 62p which is not shielded from light by the mask 66 is cured, and the uncured portion is removed with a solvent to obtain a resin layer 62 having a through hole 62a.
It is shown that it becomes.

FIG. 15 shows an example in which after forming a through-hole 62a in the resin layer 62, the air-permeable material layer 60 and the resin layer 62 are adhered. 16 to 27 show the fourth embodiment of the present invention.
It is a figure showing an example. FIG. 16 shows a metal bump array template 2 for a semiconductor electrode used in the fourth embodiment of the present invention.
It is a figure which shows the manufacturing apparatus 70 of 0 (perforated board). The manufacturing device 70 includes a laser generation unit 72 and a laser processing unit 74. The laser generator 72 is an excimer laser device in this embodiment. The laser beam generated by the laser generator 72 is supplied to a laser processing unit 74 via a conduit 75 .

The laser processing section 74 includes a support base 76 for supporting a work plate 102 (FIG. 17) on which the template 20 is to be formed, an XY stage 78, a Z stage 80, and a θ stage 82. Z stage 80 is XY stage 7
8, the θ stage 82 is attached to the Z stage 80, and the support base 76 is attached to the θ stage 82. Further, there is a φ stage (not shown), and the support base 76 is supported so as to be movable in five axial directions.

The laser processing section 74 further includes a mirror 8
4, 86, 88, mask holder 90, reduction lens 9
2 and a ring light 94. The laser beam supplied from the laser generating section 72 to the laser processing section 74 via the conduit 75 is guided to the mirror 84. The laser beam is reflected by mirrors 84, 86, and 88, and travels to the plate 102 on the support base.

The mask holder 90 holds a mask (not shown) and can adjust the size of a laser beam spot. The laser beam is applied to the support 7
6 so that it can be most narrowed down on the plate 102 to be processed. Therefore, even if the laser processing surface deviates from the reduced projection position and a projected image cannot be obtained, the through hole can be processed with energy near the center of the laser beam. Mirrors 84, 8
Reference numerals 6 and 88 are movable and can switch the optical path of the laser beam. The laser processing unit 74 further includes a microscope 98 and a CCD camera 100. The work plate 102 on the support base 76 can be observed by the microscope 98 and the CCD camera 100.

FIG. 17 is an enlarged view of the support base 76 of FIG. 16, and FIG. 18 is an enlarged view of a portion A of FIG. Support stand 7
6 is a surface 76a capable of supporting the work plate 102
A concave portion 76B provided on the surface 76a;
02 has a vacuum hole 76C for vacuum suction. The surface 76a is flat so that the vacuum-adsorbed workpiece plate 102 can be held tightly in a straight posture. The concave portion 76B is formed corresponding to the position of the through hole 26 to be formed, that is, the position of the bump.

FIG. 18 shows a state in which the plate to be processed 102 is supported on the support base 76 and the through-hole 26 is formed by irradiating a laser beam LB. Laser beam LB
Is irradiated on the plate to be processed 102 at the position of the concave portion 76B. In the present invention, the through holes 26 are formed in the glass processing plate 102 by a laser beam. The thickness of the glass processing plate 102 is 0.3 mm, and the diameter of the through hole 26 is 30 μm or less. The focus of the laser beam is set on the surface of the plate 102 to be processed.

In general, it is not possible to make a through hole in a glass plate having such a thickness with a laser beam. That is, since the glass plate generally transmits light, even if the glass plate is irradiated with the laser beam, it does not absorb enough energy to make a through hole. In the present invention, a glass that absorbs light in the ultraviolet band is selected as the plate to be processed 102, and a laser beam having a wavelength in the ultraviolet band is irradiated, so that the through-hole 26 is formed on the plate to be processed 102 by the laser beam.
Was able to open.

The glass that absorbs light in the ultraviolet band preferably has an ultraviolet absorptivity of 90% or more, and includes Pyrex (borosilicate glass), blue glass, white glass, and the like. Quartz glass has a low ultraviolet absorptivity (high transmittance) and is not suitable for forming the through-hole 26 with a laser beam. Examples of a laser beam having a wavelength in the ultraviolet band include an excimer laser and a harmonic YAG laser. As excimer lasers that can be used, the wavelength of ArF is 194 nm, the wavelength of KrF is 248 nm, and the wavelength of XeF is 308 nm. Harmonic Y
As the AG laser, the fourth harmonic YAG (FHG-YA)
The wavelength of G) is 266 nm.

Thus, by irradiating the laser beam LB, the through-hole 26 of the glass processing plate 102 (the metal bump array template 20 for semiconductor electrodes) can be directly opened. The irradiation condition of the laser beam LB can be appropriately determined according to the thickness of the workpiece plate 102 and the diameter of the through hole 26. As an example, as described with reference to FIG. 2, the irradiation conditions of the laser beam LB when the side wall of the through hole 26 of the template 20 formed by etching is smoothed can be set. However, when the through-hole 26 of the glass processing plate 102 is directly opened by irradiating the laser beam LB, it takes much longer time than in the case of the smoothing processing.

However, when the through-hole 26 of the glass processing plate 102 is formed by irradiating the laser beam LB, cutting particles adhere to the end of the through-hole 26 on the irradiation side of the laser beam LB. And the concave portion 76B of the support base 76
Otherwise, the laser beam LB passing through the through-hole 26 is reflected by the surface 76A of the support base 76, the end wall of the through-hole 26 opposite to the side irradiated with the laser beam LB becomes rough, and the support base 76 penetrates. The wall around the hole 26 may be cracked.

By providing the concave portion 76B in the support 76, the laser beam LB passing through the through hole 26 is not reflected on the surface 76A of the support 76, and is opposite to the side of the through hole 26 where the laser beam LB is irradiated. The end wall on the side is prevented from being roughened, and the end wall of the through hole 26 on the side opposite to the side irradiated with the laser beam LB becomes smooth. Recess 76B
The laser beam LB passing through the through hole 26 is formed in a shape such that not vandalized through hole 26 and is reflected by the surface 76A and the size of the support 76. For example, the concave portion 76
The area of B may be equal to or larger than the area of the through hole 26, and preferably about twice the area of the through hole 26. Recess 76
The depth of B may be 0.1 mm or more, preferably 0.5 mm.
It may be about mm. Further, the surface (bottom surface and side surface) of the concave portion 76B may be provided with minute unevenness for diffusing the penetrated laser beam LB.

Therefore, in forming the bumps, the glass processing plate 102 having the through holes 26 thus formed is used as the metal bump array template 20 for the semiconductor electrode, and the metal balls 16 are formed in the through holes 26 of the template 20.
While holding the metal ball 16 with the electronic component 12.
Can be securely attached to the electrode 24. In this case, since the end wall of the through hole 26 on the side opposite to the side irradiated with the laser beam LB is smooth, the metal ball 1
6 may be held by suction.

FIG. 19 is a view showing a variation of the formation of the through holes in FIG. When processing the through-hole 26, FIG.
As shown in FIG. 2, a laser beam LB is irradiated from one side of a glass plate 102 to form a through hole 26. In this case, the hole may not be a complete through-hole 26 but may be a hole partially formed. Then, FIG.
As shown in (B), the glass processing plate 102 is inverted, and a laser beam LB is irradiated from the other side of the glass processing plate 102. Thus, the size of the end of the through hole 26 on the side to be the suction portion is appropriately formed, and the through hole 2 is formed.
The side irradiated with the laser beam LB first in FIG.
The lower end of (B) can be prevented from becoming excessively large.

FIG. 20 to FIG. 22 are views showing further examples of changes in the formation of through holes. FIG. 20 is a diagram showing a portion of the support base 76 corresponding to FIG.
Can be used as the support base 76. 21 is an enlarged view of a portion B in FIG. 20, and FIG. 22 is a diagram showing the same portion as FIG. 21 when a through hole is formed. The support base 76 has a surface 76a capable of supporting the plate to be processed 102, a concave portion 76B provided on the surface 76a, and a vacuum hole 76C for vacuum-sucking the plate to be processed 102. The surface 76a is flat so that the vacuum-adsorbed workpiece plate 102 can be held tightly in a straight posture. The concave portion 76B is formed corresponding to the position of the through hole 26 to be formed, that is, the position of the bump.

Further, an insertion member 104 made of quartz glass is arranged in the recess 76B. Quartz glass is the plate 10 to be processed.
This is a material having a laser transmittance higher than that of 2. For example, while the laser absorptance of the plate to be processed 102 is 90% or more, the transmittance of the quartz glass insertion member 104 laser is 90% or more, and the reflectance is very small. The insertion member 104 includes the workpiece plate 102 and the insertion member 10.
4 is supported by the concave portion 76B so that an appropriate minute gap 106 exists. The insertion member 104 has the concave portion 76
Although it can be held by friction on the wall of B, it can be held so as to form the predetermined gap 106 by the support protrusion 108 or the like.

At the time of processing the through hole 26, as shown in FIG. 22, a laser beam LB is irradiated from one side of the glass plate 102 to form the through hole 26. Thus, the through-hole 26 is formed in substantially the same manner as described above, but since the quartz glass insertion member 104 is in the recess 76B, it penetrates the work plate 102 and enters the recess 76B, and the quartz glass is inserted. The laser beam LB that has not passed through the surface of the member 104 processes the portion around the through hole 26 of the workpiece 102. Therefore, the portion around the through-hole 26 of the plate to be processed 102 is smoothly rounded as shown in FIG. 22, and the rounded portion is relatively shallow. Such a shape is convenient for sucking the metal ball 16. The gap 106 depends on the conditions of the laser beam LB,
It is not preferable that it is too large (too far) or too small (too close). If the insertion member 104 is metal, most of the laser beam LB processes the plate 102, and the portion of the plate 102 around the through hole 26 is excessively processed, and as described above, the portion around the through hole 26 The part will be rough.

FIG. 23 shows an end of the through-hole 26 formed by the method of FIGS. 20 to 22 on the irradiation side of the laser beam LB, and FIG. 24 shows a side of the same through-hole 26 opposite to the irradiation side of the laser beam LB. FIG. These figures are based on photographs. The laser used for the processing is an excimer laser (wavelength λ = 248 nm), and the processing hole diameter is 30 μm. Further, in all the embodiments, in order to remove foreign matters and protrusions on the inner surface of the through hole 26 and to smooth the periphery of the through hole 26, the processing target plate 102 is made of an organic solvent or H
It is preferable to perform washing or dissolution using a strongly acidic aqueous solution such as F.

FIG. 25 is a view showing the surface of the metal bump array template 20 for a semiconductor electrode in which the through holes 26 are formed by irradiating the laser beam LB. FIG.
Is a diagram showing the back surface of the same template 20. Markers 110 such as characters and figures are engraved on the front surface of the template 20 so that the front surface and the back surface of the template 20 can be easily distinguished. The marker 110 corresponds to the microscope 98 and the CCD camera 100 shown in FIG.
Can be observed and read. If this sign 110 is engraved on the surface where the metal ball is adsorbed, there is a possibility that the metal ball adheres to the groove or the like engraved with the metal ball.
It is better to engrave on the side opposite to the surface where metal balls are adsorbed.

The processed plate 102 made of an inorganic material such as glass having the through holes 26 formed by irradiating the laser beam LB is also used as a perforated plate for applications other than the metal bump array template 20 for semiconductor electrodes. Can be For example, FIG. 27 is a diagram illustrating an example in which the work plate 102 is used as a rolling member. By irradiating the glass plate with the laser beam LB, a large number of, e.g.
A through hole 26 of μm can be formed, and this can be used as a filtering member.

[0055]

As described above, according to the present invention,
Since a metal ball mounting template having a through-hole having a smooth surface without burrs is obtained, metal bumps can be easily and reliably formed on an electronic component. Further, it is possible to improve the reliability of the connection portion and simplify the structures of the metal bump forming device and the joining device. Further, it contributes to the improvement of the quality and productivity of the metal bump. Further, a through-hole is formed by irradiating a laser beam having a wavelength in the ultraviolet band.
A glass template can be obtained. The production of a perforated glass plate by a laser beam can be performed in a period that is twice or more shorter than the production by etching, and is thus efficient.

[Brief description of the drawings]

FIGS. 1A and 1B show a process of forming a through hole according to a first embodiment of the present invention, in which FIG. 1A is a cross-sectional view showing a metal ball mounting template, and FIG. is there.

FIG. 2 shows a process of irradiating the metal ball mounting template of FIG. 1 with a laser beam;
Is a cross-sectional view showing a metal ball mounting template,
(B) is a plan view showing a through hole in which burrs are eliminated.

FIG. 3 is a schematic perspective view showing an end around a through hole that has been smoothed by irradiating a laser beam;

FIG. 4 is a cross-sectional view showing a modification of the metal ball mounting template.

FIG. 5 is a view showing a metal bump forming apparatus including a metal ball mounting template according to the present invention.

FIG. 6 is a perspective view showing the suction head of FIG. 5;

FIG. 7 is a perspective view showing the metal ball mounting template of FIG. 5;

FIG. 8 is a diagram showing the operation of the metal bump forming apparatus.

FIG. 9 is a sectional view showing a part of a metal ball mounting template according to a second embodiment of the present invention.

FIG. 10 is a sectional view showing a modification of the metal ball mounting template of FIG. 9;

FIG. 11 is a sectional view showing a part of a metal ball mounting template according to a third embodiment of the present invention.

FIG. 12 is a plan view showing a gas-permeable material layer of the metal ball mounting template of FIG. 11;

FIG. 13 is a plan view of a suction head used with the metal ball mounting template of FIGS. 11 and 12.

FIG. 14 is a view showing an example of the production of the metal ball mounting template of FIG. 11;

FIG. 15 is a diagram showing another example of the production of the metal ball mounting template of FIG. 11;

FIG. 16 is a view showing an apparatus for manufacturing a metal bump array template for a semiconductor electrode according to a fourth embodiment of the present invention.

FIG. 17 is an enlarged view of a portion of a support base of the apparatus of FIG.

18 is an enlarged view of a portion A in FIG.

FIG. 19 is a diagram showing a modified example of the formation of the through holes in FIG. 18;

FIG. 20 is a diagram showing a further example of a change in the formation of a through hole.

FIG. 21 is an enlarged view of a portion B in FIG. 20;

FIG. 22 is a diagram showing the same portion as FIG. 21 when a through hole is formed.

FIG. 23 is a diagram showing an end of the through hole formed by the method of FIGS. 20 to 22 on the irradiation side of the laser beam.

FIG. 24 is a diagram showing an end of the same through hole on the side opposite to the side irradiated with the laser beam LB.

FIG. 25 is a diagram showing a surface of a metal bump array template for a semiconductor electrode in which through holes are formed by irradiating a laser beam.

FIG. 26 is a diagram showing a back surface of the same template.

FIG. 27 is a diagram showing an example in which a work plate having a through hole formed by irradiating a laser beam is used as a lathing member.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 ... Electronic component 16 ... Metal ball 20 ... Metal ball mounting template 22 ... Suction head 24 ... Electrode 26 ... Through hole 40, 44 ... Mask 42 ... Burr 50 ... Inorganic material layer 52 ... Organic material layer 60 ... Air-permeable material Layer 62: Resin layer 76: Support base 76A: Surface 76B: Recess 102: Worked plate 104: Insert member

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yutaka Noda 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Yoshitaka Muraoka 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa No. 1 Fujitsu Limited (56) References JP-A-62-25435 (JP, A) JP-A-2-182390 (JP, A) JP-A-8-141765 (JP, A) JP-A-1- 45150 (JP, A) JP-A-1-73625 (JP, A) JP-A-4-69945 (JP, A) JP-A-8-18209 (JP, A) JP-A-9-270429 (JP, A) JP-A-9-298356 (JP, A) JP-A-9-298355 (JP, A)

Claims (8)

(57) [Claims] A through hole corresponding to an electrode of a chip on which a bump is to be formed is formed, and a template in which a side wall of the through hole is smoothed is used. And positioning the conductive ball sucked by the template on the electrode, pressing the conductive ball against the electrode with the template, and releasing the suction. 2. The method according to claim 1, further comprising a hole forming step of forming a through hole for supporting the conductive ball by suction on the plate, and a smoothing step of smoothing a side wall of the through hole formed in the hole forming step. Method of manufacturing a template. 3. The method according to claim 2, wherein the hole processing step is performed by etching, and the smoothing step is performed by irradiating a laser beam. 4. The step of irradiating the side wall of the through hole with a laser beam includes irradiating the laser beam through a mask having an opening substantially equal to or slightly larger than the diameter of one through hole. The method for manufacturing a template according to claim 3, wherein: 5. A template having a through-hole for sucking and supporting a conductive ball, wherein a side wall of the through-hole is smoothed. 6. A chip formed by laminating an inorganic material layer and an organic material layer, wherein a through hole for sucking and supporting a conductive ball is formed on the chip which penetrates the inorganic material layer and the organic material layer to form a bump. A template formed at a position corresponding to an electrode, wherein an antistatic film is provided on a surface of an organic material layer. 7. The air-permeable material layer and the resin layer are bonded to each other.
And has a through hole for sucking supporting the conductive ball into the resin layer is formed at a position corresponding to the tip of the electrode forming the bumps, breathable material layer is made of a porous material or fibrous material A template characterized by 8. A glass template that absorbs light in the ultraviolet band formed by a laser having a wavelength in the ultraviolet band is formed in a through hole corresponding to an electrode of a chip for forming a bump. The conductive balls serving as bumps are vacuum-sucked, the bump suction portions of the through holes of the template are smoothed, the conductive balls sucked by the template are positioned on the electrodes, and the conductive balls are drawn by the template onto the electrodes. And releasing the suction.