JP3203266B2 - Board holder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to a substrate holder, and more particularly to a substrate holder most suitable for use in a hard disk sputtering apparatus.

[0002]

2. Description of the Related Art FIGS. 9 and 10 show a conventional substrate holder. In FIG. 9, a substrate holder 1 made of a thin plate has four holding portions 2 formed therein. The details are shown in FIG. 10, but each holding section 2 has the same configuration. A substantially circular round hole 3 is formed in the substrate holder 1 in order to form one holding portion 2, and a taper 3 a that is inclined inward and downward is formed on the outer peripheral edge of the substrate holder 1. About 18 below this
In order to form the groove 4, the 0 degree portion has another taper 3 a.
It is formed as a groove forming portion 3b having a greater width, into which the hard disk substrate 5 is inserted into the groove 4 in an area of about 180 degrees below it, as shown on both sides of the groove forming portion 3b. Is held in.

[0003] Such a substrate holder 1 is provided in a vacuum chamber, and is provided from a known target or sputter source.
A thin film made of a desired substance receiving atoms or molecules is formed on the substrate 5.
Although formed on the upper surface, the groove forming portion 3b shadows atoms or molecules to be sputtered on the outer peripheral portion of the substrate 5 inserted into the groove 4, and a thin film cannot be formed on this portion. .

In particular, when the diameter of the substrate 5 is small, there is a strong demand that the film be formed up to the outermost peripheral portion and used as, for example, a magnetic recording area, but this request cannot be met at all.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above problems, and has as its object to provide a substrate holder capable of forming a film up to the outermost peripheral portion of a substrate.

[0006]

Further objects Means for solving the problem] is engageable with the support arm or cylinder to <br/> central opening of the substrate, the support arm or cylinder sufficient for supporting the bearing member a thin <br/> Ri consists a wire member, the front or rear of the substrate to
The fact that a thin film is formed by receiving atoms or molecules.
Achieved by the featured substrate holder.

[0007]

The substrate generally has a round hole at the center, into which a support arm or a cylinder is engaged. Further, since the support arm or the cylindrical body is supported by the wire member supported by the carrier, atoms and molecules sputtered from a position opposed thereto can collide over the entire region of the substrate, Therefore, a thin film can be formed over the entire surface. If the distance between the wire member and the substrate is set to a predetermined distance or more according to the distance from the sputter source, atoms and molecules flying from the sputter source will be at a certain angle immediately after the wire member. Therefore, it does not occur that the wire member casts a shadow and a thin film is not formed on a portion facing the substrate.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a substrate holder according to an embodiment of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show a substrate holder 10 according to a first embodiment of the present invention. In FIG. 1 and FIG. 2, wires 11 and 12 are stretched vertically and horizontally on a frame F as a rectangular carrier . Has been established. These wires 11, 12
Is sufficiently thin, but even if the substrate 5 is supported as described later,
It should have rigidity and heat resistance that hardly bends (for example, made of wire).

In this embodiment, four substrates 5 (hard disks) are held in the frame F.
One of the wires 11 will be described with reference to FIG. 2. One end of a pair of wire members 15 is fixed to one of the wires 11 around a horizontal wire 12 by, for example, welding or bonding. One end of the wire 15 as the support arm has V-shaped bent portions 15a, 15a.
a is formed, and this distance is equal to the center hole 5 of the substrate 5.
Although slightly larger than the diameter of a, when the bent portion 15a is engaged with the center hole 5a of the substrate 5 as shown in FIG. It is reliably positioned as shown in the figure and is supported by the wire member 15 as a support arm. Reference numeral 19 denotes a ring member for reinforcing the wires 15, 15, but this is not always necessary.

A substrate holder 1 according to a first embodiment of the present invention.
0 is constructed as described above, but in this embodiment, four support portions shown in FIG. 2 are provided, and the substrate 5 is formed on each of the bent portions 15 a formed at one end of the wire member 15. And is held. FIG. 1 shows a state in which four substrate holders are held, and atoms or molecules to be sputtered are projected from the front and rear of the frame 10 in a vacuum chamber, and thin films are formed on the front and back surfaces of the substrate 5. For example, a magnetic material is formed as a thin film. At this time, the distance between the substrate 5 and the wires 11 and 12 to the substrate 5 is, for example, 20 to 30 mm apart, and the wires 11 and 12 are sufficiently thin to prevent shadows of atoms or molecules flying from the front or the rear. As a result, a thin film is not formed at a portion opposed thereto, and atoms or molecules can uniformly collide with the entire region to form a thin film on the substrate 5.

As described above, a thin film is not formed in the entire area of the circular substrate 5, that is, in the conventional technique, the thin film is not formed in the portion that fits into the groove over the substantially 180-degree area of the outer peripheral edge. The thin film can be formed up to.

Further, according to the present embodiment, as shown in FIG. 2, since the distances from the vertical wire 11 and the horizontal wire 12 to the front and back surfaces of the substrate 5 are the same, the film forming conditions are the same. A homogeneous thin film is formed on the front and back surfaces.

FIGS. 3 and 4 show a substrate holder according to a second embodiment of the present invention.
0, a pair of front and rear wires 22, 22 and 23, 23
Is fixed at one end thereof, and one pair of wires 2
The other end of 2 is bent portions 22a, 22a. A pair of notches 21a, 21a are formed in the peripheral wall of the cylindrical body 21, and the bent portions 22a, 22a at the other ends of the wires 22, 22 are configured to engage with the notches 21a.

Further, an annular groove 21b having a V-shaped cross section is formed at a substantially central portion of the cylindrical body 21 so that a center hole 5a of the substrate 5 is engaged with the annular groove 21 as shown in FIG. It has become.

When the substrate 5 is mounted, one of the wires 22
After the lower end of the substrate 22 is elastically spread outward in the figure, the substrate 5 is engaged with the groove 21b of the cylindrical body 21 as shown in FIG. The cylinder body 21 is held by the holding unit 20 by returning to engage the notches 21a, 21a of the cylinder body 21 with the bent parts 22a, 22a as shown in FIG.

In such a state, as in the first embodiment, FIG.
In the above, atoms or molecules sputtered from the right or left are applied. A thin film can be uniformly formed on the entire surface of the substrate 5.

In the state shown in FIG. 4, atoms and molecules sputtered from the right or left in the figure are projected and a thin film is formed on the substrate 5, but in FIG. When atoms or molecules are sputtered from one side, the position of the wires 22 and
If it is kept away from the surface, there is no problem in forming a thin film on the entire front and back surfaces. Other operations and effects are the same as those of the first embodiment.

[0019] While FIG. 5 illustrates a substrate holder 30 according to a third embodiment of the present invention, a rectangular-shaped carrier
Both ends of the pipe 31 are fixed to the frame body 32 in a vertical direction. A plurality of pairs of wires 34, 34 are suspended from each pipe 31 in a V-shape, and the upper end thereof is fixed to the pipe 31.
Is fixed to the outer peripheral surface of.

An annular groove 33a having a V-shaped cross section is formed on the peripheral surface of the substrate receiver 33, similarly to the cylindrical body 21 in the second embodiment. That is, in FIG. 4 showing the second embodiment, the wires 23, 23 fixed to the left half of the cylindrical body 21 and the left half are omitted. The distance between the wires 34 and 34 and the substrate 5 is 16
mm.

In the third embodiment, the twenty substrates 5 are mounted on the substrate holder 30 as described above. However, atoms or molecules are irradiated from the back side to the front side with respect to the plane of FIG. 5, a thin film is formed on the back side of the substrate 5. It should be noted that FIG.
As shown in the figure, the substrate receiver 33 may be held by a pair of V-shaped wires 34, 34. In this case, a thin film can be formed from both sides of the substrate holder 30 under the same conditions.

FIG. 6 shows a transport system of the substrate holder constructed as described above. For example, the substrate holder 10 of the first embodiment is held upright on a carrier base 49 by some means. The roller 40 is supported by a roller 43, and the roller 43
The supporting members 41a, 41b support the rotating shaft 42 rotatably supported by the supporting members 41a, 41b. A plurality of such rollers 43 are arranged at a predetermined pitch. The carrier base 40 is conveyed to a thin film forming position or a substrate attaching / detaching position in a vacuum chamber with the rotation of the rollers 43.

FIG. 7 shows another example of a transport system. A carrier base 55 is provided at the lower end of the substrate holder 10.
A linear rack 54 is fixed to the lower surface, and meshes with a gear 53 fixed to a rotating shaft 52 rotatably supported by a pair of left and right columns 51a and 51b. ing. In addition, carrier base 55
A pair of left and right support shafts are fixed to the, and a pair of left and right rollers 60 are rotatably supported by the support shafts, and are mounted on a pair of left and right rail posts 51a and 51b as shown in the figure. Although not shown, when the rotating shaft 52 is driven by a motor, a linear driving force is applied to the rack 54 meshing with the gear 53 by the rotation of the gear 53, whereby the substrate holder 10 forms a thin film in a vacuum chamber. Position and substrate transfer position.

FIG. 8 shows a modification of the first embodiment, in which a frame portion 61 attached to one side of a frame of a substrate holder 60 is connected to a projecting piece 61b formed at the upper end thereof. The frame of the first embodiment is constituted by elastically engaging with the upper end portion 62 of the portion. However, by disassembling the frame portion 61 on one side as shown in FIG. A thin film is formed on the left side surface of the substrate 5 by attaching atoms or molecules to the substrate 5, but in this case, there is no wire on the front surface, so there is no influence from this. There is no. When a thin film is formed on both surfaces, the first piece 61b at the upper end of the frame portion 61 is engaged with the upper end portion 62 of the other frame portion 60 in the same manner as in the first embodiment. When forming the frame of the embodiment and forming the thin film from both sides, the thin film can be formed under exactly the same conditions.

Although the embodiments of the present invention have been described above, the present invention is, of course, not limited thereto, and various modifications can be made based on the technical concept of the present invention.

For example, in the first embodiment, the arm for supporting the substrate 5 is composed of a pair of wires 15, 15, but instead of this, a cylindrical body is vertically or horizontally mounted as in the second embodiment. The cylindrical body is fixed to the wires 11 and 12. An annular groove having a V-shaped cross section is formed at the end of the cylindrical body as in the second embodiment, and the central opening 5a is elastically engaged with the groove. You may do so.

In the second embodiment, the support portion 20 is located above and one end of each of the wires 22 and 23 is fixed to the support portion. And may support the cylindrical body.

In the above embodiment, the substrate 5 has a circular shape and a circular hole is formed at the center thereof. However, the central opening may be a polygon instead of a circle. Is not limited to a circle.

In the above embodiment, the case where a thin film is formed on the substrate 5 by sputtering while the substrate holder is kept in a vacuum has been described. However, the film is formed by sputtering while moving the substrate 5 in vacuum. May be.

[0030]

As described above, according to the substrate holder of the present invention, a thin film can be formed on the outermost peripheral portion of the substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view of a substrate holder according to a first embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view taken along a line [2]-[2] in FIG.

FIG. 3 is a front view showing a state where a substrate is held by a substrate holder according to a second embodiment of the present invention.

FIG. 4 is a side view of the same.

FIG. 5 is a front view of a substrate holder according to a third embodiment of the present invention.

FIG. 6 is a front view of a transfer system display of the substrate holder.

FIG. 7 is a front view showing another example of the transfer system of the substrate holder.

FIG. 8 is a partial side view showing a modification of the first embodiment.

FIG. 9 is a front view of a conventional substrate holder.

FIG. 10 is an enlarged front view of one of the holding portions.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 wire 12 wire 15 wire 21 cylindrical body 31 pipe 33 substrate support 34 wire

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) C23C 14/00-14/58 C23C 16/00-16/56 B65H 51/30 H01L 21/203, 21/31

Claims (1)

(57) [Claims] A support arm engageable with a central opening of a substrate.
Or a cylindrical body, Ri consists sufficiently thin wire member for supporting the carrier the support arm or cylinder, wherein the group
Form a thin film by receiving atoms or molecules from the front or back of the plate
A substrate holder characterized in that: