JP3208055B2 - Electronic device housing shield structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield structure for an electronic device housing.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional electronic device housing. This housing is formed in a substantially rectangular parallelepiped, and the front plate 11, the upper plate 1
2, a side plate comprising a lower plate 13 and a rear plate 14, and shield plates 15 and 16 provided in these side plates 11 to 14, and a phono jack 10 is attached to a front plate 11.

As shown in FIG. 6, such a housing is formed by punching a single metal flat plate with a press and bending each of the plates 11 to 16 at a right angle. The front plate 11 has engaging grooves 11a and 11b and a phono jack mounting hole 11c,
11d are formed, and the upper plate 12 is provided with engaging pieces 12a, 12b.
The lower plate 13 is formed with engaging pieces 13a and 13b, and the rear plate 14 is formed with engaging grooves 14a and 14b. After bending each at a right angle, the engaging grooves 11a and 11
b, 14a, 14b and engagement pieces 12a, 12b, 13a,
The solder is applied to the caulking portion, and the caulking portion and the contact portion facing each other are applied with cream solder to perform reflow soldering. In this case, a large number of shield plates 16 are locked to the upper plate 12 and the lower plate 13, but the shield plate 15 is only connected to the front plate 11 at the joint 17 and is shown by a broken line in FIG. It is orthogonal to the front plate 11 by being bent at right angles along the line.

As shown in FIG. 7, a printed circuit board 20 is attached to a region constituted by the front plate 11, the upper plate 12, the lower plate 13, and the rear plate 14. When the portion indicated by arrow A in FIG. 7 is enlarged and shown in FIG. 8, a hole 21 is formed in the printed circuit board 20 so that the tip of the shield plate 15 projects upward. Earth pattern 22
Are formed. Then, the tip of the shield plate 15 protruding from the hole 21 is electrically connected to the ground pattern 22 and the front plate 11 by soldering.

[0005]

However, in the above-described conventional electronic device housing, as shown in FIGS. 8 and 9, a front plate 11 and a shield plate 15 orthogonal to the front plate 11 are compared. There is a problem that a target gap is easily generated (about 0.5 to 0.6 mm), the shield is incomplete, and the front plate 11 and the shield plate 15 cannot be soldered. One of the causes of such a gap is a springback at the time of bending, and the front plate 11 and the shield plate 15 connected at the joint 17 are formed by bending the front plate 11 and the shield plate 15 at right angles to a metal flat plate. A gap occurs. In addition, the material itself of the flat metal plate is also warped. The flat metal plate is slightly warped even in a flat plate state because the flat metal plate is punched out by a press from a roll, and a gap is also generated by the warpage. Furthermore, since the phono jack mounting holes 11c and 11d of the front plate 11 are formed after press punching, the flatness of the front plate 11 is impaired by this punching process, and a gap is also generated for this reason.

The present invention has been made in consideration of the above-described conventional problems, and has as its object to provide a shield structure of an electronic device housing that can reliably electrically couple a shield plate and a side plate.

[0007]

According to the present invention, the shield plate and the side wall which are orthogonal to each other are fixed by inserting a swaged piece formed in the shield plate into a swaged hole of the side plate. In this way, when the shield plate and the side wall are fixed by the caulking piece, even if there is a springback or a warp of the material itself at the time of the bending process, the gap between the shield plate and the side wall which causes a defective shield or a defective solder is obtained. Gap can be eliminated.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS In a shield structure of an electronic equipment housing according to the present invention, a shield plate having a slit and a side wall having a caulking hole are formed by punching a flat metal plate by pressing. And the side walls are bent at right angles so as to be orthogonal to each other, and the slit is pressed in the direction of the caulking hole to form a caulking piece. The caulking piece is fitted into the caulking hole, and the shield plate and the shield plate are formed. Fix the side wall.

The caulking piece may just be fitted into the caulking hole, but if the caulking portion is soldered after the fitting, the fixing of the shield plate and the side wall becomes more reliable and the electrical contact is stabilized.

The caulking hole may have any shape as long as the caulking piece can be fitted therein. However, if the caulking piece is formed in an inverted trapezoidal shape having a narrow width along the fitting direction of the caulking piece, the caulking piece is firmly fitted into the caulking hole. be able to.

When the ground pattern of the printed circuit board mounted on the shield plate is soldered to the swaged piece and the swaged hole, the swaged portion can be soldered simultaneously with the soldering of the shield plate and the printed board. . During such soldering, the molten solder bridges between the shield plate and the side wall, so that the gap between the shield plate and the side wall is filled with the solder, and the electrical contact between the shield plate and the side wall is stabilized.

[0012]

Embodiments will be described with reference to the drawings.
FIG. 1 is a perspective view of a main part of the electronic device housing shown in FIG. 4. As shown in FIG. 1, a swaging piece 152 formed on a shield plate 15 is inserted into a swaging hole 111 formed on a front plate 11. By being fitted, the shield plate 15 is fixed to the front plate 11 by caulking. In addition, the swaged portion (111,
152) and the ground pattern of the printed circuit board 20 are coated with cream solder 23, and the cream solder 23 is melted in a reflow furnace, so that the space between the shield plate 15 and the printed circuit board 20 and between the shield plate 15 and the front plate 11 are formed. Soldered at the same time.

As shown in FIG. 3, such a housing is formed by punching a single metal flat plate with a press and bending each of the plates 11 to 16 at a right angle. A slit 151 is formed in the shield plate 15, and an inverted trapezoidal caulking hole 111 is formed in the front plate 11 so as to correspond to the slit 151. The configuration of the metal flat plate other than the front plate 11 and the shield plate 15 is the same as that of the conventional example (see FIG. 6), and thus the duplicated description will be omitted.

After each of the metal plates 11 to 16 is bent at a right angle, the engaging grooves 11a, 11b, 14a, 14b and the engaging pieces 12a,
The reflow soldering is performed by engaging the caulking with the lugs 12b, 13a, and 13b, and further applying cream solder to the caulking portion and the contact portions facing each other. Next, as shown in FIGS. 1 and 2, a punch 30 having an inclined surface is inserted into the slit 151 of the shield plate 15 and pushed open, and the swaging piece 152 formed by this operation is inserted into the swaging hole 111 of the front plate 11. To fit. In this case, the caulking hole 111 is formed in an inverted trapezoidal shape in which the lower side is narrower than the upper side, and gradually becomes narrower in the fitting direction of the caulking piece 152. Can be fitted. Thereafter, the printed circuit board 20 is attached to an area constituted by the upper plate 12, the lower plate 13, and the rear plate 14,
As described above, the swaged portions (111, 152) and the ground pattern of the printed circuit board 20 are soldered by the cream solder 23. At this time, as shown in FIG. 3, the gap between the shield plate 15 and the side wall 11 is filled with the cream solder 23 because the melted cream solder 23 bridges between the shield plate 15 and the side wall 11. The electrical contact between the plate 15 and the side wall 11 is stable.

[0015]

The present invention is embodied in the form described above and has the following effects.

By pressing the slit of the shield plate to form a swaged piece and inserting the swaged piece into the swaged hole in the side wall to fix the shield plate and the side wall, the shield plate and the side plate are securely electrically connected. Can be combined.

Further, when the caulking pieces are inserted into the caulking holes and then the caulked portions are soldered, the shield plate and the side wall are more securely fixed and the electrical contact is stabilized.

Further, when the swaging hole is formed in an inverted trapezoidal shape which becomes narrower in the fitting direction of the swaging piece, the swaging piece can be firmly inserted into the swaging hole.

Further, when the ground pattern of the printed board mounted on the shield plate is soldered to the swaged piece and the swaged hole, the swaged portion can be soldered simultaneously with the soldering of the shield plate and the printed board. Also, the electrical contact between the shield plate and the side wall is stabilized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a main part of a shield structure of an electronic device housing.

FIG. 2 is a diagram illustrating a caulking operation of a shield plate.

FIG. 3 is a plan view showing a pressed metal flat plate.

FIG. 4 is a perspective view illustrating an appearance of an electronic device housing.

FIG. 5 is a perspective view showing a conventional electronic device housing.

FIG. 6 is a plan view showing a conventional metal flat plate.

FIG. 7 is a side view illustrating a shield structure of a conventional electronic device housing.

FIG. 8 is an enlarged side view showing the shield structure of FIG. 7;

FIG. 9 is an enlarged plan view showing the shield structure of FIG. 8;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Front board 15 Shield board 20 Printed circuit board 23 Cream solder 111 Caulking hole 151 Slit 152 Caulking piece

Continuation of front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 9/00

Claims (4)

(57) [Claims] 1. A shield plate having a slit and a side wall having a caulking hole are formed by stamping a flat metal plate by press working, and the shield plate and the side wall are bent at right angles so as to be orthogonal to each other. An electronic device housing, wherein a crimping piece is formed by pressing the slit in the direction of the caulking hole, and the caulking piece is fitted into the caulking hole to fix the shield plate and the side wall. Shield structure. 2. The shield structure for an electronic device housing according to claim 1, wherein said caulking piece is inserted into said caulking hole and then soldered. 3. The shield structure for an electronic device housing according to claim 1, wherein the caulking hole is formed in an inverted trapezoidal shape which becomes narrower in a fitting direction of the caulking piece. . 4. A printed circuit board is mounted on the shield plate, and the caulking pieces are soldered to the caulked holes and a ground pattern of the printed circuit board. The shield structure of the electronic device housing according to the above.