JP3227735B2 - High expansion composite material - Google Patents
High expansion composite materialInfo
- Publication number
- JP3227735B2 JP3227735B2 JP26276391A JP26276391A JP3227735B2 JP 3227735 B2 JP3227735 B2 JP 3227735B2 JP 26276391 A JP26276391 A JP 26276391A JP 26276391 A JP26276391 A JP 26276391A JP 3227735 B2 JP3227735 B2 JP 3227735B2
- Authority
- JP
- Japan
- Prior art keywords
- composite material
- powder
- volume
- tridymite
- expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims description 17
- 239000000843 powder Substances 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 12
- 229910052905 tridymite Inorganic materials 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910020617 PbO—B2O3—SiO2 Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- OYLGJCQECKOTOL-UHFFFAOYSA-L barium fluoride Chemical compound [F-].[F-].[Ba+2] OYLGJCQECKOTOL-UHFFFAOYSA-L 0.000 description 1
- 229910001632 barium fluoride Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- 235000012255 calcium oxide Nutrition 0.000 description 1
- HNQGTZYKXIXXST-UHFFFAOYSA-N calcium;dioxido(oxo)tin Chemical compound [Ca+2].[O-][Sn]([O-])=O HNQGTZYKXIXXST-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000001256 tonic effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Glass Compositions (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は高膨張性複合材料に関
し、より詳しくは金属製ＩＣパッケージの気密封着やサ
ーミスタの被覆等に使用される高膨張性複合材料に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-expansion composite material, and more particularly to a high-expansion composite material used for hermetically sealing a metal IC package or covering a thermistor.
【０００２】[0002]
【従来の技術】ＩＣを実装するための高信頼性パッケー
ジには、アルミナセラミックが広く用いられているが、
近年、ＩＣの大型化に伴い、ＩＣから発生する熱を効率
良く放散するために、より熱伝導率の大きい材料を用い
てパッケージを作製することが検討されている。このよ
うなものとして、例えばアルミニウム、銅、及びこれら
をベースとした合金を使用した金属製パッケージが提案
されている。2. Description of the Related Art Alumina ceramics are widely used for high reliability packages for mounting ICs.
In recent years, with the increase in size of ICs, in order to efficiently dissipate heat generated from ICs, it has been studied to manufacture a package using a material having a higher thermal conductivity. As such, metal packages using, for example, aluminum, copper, and alloys based thereon have been proposed.
【０００３】ところがこの金属製パッケージは、熱膨張
係数が１４０〜２３０×１０-7／℃と高いために、アル
ミナセラミック製パッケージに使用されている低膨張の
封着材料を使用することができない。However, this metal package has a high thermal expansion coefficient of 140 to 230 × 10 −7 / ° C., so that the low expansion sealing material used for the alumina ceramic package cannot be used.
【０００４】このような事情から、米国特許第４８１９
７３０号において、ＰｂＯ−Ｂ2 Ｏ3 系、ＰｂＯ−Ｚｎ
Ｏ−Ｂ2 Ｏ3 系等の低融点ガラス粉末と、フッ化カルシ
ウム粉末やフッ化バリウム粉末を混合した高膨張の封着
材料が提案されている。[0004] Under such circumstances, US Pat.
No. 730, PbO—B 2 O 3 system, PbO—Zn
A high-expansion sealing material in which a low-melting glass powder such as an OB 2 O 3 system is mixed with a calcium fluoride powder or a barium fluoride powder has been proposed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記米
国特許に開示の封着材料は、機械的強度が不十分であ
り、実用に耐えないという問題を有している。However, the sealing material disclosed in the above-mentioned U.S. Patent has a problem that the mechanical strength is insufficient and cannot be put to practical use.
【０００６】また、Ｎｉ、Ｍｎ、Ｃｏ等の酸化物を焼結
した半導体であるサーミスタは、素子を保護するために
その表面をガラスで被覆しているが、このガラスには、
ＰｂＯ−Ｂ2 Ｏ3 −ＳｉＯ2 系等の被覆用ガラスが用い
られている。A thermistor, which is a semiconductor obtained by sintering an oxide such as Ni, Mn, or Co, has its surface coated with glass to protect the element.
PbO—B 2 O 3 —SiO 2 coating glass or the like is used.
【０００７】しかしながら、従来使用されている被覆用
ガラスは、熱膨張係数がサーミスタのそれ（１００〜１
１０×１０-7／℃）よりかなり低い７０〜８０×１０-7
／℃程度であり、しかも機械的強度が低いために、クラ
ックが発生し易いという問題を有している。However, the conventionally used coating glass has a coefficient of thermal expansion (100 to 1) that of the thermistor.
70-80 × 10 −7, which is considerably lower than 10 × 10 −7 / ° C.)
/ ° C. and low mechanical strength, and thus has a problem that cracks are likely to occur.
【０００８】本発明は上記事情に鑑みなされたもので、
９０〜２２０×１０-7／℃程度の高い熱膨張係数を有
し、しかも機械的強度が高く、金属製ＩＣパッケージの
気密封着やサーミスタの被覆に好適な高膨張性複合材料
を提供することを目的とする。[0008] The present invention has been made in view of the above circumstances,
To provide a high-expansion composite material having a high coefficient of thermal expansion of about 90 to 220 × 10 −7 / ° C. and having high mechanical strength and suitable for hermetically sealing a metal IC package or covering a thermistor. With the goal.
【０００９】[0009]
【課題を解決するための手段】本発明者は種々の研究を
行った結果、トリジマイト（ＳｉＯ2 ）粉末をフィラー
として添加することにより、上記目的が達成できること
を見いだし、本発明として提案するものである。As a result of various studies, the present inventor has found that the above object can be achieved by adding tridymite (SiO 2 ) powder as a filler, and proposes the present invention. is there.
【００１０】即ち、本発明の高膨張性複合材料は、低融
点ガラス粉末 ４５〜９５体積％、トリジマイト粉末
５〜５０体積％、セラミック粉末 ０〜４０体積％が混
合されてなり、トリジマイト粉末は表面にＺｎＯからな
る被膜が形成されてなることを特徴とする。That is, the high-expansion composite material of the present invention comprises 45 to 95% by volume of low melting glass powder, tridymite powder.
5-50% by volume, Ri Na and ceramic powder 0-40% by volume is mixed, tridymite powder ZnO on the surface Tona
Coating is formed that is characterized Rukoto such by.
【００１１】[0011]
【作用】本発明の高膨張性複合材料は、低融点ガラス粉
末、トリジマイト粉末、及びセラミック粉末が混合され
てなり、３０〜２５０℃において９０〜２２０×１０-7
／℃の熱膨張係数を有し、また高い機械的強度を有する
ものである。The high-expansion composite material of the present invention comprises a mixture of a low-melting glass powder, a tridymite powder and a ceramic powder, and has a temperature of 30 to 250 ° C. and 90 to 220 × 10 -7.
/ C and a high mechanical strength.
【００１２】本発明の高膨張性複合材料において、フィ
ラーとして使用するトリジマイト粉末は３０〜２５０℃
における熱膨張係数が３００×１０-7／℃と非常に高
く、しかも機械的強度の高いものである。またトリジマ
イト粉末の表面には、ＺｎＯからなる被膜が形成されて
いる。ＺｎＯ被膜を形成することにより、封着材料の流
動性が改善される。なお、トリジマイト粉末の形状を球
形すると、さらに流動性を改善することが可能である。In the high expansion composite material of the present invention, the tridymite powder used as a filler is at 30 to 250 ° C.
Has a very high coefficient of thermal expansion of 300 × 10 −7 / ° C. and high mechanical strength. Also Trijima
A coating made of ZnO is formed on the surface of the
I have. By forming the ZnO coating, the flow of the sealing material
Mobility is improved. Note that the shape of the tridymite powder is
Forming can further improve flowability.
【００１３】トリジマイト粉末の混合割合を上記のよう
に限定した理由は、トリジマイト粉末が５体積％より少
ないと熱膨張係数の高い複合材料が得られなくなるとと
もに機械的強度が低下し、一方５０体積％より多いと複
合材料の熱膨張係数が大きくなりすぎるためである。The reason for limiting the mixing ratio of the tridymite powder as described above is that if the tridymite powder is less than 5% by volume, a composite material having a high coefficient of thermal expansion cannot be obtained, and the mechanical strength decreases, while the 50% by volume This is because if it is larger, the thermal expansion coefficient of the composite material becomes too large.
【００１４】本発明の高膨張性複合材料において、セラ
ミック粉末としてアルミナ、ジルコニア、マグネシア、
カルシア、すず酸亜鉛、すず酸カルシウム等の酸化物粉
末を４０体積％以下混合することができる。即ち、トリ
ジマイト粉末は、上記したように熱膨張係数が極めて高
いため、これのみをフィラーとして使用すると、複合材
料の熱膨張係数が高くなりすぎることがある。このよう
な場合、上記したようなセラミック粉末を１種又は２種
以上混合することによって、所望の熱膨張係数に調整す
ることが可能である。In the high expansion composite material of the present invention, alumina, zirconia, magnesia,
An oxide powder such as calcia, zinc stannate, calcium stannate and the like can be mixed in an amount of 40% by volume or less. That is, since the tridymite powder has an extremely high coefficient of thermal expansion as described above, if only this is used as a filler, the coefficient of thermal expansion of the composite material may be too high. In such a case, the desired thermal expansion coefficient can be adjusted by mixing one or more of the above-described ceramic powders.
【００１５】セラミック粉末の混合割合を上記のように
限定した理由は、これらのフィラーを４０体積％より多
くするとトリジマイト粉末を添加する余地が小さくな
り、熱膨張係数の高い複合材料が得られなくなることに
よる。The reason that the mixing ratio of the ceramic powder is limited as described above is that if these fillers are more than 40% by volume, the room for adding the tridymite powder becomes small, and a composite material having a high thermal expansion coefficient cannot be obtained. by.
【００１６】また本発明の高膨張性複合材料において、
低融点ガラス粉末としては、例えばＰｂＯ−Ｂ2 Ｏ3
系、ＰｂＯ−ＺｎＯ−Ｂ2 Ｏ3 系、ＰｂＯ−ＰｂＦ2 −
Ｂ2 Ｏ3 系、ＰｂＯ−Ｖ2 Ｏ5 系、ＰｂＯ−Ｖ2 Ｏ5 −
ＴｅＯ2 系、ＰｂＯ−Ｖ2 Ｏ5−Ｐ2 Ｏ5 系、ＰｂＯ−
Ｂｉ2 Ｏ3 −Ｂ2 Ｏ3 −ＴｅＯ2 系ガラス等を使用する
ことができる。なお、ＩＣパッケージの封着に使用する
場合、実装するＩＣに悪影響を及ぼさないように封着温
度を５００℃以下にする必要がある。このような場合、
３５０℃以下の転移点を有する低融点ガラスを使用する
ことが好ましい。Further, in the high expansion composite material of the present invention,
As the low melting point glass powder, for example, PbO—B 2 O 3
System, PbO-ZnO-B 2 O 3 system, PbO-PbF 2 -
B 2 O 3 system, PbO-V 2 O 5 system, PbO-V 2 O 5 −
TeO 2 system, PbO-V 2 O 5 -P 2 O 5 system, PbO-
Bi 2 O 3 -B 2 O 3 can be used -TeO 2 based glass or the like. When used for sealing an IC package, it is necessary to set the sealing temperature to 500 ° C. or lower so as not to adversely affect the IC to be mounted. In such a case,
It is preferable to use a low melting point glass having a transition point of 350 ° C. or lower.
【００１７】低融点ガラス粉末の混合割合を上記のよう
に限定した理由は、低融点ガラス粉末が４５体積％より
少ないと複合材料の流動性が低下し、９５体積％より多
いと複合材料の機械的強度が不十分になるためである。The reason for limiting the mixing ratio of the low-melting glass powder as described above is that if the low-melting glass powder is less than 45% by volume, the fluidity of the composite material is reduced, and if it is more than 95% by volume, the mechanical properties of the composite material are reduced. This is because the target strength becomes insufficient.
【００１８】[0018]
【発明の効果】【The invention's effect】
以上説明したように本発明の低融点高膨As described above, the low melting point and high expansion of the present invention
張性複合材料は、熱膨張係数が９０〜２２０×１０The tonic composite material has a coefficient of thermal expansion of 90 to 220 × 10
-7-7
／/
℃と高く、しかも機械的強度が高いため、金属製ＩＣパ° C and high mechanical strength.
ッケージの気密封着やサーミスタの被覆に好適である。It is suitable for hermetically sealing packages and for covering thermistors.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C03C 1/00 - 14/00 H01L 23/10 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int. Cl. 7 , DB name) C03C 1/00-14/00 H01L 23/10
Claims (1)
トリジマイト粉末５〜５０体積％、セラミック粉末 ０
〜４０体積％が混合されてなり、トリジマイト粉末は表
面にＺｎＯからなる被膜が形成されてなることを特徴と
する高膨張性複合材料。1. A low melting glass powder of 45 to 95% by volume,
Tridymite powder 5 to 50% by volume, ceramic powder 0
Ri Na 40% by volume is mixed, tridymite powder Table
High expansion composite material characterized Rukoto a coating made of ZnO is formed on the surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26276391A JP3227735B2 (en) | 1991-09-12 | 1991-09-12 | High expansion composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26276391A JP3227735B2 (en) | 1991-09-12 | 1991-09-12 | High expansion composite material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0570172A JPH0570172A (en) | 1993-03-23 |
| JP3227735B2 true JP3227735B2 (en) | 2001-11-12 |
Family
ID=17380254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26276391A Expired - Fee Related JP3227735B2 (en) | 1991-09-12 | 1991-09-12 | High expansion composite material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3227735B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4803157B2 (en) * | 2002-08-07 | 2011-10-26 | パナソニック株式会社 | Load sensor and manufacturing method thereof |
| JP4692918B2 (en) * | 2004-12-01 | 2011-06-01 | 日本電気硝子株式会社 | Sealing material |
| JP6101232B2 (en) * | 2014-04-22 | 2017-03-22 | 株式会社ノリタケカンパニーリミテド | Glass bonding material |
| JP6025775B2 (en) * | 2014-04-22 | 2016-11-16 | 株式会社ノリタケカンパニーリミテド | High thermal expansion filler composition and method for producing the same |
-
1991
- 1991-09-12 JP JP26276391A patent/JP3227735B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0570172A (en) | 1993-03-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |