JP3233382B2 - Resin composition - Google Patents
Resin compositionInfo
- Publication number
- JP3233382B2 JP3233382B2 JP14611694A JP14611694A JP3233382B2 JP 3233382 B2 JP3233382 B2 JP 3233382B2 JP 14611694 A JP14611694 A JP 14611694A JP 14611694 A JP14611694 A JP 14611694A JP 3233382 B2 JP3233382 B2 JP 3233382B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- weight
- less
- resin
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 11
- -1 phosphonium ion Chemical class 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 150000002891 organic anions Chemical class 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 239000005011 phenolic resin Substances 0.000 claims description 5
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 4
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 2
- 125000001931 aliphatic group Chemical group 0.000 claims description 2
- 125000003118 aryl group Chemical group 0.000 claims description 2
- 125000000962 organic group Chemical group 0.000 claims description 2
- 229920001568 phenolic resin Polymers 0.000 claims description 2
- 125000001424 substituent group Chemical group 0.000 claims description 2
- 150000008040 ionic compounds Chemical class 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 229920003986 novolac Polymers 0.000 description 9
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920003261 Durez Polymers 0.000 description 1
- 241000282376 Panthera tigris Species 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、硬化性に優れ、かつ常
温における保存性のよい電子、電気部品用樹脂組成物に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition for electronic and electric parts which has excellent curability and good storage stability at room temperature.
【０００２】[0002]
【従来の技術】近年、ＩＣ、ＬＳＩなどの半導体素子や
電気部品などの封止用材料として、特性やコストのバラ
ンスの点から、エポキシ樹脂組成物が一般的に用いられ
ている。2. Description of the Related Art In recent years, epoxy resin compositions have been generally used as sealing materials for semiconductor elements such as ICs and LSIs and electric parts from the viewpoint of balance between properties and costs.
【０００３】このようなエポキシ樹脂封止材において、
従来用いられている硬化促進剤は、２−メチルイミダゾ
ール、ＤＢＵ、トリフェニルホスフィンなどが挙げられ
るが、これらの硬化促進剤を用いたエポキシ樹脂封止材
は常温における保存性が悪く、そのため、常温で保存す
ると流れ性の低下から、成形時に未充填不良が発生した
り、ＩＣチップの金ワイヤーが断線し、導通不良が発生
するなどの問題点があった。In such an epoxy resin sealing material,
Conventionally used curing accelerators include 2-methylimidazole, DBU, triphenylphosphine, etc., but epoxy resin encapsulants using these curing accelerators have poor storage stability at room temperature. However, when stored for a short time, there is a problem that a poor filling property occurs during molding, a gold wire of an IC chip is broken, and a conduction failure occurs due to a decrease in flowability.
【０００４】このため現在は、エポキシ樹脂封止材を冷
蔵保存する必要があり、冷蔵保存、冷蔵輸送に多大なコ
ストがかかっているのが現状である。[0004] For this reason, at present, it is necessary to store the epoxy resin sealing material in a refrigerated state, and at present, enormous costs are required for refrigerated storage and refrigerated transportation.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的とすると
ころは、硬化性に優れ、かつ常温における保存性のよい
電子、電気部品用樹脂組成物を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition for electronic and electric parts which has excellent curability and good storage stability at room temperature.
【０００６】[0006]
【課題を解決するための手段】本発明は、１分子内にエ
ポキシ基を２個以上有するエポキシ樹脂（Ａ）と１分子
内にフェノール性水酸基を２個以上有するフェノール樹
脂（Ｂ）において、エポキシ基のフェノール性水酸基に
対する当量比が０.５以上２以下であり、更に硬化促進
剤として、一般式（１）で示されるホスホニウムイオンThe present invention relates to an epoxy resin (A) having two or more epoxy groups in one molecule and a phenol resin (B) having two or more phenolic hydroxyl groups in one molecule. The equivalent ratio of the group to the phenolic hydroxyl group is 0.5 or more and 2 or less, and a phosphonium ion represented by the general formula (1) is used as a curing accelerator.
【化１】 （以下単にホスホニウムイオンと略す。また、式中のＲ
1、Ｒ2、Ｒ3、Ｒ4は１価の芳香環を含む有機基又は１価
の脂肪族残基よりなる群より選ばれた置換基を表す）
と、イソシアヌル酸よりなるイオン対を形成し得る有機
アニオン（Ｃ）とのイオン結合体（以下単にイオン結合
体と略す）（Ｄ）を、（Ａ）＋（Ｂ）１００重量部に対
し、０.４重量部以上２０重量部以下を含有し、更に無
機充填剤（Ｅ）が（Ａ）＋（Ｂ）１００重量部に対し、
４０重量部以上２４００重量部以下含有されてなる樹脂
組成物である。Embedded image (Hereinafter simply abbreviated as phosphonium ion. In the formula, R
1 , R 2 , R 3 , and R 4 represent a substituent selected from the group consisting of an organic group containing a monovalent aromatic ring or a monovalent aliphatic residue.
Of an isocyanuric acid and an organic anion (C) capable of forming an ion pair of isocyanuric acid (hereinafter simply abbreviated as an ionic bond) (D) with respect to 100 parts by weight of (A) + (B). Not less than 0.4 parts by weight and not more than 20 parts by weight, and the inorganic filler (E) is based on 100 parts by weight of (A) + (B).
The resin composition is contained in an amount of from 40 parts by weight to 2400 parts by weight.
【０００７】ここで上記エポキシ樹脂（Ａ）の具体例と
してはオルソクレゾールノボラックエポキシ、フェノー
ルノボラックエポキシ、ビスフェノールＡ型エポキシ、
ビフェニル型エポキシなどが挙げられるが、特にこれら
に限定されるものではない。更にフェノール樹脂（Ａ）
としては、フェノールノボラック、クレゾールノボラッ
クなどが例示できる。この（Ａ）、（Ｂ）において、エ
ポキシ基のフェノール性水酸基に対する当量比は０.５
以上２以下が好ましく、この範囲外ではガラス転移温度
の低下、硬化性の低下などの問題が発生する。[0007] Specific examples of the epoxy resin (A) include orthocresol novolak epoxy, phenol novolak epoxy, bisphenol A type epoxy,
Examples thereof include a biphenyl type epoxy, but are not particularly limited thereto. Furthermore, phenolic resin (A)
Examples thereof include phenol novolak and cresol novolak. In these (A) and (B), the equivalent ratio of the epoxy group to the phenolic hydroxyl group is 0.5.
Above 2 is preferable, and if it is out of this range, problems such as lowering of glass transition temperature and lowering of curability occur.
【０００８】硬化促進剤であるホスホニウムイオンとイ
ソシアヌル酸よりなる有機アニオン（Ｃ）とのイオン結
合体（Ｄ）はホスホニウムイオンと有機アニオン（Ｃ）
が少なくとも１個のイオン対を形成すればよい。The ionic complex (D) of a curing accelerator, a phosphonium ion and an organic anion (C) comprising isocyanuric acid is a phosphonium ion and an organic anion (C).
There may be formed at least one ion pair.
【０００９】更に、この硬化促進剤（Ｄ）の添加量はエ
ポキシ樹脂（Ａ）及びフェノール樹脂（Ｂ）の総重量１
００重量部に対し、０.４重量部以上２０重量部以下が
好ましい。０.４重量部より少ないと硬化性の低下を生
じ、２０重量部より多いと硬化が速すぎて成形時に未充
填不良などの問題が生ずる。Further, the amount of the curing accelerator (D) to be added is 1% of the total weight of the epoxy resin (A) and the phenol resin (B).
It is preferably from 0.4 to 20 parts by weight based on 00 parts by weight. If the amount is less than 0.4 part by weight, the curability is lowered. If the amount is more than 20 parts by weight, the curing is too fast, and problems such as insufficient filling during molding occur.
【００１０】本発明に用いられる無機充填剤はアルミ
ナ、溶融シリカ、結晶シリカ、クレー、タルクなどが例
示されるが、特にこれらに限定されるものではない。こ
の無機充填剤（Ｅ）の添加量は、樹脂成分（Ａ）、
（Ｂ）の総重量１００重量部に対し、４０重量部以上２
４００重量部以下が好ましく、４０重量部より少ないと
成形材料にした場合、強度の低下を招くなどの問題が生
じ、２４００重量部より多いと流動性が低下し、成形時
に未充填不良などの問題が生ずる。Examples of the inorganic filler used in the present invention include alumina, fused silica, crystalline silica, clay, and talc, but are not particularly limited thereto. The amount of the inorganic filler (E) added depends on the resin component (A),
40 parts by weight or more based on 100 parts by weight of the total weight of (B) 2
When the amount is less than 40 parts by weight, when the molding material is used, a problem such as a decrease in strength is caused. When the amount is more than 2400 parts by weight, the fluidity decreases, and problems such as insufficient filling during molding are caused. Occurs.
【００１１】[0011]
【作用】本発明に用いられるホスホニウムイオンと有機
アニオン（Ｃ）とのイオン結合体（Ｄ）はホスホニウム
イオンと有機アニオン（Ｃ）が少なくとも１個のイオン
対を形成したものであるが、この硬化促進剤（Ｄ）は常
温においてはホスホニウムイオンと有機アニオン（Ｃ）
とのイオン結合体が安定に存在しており、ホスホニウム
イオンの触媒作用を抑制し、高温にさらされる成形時に
はこのイオン結合体がすみやかに解離し、ホスホニウム
イオンが活性化し、硬化を促進する作用を有するもので
ある。この硬化促進剤（Ｄ）はエポキシ樹脂（Ａ）、フ
ェノール樹脂（Ｂ）の総重量１００重量部に対し、０.
４重量部以上２０重量部以下が好ましく、０.４重量部
より少ないと硬化性の低下を生じ、２０重量部より多い
と硬化が速すぎて成形時に流動性の低下により、未充填
不良などの問題が生ずる。The ionic complex (D) of the phosphonium ion and the organic anion (C) used in the present invention is one in which the phosphonium ion and the organic anion (C) form at least one ion pair. The accelerator (D) comprises a phosphonium ion and an organic anion (C) at room temperature.
The ionic bond with the cation is stably present, suppressing the catalytic action of the phosphonium ion, and when molding is exposed to high temperatures, this ionic bond dissociates quickly, activating the phosphonium ion and promoting the action of promoting curing. Have This curing accelerator (D) is used in an amount of 0.1 parts by weight based on 100 parts by weight of the total weight of the epoxy resin (A) and the phenol resin (B).
The content is preferably from 4 parts by weight to 20 parts by weight, and if it is less than 0.4 part by weight, the curability is reduced. Problems arise.
【００１２】[0012]
【実施例】以下、本発明を実施例により更に具体的に説
明するが、実施例及び比較例で用いた触媒テトラフェニ
ルホスホニウム-イソシアヌル酸塩（以下ＴＰＰ−ＩＣ
Ａと略す）は常法に従い作成した。EXAMPLES Hereinafter, more specifically describes the invention based on examples, Nakadachite tiger tetraphenylphosphonium catalyst used in Examples and Comparative Examples - isocyanurates (hereinafter TPP-IC
A) was prepared according to a conventional method.
【００１３】[0013]
【００１４】[0014]
【００１５】（実施例１）軟化点が６５℃でエポキシ当
量２１０のオルソクレゾールノボラックエポキシ（日本
化薬（株）製ＥＯＣＮ−１０２５−６５）６７部（以下
重量部をすべて部と略す）、軟化点が１０５℃で水酸基
当量１０４のフェノールノボラック（住友デュレズ
（株）製ＰＲ−５１４７０）３３部、硬化促進剤にＴＰ
Ｐ−ＩＣＡ ２.１部、溶融シリカ３００部、カルナバワ
ックス２部を配合し、熱ロールで９０℃８分間混練して
成形材料を得た。この成形材料のトランスファー成形に
よる１７５℃のスパイラルフローは７０cm、１７５℃キ
ュラストメータにおける９０秒後のトルクは７７kgf-cm
であり、値が大きい方が流れ性がよい。またキュラスト
メータにおけるトルクは硬化性のパラメーターであり、
値の大きい方が硬化性がよい。次にこの材料の２５℃６
ケ月間保存後のスパイラルフローは６５cmで、フロー残
存率（２５℃６ケ月間保存後フロー／初期フロー×１０
０（％））は９３％であった。Example 1 An epoxy resin having a softening point of 65 ° C.
Orthocresol novolak epoxy in quantity 210 (Japan
67 parts of EOCN-1025-65 manufactured by Kayaku Co., Ltd.
All parts by weight are abbreviated as "parts").
Phenol novolak with an equivalent of 104 (Sumitomo Durez)
33 parts of PR-51470, manufactured by TP Co., Ltd.
2.1 parts of P-ICA , 300 parts of fused silica, Carnabawa
Mix 2 parts of kneading, knead with a hot roll at 90 ° C for 8 minutes
A molding material was obtained. For transfer molding of this molding material
According 175 ° C. spiral flow 70cm, 175 ° C. key
Torque after 90 seconds in Yurasutometa is 77kgf-cm
Der is, the larger the value is good flowability. Also the curast
The torque in the meter is a hardening parameter,
The higher the value, the better the curability. Next, at 25 ° C
The spiral flow after storage for 6 months is 65 cm, and the residual flow rate (flow after storage for 6 months at 25 ° C./initial flow × 10)
0 (%)) was 93%.
【００１６】[0016]
【００１７】[0017]
【００１８】（比較例１）実施例１の硬化促進剤ＴＰＰ
−ＩＣＡ ２.１部に替えて、硬化促進剤にトリフェニル
ホスフィン（以下ＴＰＰと略す）０.８部を使用する以
外はすべて実施例１と同様の操作で材料化した。この材
料のスパイラルフローは７０cm、９０秒後のトルクは７
４kgf-cmであった。また、２５℃６ケ月間保存後のスパ
イラルフローは４８cmで、フロー残存率は６９％であっ
た。Comparative Example 1 Curing accelerator TPP of Example 1
-A material was produced in the same manner as in Example 1 except that 0.8 parts of triphenylphosphine (hereinafter abbreviated as TPP) was used as a curing accelerator instead of 2.1 parts of ICA . The spiral flow of this material is 70cm and the torque after 90 seconds is 7
It was 4 kgf-cm. The spiral flow after storage at 25 ° C. for 6 months was 48 cm, and the residual flow rate was 69%.
【００１９】（比較例２）実施例１のフェノールノボラ
ック３３部、硬化促進剤ＴＰＰ−ＩＣＡ ２.１に替え
て、フェノールノボラック３１.１部、硬化促進剤に１,
８-ジアザビシクロ[５,４,０]-７-ウンデセン（以下Ｄ
ＢＵと略す）３０％含有フェノールノボラック２.７部
（サンアプロ（株）製ＳＡ８４１）使用する以外はすべ
て実施例１と同様の操作で材料化した。この材料のスパ
イラルフローは７３cm、９０秒後のトルクは７０kgf-cm
であった。また、２５℃６ケ月間保存後のスパイラルフ
ローは４９cmで、フロー残存率は６７％であった。(Comparative Example 2) In place of 33 parts of phenol novolak and the curing accelerator TPP-ICA 2.1 in Example 1, 31.1 parts of phenol novolak and 1,1 part of curing accelerator were used.
8-diazabicyclo [5,4,0] -7-undecene (hereinafter D
A material was produced in the same manner as in Example 1 except that 2.7 parts of 30% phenol novolak (abbreviated as BU) (SA841 manufactured by San Apro Co., Ltd.) was used. The spiral flow of this material is 73cm, the torque after 90 seconds is 70kgf-cm
Met. The spiral flow after storage at 25 ° C. for 6 months was 49 cm, and the residual flow rate was 67%.
【００２０】[0020]
【００２１】[0021]
【００２２】[0022]
【００２３】実施例１〜４、比較例１〜５の結果をまと
めて表１に示す。Table 1 summarizes the results of Examples 1 to 4 and Comparative Examples 1 to 5.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【発明の効果】本発明による樹脂組成物は硬化性に優
れ、かつ常温における保存性が非常によく、本発明によ
る樹脂組成物を電子、電気部品用材料として用いれば、
冷蔵保存、冷蔵輸送が不要になるなど産業へのメリット
は大きい。The resin composition according to the present invention has excellent curability and excellent storage stability at room temperature. If the resin composition according to the present invention is used as a material for electronic and electric parts,
The merit for industry is great, such as refrigerated storage and refrigerated transportation are not required.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平２−206667（ＪＰ，Ａ) 特開 昭54−58795（ＪＰ，Ａ) 国際公開93／15126（ＷＯ，Ａ１) (58)調査した分野(Int.Cl.7，ＤＢ名) C08G 59/62 C08G 59/68 C08L 63/00 - 63/10 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-2-206667 (JP, A) JP-A-54-58795 (JP, A) WO 93/15126 (WO, A1) (58) Fields surveyed (Int.Cl. 7 , DB name) C08G 59/62 C08G 59/68 C08L 63/00-63/10
Claims (1)
エポキシ樹脂（Ａ）と１分子内にフェノール性水酸基を
２個以上有するフェノール樹脂（Ｂ）において、エポキ
シ基のフェノール性水酸基に対する当量比が０.５以上
２以下であり、更に硬化促進剤として、一般式（１）で
示されるホスホニウムイオン 【化１】 （以下単にホスホニウムイオンと略す。また、式中のＲ
1、Ｒ2、Ｒ3、Ｒ4は１価の芳香環を含む有機基又は１価
の脂肪族残基よりなる群より選ばれた置換基を表す）
と、イソシアヌル酸よりなるイオン対を形成し得る有機
アニオン（Ｃ）とのイオン結合体（以下単にイオン結合
体と略す）（Ｄ）を、（Ａ）＋（Ｂ）１００重量部に対
し、０.４重量部以上２０重量部以下を含有し、更に無
機充填剤（Ｅ）が（Ａ）＋（Ｂ）１００重量部に対し、
４０重量部以上２４００重量部以下含有されてなる樹脂
組成物。1. An equivalent ratio of epoxy groups to phenolic hydroxyl groups in an epoxy resin (A) having two or more epoxy groups in one molecule and a phenolic resin (B) having two or more phenolic hydroxyl groups in one molecule. Is not less than 0.5 and not more than 2, and a phosphonium ion represented by the general formula (1) is further used as a curing accelerator. (Hereinafter simply abbreviated as phosphonium ion. In the formula, R
1 , R 2 , R 3 , and R 4 represent a substituent selected from the group consisting of an organic group containing a monovalent aromatic ring or a monovalent aliphatic residue.
If, ionic compound with an organic anion (C) capable of forming an ion pair consisting of i Soshianuru acid (hereinafter simply referred to as the ionic compound) (D), relative to 100 parts by weight of (A) + (B), Containing not less than 0.4 part by weight and not more than 20 parts by weight, and further containing 100 parts by weight of (A) + (B) based on the inorganic filler (E).
A resin composition comprising 40 parts by weight or more and 2400 parts by weight or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14611694A JP3233382B2 (en) | 1993-12-20 | 1994-06-28 | Resin composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31956393 | 1993-12-20 | ||
| JP5-319563 | 1993-12-20 | ||
| JP14611694A JP3233382B2 (en) | 1993-12-20 | 1994-06-28 | Resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07228670A JPH07228670A (en) | 1995-08-29 |
| JP3233382B2 true JP3233382B2 (en) | 2001-11-26 |
Family
ID=26477034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14611694A Expired - Fee Related JP3233382B2 (en) | 1993-12-20 | 1994-06-28 | Resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3233382B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY123645A (en) | 1999-07-22 | 2006-05-31 | Sumitomo Bakelite Co | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product |
| JP5055679B2 (en) * | 2000-09-29 | 2012-10-24 | 住友ベークライト株式会社 | Thermosetting resin composition, epoxy resin molding material and semiconductor device using the same |
| WO2010084939A1 (en) * | 2009-01-23 | 2010-07-29 | 味の素株式会社 | Resin composition |
| TWI473854B (en) * | 2009-01-23 | 2015-02-21 | Ajinomoto Kk | Resin composition |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993015126A1 (en) | 1992-01-24 | 1993-08-05 | The Dow Chemical Company | Precatalyzed catalyst compositions, process for preparing resins |
-
1994
- 1994-06-28 JP JP14611694A patent/JP3233382B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1993015126A1 (en) | 1992-01-24 | 1993-08-05 | The Dow Chemical Company | Precatalyzed catalyst compositions, process for preparing resins |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07228670A (en) | 1995-08-29 |
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