JP3239692B2 - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component crimping apparatus and a method for crimping an electronic component on a display panel.

[0002]

2. Description of the Related Art A TCP (Tape Carrier Package) as a driver is provided at an edge of a display panel.
And electronic components such as flip chips are crimped. In some display panels, for example, an STN-type liquid crystal panel, TCP is pressure-bonded not only on the front side but also on the rear side of the display panel.

FIG. 3 is an external view of an STN type liquid crystal panel (hereinafter always referred to as a display panel). This display panel 11
Is composed of three glass plates P1, P2, and P3, the middle glass plate P2 is larger than the other glass plates P1 and P3, and the edges protrude outside. The edges of the display panel 11 are a front-side crimping surface 13 and a back-side crimping surface 16.
Is crimped. When the TCP 14 is pressure-bonded to the front-side pressure-bonding surface 13 of the display panel 11, the back surface 15 is first held on a horizontally movable holding table, and the TC to be pressed is pressed.
It is necessary to support the lower crimping surface 16 below P14 with a fixed lower receiving table to receive the load of the crimping tool. On the other hand, when the TCP 14 is crimped to the back side crimping surface 13, it is necessary to hold the table 12 on the surface 12 and to support the front side crimping surface 13 with the lower receiving table. By the way, the first step H1 between the front surface 12 of the display panel 11 and the front crimping surface 13 may be different from the second step H2 between the back surface 15 and the back side crimping surface 16 in some cases.

[0004]

However, the conventional electronic component crimping apparatus cannot cope with such a difference in level difference, so that an electronic device corresponding to the first level difference H1 has to be used for crimping TCP on both front and back surfaces. Component crimping device and second step H2
Two electronic component crimping devices corresponding to the above are prepared. First, the former electronic component crimping device crimps TCP only on the front side.
Next, the display panel was transferred to the latter electronic component crimping apparatus, and the rear surface side was crimped by the latter electronic component crimping apparatus.

However, in such a configuration, two electronic component crimping apparatuses must be prepared for one display panel, which not only increases the equipment cost but also increases the equipment cost.
There is a problem that the installation space also increases.

Accordingly, an object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of crimping TCP on both the front and back surfaces of a display panel by one unit.

[0007]

An electronic component crimping apparatus according to the present invention comprises: a holding table for holding a central portion of a display panel;
And handlers for transferring the display panel to the holding table, a reversing mechanism for reversing the display panel, and a lower receiving table to receive under the bottom of the crimping surface of the display panel on the holding table, the lower receiving table top and the holding table A level adjusting mechanism for adjusting a step on the upper surface, and a pressure bonding head for pressing an electronic component on a pressure bonding surface of the display panel are provided.

[0008]

According to the above construction, the electronic component is pressure-bonded to one of the front surface and the back surface held by the holding table by using the pressure bonding head on the surface-side pressure bonding surface. Then, the display panel is turned upside down using an inversion mechanism, and the electronic component is crimped to the other surface side of the front surface or the back surface of the display panel.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component crimping apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes an XY table that moves in the X and Y directions, and 2 denotes an XY table that is provided on the XY table 1 so that the upper surface can be sucked and held by the lower surface of the center of the display panel. Table), 3 is a level adjusting mechanism provided immovably in the XY directions, 4 is a lower receiving table for receiving the lower part of the crimping surface of the display panel, and the level of the upper surface of the lower receiving table 4 is
The level is set by driving the level adjusting mechanism 3 to move the lower receiving table 4 up and down. That is, the level adjusting mechanism 3 adjusts a step between the upper surface of the θ table 2 and the upper surface of the lower receiving table 4. Reference numeral 5 denotes a level control unit for controlling the operation of the level adjustment mechanism 3, and reference numeral 6 denotes a pressure bonding unit having a front pressure bonding head 7 and a rear pressure bonding head 8 provided on the upper portion of the lower receiving table 4.

Reference numeral 9 denotes an X table that moves in the X direction. Reference numeral 10 denotes a handler that protrudes from the X table 9. The handler 10 transfers the display panel 11 in the X direction. 12
Denotes a front surface of the display panel 11, and 13 denotes a front-side pressure-bonded surface exposed on the front surface 12 side of the display panel 11. Display panel 11
Is carried in a state in which the TCP 14 is temporarily crimped to the front side crimping surface 13. Of course, as shown in FIG.
Has a back surface 15 and a back side crimping surface 16.

Then, as described in the section of the prior art,
A first step H1 between the front surface 12 and the front side crimping surface 13 is different from a second step H2 between the back surface 15 and the back side crimping surface 16.

In FIG. 1, reference numeral 17 denotes a reversing mechanism for reversing the display panel 11 held on the handler 10. Reference numeral 18 denotes a drive unit that expands / contracts the shaft 19 in the Y direction or rotates the shaft 19 in the Y direction. Reference numeral 20 denotes a block fixed to the tip of the shaft 19;
Reference numeral 2 denotes a chuck attached to the front surface of the block 20 and opened and closed in the direction of arrow N1.

In the reversing mechanism of the embodiment, the display panel 11 is reversed as follows. That is, when the handler 10 is located away from the θ table 2,
By operating the drive unit 18, the shaft 19 is extended, and the display panel 11 on the handler 10 is attached to the chuck 21.
Clamp at 22. Then, the shaft 19 is retracted, and the shaft 19 is rotated by 180 degrees. Then, by extending the shaft 19 again and mounting the display panel 11 on the handler 10, the display panel 11 is turned upside down.

The electronic component crimping apparatus according to the present embodiment has the above-described configuration. Next, the operation of the apparatus will be described with reference to FIG. Here, the display panel 11 is supported on the θ table 2. The level of the upper surface of the θ table 2 is constant, and this level is hereinafter referred to as a reference level.

First, as shown in FIG.
In the previous step, the TCP 14 is the front side crimping surface 13,
Each of the back side crimping surfaces 16 is carried in a state of being temporarily crimped. The display panel 11 is placed on the handler 10 at a position away from the θ table 2 so that the front surface 12 faces upward. Then, the X table 9 is driven,
The display panel 11 is transferred onto the θ table 2 with the front surface 12 facing upward.

At this time, as shown in FIG. 2A, the upper surface of the lower receiving table 4 is positioned above the reference level by a second step H2. Then, in this state, the front pressure bonding head 7 is lowered, and the TCP 14 is pressed against the front pressure bonding surface 13.

When the crimping to the front-side crimping surface 13 is completed, the handler 10 is moved to remove the display panel 11 from the θ table 2. Then, the display panel 11 is turned upside down by the inversion mechanism 17 as described above.

Then, the display panel 11 is transferred onto the θ table 2 again with the back surface 15 facing upward. Prior to this,
The level control unit 5 operates the level adjustment mechanism 3, and FIG.
As shown in (b), the level of the upper surface of the lower receiving table 4 is set above the reference level by the first step H1. Next, the TCP 14, which is temporarily crimped on the back side crimping surface 16 of the display panel 11, is crimped by the back side crimping head 8. When this crimping is completed, the necessary TCP 14 is crimped on both the front and back surfaces of the display panel 11, and the display panel 11 is carried out of the electronic component crimping apparatus.

The present invention can be implemented with various design changes. For example, the upper surface of the lower receiving table 4 may be fixed to the reference level, and the θ table 2 may be provided with a level adjusting mechanism for adjusting the level of the upper surface of the θ table 2.

[0021]

According to the present invention, the one electronic component crimping apparatus, Runode can step of crimping surfaces are crimping electronic components on both sides of the different display panel, it is possible to reduce the equipment cost Installation space can be saved.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component crimping apparatus according to an embodiment of the present invention.

FIG. 2A is an explanatory diagram of an operation of an electronic component crimping apparatus according to an embodiment of the present invention. FIG. 2B is an operational explanatory diagram of an electronic component crimping apparatus according to an embodiment of the present invention.

FIG. 3 is an external view of a conventional STN liquid crystal panel.

[Explanation of symbols]

 Reference Signs List 1 XY table 2 θ table (holding table) 3 Level adjustment mechanism 7 Front pressure bonding head 8 Back pressure bonding head 10 Handler 11 Display panel 14 TCP

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 G02F 1/1345 H05K 13/04

Claims (3)

(57) [Claims] And 1. A holding table for holding a central portion of the display panel, and handlers for transferring the display panel to the holding table, a reversing mechanism for reversing the display panel, crimping surface of the display panel on the holding table A lower receiving table for receiving the lower part of the display table, a level adjusting mechanism for adjusting a step between the upper surface of the lower receiving table and the upper surface of the holding table, and a crimping head for crimping the electronic component to the crimping surface of the display panel. An electronic component crimping apparatus characterized by the above-mentioned. 2. The display device according to claim 1, wherein the reversing mechanism includes a display panel on the handler.
The feature is that the panel is
The electronic component crimping apparatus according to claim 1, wherein 3. A first step between the front surface and the front-side crimping portion, wherein the first step and the step are between the back surface and the back-side crimping surface.
An electronic component crimping method for crimping electronic components on both crimping surfaces of a display panel having different second steps, wherein a step between an upper surface of a holding table and an upper surface of a lower receiving table is adjusted to the second step. Holding the back side of the display panel on the upper surface of the holding table and receiving the back side pressure-bonded surface with the lower receiving table; and a front side opposite to the back side pressure-bonded surface received by the lower receiving table. A step of crimping an electronic component on a crimping surface; a step of turning the display panel upside down by a reversing mechanism ; and adjusting the step between the upper surface of the holding table and the upper surface of the lower receiving table to the first step to display the display. Holding the surface of the panel on the upper surface of the holding table, and receiving the front side crimping surface with the lower receiving table; and the back side of the surface opposite to the front side crimping surface received by the lower receiving table. An electronic component crimping method, comprising a step of crimping an electronic component on a crimp surface.