JP3255030B2 - Apparatus and method for mounting conductive ball - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for mounting conductive balls used in a process for manufacturing a work with bumps.

[0002]

2. Description of the Related Art As a method of manufacturing a work with bumps such as flip chips, a method using conductive balls is known (for example, Japanese Patent Application Laid-Open No. 61-242759). In this method, by causing the mounting head to perform a lowering / elevating operation above the container in which the conductive balls are stored, the conductive balls are vacuum-sucked into suction holes formed on the lower surface of the mounting head, and are picked up. Next, the mounting head is moved above the work, where the mounting head is again lowered and raised to mount the conductive balls on the pads of the work.

FIG. 4 is an explanatory view of a conductive ball pick-up operation of a conventional conductive ball mounting device as disclosed in the above-mentioned publication, in which a mounting head performs a lowering / upward operation and is stored in a container. FIG. 9 shows a state in which a conductive ball picked up is picked up. The conductive balls 1 are stored in a large amount in the container 2. The mounting head 3 performs a lowering / upward operation and vacuum-adsorbs and picks up the conductive ball 1 in the suction hole on the lower surface. The mounting head 3 moves down and the lower surface is placed in the conductive ball 1 layer. With the implanted,
The upper surface of the side wall of the container 2 is higher than the upper surface of the layer of the conductive ball 1 so that the conductive ball 1 does not overflow the side wall of the container 2 and spill from the container 2 (see step D). . In general, in this type of device, the conductive ball 1 is fluidized by sending gas into the container 2 or applying physical vibration such as by applying vibration to the container 2. The conductive balls 1 are vacuum-sucked in all the suction holes on the lower surface of the mounting head 3. Therefore, due to this fluidization, the conductive ball 1 is easily spilled from the container 2 as described above.

[0004]

The mounting head 3 moves the container 2 and the work in the lateral direction to mount the conductive ball 1 on the work. Move laterally at a position higher than the container 2 so as not to collide with the container 2. On the other hand, as described above,
In order to secure the step D, the side wall must be made high. Therefore, there is a problem that the vertical stroke Z1 of the descending / elevating performed by the mounting head 3 above the container 2 becomes longer, so that the tact time becomes longer and the productivity decreases. By the way, in order to reliably pick up the conductive ball 1 by vacuum suction in all the suction holes,
The vertical movement speed of the mounting head 3 needs to be reduced, and therefore, if the vertical stroke is long, a large tact time is required.

Therefore, according to the present invention, the mounting head is lowered
It is an object of the present invention to provide a conductive ball mounting apparatus and a mounting method capable of shortening a vertical stroke when picking up a conductive ball stored in a container by performing an ascending operation and improving productivity.

[0006]

According to a first aspect of the present invention, there is provided a container for storing conductive balls, a work positioning portion, a mounting head, and the mounting head being moved between the container and the work positioning portion. A moving table for moving, and a vertical movement means for causing the mounting head to perform an up and down operation, and causing the mounting head to perform a descending and ascending operation above the container so that the conductive balls stored in the container are moved. The conductive head is vacuum-adsorbed and picked up on the lower surface of the mounting head, and then the mounting head is moved above the positioning portion of the work, where the lowering and raising operations are performed again to mount the conductive balls on the work. A mounting device for a conductive ball, wherein a receiving portion for a conductive ball spilling from the container is provided on a side portion of the container, and the conductive ball collected in the receiving portion is provided with the conductive ball. Provided return means returning the vessel.

According to a second aspect of the present invention, the mounting head is caused to perform a lowering / upward operation above the container, and the conductive balls stored in the container are vacuum-adsorbed to the lower surface of the mounting head to be picked up. A method for mounting a conductive ball, wherein the mounting head is moved above the positioning portion of the work, and the lowering and raising operations are performed again to mount the conductive ball on the work. The conductive balls spilled from the container by performing the ascending operation are collected in a receiving portion provided on a side portion of the container, and the returning means is driven to collect the conductive balls collected in the receiving portion in the container. Back to.

[0008]

According to the first and second aspects of the present invention, when the mounting head picks up the conductive balls stored in the container, the conductive balls spilled out of the container are subjected to the receiving portion. And then returned to the container by return means. Therefore, since the conductive balls may spill out of the container, the height of the side wall of the container can be reduced and the vertical stroke of the mounting head can be reduced.

An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side view of a conductive ball mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a conductive ball supply unit provided in the conductive ball mounting apparatus, and FIG. FIG. 4 is an explanatory diagram of a pickup operation of a mounting head provided in a conductive ball mounting device.

In FIG. 1, a container 5 is placed on a base 4. The conductive balls 1 are stored in the container 5. Vibration means for vibrating the container 5 and gas supply means for feeding gas into the container 5 are provided inside the base 4 to fluidize the conductive balls 1 in the container 5.

In FIG. 1, reference numeral 10 denotes a work, which is positioned on a clamper 11 by a clamp. The clamper 11 is supported by a column 13 erected on a base 12. The clamper 11, the base 12, and the support 13
This is the positioning part. Reference numeral 22 denotes a mounting head.
The mounting head 22 is held below the box 23. A motor 24 is provided above the box 23. The box 23 has built-in vertical movement means such as a feed screw driven by a motor 24.
When 4 is driven, the mounting head 22 moves up and down. The mounting head 22 is connected to a pneumatic unit (not shown), and when the pneumatic unit is driven, the conductive balls 1 are vacuum-adsorbed and held in suction holes (not shown) on the lower surface of the mounting head 22. The conductive ball 1 is dropped by releasing the vacuum suction state.

The box 23 is held on a horizontally long moving table 26. The moving table 26 has a built-in feed screw mechanism. When the motor 27 is driven to operate the feed screw mechanism, the mounting head 22 is moved to the container 5 as shown by an arrow.
And the workpiece 10 in the horizontal direction.

Next, referring to FIG. 2, a supply unit of the conductive ball will be described. The container 5 is a rectangular box, around which a rectangular frame-shaped receiving portion 6 is provided. The bottom surface 6a of the receiving portion 6 is a tapered surface having a downward slope toward the container 5 side (FIG. 3A). A base plate 7 protrudes from a side wall of the base 4. A cylinder 8 as a means for vertically moving the receiving portion 6 is provided on the base plate 7.
The upper end of the rod 8 a of the cylinder 8 is connected to a tongue piece 9 extending from the receiving portion 6. Rod 8a of cylinder 8
When the is pushed down, the receiving portion 6 moves up and down. That is, the cylinder 8 serves as up-down moving means for moving the receiving portion 6 up and down relatively to the container 5. Reference numeral 14 denotes a pipe through which gas for fluidizing the conductive balls 1 in the container 5 is sent.

This conductive ball mounting device is configured as described above, and the operation will be described next. In FIG. 1, the mounting head 22 moves above the container 5 and performs a lowering / upward operation, whereby the conductive ball 1 is vacuum-adsorbed and picked up by the suction hole on the lower surface thereof. 3A to 3D sequentially show the pickup operation of the mounting head 22. The mounting head 22 arrives above the container 5 (FIG. 3A). At this time, the rod 8a of the cylinder 8 is retracted, and the receiving portion 6 is at the lowered position. As shown in FIG. 3A, the conductive balls 1 are fully stored in a container 5. Therefore, the level of the upper surface of the layer of the conductive balls 1 is substantially equal to the upper surface of the side wall of the container 5, and the vertical stroke of the mounting head 22, that is, the distance Z2 between the mounting head 22 and the upper surface of this layer is shown in FIG. It is smaller than the vertical stroke Z1 of the conventional example.

Next, the mounting head 22 is lowered to bury its lower surface in the layer of the conductive balls 1, and the conductive balls 1 are vacuum-sucked into the suction holes on the lower surface (FIG. 3B). Then, the conductive ball 1 in the container 5 overflows the side wall of the container 5 and spills on the receiving portion 6. Next, the mounting head 22 rises to pick up the conductive ball 1 and moves toward the work 10 (FIG. 3C). When the mounting head 22 leaves above the container 5, the rod 8a of the cylinder 8 protrudes and the receiving portion 6 rises (FIG. 3D). Then, the conductive balls 1 accumulated in the receiving portion 6 flow down the bottom surface 6a and return to the inside of the container 5 (see the arrow N). That is, the cylinder 8 serves as a return unit that further returns the conductive balls 1 collected in the receiving portion 6 to the container 5. Thereafter, the rod 8a of the cylinder 8 is retracted, and the receiving portion 6 returns to the lowered position shown in FIG.

As described above, when the mounting head 22 picks up the conductive balls 1 in the container 5, the conductive balls 1 may spill out of the container 5, so that the height of the side wall of the container 5 is reduced. Thus, the vertical stroke Z2 of the mounting head 22 is reduced, and the conductive balls 1 are moved at a high speed.
Can be picked up.

The mounting head 22 having picked up the conductive ball 1 as described above is mounted on the work 10 in FIG.
Move up. Then, the mounting head 22 descends to land the conductive ball 1 on the electrode of the work 10. Next, the vacuum suction state of the conductive ball 1 is released and the mounting head 2 is released.
If 2 is raised, the conductive ball 1 is mounted on the electrode of the work 10. Work 1 on which conductive ball 1 is mounted
0 is sent to a heating furnace (not shown), and the conductive balls 1 are melted and solidified by heating to form bumps.

It is to be noted that the receiving portion 6 is raised and the conductive balls 1
The timing and frequency of returning to the container 5 can be freely determined. In short, when the mounting head 22 is lowered and embedded in the layer of the conductive ball 1, the receiving portion 6 is positioned at the lowered position, What is necessary is just to be able to collect the conductive balls 1 spilling from the container 5 into the receiving portion 6.

[0019]

According to the present invention, when the mounting head performs the lowering / upward operation to pick up the conductive balls in the container, the conductive balls may spill out of the container. By lowering the height, the vertical stroke of the mounting head can be shortened, so that the mounting head can pick up the conductive balls at a high speed.

[Brief description of the drawings]

FIG. 1 is a side view of a conductive ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a conductive ball supply unit provided in the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 3 is an explanatory diagram of a pickup operation of a mounting head provided in the conductive ball mounting apparatus according to one embodiment of the present invention;

FIG. 4 is an explanatory view of a conductive ball pickup operation of a conventional conductive ball mounting apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Conductive ball 5 Container 6 Receiving part 8 Cylinder 10 Work 22 Mounting head 24 Motor 26 Moving table

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H01L 21/60 B23P 21/00 H01L 21/70

Claims (2)

(57) [Claims] 1. A container for storing conductive balls, a work positioning part, a mounting head, a moving table for moving the mounting head between the container and the work positioning part, and Up and down moving means for performing an operation, wherein the mounting head descends above the container.
The lifting operation is performed to pick up the conductive balls stored in the container by vacuum suction on the lower surface of the mounting head, and then move the mounting head above the positioning portion of the work, where it is lowered and raised again. What is claimed is: 1. An apparatus for mounting a conductive ball, wherein the conductive ball is mounted on a workpiece by performing an operation, wherein a receiving portion for a conductive ball spilling from the container is provided on a side of the container, and the receiving portion is provided. And a return means for returning the collected conductive balls to the container. 2. The mounting head performs a lowering / elevating operation above a container, and vacuum-adsorbs and picks up conductive balls stored in the container on a lower surface of the mounting head. A method of mounting a conductive ball, wherein the conductive head is moved above a positioning portion, and the lowering and raising operations are performed again to mount the conductive ball on a work, wherein the mounting head performs the lowering and raising operations. Thus, the conductive balls spilled from the container are collected in a receiving portion provided on the side of the container, and the return means is driven to return the conductive balls collected in the receiving portion to the container. A method for mounting a conductive ball, comprising: