JP3259142B2 - Molding resin material - Google Patents
Molding resin materialInfo
- Publication number
- JP3259142B2 JP3259142B2 JP13289092A JP13289092A JP3259142B2 JP 3259142 B2 JP3259142 B2 JP 3259142B2 JP 13289092 A JP13289092 A JP 13289092A JP 13289092 A JP13289092 A JP 13289092A JP 3259142 B2 JP3259142 B2 JP 3259142B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- molding resin
- resin material
- expansion coefficient
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000465 moulding Methods 0.000 title claims description 56
- 239000000463 material Substances 0.000 title claims description 55
- 229920005989 resin Polymers 0.000 title claims description 50
- 239000011347 resin Substances 0.000 title claims description 50
- 238000001746 injection moulding Methods 0.000 claims description 9
- 229920001169 thermoplastic Polymers 0.000 claims description 3
- 239000004416 thermosoftening plastic Substances 0.000 claims description 3
- 229920006038 crystalline resin Polymers 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 description 9
- 238000007792 addition Methods 0.000 description 6
- -1 polypropylene Polymers 0.000 description 5
- 239000004743 Polypropylene Substances 0.000 description 4
- 229910000174 eucryptite Inorganic materials 0.000 description 4
- 229920001155 polypropylene Polymers 0.000 description 4
- 229910000505 Al2TiO5 Inorganic materials 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- AABBHSMFGKYLKE-SNAWJCMRSA-N propan-2-yl (e)-but-2-enoate Chemical compound C\C=C\C(=O)OC(C)C AABBHSMFGKYLKE-SNAWJCMRSA-N 0.000 description 3
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【0001】[0001]
【産業上の利用分野】この発明は成形樹脂材料に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding resin material.
【0002】[0002]
【従来の技術】成形樹脂材料を用いて、例えば、射出成
形でプラスチック成形品を作るということが行われてい
るが、この成形品には成形用樹脂のもつ収縮性に起因す
るヒケやソリなどが生ずるという不都合がある。ヒケや
ソリは成形用樹脂が結晶性のもである場合や肉厚の厚い
箇所で生じやすい。勿論、これらヒケやソリなどが起こ
らないように様々な改善策がとられている。Using BACKGROUND ART molding resin material, for example, injection molding
Although it is common to make a plastic molded product in the form , the molded product has a disadvantage that sinks and warpages are caused by the shrinkage of the molding resin. Sinking and warping are likely to occur when the molding resin is crystalline or in thick places. Of course, various measures have been taken to prevent such sink marks and warpage.
【0003】まず、成形品をヒケやソリの生じ難い形状
に設計することによる改善策が一つ挙げられる。成形品
の肉厚、ボスの大きさ、リブの大きさなどを調整しヒケ
やソリを極力抑えるのである。しかしながら、この改善
策には、成形品の形状が制限されるという欠点がある。
また、金型構造を工夫することによる改善策が挙げられ
る。金型冷却管の位置やゲートの大きさを調整すること
によりヒケやソリを極力抑えるようにするのである。し
かしながら、この改善策には、金型構造が複雑化すると
いう欠点がある。[0003] First, there is one improvement measure by designing a molded product into a shape that is unlikely to cause sink marks and warpage. The thickness of the molded product, the size of the boss, and the size of the ribs are adjusted to minimize sink marks and warpage. However, this remedy has the disadvantage that the shape of the molding is limited.
Further, there is an improvement measure by devising a mold structure. By adjusting the position of the mold cooling pipe and the size of the gate, sink and warp are minimized. However, this remedy has the disadvantage that the mold structure is complicated.
【0004】この他、成形条件の調整による改善策も挙
げられる。金型温度、樹脂溶融温度、射出圧力、射出速
度などを調整することによりヒケやソリを極力抑えるよ
うにするのである。しかしながら、この改善策には、成
形条件が厳しくなるため実施が難しくなるという欠点が
ある。[0004] In addition, there are improvement measures by adjusting molding conditions. By adjusting the mold temperature, resin melting temperature, injection pressure, injection speed, etc., sinks and warpage are minimized. However, this remedy has the disadvantage that it is difficult to implement due to stricter molding conditions.
【0005】[0005]
【発明が解決しようとする課題】この発明は、上記事情
に鑑み、成形品形状の制限や金型構造の複雑化を伴わ
ず、成形条件も緩やかで、しかも、ヒケやソリが起こり
難い成形樹脂材料を提供することを課題とする。SUMMARY OF THE INVENTION In view of the above circumstances, the present invention does not involve the limitation of the shape of the molded product or the complexity of the mold structure, the molding conditions are moderate, and the molding resin is less likely to sink or warp. It is an object to provide materials.
【0006】[0006]
【課題を解決するための手段】上記課題を解決するた
め、この発明にかかる成形樹脂材料は、熱可塑性の結晶
性樹脂からなる成形用樹脂に、負の熱膨張率を有する材
料を添加してなる射出成形用の成形樹脂材料である。以
下、この発明の成形樹脂材料を詳しく説明する。成形用
樹脂(ベース樹脂)としては、特定の種類の樹脂に限定
されないが、熱可塑性の結晶性樹脂が効果が顕著にあら
われるため適当である。具体的な樹脂の種類としては、
例えば、ポリプロピレン(PP)、ナイロン(PA:ポ
リアミド)、ポリブチレンテレフタレート(PBT)な
どが挙げられる。In order to solve the above-mentioned problems, a molding resin material according to the present invention comprises a thermoplastic crystal.
A molding resin made of RESIN, a molding resin material for injection molding obtained by adding a material having a negative coefficient of thermal expansion. Hereinafter, the molding resin material of the present invention will be described in detail. The formed shape resin (base resin), but are not limited to a particular type of resin, thermoplastic crystalline resin is suitable because the effect is remarkable. Specific types of resin include:
For example, polypropylene (PP), nylon (PA: polyamide), polybutylene terephthalate (PBT) and the like can be mentioned.
【0007】この発明における負の熱膨張率を有する材
料(以下では、「熱膨張率」を単に「膨張率」と略し、
「負膨張率材料」と称する。また「熱膨張係数」を「膨
張係数」と略する。)としては、特定の種類に限定され
ないが、例えば、平均粒径15μm程度のβ−ユークリ
プタイト(膨張係数:−86×10-7/℃)、平均粒径
20μm程度のチタン酸アルミニウム(膨張係数:−1
9×10-7/℃)などが挙げられる。負膨張率材料の添
加量も、特に限定されないが、普通、〔負膨張率材料の
重量〕≦0.6×〔成形用樹脂の重量〕の範囲が好まし
い。成形用樹脂100wt%に対し負膨張率材料60wt%
以下とするのである。負膨張率材料の添加量が60wt%
を越えると成形し難くなる傾向が出てくる。In the present invention, a material having a negative coefficient of thermal expansion (hereinafter, “coefficient of thermal expansion” is abbreviated simply to “coefficient of expansion”,
It is referred to as "negative expansion coefficient material" . In addition, the coefficient of thermal expansion
Abbreviation coefficient. ) Is not limited to a specific type, but for example, β-eucryptite having an average particle size of about 15 μm (expansion coefficient: −86 × 10 −7 / ° C.), aluminum titanate having an average particle size of about 20 μm (expansion) Coefficient: -1
9 × 10 −7 / ° C.). The amount of the negative expansion coefficient material to be added is not particularly limited, but usually, the range of [weight of the negative expansion coefficient material] ≦ 0.6 × [weight of the molding resin] is preferable. 60% by weight of negative expansion material for 100% by weight of molding resin
It is as follows. 60wt% of negative expansion material
When the ratio exceeds the above, molding tends to be difficult.
【0008】また、成形用樹脂には、負膨張率材料以外
に、着色、耐熱性改善、耐候性改善、離型性改善などの
目的で、顔料、ガラス繊維、紫外線吸収剤、離型剤など
も添加してもよく、これらの添加は特に問題なく行え
る。この発明の成形樹脂材料で成形品を作製する場合の
成形法としては、例えば、射出成形が例示されるが、こ
れに限られるものではないことは言うまでもない。[0008] In addition to the negative expansion coefficient material, the molding resin may be pigments, glass fibers, ultraviolet absorbers, release agents, etc. for the purpose of coloring, improving heat resistance, improving weather resistance, and improving releasability. May be added, and these additions can be performed without any particular problem. As a molding method for producing a molded article with the molding resin material of the present invention, for example, injection molding is exemplified, but it goes without saying that the molding method is not limited to this.
【0009】[0009]
【作用】この発明の成形樹脂材料を用いて成形を行った
場合、成形温度から室温に下がるに従い成形用樹脂は収
縮するが、負膨張率材料は逆に膨張する。そのため、成
形用樹脂の収縮分が、丁度、負膨張率材料の膨張で吸収
される(補なわれる)かたちとなって、ヒケやソリが起
こり難くなる。When molding is performed using the molding resin material of the present invention, the molding resin shrinks as the molding temperature falls to room temperature, but the negative expansion coefficient material expands conversely. Therefore, the shrinkage of the molding resin is just absorbed (supplemented) by the expansion of the negative expansion coefficient material, and sinking and warping hardly occur.
【0010】この発明の場合、成形樹脂材料自体に工夫
を凝らすことでヒケやソリを起こり難くする改善策であ
るため、成形品形状の制限や金型構造の複雑化を伴わ
ず、成形条件が特定の範囲に限られ厳しくなるというこ
とも事実上ない。In the case of the present invention, since it is an improvement measure that makes sinks and warpage less likely to occur by devising the molding resin material itself, the molding conditions are not limited without limiting the shape of the molded product and complicating the mold structure. It is practically not limited to a specific range and becomes severe.
【0011】[0011]
【実施例】以下、この発明の実施例を説明する。勿論、
この発明は、下記の実施例に限らない。 −実施例1− 実施例1では下記の成形樹脂材料を用い、図1および図
3に示す成形品を射出成形で作製した。成形温度は26
0℃である。Embodiments of the present invention will be described below. Of course,
The present invention is not limited to the following embodiments. -Example 1-In Example 1, the following molded resin material was used, and molded articles shown in FIGS. 1 and 3 were produced by injection molding. Molding temperature is 26
0 ° C.
【0012】図1の成形品1は平板2の裏面中央に円柱
3が起立した形状である。図3の成形品6は箱体7の右
寄りに仕切り8のある形状である。なお、図中の寸法を
示す数字の単位はmmである。 実施例1の成形樹脂材料 成形用樹脂:ポリプロピレ
ン,負膨張率材料の種類:β−ユークリプタイト,負膨
張率材料の添加量:30.0wt% −実施例2− 実施例2では下記の成形樹脂材料を用い、図1および図
3に示す成形品を射出成形で作製した。成形温度は26
0℃である。The molded article 1 shown in FIG. 1 has a shape in which a column 3 is erected at the center of the back surface of a flat plate 2. The molded article 6 in FIG. 3 has a shape with a partition 8 on the right side of the box 7. The unit of the numeral indicating the dimension in the drawing is mm. Molding resin material of Example 1 Molding resin: polypropylene, type of negative expansion coefficient material: β-eucryptite, addition amount of negative expansion coefficient material: 30.0 wt%-Example 2-In Example 2, the following molding was performed. A molded article shown in FIGS. 1 and 3 was produced by injection molding using a resin material. Molding temperature is 26
0 ° C.
【0013】実施例2の成形樹脂材料 成形用樹脂:ポ
リプロピレン,負膨張率材料の種類:チタン酸アルミニ
ウム,負膨張率材料の添加量:50.0wt% −実施例3− 実施例3では下記の成形樹脂材料を用い、図1および図
3に示す成形品を射出成形で作製した。成形温度は26
0℃である。Molding resin material of Example 2 Molding resin: polypropylene, type of negative expansion coefficient material: aluminum titanate, addition amount of negative expansion coefficient material: 50.0 wt%-Example 3-In Example 3, Using the molding resin material, molded articles shown in FIGS. 1 and 3 were produced by injection molding. Molding temperature is 26
0 ° C.
【0014】実施例3の成形樹脂材料 成形用樹脂:ナ
イロン,負膨張率材料の種類:β−ユークリプタイト,
負膨張率材料の添加量:10.0wt% −実施例4− 実施例4では下記の成形樹脂材料を用い、図1および図
3に示す成形品を射出成形で作製した。成形温度は26
0℃である。Molding resin material of Example 3 Molding resin: nylon, type of negative expansion coefficient material: β-eucryptite,
Addition amount of negative expansion coefficient material: 10.0 wt%-Example 4 In Example 4, the following molded resin materials were used, and molded articles shown in FIGS. 1 and 3 were produced by injection molding. Molding temperature is 26
0 ° C.
【0015】実施例4の成形樹脂材料 成形用樹脂:ナ
イロン,負膨張率材料の種類:チタン酸アルミニウム,
負膨張率材料の添加量:25.0wt% −実施例5− 実施例5では下記の成形樹脂材料を用い、図1および図
3に示す成形品を射出成形で作製した。成形温度は28
0℃である。Molding resin material of Example 4 Molding resin: nylon, type of negative expansion coefficient material: aluminum titanate,
Addition amount of negative expansion coefficient material: 25.0% by weight-Example 5 In Example 5, the following molded resin material was used, and molded articles shown in FIGS. 1 and 3 were produced by injection molding. Molding temperature is 28
0 ° C.
【0016】実施例5の成形樹脂材料 成形用樹脂:ポ
リブチレンテレフタレート,負膨張率材料の種類:β−
ユークリプタイト,負膨張率材料の添加量:20.0wt
% −比較例1− 実施例1において負膨張率材料を添加しない他は同じで
ある成形樹脂材料を用いた他は実施例1と同様にして成
形品を作製した。Molding resin material of Example 5 Molding resin: polybutylene terephthalate, type of negative expansion coefficient material: β-
Addition amount of eucryptite and negative expansion material: 20.0wt
%-Comparative Example 1-A molded article was produced in the same manner as in Example 1 except that the same molding resin material was used except that the negative expansion coefficient material was not added.
【0017】−比較例2− 実施例3において負膨張率材料を添加しない他は同じで
ある成形樹脂材料を用いた他は実施例3と同様にして成
形品を作製した。 −比較例3− 実施例5において負膨張率材料を添加しない他は同じで
ある成形樹脂材料を用いた他は実施例5と同様にして成
形品を作製した。Comparative Example 2 A molded product was produced in the same manner as in Example 3 except that the same molding resin material was used except that the negative expansion coefficient material was not added. Comparative Example 3 A molded article was produced in the same manner as in Example 5, except that the same molding resin material was used except that the negative expansion coefficient material was not added.
【0018】実施例および比較例で得られた成形品につ
いて、図1の成形品1については図2中に示すヒケ深さ
LAを、図3の成形品8については図4中に示すソリ量
LBをそれぞれ測定した。測定結果は、以下の通りであ
る。 実施例1 ヒケ深さ: 48μm ソリ量:0.4mm 実施例2 ヒケ深さ: 65μm ソリ量:0.5mm 比較例1 ヒケ深さ:125μm ソリ量:1.3mm 実施例3 ヒケ深さ: 47μm ソリ量:0.5mm 実施例4 ヒケ深さ: 42μm ソリ量:0.4mm 比較例2 ヒケ深さ: 89μm ソリ量:1.0mm 実施例5 ヒケ深さ: 40μm ソリ量:0.3mm 比較例3 ヒケ深さ: 75μm ソリ量:0.7mm 実施例と比較例の測定結果を比べれば、この発明の成形
樹脂材料ではヒケやソリが起こり難くなったことがよく
分かる。With respect to the molded products obtained in the examples and comparative examples, the sink depth LA shown in FIG. 2 for the molded product 1 in FIG. 1 and the warpage amount shown in FIG. 4 for the molded product 8 in FIG. LB was measured respectively. The measurement results are as follows. Example 1 Sinking depth: 48 μm Warpage amount: 0.4 mm Example 2 Sinking depth: 65 μm Warpage amount: 0.5 mm Comparative Example 1 Sinking depth: 125 μm Warpage amount: 1.3 mm Example 3 Sinking depth: 47 μm Warp amount: 0.5 mm Example 4 Sink depth: 42 μm Warp amount: 0.4 mm Comparative Example 2 Sink depth: 89 μm Warp amount: 1.0 mm Example 5 Sink depth: 40 μm Warp amount: 0.3 mm Comparative example 3 sink depth: 75 μm warpage amount: 0.7 mm Comparing the measurement results of the example and the comparative example, it can be clearly understood that sink and warpage hardly occurred in the molded resin material of the present invention.
【0019】[0019]
【発明の効果】この発明の成形樹脂材料は、成形用樹脂
の収縮分が負膨張率材料の膨張で吸収されるかたちとな
るため、ヒケやソリが起こり難く、成形樹脂材料自体に
工夫を凝らすことでヒケやソリを起こり難くする改善策
であるため、成形品形状の制限や金型構造の複雑化を伴
わず、成形条件が特定の範囲に限られ厳しくなるという
ことも事実上なく、したがって、この発明は非常に有用
である。According to the molding resin material of the present invention, since the shrinkage of the molding resin is absorbed by the expansion of the negative expansion coefficient material, sink and warp hardly occur, and the molding resin material itself is devised. Because it is an improvement measure that makes sinks and warpage less likely to occur, molding conditions are limited to a specific range and are not strict, without limiting the shape of the molded product and complicating the mold structure, and therefore, The present invention is very useful.
【図面の簡単な説明】[Brief description of the drawings]
【図1】実施例および比較例で作製した成形品の外観を
あらわす斜視図である。FIG. 1 is a perspective view showing the appearance of molded articles produced in Examples and Comparative Examples.
【図2】図1の成形品のヒケ深さ測定箇所を示す説明図
である。FIG. 2 is an explanatory view showing locations where sink marks are measured on the molded article of FIG. 1;
【図3】実施例および比較例で作製した他の成形品の外
観をあらわす斜視図である。FIG. 3 is a perspective view showing the appearance of another molded article produced in the example and the comparative example.
【図4】図3の成形品のソリ量の測定箇所を示す説明図
である。FIG. 4 is an explanatory view showing locations where the warpage amount of the molded article in FIG. 3 is measured.
1 成形品 6 成形品 LA ヒケ深さ LB ソリ量 1 molded product 6 molded product LA sink mark depth LB warpage
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) C08L 1/00 - 101/16 C08K 3/00 - 13/08 ──────────────────────────────────────────────────続 き Continuation of front page (58) Field surveyed (Int. Cl. 7 , DB name) C08L 1/00-101/16 C08K 3/00-13/08
Claims (2)
脂に、負の熱膨張率を有する材料を添加してなる射出成
形用の成形樹脂材料。To 1. A molding resin made of a thermoplastic crystalline resin, formed by adding a material having a negative coefficient of thermal expansion injection molding
Molding resin material for shapes .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13289092A JP3259142B2 (en) | 1992-05-25 | 1992-05-25 | Molding resin material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13289092A JP3259142B2 (en) | 1992-05-25 | 1992-05-25 | Molding resin material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05320408A JPH05320408A (en) | 1993-12-03 |
| JP3259142B2 true JP3259142B2 (en) | 2002-02-25 |
Family
ID=15091948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13289092A Expired - Fee Related JP3259142B2 (en) | 1992-05-25 | 1992-05-25 | Molding resin material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3259142B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19751542A1 (en) | 1997-11-20 | 1999-07-29 | Siemens Ag | Plastics material with spherical silicon dioxide filler of specific particle size and having negative coefficient of thermal expansion |
-
1992
- 1992-05-25 JP JP13289092A patent/JP3259142B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05320408A (en) | 1993-12-03 |
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