JP3274643B2 - connector - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to PGA (Pin).
Grid Array type IC package and MCM (M
The present invention relates to a connector for connecting a low-profile package such as a multi chip module on a substrate.

[0002]

FIG. 9 is a longitudinal sectional view of a conventional connector.

This connector includes a socket contact 510 connected to a printed circuit board 600 by soldering, a base insulator 520 to which the socket contact 510 is fixed, and a socket contact 5.
10 is provided with a cover insulator 530 in which a pin insertion hole 531 for guiding the pin 710 of the PGA type IC package 700 is formed.

[0004] This connector is used as follows.

The terminal 511 of the socket contact 510 inserted into the base insulator 520 is connected to the printed circuit board 600 by soldering, and the IC package 70
0 is inserted into the pin insertion hole 531 of the cover insulator 530, and then the cover insulator 530 is inserted.
Is applied in the lateral direction (the left-right direction in FIG. 9) to move the cover insulator 530. The IC package 700 moves with the movement of the cover insulator 530, and the pins 710 are fitted into the socket contacts 510.

[0006]

However, in the conventional connector, all pins 7 of the PGA type IC package 700 are not provided.
Since the pins 10 are simultaneously fitted into the socket contacts 510, there is a problem that when the number of pins 710 is large, a considerable force is required to move the cover insulator 530.

The present invention has been made in view of such circumstances, and an object thereof is to provide a connector capable of fitting a pin of a pin stand package and a socket contact with a small force.

[0008]

According to a first aspect of the present invention, there is provided a connector comprising: a fixed contact connected to a printed circuit board; a base insulator to which the fixed contact is fixed; And a cover insulator provided with a plurality of pin insertion holes for guiding a plurality of pins of the pin stand package. A spring part,
A wedge contact that is disposed between the base insulator and the cover insulator and that can be inserted between the pin and one of the spring portions against the elastic force of the spring portion; and the base insulator and the cover. A drive insulator that is relatively movable with respect to the insulator and moves the wedge contact in a direction perpendicular to the pins. possible der is, the wedge contact
Is inserted between the pin and one of the springs of the spring portion.
The pin is not in contact with one of the springs
Without touching, it comes into contact with the other spring, and the wedge contact
Inserted between the pin and one of the springs
When the pin is deformed and the other spring of the spring portion
It is characterized in that the contact force increases .

By moving the drive insulator and moving the wedge contact in a direction perpendicular to the pins of the pin stand package, the wedge contact is moved between the pin and one of the springs of the spring portion against the elastic force of the spring portion. The pin is inserted between the spring portion and the wedge contact. The drive insulator is constituted by a plurality of members, and is moved independently.

A connector according to a second aspect of the present invention is the connector according to the first aspect, wherein a bent portion for preventing deformation of the pin is formed in the spring portion.

Since the bent portion for preventing the deformation of the pin is formed in the spring portion, the deformation of the pin is prevented by the bent portion when the wedge contact is to be fitted between the spring portion and the pin. You.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of a connector according to a first embodiment of the present invention.

The connector is a cover insulator 30
, A base insulator 10, and an operation lever 80 for moving a drive insulator (not shown) disposed between the base insulator 10 and the cover insulator 30.

FIG. 2 is a cross-sectional view showing an unmated state of the connector according to the first embodiment of the present invention, FIG. 3 is a view taken in the direction of the arrow A in FIG. 2, and FIG. FIG.

This connector is provided with a base insulator 2
0, a socket contact (fixed contact) 10,
A drive insulator 40, a wedge contact 50,
And a cover insulator 30.

The socket contact 10 has a terminal portion 11, a press-fit portion 12, and a spring portion 13 composed of a pair of springs 13a and 13b.

The terminal section 11 is connected to the surface of the printed circuit board 60 by soldering.

The press-fitting portion 12 has a U-shaped cross section, and is fixed to the mounting hole 21 of the base insulator 20 by press-fitting.

The springs 13a and 13b are opposed to each other with a pin 71 standing on a PGA package (pin package) 70 on which an IC chip is mounted. The pin 71 does not contact one of the springs 13a, but the other spring 13b
(See FIG. 4).

The cover insulator 30 has a plurality of pin insertion holes 31 for guiding a plurality of pins 71 to the socket contacts 10. The pin insertion hole 31 has an inner diameter larger than the outer diameter of the pin 71, and has a tapered surface 31a that extends from the intermediate portion toward the upper surface of the cover insulator 30.

The cover insulator 30 is fixed to the base insulator 20.

The wedge contact 50 is fixed to the mounting hole of the drive insulator 40 by press fitting. A wedge-shaped insertion portion 51 having a sectional shape inserted between the pin and the spring 13a is formed below the wedge contact 50 (see FIGS. 2 and 3).

The drive insulators 40 are composed of a plurality of members, each of which is independently movable relative to the base insulator 20 and the cover insulator 30. The drive insulator 40 can move in a direction perpendicular to the pins 71 (the left-right direction in FIG. 2).

Each drive insulator 40 is provided with an eccentric cam 81 constituting a drive mechanism for moving each drive insulator 40.

The eccentric cam 81 is connected to the base insulator 20
The shaft 82 is rotatably supported on the shaft 82.
The operation lever 80 (see FIG. 1) is attached to the control panel.

FIG. 5 is a sectional view showing a fitted state of the connector according to the first embodiment of the present invention, FIG.
FIG. 7 is a sectional view taken along line VII-VII in FIG.

When the eccentric cam is rotated by 90 ° by operating the operating lever from the state shown in FIG.
0 moves in a predetermined direction (left direction in FIG. 2) (see FIG. 5).

As a result, as shown in FIGS. 6 and 7, the wedge contact 50 is inserted between one of the springs 13a and the pin 71 against the elastic force of the spring portion 13, and the pin 71 is It fits with the wedge contact 50.

The above operation is performed on all drive insulators 40.
Do about.

At this time, the pin 71 is connected to the wedge contact 5
Although the PGA-type IC package 70 is hardly moved in the moving direction of the drive insulator 40 due to the flexibility of the pins 71, the PGA type IC package 70 is deformed in the moving direction of the drive insulator 40 by the insertion of 0.

The pin 71 is moved by the wedge contact 50 in the direction of deformation of the spring portion 13 (the spring 13a and the spring 13b).
However, the PGA type IC package 70 hardly moves in the deformation direction of the spring portion 13 due to the flexibility of the pins 71.

According to the above embodiment, the pins 71 of the PGA type IC package 70 need only be fitted between one of the springs 13a and the wedge contacts for each drive insulator 40. The pin 71 can be fitted with a smaller operating force than the conventional example in which the fitting is performed, so that the driving mechanism for moving the driving insulator 40 can be reduced in size and weight.

Since the socket contact 10 is fixed to the base insulator 20 and the wedge contact 50 is fixed to the drive insulator 40, assembly is easy (improvement of assemblability).

Further, since the socket contact 10 is fixed to the base insulator 20, mounting on the printed circuit board 60 is easy (improvement in mounting).

FIG. 8 is a perspective view illustrating a socket contact used in the connector according to the second embodiment of the present invention.

In the second embodiment, the socket contact 1
Only the structure 10 is different from the first embodiment.

One spring 1 of the socket contact 110
A bent portion 111 is provided integrally with 13a. The bent portion 111 is formed by bending 90 ° in the direction of the other spring 113b.

According to the second embodiment, the same effect as that of the first embodiment can be obtained, and when the wedge contact 50 is fitted between the spring portion 113 and the pin 71, the bent portion is formed. The force acting on the pin 71 at 111 can prevent the pin 71 from being deformed.

The bent portion 111 is connected to the other spring 113
b, or may be provided on each of the springs 113a and 113b.

Although the terminal 11 is connected to the surface of the printed board 60 by soldering, the terminal 11 may be connected to a through hole of the printed board 60.

[0042]

As described above, according to the connector of the first aspect of the present invention, since the drive insulators are composed of a plurality of members and are moved independently of each other, all pins of the pin stand package are simultaneously fitted. The pin can be fitted with a smaller operating force than in the case of fitting.

According to the connector of the second aspect, when the wedge contact is to be fitted between the spring portion and the pin, the bent portion prevents the pin from being deformed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a connector according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing an unfit state of the connector according to the first embodiment of the present invention.

FIG. 3 is a view taken in the direction of the arrow A in FIG. 2;

FIG. 4 is a sectional view taken along the line IV-IV in FIG. 2;

FIG. 5 is a sectional view showing a fitted state of the connector according to the first embodiment of the present invention.

FIG. 6 is a view as viewed in the direction of arrow B in FIG. 5;

FIG. 7 is a sectional view taken along line VII-VII in FIG. 5;

FIG. 8 is a perspective view illustrating a socket contact used in a connector according to a second embodiment of the present invention.

FIG. 9 is a longitudinal sectional view of a conventional connector.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Socket contact (fixed contact) 13,113 Spring part 20 Base insulator 30 Cover insulator 31 Pin insertion hole 40 Drive insulator 50 Wedge contact 60 Printed circuit board 70 PGA type IC package (Pin stand package) 111 Bent part

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-10-189195 (JP, A) JP-A-56-158661 (JP, A) JP-A 5-38774 (JP, U) JP-A 60-1985 162391 (JP, U) Japanese Utility Model Showa 58-123581 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 33/76 H01L 23/32

Claims (2)

(57) [Claims] 1. A fixed contact connected to a printed circuit board, a base insulator to which the fixed contact is fixed, and a cover formed with a plurality of pin insertion holes for guiding a plurality of pins of a pin stand package in the fixed contact. A connector provided on the fixed contact and comprising a pair of springs opposed to each other with the pin interposed therebetween; and a spring portion disposed between the base insulator and the cover insulator. A wedge contact that can be inserted between the pin and one of the springs against the elastic force of the pin, and that is relatively movable with respect to the base insulator and the cover insulator, and that the wedge contact is attached to the pin. A drive insulator for moving in a direction orthogonal to the direction, Serial drive insulator is composed of a plurality of these drive insulator Ri each independently movable der, the wedge contacts one of said pins and said spring portion
When the pin is not inserted between the spring and the
The wedge contact does not contact one spring of the ridge but contacts the other spring .
When inserted between the spring and the pin deforms the pin
A connector characterized in that a contact force of a spring portion with another spring is increased . 2. The connector according to claim 1, wherein a bent portion for preventing deformation of the pin is formed in the spring portion.