JP3293370B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC package which is connected and arranged on a printed wiring board, exchangeably mounts an IC package, and
The present invention relates to an IC socket in which a C package is electrically connected to a printed wiring board.
I suitable for grid array type IC package
Regarding C socket.

[0002]

2. Description of the Related Art Normally, when an IC package is loaded into an IC socket, the IC package is placed on a mounting portion of the IC socket from above, and good contact with contact pins provided on the IC socket is maintained. Like that.
An IC package loaded in such an IC socket has a flat shape usually sealed with an epoxy resin or the like, and its connection terminals are roughly divided so as to protrude vertically from a substrate surface parallel to the package. And
Some packages extend in the horizontal direction.

According to the present invention, there is provided an IC package comprising:
An IC package IC provided such that connection terminals protrude vertically from a substrate surface parallel to the package.
Although the present invention relates to a C socket, its effect is particularly great when applied to a ball grid array type IC package. One example of this ball grid array type IC package is a plan view of FIG.
As shown in the side view of FIG. 1, on a lower surface of a substrate 1b integrated with a main body 1a of an IC package 1, a connection terminal 1c having a ball-shaped spherical surface usually formed of a low melting point metal such as solder is provided. A plurality of them are arranged vertically and horizontally.

[0004]

However, when the above-mentioned connection terminal is brought into contact with the contact pin, the material of the connection terminal is relatively brittle and easily broken, so that a conventional method for appropriately obtaining the contact pressure has been used. However, there has been a problem that a method for obtaining a good effect is hardly found, and a method that seems to be effective has a problem that an IC socket becomes expensive. Further, in the case of other types of IC sockets for IC packages, there is known an IC socket for performing wiping (rubbing and wiping off an oxide film on a contact surface) between a connection terminal and a contact pin at the time of loading. At least in the case of an IC socket for an IC package, which is the object of the present invention, an effective configuration is not known.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem. It is an object of the present invention to provide connection terminals such that connection terminals protrude vertically from a plane parallel to a flat type IC package. An object of the present invention is to provide an IC socket for an IC package in which an appropriate contact pressure is obtained between a connection terminal and a contact pin and wiping is performed effectively.

[0006]

In order to achieve the above object, an IC socket according to the present invention comprises a main body case and a main body.
And mounting means for mounting said IC package in which a plurality of through-holes are provided is fixed to the case so as to correspond to a plurality of connection terminals of the IC package, its distal end is implanted in the body casing in the through hole Loosely fitted and fits the mounting means described above
A first direction and a direction substantially orthogonal to the first direction on a plane
A plurality of contact pins configured to be displaceable in a second direction so as to be able to contact a plurality of connection terminals of the IC package; and pressing means provided to be vertically movable above the main body case; Movable means for sequentially displacing the contact pin in a first direction and a second direction substantially orthogonal to the first direction on a plane of the placing means in conjunction with the vertical movement of the pressing means. I have.

[0007] In addition, the IC socket of the present invention as described above
Wherein the movable means extends through the contact pin.
A plurality of through-holes, and
And the contact pin interlocked with the pressing means.
Are sequentially displaced in the first direction and the second direction.
Then, a suitable configuration is obtained.

Further, in the IC socket of the present invention,
The movable means is interlocked with the pressing means, on the plane
Forward in a first direction and a second direction substantially perpendicular to the first direction;
Next, the contact pins are displaced sequentially.
The movable means may be interlocked with the pressing means.
And a first direction perpendicular to the plane and a second direction along the plane.
2 so that the contact pins are moved sequentially.
May be sequentially displaced.

[0009]

When the pressing member is depressed, the movable member first performs a first movement in a horizontal direction orthogonal to the depressing direction. Therefore, the contact pin loosely fitted into the through hole of the movable member moves in the first direction following the inner peripheral end face of the through hole. Next, the movable member performs a second movement in a direction orthogonal to the movement direction on the same horizontal plane. Therefore, the contact pin also follows the second direction orthogonal to the first direction by its own spring behavior. In this state, the IC package is inserted from above with its connection terminals facing down, and mounted on the mounting portion. In this case, since the contact pins are moving in the second direction, the connection terminals are without having contact with this the contact pins are mounted horizontally.

Next, when the pressing force by the pressing member is released, first, the movable member performs the returning operation of the second movement.
Therefore, the contact pin also performs the above-described return operation in the second direction against its own spring behavior, and the tip portion abuts on the side surface of the connection terminal. Due to the spring pressure of the contact pin, the contact pressure between the connection terminal and the contact pin can be obtained reasonably and appropriately. Further, when the pressing force by the pressing member is released, the movable member performs the returning operation of the first movement. Therefore, the contact pin is pressed against the inner peripheral end surface of the through hole, is moved against its own spring behavior, and performs the return operation in the first direction. At that time, the contact pin contacts the side surface of the connection terminal. Since the return operation is performed by rubbing the connection terminal with its tip, a good wiping action can be obtained between the connection terminal and the contact pin. After the IC package is loaded in this manner, the IC package can be easily removed from the IC socket by pressing down the pressing member again so that the connection terminal is not in contact with the contact pin.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment A first embodiment of the present invention will be described with reference to FIGS. FIG. 3 is a plan view showing a state in which the IC package 1 as shown in FIGS. 1 and 2 is loaded in the IC socket of the present embodiment. 4 is a cross-sectional view as viewed from the line AA in FIG. 3, and FIG. 5 is a cross-sectional view as viewed from the line BB in FIG. FIG.
7 is an enlarged view of a main part in FIG. 4, and FIG. 7 is an enlarged view of a main part in FIG.

First, the configuration of this embodiment will be described. In FIG. 4, the shafts 3 and 4 are fixed to the case body 2,
The movable plate 5 is mounted so as to be able to move horizontally in the left-right direction using the shafts 3 and 4 as guides. This movable plate 5
As shown in FIG. 5, the shaft can be moved horizontally in the left-right direction in FIGS.
As shown in FIG. 3, the movable plate 5 has shaft portions 5a, 5a.
b, 5c and 5d are formed so as to protrude in all directions. A fixed plate 6 is integrally attached to the case main body 2 above the movable plate 5. The fixed plate 6 has inclined surfaces 6a, 6b, 6c, 6 so as to form a square on its upper surface.
d is formed, and constitutes a mounting portion for loading the IC package 1 in the square. Accordingly, the ball grid array type IC package 1 is securely mounted on the mounting portion as shown in the figure by being guided by these inclined surfaces.

The case body 2 has a plurality of contact pins 7.
Are implanted, but most of them are indicated only by dash-dot lines, and only some of them are explicitly shown. The lower ends of the contact pins 7 protrude from the case body 2 to the outside and are connected to a printed wiring board as is well known. The upper end of the contact pin 7 is
And the fixing plate 6 are loosely fitted into through holes 5e and 6e provided by the number of connection terminals 1c and the number of contact pins 7, respectively. This state is clearly shown in the enlarged views of FIGS. The upper end of the contact pin 7 is bent substantially at a right angle. When the IC package 1 is loaded, the movable plate 5 moves to the left in FIG. 6 and is pressed against the connection terminal 1c against its habit. In FIG. 7, the movable plate 5 is pushed to the right by the movement of the movable plate 5 to the right.

A pressing member 8 is attached to the case body 2 so as to be vertically movable. This pressing member 8 has I
Opening 8a so that C package 1 can be inserted from above
Are formed, and have shaft portions 8b at four corners as shown in FIG. The tips of these shaft portions 8b are
Is fitted in a hole (not shown) provided in the. The spring 9 wound around each shaft portion 8b pushes the pressing member 8 upward, but the claw portions 8 provided at two places of the pressing member 8 are provided.
c is locked by a claw portion 2a provided on the case body 2,
The position shown in FIG. 4 is maintained.

The pressing member 8 has four sets of cam portions 8.
d, 8e, 8f, and 8g are provided, and the shaft portions 5a, 5b, 5c, and 5d of the movable plate 5 each having an elliptical cross section.
Is sandwiched. These cam portions 8d, 8e, 8f, 8
g, a slope portion (see the shape of the cam portion 8d in FIG. 4 and the cam portion 8e in FIG. 5) is formed, and when the pressing member 8 is pressed down, the cam portions 8d and 8f cause the movable plate 5 to move. In FIG. 4, the cam 8 is moved to the right.
e and 8g move the movable plate 5 to the left in FIG. The position at which the slopes are formed is such that the movable plate 5 is moved to the left in FIG. 5 and then to the right in FIG. ing.

Next, the IC package 1 in the present embodiment
Will be described. Since each drawing shows the mounting state of the IC package 1, the operation of taking out the IC package 1 from the IC socket will be described first.
When the pressing member 8 is slowly pressed down from above against the spring 9, the movable plate 5 is firstly moved by the cam portions 8e and 8g as shown in FIG.
7 and in FIG. Therefore, the contact pin 7 also follows the left direction in FIGS. 5 and 7 due to its own spring behavior. When the pressing member 8 is further pressed down from this state, the cam portions 8d and 8f move the movable plate 5 rightward in FIGS. 4 and 6. Therefore, the contact pin 7 follows rightward in FIGS. 4 and 6 due to its own spring behavior, releases the pressing force on the connection terminal 1c, and is completely separated from the connection terminal 1c. Accordingly, in this state, the IC package 1 can be freely taken out from the opening 8a.

The operation of mounting the IC package 1 on the IC socket is similar to the above-mentioned case. First, the pressing member 8 is pressed down from above against the spring 9. In this state, the IC
The package 1 is inserted through the opening 8a, and the inclined surfaces 6a, 6
It is mounted on the mounting portion of the fixed plate 6 defined by b, 6c and 6d. In this state, the connection terminal 1c and the contact pin 7 are not yet in contact.

Next, when the pressing on the pressing member 8 is released,
First, the movable plate 5 is moved by the cam portions 8d and 8f in FIGS.
Move to the left at. Therefore, the contact pin 7
Is pressed by the through hole 5e of the movable plate 5 and contacts the side surface of the connection terminal 1c against its own spring behavior. As described above, the contact pin 7 contacts the side surface of the connection terminal 1c with a flat surface regardless of the end surface of the tip, so that the connection terminal 1c is not damaged, and the connection terminal 1c is formed by the through hole 5e.
c is forcibly pressed, but since the connection terminal 1c is in contact with the inner wall surface of the through hole 6e of the fixing plate 6, the connection terminal 1c is not deformed or peeled off from the substrate 1b. 1c can be obtained with a sufficient contact pressure.

Thereafter, when the pressing force on the pressing member 8 is further released, the movable plate 5 is moved rightward in FIGS. 5 and 7 by the cam portions 8e and 8g. for that reason,
The contact pin 7 is pushed by the through-hole 5e of the movable plate 5, and is pushed rightward in FIGS. At this time, the contact pin 7 is connected to the connection terminal 1
c, the wiping is performed and the connection terminal 1
Even if there is an oxide film or dirt on the surface of the contact c or the contact pin 7, it is wiped off neatly and a good electrical connection between the two is enabled.

In the configuration of the above embodiment, the movable plate 5
Is disposed below the fixed plate 6 and the movable plate 5 is
Although the movable plate is moved by d, 8e, 8f, and 8g, the fixed plate 6 in this embodiment is integrally formed with the movable plate 5 to form a movable plate, and another movable plate having a plurality of through holes thereunder is provided. Even if a fixing plate is provided, the same operation and effect can be obtained. This means that the movable plate 5 in this embodiment is fixed to the case body 2 and the fixed plate 6 is connected to the cam portions 8d, 8e,
It is equivalent to moving by 8f and 8g, and these modes are all embodiments of the present invention.

In the present embodiment, when the IC package 1 is mounted, the contact pins 7 move in two directions substantially orthogonal to each other after the IC package 1 is mounted. Through hole 5e of movable plate 5
However, the method of using this elastic deformation is reversed, and in this case, the movement in two directions may be performed by their own spring habits, or in one direction. It is also possible to perform the operation in the spring behavior in the other direction and against the spring behavior in the other direction.

Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a plan view showing a state where the IC package 1 as shown in FIGS. 1 and 2 is not loaded in the IC socket of this embodiment. FIG. 9 is a cross-sectional view taken along line CC of FIG. 8 when the IC package 1 is loaded.
0 is a cross-sectional view as viewed from the line DD in FIG. FIG. 11 is a plan view of the movable plate 15 in the present embodiment, FIG. 12 is an enlarged view of a main part in FIG. 9, and FIG. 13 is an enlarged view of a main part in FIG.

First, the configuration of this embodiment will be described. In FIG. 9, the movable plate 15 is pushed upward by four springs 11 provided between the movable plate 15 and the case body 12, but the two claw portions 15 a are locked by the claw portions 12 a of the case body 12, The position shown is retained. Although a plurality of contact pins 17 are implanted in the case main body 12, most of them are omitted and only a part thereof is clearly shown.

The lower end of the contact pin 17 protrudes from the case body 12 to the outside and is connected to a printed wiring board as is well known. The upper ends of the contact pins 17 are provided in the movable plate 15 with through holes 15 e provided by the number of the connection terminals 1 c and the number of the contact pins 17.
Are fitted loosely. This state is shown in FIGS.
3 is clearly shown in the enlarged view. The contact pin 17 has a bifurcated upper end portion.
The rib 15f provided between the through-holes 15e is configured to be inserted. When the movable plate 15 descends against the spring 11, the forked portion is opened.

A pressing member 18 is attached to the case body 12 so as to be vertically movable. The pressing member 18 has an opening 18a so that the IC package 1 can be inserted from above, and has shaft portions 18b at four corners as shown in FIG. The tip of these shafts 18b
It is fitted in a hole (not shown) provided in the case body 12. The spring 19 wound around each shaft portion 18b is
The pressing member 18 is pressed upward. The pressing member 18 includes
In order to facilitate mounting of the IC package 1 on the predetermined mounting portion 12c together with the four inclined surfaces 12b provided on the case body 12, inclined surfaces 18c are formed on all sides.

The pressing member 18 has a cam portion 18d,
18e are provided, and the side portions 15 of the movable plate 15 are respectively provided.
g, 15h. These cam portions 18d, 1
As shown in FIG. 10, a slope is formed in 8e, so that when the pressing member 18 is pressed down, the movable plate 15 is moved rightward in FIG. Further, the pressing member 18 has four pressing surfaces 18f.

Next, the IC package 1 in the present embodiment
Will be described. First, IC package 1
From the IC socket. When the pressing member 18 is pressed down from above against the spring 19, the movable plate 15 is first moved rightward in FIGS. 10 and 13 by the cam portions 18d and 18e of the pressing member 18. Therefore, the contact pin 17 follows by its own spring behavior. When the pressing member 18 is further pushed, it is moved downward in FIGS. 9 and 10 by four pressing surfaces 18f. Therefore, the contact pins 17 are
5, the bifurcated tip is opened by the rib 15f, the pressing force on the connection terminal 1c is released, and the rib is completely separated from the connection terminal 1c. Therefore, in this state, the IC package 1 can be freely taken out from the opening 18a.

The operation of mounting the IC package 1 in the IC socket is performed in the same manner as in the above case.
Is pressed down against the spring 19 from above. In this state,
The IC package 1 is inserted through the opening 18a, and the inclined surface 1 is inserted.
It is mounted on the mounting portion of the movable plate 15 defined by 2b and 18c. In this state, the connection terminal 1c and the contact pin 17 are not yet in contact.

Next, when the pressing on the pressing member 18 is released, the pressing member 18 is lifted by the spring 19, and in the process, first, the movable plate 15 follows the spring 11 and moves upward. For this reason, the rib 15f moves upward, the contact pin 17 performs a return operation by its own spring behavior, and is pinched from both ends of the connection terminal 1c by its tip. As described above, since the contact pin 17 contacts the side surface of the connection terminal 1c with a flat surface regardless of the end surface of the tip, the contact terminal 17 does not damage the connection terminal 1c, and appropriate contact is made from both surfaces by the spring pressure. Pressure can be obtained.

Thereafter, when the pressing force on the pressing member 18 is further released, the movable plate 15 is moved leftward in FIGS. 10 and 13 by the cam portions 18d and 18e. Therefore, the contact pin 17 is pushed by the through hole 15e of the movable plate 15, and is also pushed leftward against its own spring behavior. At this time, since the contact pins 17 rub the side surfaces of the connection terminals 1c, wiping is performed. Even if there is an oxide film or dirt on the surfaces of the connection terminals 1c and the contact pins 17, they are wiped clean and removed. A good electrical connection. The above-described wiping may be performed in a process in which the contact pin 17 returns due to its own spring habit. However, forcibly moving the contact pin 17 as described above performs wiping more reliably. be able to.

FIG. 14 shows a modification of this embodiment. In this example, the tip of the contact pin 17 is not bifurcated, but is only one side. Also in this case, since the IC package 1 is restricted from moving in the horizontal direction on the mounting portion 12c, the same operation and effect as those of the above configuration can be obtained.

Third Embodiment A third embodiment of the present invention will be described with reference to FIGS. FIG. 15 is a side sectional view of the present embodiment, and FIG. 16 is a sectional view of FIG. 15 viewed from the right. Although the IC package is not shown in each drawing, the IC package 1 shown in FIGS. 1 and 2 is also applied to this embodiment.

First, the structure of this embodiment will be described. A movable plate 25 is mounted on the case body 22 so as to be movable in the horizontal direction. The movable plate 25 is pushed leftward by a spring 21A in FIG. 15, and is pushed leftward by a spring 21B in FIG. Further, the movable plate 25 is provided with a plurality of through holes 25e, and the tips of the plurality of contact pins 27 implanted in the case body 22 are loosely fitted. In this embodiment, the mounting portion of the IC package is the upper surface of the movable plate 25, and the movement in the horizontal direction is restricted by the four end surfaces 22c of the case body 22.

A pressing member 28 is attached to the case body 22 so as to be vertically movable. The pressing member 28 has an opening 28a so that the IC package 1 can be inserted from above, and has shaft portions 28b at four corners. The distal ends of these shaft portions 28b are fitted into holes 22f provided in the case main body 22. The spring 29 wound around each shaft portion 28b pushes the pressing member 28 upward, but is shown in the figure by a suitable means not shown, for example, a configuration like the claw portions 2a and 8c in FIG. Position is maintained.

The pressing member 28 has two notches 2
8d are provided so as to abut against the tips of two levers 30 pivotally attached to the shaft 22d of the case body 22, respectively. A shaft 30a is attached to the lever 30 between the two levers. The shaft 30a comes into contact with the end surface of the movable plate 25 and is pushed leftward by the spring 21A to maintain the position shown in the figure. I have. Further, the pressing member 28 has a notch 2 in the left shaft 28b shown in FIG.
8c is formed therein, and one end edge of a cam member 31 pivotally attached to the shaft 22e of the case main body 22 is fitted therein. The cam portion 31a of the cam member 31 is in contact with the end face of the movable plate 25 and is pressed by the spring 21B, but the position shown in FIG. 16 is maintained because the force of the spring 29 is strong.

Next, the IC package 1 in the present embodiment
The mounting operation will be described. When the pressing member 28 is pressed down against the spring 29 from above, first, the cam member 31 rotates counterclockwise on the shaft 22e in FIG. At this time, since the cam portion 31a moves leftward from the end face position of the movable plate 25, the movable plate 25 follows by the urging force of the spring 21B and is moved leftward in FIG. Therefore, the contact pin 27 also follows the left direction due to its own spring behavior.

When the pressing member 28 is further depressed, in FIG.
And rotates clockwise on the shaft 22d. Therefore, the movable plate 25 moves rightward against the spring 21A by the shaft 30a. Therefore, the contact pin 27 also follows rightward due to its own spring behavior. As a result, at the position where the movable plate 25 has been moved, the tip of the contact pin 27 does not contact the connection terminal 1c even if the IC package 1 is inserted from above.

In this state, the IC package 1 is
8a, and is mounted on the mounting portion of the movable plate 25. As described above, in this state, the connection terminal 1c and the contact pin 27 are not yet in contact. Next, when the pressing force of the pressing member 28 is released, first, the pressing force against the tip of the lever 30 is released, so that the movable plate 25 moves leftward while pressing the shaft 30a by the urging force of the spring 21A in FIG. I do. Therefore, the contact pin 27
Is pushed by the through hole 25e of the movable plate 25, and comes into contact with the side surface of the connection terminal 1c against its own spring behavior. As described above, since the contact pin 27 contacts the side surface of the connection terminal 1c on a flat surface regardless of the end surface of the tip, the connection terminal 1
Since c is not damaged and is forcibly pushed by the through hole 25e, a sufficient contact pressure can be obtained.

Thereafter, when the pressing force on the pressing member 28 is further released, the movable plate 25 is moved rightward by the cam portion of the cam member 31 in FIG. 16 against the urging force of the spring 21B. Therefore, the contact pin 27 is pushed by the through hole 25e of the movable plate 25, and is pushed to the right similarly against its own spring behavior. At this time, since the contact pins 27 rub against the side surfaces of the connection terminals 1c, wiping is performed. Even if there is an oxide film or dirt on the surfaces of the connection terminals 1c and the contact pins 27, they are wiped clean and removed. A good electrical connection.

In the present embodiment, in order to move the movable plate 25 in two directions substantially orthogonal to each other on the same plane, a configuration using the lever 30 and a configuration using the cam 31 are used. In both directions, the movement may be performed using the configuration using the lever 30, or may be performed using the configuration using the cam 31. In this embodiment, the mounting portion of the IC package 1 is provided directly on the movable plate 25. However, as shown in the first embodiment, a fixed plate is arranged above the movable plate 25, and the fixed plate is fixed. The mounting portion may be provided on the plate.

In the above three embodiments, the IC
Although the mounting and dismounting operation of the package is performed by the pressing member attached to the case body, in the present invention, it is not particularly necessary to attach the pressing member to the case body,
It may be separate. In addition, the pressing member does not need to perform a linear motion in the vertical direction in particular.
As in the configuration of the lever 30 shown in (1), the case body may be pivotally supported to perform a rotational movement. Therefore, according to the present invention, as in the above embodiment, the IC package 1
However, the present invention is not limited to an open-top type IC socket in which is inserted through the opening 8a. Further, the present invention provides a ball grid array type I
It goes without saying that the present invention can be applied not only to the C package but also to all types of IC packages such as a column grid array type and a pin grid array type in which connection terminals protrude vertically from a plane parallel to the package. Absent.

[0042]

As described above, according to the present invention, when the IC package is loaded, the movable plate is sequentially operated in the one-dimensional direction and the two-dimensional direction (the X direction and the Y direction, or the X direction and the Z direction). Since the pins are sequentially moved in two directions substantially orthogonal to each other on the mounting surface of the IC package, the contact pins come into contact with the connection terminals from substantially the sides by movement in the first direction, and In this case, a sufficient connection pressure can be obtained without damaging the connection terminal, and the movement in the second direction provides an effective wiping between the connection terminal and the contact pin.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example of a ball grid array type IC package.

FIG. 2 is a side view of FIG.

FIG. 3 is a plan view of the first embodiment showing a state where the IC package 1 shown in FIGS. 1 and 2 is loaded.

FIG. 4 is a sectional view taken along line AA in FIG. 3;

FIG. 5 is a cross-sectional view taken along line BB of FIG. 3;

FIG. 6 is an enlarged view of a main part in FIG. 4;

FIG. 7 is an enlarged view of a main part in FIG.

FIG. 8 is a plan view of the second embodiment showing a state where the IC package 1 is not loaded.

FIG. 9 shows a case where the IC package 1 is loaded.
It is sectional drawing seen from CC line of FIG.

10 is a cross-sectional view when the IC package 1 is loaded, as viewed from the line DD in FIG. 8;

FIG. 11 is a plan view of a movable plate 15 in a second embodiment.

FIG. 12 is an enlarged view of a main part in FIG. 9;

FIG. 13 is an enlarged view of a main part in FIG. 10;

FIG. 14 is a view showing a modification of the contact pin in the second embodiment.

FIG. 15 is a side sectional view of a third embodiment.

FIG. 16 is a sectional view of FIG. 15 viewed from the right side.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC package 1c Connection terminal 2, 12, 22 Case main body 2a, 8c, 12a, 15a Claw part 3, 4, 22d, 22e, 28b, 30a Axis 5, 15, 25 Movable plate 5a, 5b, 5c, 5d, 8b , 18b Shafts 5e, 6e, 15e, 25e Through holes 6 Fixing plates 6a, 6b, 6c, 6d, 12b, 18c Inclined surfaces 7, 17, 27 Contact pins 8, 18, 28 Pressing members 8a, 18a, 28a Openings 8d, 8e, 8f, 8g, 18d, 18e, 31a
Cam part 9, 11, 19, 21A, 21B, 29 Spring 12c Mounting part 15f Rib 15g, 15h Side 18f Pressing surface 22c End surface 22f Hole 28c, 28d Notch 30 Lever 31 Cam member

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-4-19979 (JP, A) JP-A-5-109456 (JP, A) JP-A-6-203926 (JP, A) JP-A-56- 125861 (JP, A) Japanese Utility Model 2-89793 (JP, U) Japanese Utility Model 3-22363 (JP, U) Japanese Utility Model Utility Model 5-20286 (JP, U) (58) Field surveyed (Int. ⁷ , DB name) H01R 13/11 H01R 33/76 H01R 33/97

Claims (11)

(57) [Claims] And 1. A main body case, and mounting means for mounting the IC package in which a plurality of through holes are provided corresponding to the plurality of connection terminals fixed IC package to the body case, the main body case The tip is loosely fitted into the through-hole and is placed on a plane of the placing means.
In a second direction substantially orthogonal to the first direction and the first direction.
A plurality of contact pins configured to be displaceable and capable of contacting a plurality of connection terminals of the IC package; pressing means provided above and below the main body case so as to be vertically movable; Movable means for sequentially displacing the contact pin in a first direction and a second direction substantially orthogonal to the first direction on a plane of the placing means in conjunction with movement. IC socket. 2. The moving means according to claim 1 , wherein
It has a plurality of through holes that penetrate and
And the contactor interlocked with the pressing means.
The toppin is sequentially displaced in the first direction and the second direction.
2. The integrated circuit according to claim 1, wherein
socket. 3. The moving means interlocks with the pressing means.
And the first direction is substantially orthogonal to the first direction on the plane.
The contact pins are sequentially moved in a second direction.
2. The method according to claim 1, wherein the second displacement is performed.
3. The IC socket according to 2. 4. The moving means interlocks with the pressing means.
A first direction perpendicular to the plane and a second direction along the plane.
And sequentially displace the contact pins
3. The method according to claim 1, wherein
Onboard IC socket. 5. The method according to claim 1 , wherein the contact pin is provided in the first direction.
When the contact is displaced in one of the second direction and the second direction.
When contact pressure is applied to the connection terminal and it is displaced in the other direction,
Wiping between connection terminals
The IC socket according to any one of claims 1 to 4, wherein
To 6. A contact pin fitted in said through hole.
Is one for each through hole and is lateral to the connection terminal.
4. The method according to claim 1, wherein the contact is made from
5. The IC socket according to any one of 5. 7. A contact pin fitted in said through hole.
Are two for each through hole, and are lateral to the connection terminals.
It is characterized in that it comes into contact with
The IC socket according to any one of claims 1 to 5, wherein 8. The movable means is provided on the pressing means.
Characterized in that it is moved by the
The IC socket according to any one of claims 1 to 7, wherein: 9. The moving means is provided by the pressing means.
Moved by a moved cam member
The IC socket according to any one of claims 1 to 7, wherein
To 10. The movable means is provided by the pressing means.
Moved by a lever that is moved
The IC socket according to any one of claims 1 to 7, wherein
To 11. The movable means is provided in one direction.
Moved by the cam member moved by the pressing means
On the other hand, the lever moved by the pressing means
2. The moving device according to claim 1, wherein
8. The IC socket according to any one of claims 1 to 7.