JP3283368B2 - Optical semiconductor encapsulation resin composition - Google Patents
Optical semiconductor encapsulation resin compositionInfo
- Publication number
- JP3283368B2 JP3283368B2 JP31014593A JP31014593A JP3283368B2 JP 3283368 B2 JP3283368 B2 JP 3283368B2 JP 31014593 A JP31014593 A JP 31014593A JP 31014593 A JP31014593 A JP 31014593A JP 3283368 B2 JP3283368 B2 JP 3283368B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- optical semiconductor
- semiconductor encapsulation
- encapsulation resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011342 resin composition Substances 0.000 title claims description 10
- 230000003287 optical effect Effects 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 title claims description 9
- 238000005538 encapsulation Methods 0.000 title claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 31
- 229920000647 polyepoxide Polymers 0.000 claims description 31
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229930003836 cresol Natural products 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 239000004843 novolac epoxy resin Substances 0.000 claims 1
- 238000002834 transmittance Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 6
- 229920003986 novolac Polymers 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- -1 fatty acid ester Chemical class 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、信頼性に優れた光半導
体封止用樹脂組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor encapsulating resin composition having excellent reliability.
【０００２】[0002]
【従来の技術】オプトエレクトロニクスの分野におい
て、酸無水物硬化タイプのエポキシ樹脂組成物は透明性
に優れ、かつ波長９００〜１０００ｎｍの近赤外光領域
での透過率が優れているため、フォトセンサー等に使用
されている。しかし酸無水硬化タイプのエポキシ樹脂組
成物は温度１００〜１２５℃、湿度８５〜１００％の高
温高湿雰囲気下では耐湿性に難点があり、光透過率や電
気特性が著しく低下する欠点があった。これらの欠点を
改良するためにシリコーンオイルを添加して耐湿性を改
良する方法（特開昭６１−１２７７２３号公報）、カッ
プリング剤を添加して耐湿性を改良する方法（特開昭６
１−１２７７２４号公報）等が試みられているが、未だ
満足できるものでなかった。従って、耐湿性が必要とさ
れるエリアセンサー等の用途にはガラスを用いて気密封
止した光半導体が用いられている。しかし、組立コスト
が高いという欠点があり、耐湿性、生産性に優れた光半
導体封止用樹脂組成物の開発が望まれていた。2. Description of the Related Art In the field of optoelectronics, an acid anhydride-curable epoxy resin composition has excellent transparency and excellent transmittance in a near-infrared light region having a wavelength of 900 to 1000 nm. Used for etc. However, the acid anhydride-curable epoxy resin composition has a drawback in moisture resistance under a high-temperature and high-humidity atmosphere at a temperature of 100 to 125 ° C. and a humidity of 85 to 100%, and has a drawback that light transmittance and electrical characteristics are significantly reduced. . In order to improve these disadvantages, a method of improving moisture resistance by adding silicone oil (Japanese Patent Application Laid-Open No. 61-127723) and a method of improving moisture resistance by adding a coupling agent (Japanese Patent Application Laid-Open No. Sho 61-127723).
No. 1-127724) have been attempted, but have not been satisfactory. Therefore, optical semiconductors hermetically sealed using glass are used for applications such as area sensors that require moisture resistance. However, there is a drawback that assembly cost is high, and development of an optical semiconductor encapsulating resin composition having excellent moisture resistance and productivity has been desired.
【０００３】[0003]
【発明が解決しようとする課題】本発明は高温高湿雰囲
気下で光透過率、電気特性が劣化しない光半導体封止用
エポキシ樹脂組成物を提供するものである。SUMMARY OF THE INVENTION The present invention provides an epoxy resin composition for encapsulating an optical semiconductor which does not deteriorate in light transmittance and electrical characteristics under a high temperature and high humidity atmosphere.
【０００４】[0004]
【課題を解決するための手段】本発明は、［１］ （Ａ）下記式（１）で示されるエポキシ樹脂、ク
レゾールノボラック型エポキシ樹脂を必須成分とし、下
記式（１）で示されるエポキシ樹脂を総エポキシ樹脂量
中に１０〜４０重量％含むエポキシ樹脂Means for Solving the Problems The present invention provides: [1] (A) an epoxy resin represented by the following formula (1):
An epoxy resin containing a resole novolak type epoxy resin as an essential component and containing an epoxy resin represented by the following formula (1) in an amount of 10 to 40% by weight based on the total epoxy resin amount.
【０００５】[0005]
【化２】 （ここで式中のＲは水素、又はメチル基で、同一でも異
なってもよい）Embedded image (Where R in the formula is hydrogen or a methyl group, which may be the same or different)
【０００６】 （Ｂ）硬化剤 及び （Ｃ）硬化促進剤 からなる光半導体封止用樹脂組成物、 ［２］ビスフェノール型エポキシ樹脂を（Ａ）成分に含
む第［１］項記載の光半導体封止用樹脂組成物、 であ
る。[0006] A resin composition for encapsulating an optical semiconductor comprising (B) a curing agent and (C) a curing accelerator , [2] a bisphenol-type epoxy resin is contained in the component (A).
The resin composition for optical semiconductor encapsulation according to item [1] .
【０００７】本発明で用いるエポキシ樹脂は、下記式
（１）で示されるエポキシ樹脂、クレゾールノボラック
型エポキシ樹脂を必須成分とし、式（１）のエポキシ樹
脂を総エポキシ樹脂量中に１０〜４０重量％含み、他の
エポキシ樹脂としてビスフェノール型エポキシ樹脂を併
用して用いてもよい。下記式（１）で示されるエポキシ
樹脂を用いずに、クレゾールノボラック型エポキシ樹脂
単独またはビスフェノール型エポキシ樹脂を併用して用
いると高い耐熱性を示すが、吸水率が高く、急熱急冷時
に割れるという欠点があった。式（１）のエポキシ樹脂
は２官能の構造なので、多官能エポキシ樹脂と併用する
と硬化物の架橋密度が下がり、多官能エポキシ樹脂の欠
点を解消することができる。これにより、耐熱性が高
く、かつ低吸水および低応力の樹脂組成物を得ることが
でき、高温高湿雰囲気下での電気特性の低下を防ぐこと
ができる。式（１）のエポキシ樹脂は総エポキシ樹脂量
中に１０〜４０重量％含み、１０重量％未満だと架橋密
度の低下が不充分で、急熱急冷時に生じる割れを防ぐこ
とができない。また、４０重量％を越えると樹脂の粘度
が低くなり過ぎ、成形時にボイドが生じる等の支障をき
たす。式中のＲは水素、又はメチル基であるが、好まし
くはメチル基である。The epoxy resin used in the present invention has the following formula
Epoxy resin represented by (1), cresol novolak
The type epoxy resin as an essential component, comprises 10 to 40% by weight of epoxy resin in a total epoxy resin amount of a compound of formula (1), 併bisphenol type epoxy resin as the other epoxy resin
May be used. Epoxy represented by the following formula (1)
Cresol novolak type epoxy resin without using resin
When used alone or in combination with a bisphenol-type epoxy resin, it exhibits high heat resistance, but has a high water absorption rate and has a defect that it breaks during rapid heating and rapid cooling. Since the epoxy resin of the formula (1) has a bifunctional structure, when used in combination with a polyfunctional epoxy resin, the crosslink density of the cured product is reduced, and the drawbacks of the polyfunctional epoxy resin can be eliminated. Thereby, a resin composition having high heat resistance, low water absorption and low stress can be obtained, and a decrease in electric characteristics under a high-temperature and high-humidity atmosphere can be prevented. The epoxy resin of the formula (1) contains 10 to 40% by weight in the total amount of the epoxy resin, and if it is less than 10% by weight, the crosslink density is not sufficiently reduced, and cracks generated during rapid heating and rapid cooling cannot be prevented. On the other hand, if it exceeds 40% by weight, the viscosity of the resin becomes too low, which causes problems such as generation of voids during molding. R in the formula is hydrogen or a methyl group, and is preferably a methyl group.
【０００８】硬化剤としては、多塩基カルボン酸無水
物、フェノールノボラック樹脂等が挙げられるが、耐湿
性を考慮するとフェノールノボラック樹脂の方が好まし
い。硬化剤とエポキシ樹脂の配合割合は、エポキシ当量
１に対して０．５〜１．２当量の硬化剤が望ましい。こ
の範囲外では成形性に欠陥を起こす場合がある。硬化促
進剤としてトリメチルアミン、トリエタノールアミン等
の３級アミン類、トリフェニルホスフィン、トリシクロ
ヘキシルホスフィン等の有機ホスフィン類、２−メチル
イミダゾール等のイミダゾール類等が挙げられる。また
本発明には、公知のアゾ系、キノン系の染料を１種また
は２種以上を添加してもよい。更に離型剤として脂肪酸
エステル、ステアリン酸等を添加することができる。本
発明の組成物の製造は、各成分を混合し、加熱ロールを
用いて５０〜９０℃で混練し冷却固化後、粉砕して粉末
状とする。Examples of the curing agent include polybasic carboxylic anhydrides and phenol novolak resins, and phenol novolak resins are more preferable in consideration of moisture resistance. The mixing ratio of the curing agent and the epoxy resin is desirably 0.5 to 1.2 equivalents of the curing agent per 1 epoxy equivalent. Outside this range, defects in moldability may occur. Examples of the curing accelerator include tertiary amines such as trimethylamine and triethanolamine, organic phosphines such as triphenylphosphine and tricyclohexylphosphine, and imidazoles such as 2-methylimidazole. In the present invention, one or more known azo or quinone dyes may be added. Further, a fatty acid ester, stearic acid or the like can be added as a release agent. In the production of the composition of the present invention, the components are mixed, kneaded at 50 to 90 ° C. using a heating roll, cooled and solidified, and then pulverized to a powder.
【０００９】[0009]
【実施例】以下、実施例を用いて本発明を具体的に説明
する。 実施例１〜４、比較例１〜３ 表１のエポキシ樹脂１００重量部に、フェノールノボラ
ック樹脂（軟化点９３℃、水酸基当量１０４）をエポキ
シ当量／水酸基当量＝１の割合で添加し、更に２−メチ
ルイミダゾール１重量部、グリセリン脂肪酸エステル３
重量部を配合し、７０〜９０℃の加熱ロールを用いて加
熱混練を行い、冷却固化後粉砕して樹脂組成物の粉末を
得た。この樹脂組成物を低圧トランスファー成形機を用
いて、温度１５０℃で、厚さ１ｍｍの光透過率測定用試
験片および信頼性評価用パッケージ（１６ｐｓｏｐ：６
ｍｍ×４ｍｍ×１．５ｍｍ）を成形し、更に１５０℃
で、４時間ポストキュアした。この試験片で未処理およ
び加熱処理後の光透過率を、パッケージで耐湿性および
耐ヒートサイクル性を評価した。評価結果を表１に示
す。The present invention will be specifically described below with reference to examples. Examples 1 to 4, Comparative Examples 1 to 3 To 100 parts by weight of the epoxy resin shown in Table 1, a phenol novolak resin (softening point: 93 ° C., hydroxyl equivalent: 104) was added at a ratio of epoxy equivalent / hydroxyl equivalent = 1, and 2 1 part by weight of methyl imidazole, glycerin fatty acid ester 3
By weight, the mixture was heated and kneaded using a heating roll at 70 to 90 ° C., solidified by cooling, and then pulverized to obtain a resin composition powder. Using a low-pressure transfer molding machine, this resin composition was used at a temperature of 150 ° C. and at a temperature of 150 ° C. for a 1 mm thick light transmittance measurement test piece and a reliability evaluation package (16 psop: 6).
mm × 4mm × 1.5mm) and then 150 ° C
For 4 hours. The light transmittance of the untreated and heat-treated test pieces was evaluated, and the moisture resistance and the heat cycle resistance of the test piece were evaluated. Table 1 shows the evaluation results.
【００１０】＊光透過率：試験片を１００℃のオーブン
で１０００時間熱処理し、分光光度計を用いて波長９５
０ｎｍの光透過率を測定。 光透過率の評価基準 ○：９０％以上、●：８５〜９０
％、×：８５％以下 ＊耐湿性：１０５℃、ＰＣＴ釜（飽和）で吸湿処理した
後、リーク電流を測定。 耐湿性の評価基準 ○：１００時間不良無し、●：６
０時間不良無し、×：６０時間で不良発生 ＊耐ヒートサイクル性：−４０℃（１時間）←→１００
℃（３０分）のヒートサイクル処理後パッケージの割
れ、断線を観察。 耐ヒートサイクル性の評価基準 ○：５０サイクル不良
無し、●：３０サイクル不良無し、×：３０サイクルで
不良発生Light transmittance: The test piece was heat-treated in an oven at 100 ° C. for 1000 hours, and a wavelength of 95 was measured using a spectrophotometer.
Measure light transmittance at 0 nm. Evaluation criteria of light transmittance ：: 90% or more, ●: 85 to 90
%, X: not more than 85% * Moisture resistance: Measured at 105 ° C, PCT pot (saturated), and then leak current. Evaluation criteria of moisture resistance ○: No defect for 100 hours, ●: 6
0 hours no failure, ×: failure occurred in 60 hours * Heat cycle resistance: -40 ° C (1 hour) ← → 100
After the heat cycle treatment at 30 ° C (30 minutes), the package was observed for cracks and breaks. Evaluation criteria for heat cycle resistance ：: No failure in 50 cycles, ●: No failure in 30 cycles, ×: Failure occurred in 30 cycles
【００１１】[0011]
【表１】 [Table 1]
【００１２】[0012]
【発明の効果】本発明のエポキシ樹脂組成物を用いる
と、透明性に優れ、かつ耐湿性、耐ヒートサイクル性に
優れており、近赤外領域の光透過率の劣化が抑えられ、
エリアセンサー等の高い信頼性が要求される用途への展
開ができる。また、ガラスを用いた気密封止に較べ組立
コストを低減できる。According to the present invention, the use of the epoxy resin composition of the present invention is excellent in transparency, excellent in moisture resistance and heat cycle resistance, and can suppress deterioration of light transmittance in the near infrared region.
It can be applied to applications requiring high reliability such as area sensors. Further, assembling cost can be reduced as compared with hermetic sealing using glass.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０１Ｌ 33/00 (56)参考文献 特開 平６−271654（ＪＰ，Ａ) 特開 昭64−65116（ＪＰ，Ａ) 特開 平６−128359（ＪＰ，Ａ) 特開 平４−142070（ＪＰ，Ａ) 特開 平４−103618（ＪＰ，Ａ) 特開 平５−301942（ＪＰ，Ａ) 特開 平４−108852（ＪＰ，Ａ) 特開 平３−220229（ＪＰ，Ａ) 特開 平３−170522（ＪＰ，Ａ) 特開 平３−243616（ＪＰ，Ａ) 特開 平４−153213（ＪＰ，Ａ) 特開 平５−206331（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C08G 59/20 C08G 59/24 C08G 59/32 H01L 23/29 H01L 33/00 ────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 7 Identification code FI H01L 33/00 (56) References JP-A-6-271654 (JP, A) JP-A-64-65116 (JP, A) JP-A-6-128359 (JP, A) JP-A-4-142070 (JP, A) JP-A-4-103618 (JP, A) JP-A-5-301942 (JP, A) JP-A-4-108852 ( JP, A) JP-A-3-220229 (JP, A) JP-A-3-170522 (JP, A) JP-A-3-243616 (JP, A) JP-A 4-153213 (JP, A) JP Hei 5-206331 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C08G 59/20 C08G 59/24 C08G 59/32 H01L 23/29 H01L 33/00
Claims (2)
樹脂、クレゾールノボラック型エポキシ樹脂を必須成分
とし、下記式（１）で示されるエポキシ樹脂を総エポキ
シ樹脂量中に１０〜４０重量％含むエポキシ樹脂 【化１】 （ここで式中のＲは水素、又はメチル基で、同一でも異
なってもよい） （Ｂ）硬化剤 及び （Ｃ）硬化促進剤 からなることを特徴とする光半導体封止用樹脂組成物。1. An epoxy resin represented by the following formula (1):
Resin, cresol novolac epoxy resin as an essential component
And an epoxy resin containing an epoxy resin represented by the following formula (1) in an amount of 10 to 40% by weight based on the total amount of the epoxy resin. (Wherein R in the formula is hydrogen or a methyl group, which may be the same or different). A resin composition for encapsulating an optical semiconductor, comprising: (B) a curing agent and (C) a curing accelerator.
成分に含む請求項１記載の光半導体封止用樹脂組成物。The resin composition for optical semiconductor encapsulation according to claim 1, which is contained in a component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31014593A JP3283368B2 (en) | 1993-12-10 | 1993-12-10 | Optical semiconductor encapsulation resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31014593A JP3283368B2 (en) | 1993-12-10 | 1993-12-10 | Optical semiconductor encapsulation resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07157541A JPH07157541A (en) | 1995-06-20 |
| JP3283368B2 true JP3283368B2 (en) | 2002-05-20 |
Family
ID=18001713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31014593A Expired - Fee Related JP3283368B2 (en) | 1993-12-10 | 1993-12-10 | Optical semiconductor encapsulation resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3283368B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3598963B2 (en) * | 2000-09-26 | 2004-12-08 | 松下電工株式会社 | Resin composition for optical semiconductor device |
-
1993
- 1993-12-10 JP JP31014593A patent/JP3283368B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07157541A (en) | 1995-06-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3283368B2 (en) | Optical semiconductor encapsulation resin composition | |
| JP2807094B2 (en) | Epoxy resin composition for optical semiconductor encapsulation | |
| JP2892434B2 (en) | Sealing resin composition and semiconductor sealing device | |
| JP2892433B2 (en) | Sealing resin composition and semiconductor sealing device | |
| JP3207278B2 (en) | Resin composition for optical semiconductor encapsulation | |
| JP2820540B2 (en) | Epoxy resin composition for optical semiconductor encapsulation | |
| JPH05152464A (en) | Epoxy resin composition for photosemiconductor sealing | |
| JP3115693B2 (en) | Epoxy resin composition and semiconductor encapsulation device | |
| JP3115692B2 (en) | Epoxy resin composition and semiconductor encapsulation device | |
| JPH05230175A (en) | Epoxy resin composition and semiconductor-sealed device | |
| JPH0570562A (en) | Resin composition for sealing and sealed semiconductor device | |
| JPH08134183A (en) | Epoxy resin composition and semiconductor sealing device | |
| JP2793449B2 (en) | Epoxy resin composition | |
| JP3512460B2 (en) | Epoxy resin composition and semiconductor encapsulation device | |
| JP3032067B2 (en) | Epoxy resin composition | |
| JPH09176286A (en) | Epoxy resin composition and resin-encapsulated semiconductor device | |
| JP3004454B2 (en) | Resin composition | |
| JPH08245754A (en) | Epoxy resin composition and sealed semiconductor device | |
| JPH051210A (en) | Sealing resin composition and semiconductor-sealing device | |
| JPH10231350A (en) | Epoxy resin composition and sealed semiconductor device | |
| JPH0790053A (en) | Epoxy resin composition and semiconductor sealing device | |
| JPH0753672A (en) | Epoxy resin composition and sealed semiconductor device | |
| JPH05255477A (en) | Epoxy resin composition and semiconductor-sealing device | |
| JPH06145301A (en) | Epoxy resin composition and semiconductor device sealed therewith | |
| JPH07304850A (en) | Epoxy resin composition and semiconductor-sealing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |