JP3292442B2 - Nozzle plate bonding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for bonding a nozzle plate constituting an ink jet head or the like, and more particularly to a method for heating and curing an adhesive used for bonding a nozzle plate and an actuator.

[0002]

2. Description of the Related Art Conventionally, a method of bonding a nozzle plate to an actuator has been described below. As shown in FIG. 5, first, the nozzle plate 4 and the actuator 2 are overlapped with an epoxy resin or the like (not shown) (not shown) interposed therebetween as an adhesive. Next, the member is sandwiched from the side of each member by the jig of the pressing plate 41, the silicon rubber sheet 30 and the base block 42, and pressurization is applied by the tightening screw 43. In this state, the nozzle plate is placed in a heating device such as an oven (not shown) (hereinafter, referred to as an oven) and heated at a temperature of about 150 ° C. for about 30 minutes to cure the epoxy resin and bond the nozzle plate and the actuator.

[0003]

However, in the conventional method of bonding the nozzle plate and the actuator as described above, the jig is heated in an oven together with the nozzle plate and the actuator. At this time, since the heat capacity of the nozzle plate, the actuator, and the jig is large, the temperature of these components rises slowly. Epoxy-based adhesives begin to cure due to the rise in temperature and release gas with it.However, if the rise in temperature is slow, the release of gas is performed little by little, and the time until release ends is longer. It has the property of becoming. Due to this property,
The release of gas may not be completed until the epoxy resin is completely cured, and the gas may be cured while remaining in the epoxy resin as bubbles. If these bubbles remain on the surface where the epoxy resin and the nozzle plate or the actuator are in contact, a gap is formed between the epoxy resin and the nozzle plate or the actuator, so that the bonding strength is weakened and a bonding failure occurs. There's a problem. Since the nozzle plate is subjected to wiping or the like during maintenance when driving the print head, if the adhesive strength is weak, the nozzle plate may be peeled off from the actuator during printing, and printing may not be possible. SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has been made to cure an epoxy resin without leaving air bubbles at the time of heating, thereby eliminating the adhesion failure between a nozzle plate and an actuator. The aim is to provide a method.

[0004]

According to a first aspect of the present invention, there is provided a method for bonding a nozzle plate, comprising ejecting ink to a recording medium and an actuator having a plurality of channels. A method of bonding with a nozzle plate having a nozzle formed at a position corresponding to each channel to overlap the actuator and the nozzle plate with an adhesive interposed therebetween. Attaching the heating member to the nozzle plate and heating the adhesive through the nozzle plate,
Ri by the addition of pressurization to the actuator and the nozzle plate by pressing the nozzle plate by the heating element,
A second step of curing the adhesive, and the second step
The actuator in a state where the adhesive is cured in
Presser and nozzle plate from each side with a jig
In a high temperature ambient environment with
By further heating and curing the adhesive,
Third bonding the actuator and the nozzle plate
And the steps of

In the above method, since the adhesive is heated by bringing the heating member into contact with the nozzle plate, heat generated by the heating member can be efficiently transmitted to the adhesive, and the temperature of the adhesive can be rapidly increased. . This makes it possible to release all the gas generated when the adhesive is heated before the adhesive is cured, so that no bubbles remain in the cured adhesive. Therefore, since no a gap due to the air bubbles to the surface where the adhesive is in contact with the actuator or nozzle plate, Ru can increase the adhesion strength between the actuator and the nozzle plate.

[0006]

[0007]

[0008]

[0009]

[0010]

In addition, since the actuator and the nozzle plate in a state where the adhesive is cured in the second step are sandwiched from each side by a holding jig and pressurized, the actuator and the nozzle plate are placed in a high temperature ambient environment. While maintaining the state of applying enough pressure to the actuator and nozzle plate,
Further, since the actuator and the nozzle plate can be heated, the adhesive can be more reliably cured.

Further, a method of bonding a nozzle plate according to the invention of claim 2 is a method of bonding a nozzle plate according to claim 1, the heating temperature in the second step, in the third step And the heating time in the second step is shorter than the heating time in the third step.

In the above method, in the second step,
At a temperature higher than the third step, and since the adhesive is heated in a short time, almost to terminate the curing of the adhesive in the second step, Ru can be fully cure the adhesive in the third step.

According to a third aspect of the present invention, there is provided a method for bonding a nozzle plate, wherein an activator having a plurality of channels is formed.
To eject ink to the recording medium
Nozzles with nozzles formed at positions corresponding to each channel
In the method of bonding to the actuator plate, the actuator
And nozzle plate with adhesive between them
A first step of causing the nozzle plate to overlap
The heating member is brought into contact with the
The adhesive is heated, and the heating member
Press the actuator plate and the nozzle plate.
The pressure is applied to the rate to cure the adhesive.
A second step of applying the adhesive in the second step
The actuator and nozzle plate in a state where
Place in a high temperature ambient environment and apply the adhesive further.
By heating and curing, the actuator and the nozzle are heated.
A third step of bonding the spill plate,
The heating temperature in the second step is higher than the heating temperature in the third step.
The heating time in the second step is the same as the heating time in the third step.
It is characterized by being shorter than the interval .

In the above method, the heating member is provided with a nozzle plug.
Adhesive is higher than third step by contacting rate
Heating at a low temperature and for a short time,
Raises violently and bonds gas generated when adhesive is heated.
It can release everything before the agent cures.
Increases the adhesive strength between the actuator and the nozzle plate.
Can be bigger. Also, in the second step,
Actuator and nozzle plate with hardened agent
Is placed in a high-temperature ambient environment, so the adhesive
Can Rukoto cured.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a nozzle plate bonding structure and a method according to an embodiment of the present invention will be described with reference to the drawings. First, an ink jet head to which the nozzle plate bonding structure and the bonding method of the present invention are applied will be described. The ink-jet head described here is applied to an ink-jet printer or the like, and uses a piezoelectric element on a side wall of the pressure chamber to eject ink droplets using a change in the internal pressure of the pressure chamber due to shear deformation by the element. Is what you do.

FIG. 1A is an exploded perspective view of the ink jet head, and FIG. 1B is a diagram showing a connection state between the ink jet head and electrodes. The actuator 2 of the inkjet head 1 is formed by forming grooves parallel to each other by a cutting process such as dicing on a piezoelectric substrate made of piezoelectric ceramics as a piezoelectric element, and has a large number of channels 3 serving as ink chambers. . A nozzle plate 4 having nozzles 4a (ink ejection ports) is attached to one end of the channel 3. This nozzle plate 4
Is formed of a polyimide resin so as not to be deformed or deteriorated even in the manufacturing process of the ink jet head 1 or at a high temperature during printing. A side wall 5 (hereinafter referred to as a piezoelectric side wall) constituting the channel 3 is indicated by an arrow B
An electrode 6 for applying an electric field in a direction perpendicular to the polarization direction is formed on the upper half surface of the piezoelectric side wall 5.

A cover plate 8 having an ink supply port (liquid supply means) 7 is placed over the actuator 2 in which the channel 3 is formed. Channel 3
Are connected to an ink cartridge (not shown) through the ink supply port 7. The ink used for printing is supplied from the ink cartridge to the ink chamber defined by the channel 3 through the ink supply port 7 and is discharged from the nozzle 4 a of the nozzle plate 4. With such a configuration, the cross-sectional shape of the channel 3 has a rectangular shape surrounded by the piezoelectric side wall 5 and the cover plate 8.

Further, a printed board 10 on which the electrodes 9 are printed is provided below the actuator 2. The electrode 9 and the electrode 6 on the surface of the piezoelectric side wall 5 are connected by a wire 11, and the electrode 9 is connected to a head driver 15 that drives the ink jet head 1. The head driver 15 is connected to a power supply by a connection line 16,
The head driver 15 applies a voltage to the electrode 6 through a connection line 17. The head driver 15 is connected to the
C of the recording apparatus provided with the inkjet head 1
It is connected to a PU (not shown) and is controlled by this CPU. The head driver 15 is provided in a recording device such as a printer in which the inkjet head 1 is provided.

Next, the ejection of ink by the inkjet head 1 will be described with reference to FIG. FIG. 2 (a)
Is a longitudinal sectional view of the ink jet head 1, and FIG.
FIG. 4 is a diagram showing a state in which a voltage is applied to the piezoelectric element and the piezoelectric side wall 5 is distorted. An actuator is composed of the electrodes 6 (61, 62) formed on the upper half of the piezoelectric side wall 5. A cover plate 8 is attached to the upper portion of the piezoelectric side wall 5 with an epoxy resin (adhesive) 13. The electrodes 61 and 62 are formed by plating.
1 is connected to a positive potential, and the electrode 62 is connected to GND, whereby an electric field is generated on the piezoelectric side wall 5 in the directions of arrows 12a and 12b. Then, the volume of the ink chamber (channel 3) changes due to the piezoelectric thickness shear deformation of the upper half portion of the piezoelectric side wall 5 to which the electrodes 61 and 62 are attached. Accordingly, the internal pressure of the channel 3 increases, and the ink in the channel 3 is ejected from the nozzle 4a (FIG. 1A). When the application of the voltage is stopped, the electric field disappears on the piezoelectric side wall 5, so that the deformed piezoelectric side wall 5 returns to the original state.
CPU of recording apparatus provided with inkjet head 1
The head driver 15 (FIG. 1) controls the above-described operation of the inkjet head 1 based on print data sent from a host computer or the like, that is, controls voltage application, so that a printing operation is performed on a recording medium. Will be

Next, a description will be given of the adhesion of the above-described members constituting the ink jet head 1, the actuator 2, the cover plate 8, the nozzle plate 4, and the like. FIG. 3 is a view showing a state in which a plurality of cover plates 8 are placed on a piezoelectric substrate on which a plurality of actuators 2 are formed, corresponding to each actuator 2. In order to enhance the productivity, the actuator 2 and the cover boot 8 are bonded to each other. In order to enhance the productivity, the actuator body 19 in which the channels 3 for a plurality of actuators are formed on one piezoelectric substrate and the plurality of cover plates 8 corresponding to the channels 3 are formed. And by bonding. In this case, as shown in FIG. 3, the cover plate 8 is attached to the actuator body 19 with an epoxy resin (adhesive).
It is placed via. Next, the cover plate 8 and the actuator body 19 are sandwiched and pressed by jigs such as a holding member and a base member (not shown), and the epoxy resin is cured by heating in an oven in that state, whereby the cover plate 8 and the actuator body are cured. The body 19 is glued.

FIG. 4 is a side view showing a state in which the nozzle plate 4 and the actuator body 19 are heated and pressed by a heater block or the like when the nozzle plate 4 is bonded to the actuator body 19. In order to bond the nozzle plate 4 to the cover plate 8 and the actuator body 19 bonded as described above, first, the position of the nozzle 4a is made to correspond to the position of the channel 3, and the nozzle plate 4 is interposed with epoxy resin. 4 is the actuator body 1
9. Next, the lower part of the actuator body 19 is fixed by the base plate 31 via the silicon rubber sheet 30, and the heater block (heating member) 32 is brought into contact with the upper part of the nozzle plate 4. The heater block 32 is made of a metal block heated to 160 ° C. in advance, and heats the epoxy resin via the nozzle plate 4. The nozzle block 4, the cover plate 8, and the actuator body 19 are sandwiched between the heater block 32 and the base plate 30, and pressure is applied from above the heater block 32 by a press device or the like (not shown), and the nozzle plate 4, the cover plate 8, and pressurizing the actuator body 19 and heating the epoxy resin for 2 minutes.

When the epoxy resin is heated, a gas is generated in the resin. However, when the epoxy resin is heated as described above, the heat from the heater block 32 is efficiently transmitted to the epoxy resin. Can be heated,
When the heating for 2 minutes is completed, the gas generated in the epoxy resin can be completely released.

Next, the nozzle plate 4, the cover plate 8, and the actuator body 19 in a state where the epoxy resin is hardened to some extent by the heating and pressing are removed, the heater block 32, the silicon rubber sheet 30, and the base plate 31 are removed, and the other states are removed. Put in oven at 80 ℃
At 30 ° C. for 30 minutes to completely cure the epoxy resin. Thus, the nozzle plate 4 is bonded to the cover plate 8 and the actuator body 19.

As described above , according to the above-described method of bonding the nozzle plate 4, the epoxy resin is rapidly heated by the heater block 32, and all the gas generated in the epoxy resin is released and then completely cured. No air gap is formed in the epoxy resin after curing. Therefore,
Epoxy resin and nozzle plate 4, cover plate 8,
Alternatively, since there is no gap due to bubbles on the surface in contact with the actuator body 19, these members can be firmly bonded. The heating of the epoxy resin by the heater block 32 is performed at a temperature of 160 ° C. for 2 minutes, and the heating by an oven is performed at a temperature of 80 ° C. for 30 minutes. Rather than heating at 30 ° C for 30 minutes,
The cost for heating is reduced. Furthermore, in the method of bonding the nozzle plate 4 described above, the epoxy resin has already been hardened to some extent at the time of heating by the oven, so that it is not necessary to fix the nozzle plate 4, the cover plate 8, and the actuator body 19 with the jig.

The method of bonding the nozzle plate 4 described above
Is not limited to the above-described embodiment, and various modifications are possible. For example, in the above SL method, after heating the epoxy resin by the heater block 32, further heated in an oven, but it is assumed to fully cure the epoxy resin, a longer heating time by the heater block 32, the heater The epoxy resin may be completely cured only by heating by the block 32. In this case, the nozzle plate 4 and the cover plate 8 and the actuator body 19
Can be simplified.

Further, in the above SL method, during heating by an oven, a nozzle plate 4, the cover plate 8, and the actuator body 19 is intended to put in the oven without fixing a jig, the above-described this Figure Similarly to 5, it may be fixed by a holding jig such as a holding plate 41, a base block 42, and a tightening screw 43, and then put into an oven. In this case, the pressurization can be more appropriately applied, and the nozzle plate 4 and the cover plate 8 and the actuator body 19 can be more firmly bonded.

[0028] In addition, in the above Symbol of the method, the heater block 3
2, the lower portion of the cover plate 8 and the lower part of the actuator body 19 are fixed by the silicon rubber sheet 30 and the base plate 31. The heater block 32 is used to fix the nozzle plate 4, the cover plate 8, and the actuator. Body 19
If it is possible to apply a pressure to the silicon rubber sheet 30, the fixing by the silicon rubber sheet 30 and the base plate 31 is not always necessary.

[0029] In addition, in the above Symbol of the method, the heater block 3
2, the heating of the epoxy resin is applied to the adhesion between the nozzle plate 4 and the actuator 2 and the cover plate 8, but may be applied to the adhesion between the actuator 2 and the cover plate 8.

[0030]

As described above, according to the method of bonding the nozzle plate according to the first aspect of the present invention, the adhesive is heated by bringing the heating member into contact with the nozzle plate, so that the heat generated by the heating member is efficiently reduced. It can transfer well to the adhesive, and can rapidly raise the temperature of the adhesive. This makes it possible to release all the gas generated when the adhesive is heated before the adhesive is cured, so that it is possible to eliminate the formation of a space due to bubbles in the cured adhesive. . Thus, even a surface where the adhesive is in contact with the actuator or the nozzle plate, so that no gaps due to the air bubbles, Ru can increase the adhesion strength between the actuator and the nozzle plate.

[0031]

[0032]

Further , since the actuator and the nozzle plate in the state where the adhesive is cured in the second step are sandwiched from each side by a holding jig and pressurized, the actuator and the nozzle plate are placed in a high-temperature ambient environment. While maintaining the state of applying enough pressure to the actuator and nozzle plate,
Further, since the actuator and the nozzle plate can be heated, the cured adhesive can be more reliably cured. Therefore, the adhesive strength between the actuator and the nozzle plate further increases.

Further, according to the method of bonding a nozzle plate according to the invention of claim 2, in the second step, since the adhesive is heated in a short time at a temperature higher than the third step, the second step curing of the adhesive substantially terminate the, Ru can be fully cure the adhesive in the third step.

According to the third aspect of the present invention, the heating member includes a nozzle plate.
The adhesive to a higher temperature than in the third step.
Temperature and in a short time, so the temperature of the adhesive
Raises the gas generated when the adhesive is heated.
Since it is possible to release all before curing,
Increases the adhesive strength between the actuator and the nozzle plate
Can be In the second step, the adhesive is hardened.
Temperature of the actuator and nozzle plate
In the surrounding environment, so that the adhesive is more reliably cured.
Can not Rukoto.

[Brief description of the drawings]

FIG. 1A is an exploded perspective view of an inkjet head to which a method for bonding a nozzle plate according to the present invention is applied;
(B) is a diagram showing a connection state between the inkjet head and electrodes.

2A is a longitudinal sectional view of the ink jet head, and FIG. 2B is a diagram showing a state in which a voltage is applied to an electrode of the ink jet head and a piezoelectric side wall is distorted.

FIG. 3 is a diagram showing a state in which a plurality of cover plates are placed in correspondence with each actuator on a piezoelectric substrate on which a plurality of actuators are formed.

FIG. 4 is a side view showing a state in which a nozzle plate and an actuator body are heated and pressed by a heater block or the like in the bonding method of the present invention.

FIG. 5 is a diagram showing a state in which pressurizing is applied to a nozzle plate and an actuator with an adhesive interposed therebetween by fixing a holding plate and a base block when a conventional bonding method is used.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ink jet head 2 Actuator 4 Nozzle plate 8 Cover plate 19 Actuator body 32 Heater block 31 Base plate 41 Holding plate 42 Base block 43 Tightening screw

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) B41J 2/045 B41J 2/16

Claims (3)

(57) [Claims] 1. A method of bonding an actuator having a plurality of channels formed thereon to a nozzle plate having nozzles formed at positions corresponding to the channels for ejecting ink to a recording medium, comprising: A first step of superposing the plates on each other with an adhesive interposed therebetween, and a heating member abutting on the nozzle plate, and heating the adhesive through the nozzle plate; By pressing the nozzle plate to apply a pressure to the actuator and the nozzle plate,
A second step of curing the adhesive, and pressing the actuator and the nozzle plate in a state where the adhesive is cured in the second step from each side.
A third step of bonding the actuator and the nozzle plate by further heating and curing the adhesive under a high-temperature ambient environment with the pre-pressurized pressure applied by sandwiching the actuator and the nozzle plate. A method for bonding a nozzle plate. 2. A heating temperature in the second step, the third
Higher than the heating temperature in the step, the heating time in the second step is a method of bonding a nozzle plate according to claim 1, wherein the shorter than the heating time in the third step. (3) Actuator with multiple channels
Eater and each of them to eject ink to the recording medium.
Nozzles with nozzles formed at positions corresponding to channels
In the method of bonding with the plate, The actuator and the nozzle plate,
A first step of overlapping with an adhesive interposed therebetween, A heating member is brought into contact with the nozzle plate, and the nozzle plate is
Heating the adhesive through a rate
The nozzle plate is pressed by a member to
By applying pressure to the eta and nozzle plate,
A second step of curing the adhesive; Before the adhesive is cured in the second step
Put the actuator and nozzle plate around the high temperature
In the background, the adhesive is further heated and cured.
Bonds the actuator and nozzle plate with
And the third step, The heating temperature in the second step is the heating temperature in the third step.
And the heating time in the second step is higher than that in the third step.
Nozzle plate characterized by shorter heating time
Bonding method.