JP3301419B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a method of manufacturing an electronic component such as a surface acoustic wave device in which elements are housed in a package.

[0002]

2. Description of the Related Art A conventional method for manufacturing a surface acoustic wave device will be described with reference to the drawings.

FIG. 5 is a top view of a conventional surface acoustic wave device before sealing with a lid, and FIG. 6 is a cross-sectional view of the conventional surface acoustic wave device.

[0004] First, a first ceramic frame 101 is laminated on a ceramic substrate 100, a second ceramic frame 102 is laminated thereon, fired, and integrated to obtain a package 103.

Next, the internal connection electrode 10 is
4 and a shield electrode 105, and a seam ring 110 is soldered to the upper end surface of the package by silver.

Next, gold plating is performed on the surfaces of the internal connection electrode 104, the shield electrode 105, and the seam ring 110.

On the other hand, a plurality of comb electrodes for input and output on the piezoelectric substrate, and a plurality of connection electrodes electrically connected to the reflector and the comb electrodes on both sides of the comb electrodes are formed to obtain the SAW element 107.

Next, the SAW element 107 is mounted on the shield electrode 105 on the inner bottom surface of the package 103 via the adhesive layer 106.

Next, the package 103 is image-recognized from the upper surface, and the second ceramic frame 102 of the package 103 is recognized.
And the boundary point between the first ceramic frame 101 and the boundary point between the internal connection electrode 104 and the internal connection electrode non-formed portions 108a and 108b are detected. From the two points and the dimensions of the package 103, the internal connection electrode 104 is detected. The position to connect with the wire 109 is determined.

Next, based on this determination, the SAW element 107
And the internal connection electrode 104 are connected by a wire 109, and a lid 111 is welded to a seam ring 110 of the package 103.

[0011]

Since the seam ring 110 is brazed with silver, its forming position tends to vary. In addition, since positioning is performed using a small portion of the package 103, variation is likely to occur.

[0012] Therefore, due to such a variation, for example, positioning may be performed so as to connect the wire 109 to the shield electrode 105, or the wire 109 and the internal connection electrode 104 may not be connected.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method of manufacturing an electronic component that can securely connect a wire and an internal connection electrode.

[0014]

In order to achieve this object, a method of manufacturing an electronic component according to the present invention comprises the steps of:
Steps, a plurality of internal connection electrodes on the upper end surface of the step
Having a shield electrode on the inner bottom surface and the above when viewed from the top surface
One side of the internal connection electrode or its extension is perpendicular to one side
Package with a shield electrode non-formed part
A first step of mounting the package, and then placing the package on top
From one side of the internal connection electrode or its
The intersection of the extension and one side of the shield electrode non-formed portion
At least two inspections are performed, and the midpoint of the straight line connecting the two points is used as a reference.
To determine the connection position between the wire and the internal connection electrode
And connecting the internal connection electrode and the element to each other.
A third step of connecting the package opening, and
And a fourth step of sealing with an electrode, and the above object can be achieved by performing positioning using the internal connection electrode and the shield electrode non-formed portion having the best shape accuracy.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention has a step on inner walls facing each other, and an upper end surface of the step.
Has a plurality of internal connection electrodes, and a shield electrode
And one side or the side of the internal connection electrode when viewed from above.
Of the shield electrode where one side is orthogonal to the extension of
A first step of mounting the element in a package having
Image recognition of the package from above, and the internal connection
One side of the electrode or its extension and the shield electrode non-shaped
Check at least two intersections on one side of the component
Wire and the internal connection electrode with reference to the midpoint of the connecting straight line
A second step of determining a position for connecting the internal connection;
A third step of connecting an electrode and the element with a wire,
And a fourth step of sealing the package opening with a lid.
This is a method for manufacturing an electronic component, whereby the internal connection electrode and the element can be reliably electrically connected with a wire.

According to a second aspect of the present invention, there is provided an image forming apparatus according to the first aspect,
There is a step on the wall, and a plurality of internal connection
It has a pole, a shield electrode on the inside bottom, and when viewed from the top
One side of the internal connection electrode or its extension and one side are
Package having shield electrode non-forming portions that intersect
Is recognized from the upper surface, and one side or one side of the internal connection electrode is recognized.
Is the intersection of the extension line and one side of the shield electrode non-formed portion
At least two points, and find the middle point of the straight line connecting the two points.
A first step of determining a mounting position of the element as a reference;
A second step of mounting the device in a package;
A third step of electrically connecting the internal connection electrode with a wire
And a fourth step of sealing the opening of the package.
Is a method of manufacturing electronic components that
Can be implemented

According to a third aspect of the present invention, there is provided an image forming apparatus according to the first aspect,
There is a step on the wall, and a plurality of internal connection
It has a pole, a shield electrode on the inside bottom, and when viewed from the top
One side of the internal connection electrode or its extension and one side are
Package having shield electrode non-forming portions that intersect
Is recognized from the upper surface, and one side or one side of the internal connection electrode is recognized.
Is the intersection of the extension line and one side of the shield electrode non-formed portion
At least two points, and find the middle point of the straight line connecting the two points.
A first step of determining a mounting position of the element as a reference;
A second step of mounting the device in a package;
A third step of electrically connecting the internal connection electrode with a wire
And a fourth step of sealing the opening of the package.
In this method, the element can be reliably mounted on a package, and the element and the internal connection electrode can be reliably connected by a wire.

[0018]

[0019]

[0020]

Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking an elastic surface device as an example.

(Embodiment 1) FIG. 1 is a top view of an elastic surface device according to Embodiment 1 of the present invention before sealing with a lid, and FIG. 2 is a cross-sectional view of the elastic surface device shown in FIG. is there.

Reference numeral 10 denotes a ceramic substrate, 11 denotes a first ceramic frame, and 12 denotes a second ceramic frame. The ceramic substrate 10, the first ceramic frame 11, and the second ceramic frame 12 are provided on the inner wall. A package 13 having a step 26 is formed. 14 is an internal connection electrode, 15 is a shield electrode, 16 is an adhesive layer, 17 is a SAW element, 18
a and 18b are portions where no shield electrode is formed, 19 is a wire, 2
0 is a seam ring, 21 is a lid, 22 is a comb-shaped electrode, 2
3 is a reflector electrode, 24 is a connection electrode, and 25 is silver braze.

First, a plating base layer having the same shape as the shield electrode 15 and the internal connection electrode 14 to be formed on the surface, surface and side surfaces of the ceramic substrate 10 is formed.

Next, a first ceramic frame 11 is provided on the ceramic substrate 10. A plating base layer having the same shape as the internal connection electrode 14 to be formed on the surface and the outer peripheral side surface of the first ceramic frame 11 is formed.

Next, a second ceramic frame 12 having the same outer peripheral shape as that of the first ceramic frame 11 and having a width smaller than that of the first ceramic frame 11 is provided on the first ceramic frame 11. And fired, and the ceramic substrate 10 and the first
Then, the package 13 having the step 26 on the opposing inner side walls is manufactured by integrating the second ceramic frames 11 and 12. A plating base layer is also formed on the upper surface of the second ceramic frame 12.

Here, the ceramic substrate 10, the first ceramic frame 11, and the second ceramic frame 12 are all composed mainly of aluminum oxide, and the plating underlayer is composed mainly of tungsten.

Thereafter, nickel plating is performed on the plating underlayer of the package 13, and a seam ring having the same coefficient of thermal expansion as that of the package 13 is formed on the upper end surface of the second ceramic frame 12 of the package 13 by using a silver solder 25. 20
Is provided.

Next, nickel plating is again performed and then gold plating is performed to obtain the internal connection electrode 14 and the shield electrode 15.

As can be seen from FIG. 1, a plurality of internal connection electrodes 14 are provided on the inner peripheral side upper end surface (the upper end surface of the first ceramic frame 11) of the inner wall having the step 26 of the package 13. It is formed so as to reach the inner peripheral end, and each side thereof is formed on each side of the package 13 (the first ceramic frame 11).
Are parallel to each other.

Each side of the shield electrode non-forming portions 18a and 18b on the inner bottom surface of the package 13 is
3 is provided so as to be parallel to each side and to reach the lower end of the inner periphery of the first ceramic frame 11.

Further, the shield electrode non-formed portions 18a, 18b
Package 13 so that one side of the inner peripheral lower end of the first ceramic frame 11 and one side of the internal connection electrode 14 are orthogonal to each other.
1 of the internal connection electrode 14 when viewed from above
3 and the non-shield electrode forming portions 18a and 18b
And the shield electrode non-forming portions 18a and 18b are provided one at each end of the opposing internal connection electrode 14.
Is formed.

On the other hand, a plurality of comb electrodes 22 for input and output on the piezoelectric substrate, a plurality of reflector electrodes 23 on both sides of the comb electrodes 22, and a plurality of connection electrodes 24 electrically connected to the reflector electrodes 23. Thus, a SAW element 17 is obtained.

Next, the SAW element 17 is fixed via the adhesive layer 16 on the shield electrode 15 on the inner bottom surface of the package 13. At this time, the internal connection electrode 14 and the connection electrode of the SAW element 17 are substantially on the same plane. When viewed from above, the internal connection electrode 14 and the connection electrode 24 of the SAW element 17 are viewed.
The shield electrode non-formed portions 18a and 18b are present between them.

Next, the package 13 is image-recognized from the upper surface, and the shield electrode non-forming portions 18a, 1
8b, an orthogonal point between one side of the inner peripheral lower end of the first ceramic frame 11 and one side of the internal connection electrode 14 is detected, and based on the midpoint of a straight line connecting these two points, the various dimensions of the package 13 are determined. The connection portion between the internal connection electrode 14 and the wire 19 is determined.

Further, the electrode patterns such as the comb electrode 22, the reflector electrode 23 and the connection electrode 24 provided on the surface of the SAW element 17 are recognized, and the position where the connection electrode 24 and the wire 19 are connected is also determined.

Thereafter, one end of the wire 19 is connected to the internal connection electrode 1.
4 and the other end are electrically connected to the connection electrode 24 of the SAW terminal 17.

Next, the lid 21 is welded to the seam ring 20 provided on the upper end surface of the package 13 to
The SAW element 17 is sealed in the package 13.

(Embodiment 2) First, as in Embodiment 1, a package 13 having an internal connection electrode 14 and a shield electrode 15 and a SAW element 17 are formed.

Next, the package 13 is image-recognized from the upper surface, and the shield electrode non-formed portions 18a, 1
8b, an orthogonal point between one side of the inner peripheral lower end of the first ceramic frame 11 and one side of the internal connection electrode 14 is detected, and based on the midpoint of a straight line connecting these two points, the various dimensions of the package 13 are determined. The mounting position of the SAW element 17 is determined.

Thereafter, the shield electrode 1 of the package 13
The SAW element 17 is mounted on the substrate 5 via the adhesive layer 16.

Next, after connecting the connection electrode 24 of the SAW element 17 and the internal connection electrode 14 with the wire 19, the package 1
The lid 21 is welded to the seam ring 20 provided on the upper end surface of the SAW 3, and the SAW element 17 is sealed in the package.

(Embodiment 3) First, as in Embodiment 1, a package 13 having an internal connection electrode 14 and a shield electrode 15 and a SAW element 17 are formed.

Next, the package 13 is image-recognized from the upper surface, and the shield electrode non-formed portions 18a and 1
8b, an orthogonal point between one side of the inner peripheral lower end of the first ceramic frame 11 and one side of the internal connection electrode 14 is detected, and based on the midpoint of a straight line connecting these two points, the various dimensions of the package 13 are determined. The mounting position of the SAW element 17 is determined.

Thereafter, the shield electrode 1 of the package 13
The SAW element 17 is mounted on the substrate 5 via the adhesive layer 16.
At this time, the internal connection electrode 14 and the connection electrode 2 of the SAW element 17 are connected.
4 exists on substantially the same plane. When viewed from above, shield electrode non-formed portions 18a and 18b exist between the internal connection electrode 14 and the connection electrode of the SAW element 17.

Next, the package 13 is image-recognized from the upper surface, and is internally connected to one side of the inner peripheral lower end of the first ceramic frame 11 of the shield electrode non-formed portions 18a, 18b at the opposing upper end surfaces of the side wall of the package 13. Electrode 1
The connection point between the internal connection electrode 14 and the wire 19 is determined from various dimensions of the package 13 with reference to the midpoint of a straight line connecting these two points.

Thereafter, one end of the wire 19 is connected to the internal connection electrode 1.
4 and the other end are electrically connected to the connection electrode 24 of the SAW element 17.

Next, the lid 21 is welded to the seam ring 20 provided on the upper end surface of the package 13,
The SAW element 17 is sealed in the package 13.

Hereinafter, the points of the present invention will be described.

(1) In the present invention, the SAW element 17
In order to determine the mounting position or the connection portion between the wire 19 and the internal connection electrode 14, the boundary point between the inner peripheral end of the package 13 and the side end of the internal connection electrode 14 of the shield electrode 15 is recognized. Is going.

The reason why this part is selected as a recognition point will be described.

First, in order to reduce the error, it is preferable that the distance between the recognition points is as long as possible. Therefore, the inner peripheral end of the seam ring 20 of the package 13 and the internal connection electrode 1
It suffices to recognize the boundary point between the first ceramic frame 11 formed with 4 and the second ceramic frame 12.
Since the seam ring 20 is fixed to the upper end surface of the second ceramic frame 12 with the silver braze 25, the positional accuracy varies. However, since the inner peripheral end of the first ceramic frame 11 is formed by punching, the variation in shape accuracy is much smaller than the positional accuracy of the seam ring 20.

Also, the lid 2 is formed using the seam ring 20.
In addition to the case where the first ceramic frame 1 is welded and the case where the second ceramic frame 12 is sealed with solder, it is necessary to form a plating layer on the upper end surface of the second ceramic frame 12. Since the shape accuracy is not excellent, it is desirable that the positioning be performed using the inner peripheral end of the first ceramic frame 11 also in this case.

(2) Shield electrode non-formed portions 18a, 18
By providing “b” corresponding to the side end of the internal connection electrode 14, when the package 13 is image-recognized from the upper surface, the internal connection electrode 14 and the shield electrode 15 are formed by the same gold plating in the above embodiment. Because they are the same color, it is difficult to distinguish them. Therefore, by providing the shield electrode non-forming portions 18a and 18b and utilizing the contrast due to the difference in color between the portions and the internal connection electrodes 14, positioning can be performed more accurately.

(3) Shield electrode non-forming portions 18a, 18
b indicates that the corner of the internal connection electrode 14 exists between the widths of the side ends of the internal connection electrode 14 of the shield electrode non-formed portions 18a and 18b when the package 13 is viewed from above as shown in FIG. Alternatively, as shown in FIG. 3, the shield electrode non-formed portions 18a and 18b and the corners of the internal connection electrode 14 may be formed apart from each other.

In any case, the shield electrode non-formed portion 1
Positioning is performed by detecting a point at which one side of the side end of the internal connection electrode 8a or 18b or an extension thereof is orthogonal to one side of the internal connection electrode 14.

However, in order to perform more accurate positioning, as shown in FIG.
It is preferable that the shield electrode non-formed portions 18a and 18b are formed such that corners of the internal connection electrode 14 exist between the widths of the side ends of the internal connection electrode 14 of the internal connection electrodes 14a and 18b.

(4) Since the plane can be defined by two points, the shield electrode non-formed portions 18a and 18b are provided at the side end of one of the internal connection electrodes 14 of the shield electrode 15, and the points orthogonal to each other are provided. By detecting, the positioning can be performed. However, in order to perform the positioning more accurately, the shield electrode non-formed portions 18a and 18b are provided at both ends of the shield electrode 15 on the side of the internal connection electrode 14 and the shield electrode non-formed portions. It is desirable that the distance between the point where one side of the side end of the internal connection electrode 14 of 18a, 18b and one side of the internal connection electrode 14 is orthogonal is as long as possible.

(5) First ceramic frame 11 and second ceramic frame 11
Is formed by punching a ceramic sheet into a desired shape. Therefore, the inner peripheral side surface is always tapered. If the angle between the inner peripheral side surface and the upper end surface is an obtuse angle, the boundary between the inner peripheral end and the bottom end of the first ceramic frame 11 when the package 13 is viewed from the top cannot be recognized, Since the boundary between the inner peripheral upper end of the first ceramic frame 11 and the inner peripheral side surface is recognized, SA
The W element 17 cannot be securely mounted, or the SAW element 1
7 may not be connected to the internal connection electrode 14 with the wire 19.

Therefore, when the first ceramic frame 11 is laminated on the ceramic substrate 10 as shown in FIG. 4, it is desirable that the angle between the inner peripheral side surface and the upper end surface be an acute angle.

(6) When performing image recognition for positioning the connection between the internal connection electrode 14 and the wire 19, the width of the shield electrode non-formed portions 18a and 18b is wider than the width of the defocus of the lens for performing image recognition. Thereby, erroneous recognition can be prevented.

(7) By forming the upper surface of the SAW element 17 and the internal connection electrode 14 on substantially the same plane, the focus is adjusted to both the internal connection electrode 14 of the SAW element 17 during image recognition. Internal connection electrode 14 and package 13
And the connection electrode 2 of the SAW element 17
4. Recognition of the electrode patterns of the comb-shaped electrode 22, the reflector electrode 23 and the like can be easily performed.

(8) Shield electrode 15 and internal connection electrode 1
When the package 13 formed using the same material as the package No. 4 was viewed from the top surface, it was very difficult to recognize the boundary between the inner peripheral edge and the inner bottom edge of the package 13. Therefore, the package 1 is mounted so that the mounting accuracy of the SAW element 17 is not deteriorated.
The SAW element 17 was mounted by making the inside of 3 larger than necessary. However, according to the present invention, the SAW element 17
Can be reliably determined, so that the size inside the package 13 can be reduced to the minimum necessary for mounting the SAW element 17. Therefore, the size of the surface acoustic wave device can be reduced.

(9) The larger the shield electrode 15 is, the greater the shielding effect is. Although three or more shield electrode non-formed portions 18a and 18b may be formed, if two are formed, the mounting position of the SAW element 17 can be determined. Therefore, the number of shield electrode non-formed portions 18a and 18b is two.
It is desirable that the size be the minimum necessary.

(10) In the above embodiment, a surface acoustic wave device has been described as an example. However, similar effects can be obtained in an electronic component in which electrodes are provided on the top and bottom surfaces of a package and elements are mounted inside. It is something that can be done.

[0066]

As described above, according to the present invention, it is possible to provide a method of manufacturing an electronic component capable of reliably connecting a wire and an internal connection electrode.

[Brief description of the drawings]

FIG. 1 is a top view of a surface acoustic wave device according to Embodiments 1 to 3 of the present invention before being sealed with a lid.

FIG. 2 is a cross-sectional view of the surface acoustic wave device according to Embodiments 1 to 3 of the present invention.

FIG. 3 is a top view of a surface acoustic wave device according to another embodiment of the present invention.

FIG. 4 is a sectional view of another embodiment of the present invention.

FIG. 5 is a top view of a conventional surface acoustic wave device before sealing with a lid.

FIG. 6 is a cross-sectional view of a conventional surface acoustic wave device.

[Explanation of symbols]

 Reference Signs List 10 ceramic substrate 11 first ceramic frame 12 second ceramic frame 13 package 14 internal connection electrode 15 shield electrode 16 adhesive layer 17 SAW element 18a shield electrode non-formed portion 18b shield electrode non-formed portion 19 wire 20 seam ring 21 Lid 22 Comb electrode 23 Reflector electrode 24 Connection electrode

Claims (3)

(57) [Claims] An inner wall facing the inner wall;
A plurality of internal connection electrodes are provided on the upper end surface of the
One side of the internal connection electrode when viewed from above
Or a shielded electric wire whose one side is orthogonal to its extension
A first method for mounting an element in a package having a pole non-forming portion
Process and then image recognition of the package from above,
One side of the internal connection electrode or its extension and the seal
Check out at least two intersections on one side of the non-electrode formation part,
The wire and the inner part are referred to the midpoint of the straight line connecting the two points.
A second step of determining a position to be connected to the external connection electrode;
A third step of connecting the internal connection electrode and the element with a wire
And a fourth step of sealing the package opening with a lid.
And a method for manufacturing an electronic component. 2. The method according to claim 1 , wherein the inner walls opposing each other have steps.
A plurality of internal connection electrodes are provided on the upper end surface of the
One side of the internal connection electrode when viewed from above
Or a shielded electric wire whose one side is orthogonal to its extension
Image recognition of the package having the extremely non-formed part from the top,
One side of the internal connection electrode or an extension thereof and the sheet
Detects at least two points of intersection of one side where no ground electrode is formed
And mounting the element on the basis of the midpoint of the straight line connecting the two points.
A first step of determining the position and mounting the device in a package;
Mounting a second step, and connecting the element and the internal connection electrode to a wire.
A third step of making electrical connection with ears,
And a fourth step of sealing the opening . 3. The method according to claim 1 , wherein the inner walls opposing each other have steps.
A plurality of internal connection electrodes are provided on the upper end surface of the
One side of the internal connection electrode when viewed from above
Or a shielded electric wire whose one side is orthogonal to its extension
Image recognition of the package having the extremely non-formed part from the top,
One side of the internal connection electrode or an extension thereof and the sheet
Detects at least two points of intersection of one side where no ground electrode is formed
And mounting the element on the basis of the midpoint of the straight line connecting the two points.
A first step of determining the position and mounting the device in a package;
Mounting a second step, and connecting the element and the internal connection electrode to a wire.
A third step of making electrical connection with ears,
And a fourth step of sealing the opening .