JP3303880B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an electronic component mounting method capable of speeding up board transfer.

[0002]

2. Description of the Related Art A recent electronic component mounting apparatus using a rotary table can realize a mounting operation time of about 0.1 second per one electronic component, and the mounting operation itself becomes extremely fast. I have.

[0003]

However, in addition to the above-described high-speed operation, the electronic component mounting apparatus needs to carry out the mounted board to the next process and also to carry in the board before mounting. is there.

[0004] However, while the speed of the mounting operation has been remarkably increased, this substrate transport operation is still old, and the substrate transport time takes about 5 to 7 seconds.

[0005] This is because, before the mounted board is completely unloaded, the board before mounting is loaded, and the mounted board can be unloaded only slowly. And the only thing that can only unload the mounted board is
Electronic components are simply mounted on the mounted board instead of being fixed.If the mounted board is transported quickly, the electronic components on the mounted board may be misaligned or fall down. It is because.

[0006] In spite of such circumstances, 5 to 10 electronic components can be mounted only by shortening the board transfer time by, for example, only 1 second. Therefore, it is required to improve the productivity of the entire electronic component mounting apparatus.

Accordingly, an object of the present invention is to provide an electronic component mounting method capable of speeding up board transfer.

[0008]

According to the present invention, a transfer head for picking up an electronic component is provided with a fixed track including a pickup station for picking up the electronic component from a component supply section and a mounting station for mounting the electronic component on a substrate. While the electronic components are mounted on the board while circulating, the board already mounted at a position distant from the fixed track is carried out to the next process by the board carrying out means from the positioning portion for positioning the board, and the board before mounting is An electronic component mounting method configured to be carried into the positioning unit from a substrate loading unit located on a side opposite to the substrate unloading unit as viewed from the positioning unit, wherein the substrate mounted by a substrate transfer mechanism is mounted on the positioning unit. After the substrate is lifted up and before the transfer to the board unloading means is completed, the board before mounting is transferred to the positioning unit by the board unloading means. It is obtained by way.

Further, the substrate transfer mechanism is configured to sandwich the opposing edge of the substrate, separate the substrate upward, and transfer the substrate to the substrate unloading means in that state.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention, and FIG. FIG. 4 is an explanatory view of a process of an electronic component mounting method, FIG. 4 is an explanatory view of a process of an electronic component mounting method according to an embodiment of the present invention, and FIG. 6 is an explanatory view of a process of an electronic component mounting method according to an embodiment of the present invention, FIG. 7 is an explanatory view of a process of an electronic component mounting method according to an embodiment of the present invention, and FIG. FIG. 4 is a process explanatory view of the electronic component mounting method.

As shown in FIG. 1, the electronic component mounting apparatus employs a method in which a plurality of transfer heads 2 are provided concentrically on a rotary table 1 and the rotary table 1 is circulated in the direction of arrow M1. As a result, the transfer head 2 circulates on a fixed trajectory including the pickup station S1 and the mounting station S2 (shifted by 180 degrees from each other) (a trajectory separated by a certain distance from the center of the rotary table 1 in a plan view).

The pickup station S1 is provided with a component supply unit 3 that moves in the X direction. Parts supply unit 3
In FIG. 1, parts cassettes 4 for supplying various electronic components are arranged in the X direction. The component supply unit 3 is moved in the X direction, and a parts cassette 4 having electronic components of a type to be supplied to the transfer head 2 is set in the pickup station S1.

The positioning section 5 positions the substrate 6 between a position directly below the mounting station S2 opposite to the pickup station S1 and the position shown in FIG. The positioning section 5 has a substrate holding conveyor 8 that holds an opposing edge of the substrate 6 parallel to the X direction, and a positioning mechanism 7 that positions the substrate holding conveyor 8 in the XYZ directions. The details of the positioning mechanism 7 will be described later.

In the state shown in FIG. 1, the mounted board 6 and the unmounted board 20 are to be exchanged and carried out / in. And the board holding conveyor 8 of the positioning part 5
The board 20 before mounting is transported to the right side in FIG. 1 and the board 20 is transferred to the board holding conveyor 8. The board unloading conveyor 21 located on the opposite side of the board loading conveyer 19 when viewed from the board holding conveyor 8 receives the mounted board 6 by the board transfer mechanism 9 described below, and proceeds to the next step (FIG. (Right direction of 1) The substrate 6 is unloaded.

The substrate transfer mechanism 9 has the following components. First, the arms 10 and 11 hold opposing edges parallel to the Y direction. The arm 10 and the arm 11 are respectively attached to the base ends of the arm 10 and the arm 11 by the lifting cylinder 1.
2. It is supported by the rod of the lifting cylinder 13. The lifting cylinder 12 and the lifting cylinder 13 are slidably mounted on the moving plate 15 in the X direction.
4 moves symmetrically. Therefore, the arm 10 and the arm 11 are simultaneously moved up and down by the lifting cylinder 12 and the lifting cylinder 13, and are opened and closed by both rod cylinders 14.

A feed nut 16 is attached to a side surface of the movable plate 15. A feed screw 17 having an X direction as an axial direction is screwed to the feed nut 16, and the feed screw 17 is rotated by a motor 18. Therefore, arm 10, arm 11
When the motor 6 is driven while holding the substrate 6 with the arms 10 and 11 closed, the substrate 6 can be transferred in the X direction.

Next, a positioning mechanism 7 will be described with reference to FIGS.
Will be described. As shown in FIG.
Has the following elements: First, the Y table 2 on the base 22
3 are provided, and an X table 24, X
A horizontal fixed plate 25 is provided on the table 24, and a lower support block 26 is provided on the fixed plate 25. On the upper surface of the support block 26, a plurality of support pins 27 of the same size are erected. The lower receiving pin 27 has an upper end portion in contact with the lower surface of the substrate 6 to flatly receive the substrate 6 (FIG. 3).

A push-up cylinder 28 and a push-up cylinder 29 which operate in synchronization with each other are provided on the base 22, and their rods 30 and 31 always project upward and downward by the same height. Further, the lifting column 32 and the lifting column 33 are protruded downward from the lower surface of the horizontal lifting plate 34 at the same interval as the rods 30 and 31, and the lifting column 3 is provided.
2. The lower end of the lifting column 33 is a rod 30, a rod 31
Abuts on the upper end of the device so as to be able to freely come and go. The lifting column 32,
The lifting column 33 is supported to be movable up and down with respect to the fixed plate 25, and a spring 37 and a spring 38 are interposed between the lower surface of the fixed plate 25 and the lower ends of the lifting column 32 and the lifting column 33.

On both sides of the lifting plate 34,
In order to open and close the substrate holding conveyor 8 with respect to the substrate 6 in the direction of the arrow N1, a pair of open / close cylinders 35 and open / close cylinders 36 for symmetrically moving the pair of substrates 6 are arranged.

Next, each step of the electronic component mounting method of the present embodiment will be described with reference to FIGS. First, as shown in FIG. 4, it is assumed that the board 6 is held by the board holding conveyer 8, is under the mounting station S2, and the components are mounted. At this time, the next loading station S2
The unmounted board 20 to be transferred to the board is sent to the board carrying conveyor 19 and is on standby. When the mounting of the substrate 6 is completed, the positioning mechanism 7 positions the substrate holding conveyor 8 between the substrate loading conveyor 19 and the substrate unloading conveyor 21 as shown by the positioning unit 5.

Next, as shown in FIG. 6, the arms 10 and 11 are closed by the two rod cylinders 14 (arrow N).
3) The opposite edge parallel to the Y direction of the board 6 is held, and the board holding conveyor 8 is held by the open / close cylinder 35 and the open / close cylinder 36.
Is opened as shown by an arrow N4, and the lifting cylinders 12, 13 are opened.
The arm 10 and the arm 11 are raised by the
Is lifted slightly above the substrate holding conveyor 8 and separated therefrom.

Next, as shown in FIG. 7, the opened board holding conveyor 8 is closed, and the board 20 before mounting is transferred from the board loading conveyor 19 to the board holding conveyor 8 at a high speed, and the board 20 is held. After being held by the conveyor 8, the substrate 20 is immediately positioned by the positioning mechanism 7 below the mounting station S2. Here, since the electronic components are not mounted on the substrate 20, even if the substrate 20 is transferred at a high speed, there is no risk of the electronic components being displaced. That is, the transfer of the substrate 20 can be performed at a higher speed than in the related art, and the substrate loading time can be reduced. The process until the substrate 20 is positioned below the mounting station S2 will be described later in detail.

On the other hand, after the board 6 is held by the arms 10 and 11 and floated from the board holding conveyor 8, the board 10 is slowly moved by the arms 10 and 11 irrespective of the board 20 before mounting. Transfer up (arrow N
4). As described above, the board 20 can be set on the board holding conveyor 8 independently of the board 6 except for the time when the board 6 is lifted from the board holding conveyor 8.
Most of the unloading time is not included in the substrate transfer time, and the substrate transfer time can be greatly reduced.

By the way, in the experiment of the present inventor, the time was shortened by 2 to 3 seconds. However, if this shortened time is used for mounting all other parts, 20 to 30 extra parts can be mounted per cycle. The productivity of the entire electronic component mounting apparatus is greatly improved.

After that, the mounted board 6 which has been slowly transferred to the board unloading conveyor 21 is slowly unloaded to the next step by the board unloading conveyor 21 while the components of the board 20 are mounted.

Next, a process until the substrate 20 is positioned below the mounting station S2 will be described with reference to FIGS. First, FIG. 2 shows the moment when the board holding conveyer 8 holds the board 20 before mounting immediately after the arm 11 floats (chain line) on the mounted board 6 as described above. At this time, the fixed plate 25 and the lifting plate 34 on the Y table 23 and the X table 24 are separated from the mounting station S2 and are between the substrate carry-in conveyor 19 and the substrate carry-out conveyor 21. Also, the rod 30,
The rod 31 protrudes, the elevating plate 34 is at a high level, and the upper end of the support pin 27 is below the substrate 20 and does not contact the lower surface of the substrate 20.

Next, the rods 30 and 31 are immersed to lower the level of the substrate 20, and when the lifting plate 34 is lowered most, the upper end of the lower receiving pin 27 comes into contact with the lower surface of the substrate 20. ing. As a result, the substrate 20 is horizontally received by the support pins 27. Next, as shown in FIG. 3, the Y table 23 and the X table 24 are driven to position the received substrate 20 directly below the transfer head 2 passing through the mounting station S2. Then, component mounting is performed.

[0028]

According to the present invention, most of the time consumed for unloading the mounted board is eliminated, and high-speed mounting operation can be performed during this time, so that productivity is considerably improved. can do.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention.

FIG. 3 is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention.

FIG. 4 is a process explanatory view of an electronic component mounting method according to an embodiment of the present invention.

FIG. 5 is a process explanatory view of the electronic component mounting method according to one embodiment of the present invention;

FIG. 6 is a process explanatory view of the electronic component mounting method according to one embodiment of the present invention;

FIG. 7 is a process explanatory view of the electronic component mounting method according to one embodiment of the present invention;

FIG. 8 is a process explanatory view of the electronic component mounting method according to one embodiment of the present invention;

[Explanation of symbols]

 5 Positioning part 6 Substrate 19 Substrate carry-in conveyor 20 Substrate 21 Substrate carry-out conveyor

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 13/02

Claims (3)

(57) [Claims] An electronic component is mounted on a board while circulating a transfer head for picking up the electronic component on a fixed track including a pickup station for picking up the electronic component from a component supply section and a mounting station for mounting the electronic component on the board. And a board mounted at a position distant from the fixed track is carried out to a next process by a board carrying out means from a positioning section for positioning the board, and the board before mounting is taken out of the board as viewed from the positioning section. An electronic component mounting method for carrying the board into the positioning unit from a board loading unit located on the opposite side of the unit, wherein the board transfer mechanism separates the mounted board upward from the positioning unit and then unloads the board. Before the transfer to the means is completed, the board before mounting is carried into the positioning portion by the board carrying means. Child component mounting method. 2. The electronic component according to claim 1, wherein the substrate transfer mechanism holds the opposing edge of the substrate, separates the substrate upward, and transfers the substrate to the substrate unloading means in that state. Implementation method. 3. The electronic component mounting method according to claim 2, wherein the board transfer mechanism holds the board by an openable / closable arm.