JP3758932B2 - Mounter board setting device and backup pin switching method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounter board setting device and a backup pin switching method in which a board is carried into a component mounting position and a number of backup pins are exposed so as to support the carried board from the back side.
[0002]
[Prior art]
A number of backup pins in the board setting device of the mounter support the board from the back side to prevent the board from bending when mounting electronic components on the board. The size and thickness of the board, the back side of the board The arrangement differs depending on whether or not there is a leading part. For this reason, in the conventional mounter, a large number of backup pins are inserted / removed at the time of substrate replacement, and rearranged so as to have an appropriate arrangement with respect to a new substrate. This rearrangement may be performed manually by an operator facing the mounter or automatically by driving the mounting head of the mounter (for example, Japanese Patent Laid-Open No. 3-108800).
[0003]
[Problems to be solved by the invention]
Backup pin rearrangement work is difficult in manual operation and is likely to cause erroneous mounting of backup pins. In automatic operation, backup pins are misplaced (pins fall down) and the control system becomes complicated. There is a problem that takes more time than that. That is, there is a problem that the time required for the substrate setup change becomes longer depending on the work time for rearranging the backup pins.
[0004]
Accordingly, the present applicant has invented a technique as described in the specification attached to the application of Japanese Patent Application No. 10-289786.
[0005]
As shown in FIG. 10, the backup plate 101 on which the backup pin 100 is erected is placed on the backup base 105 in a positioning state via the fixtures 102 and 103. Here, when the backup plate 101 is placed on the backup base 105 in a positioning state, the lower end portion of the fixture 102 is inserted into the elongated hole 104 to engage the both. In the above configuration, the backup base 105 is fixed to the backup pin elevating device 106 via the fixture 107.
[0006]
As described above, in the above-described conventional configuration, the backup base 105 is fixed to the backup pin lifting / lowering device 106 via the fixture 107, and further, the fixture 102 is inserted into the long hole 104 provided in the backup base 105, The backup plate 101 is attached.
[0007]
Accordingly, since the number of components that are interposed until the backup pin 100 is erected on the backup pin lifting / lowering device 106, which is the base, is relatively large, there is a problem that variations in processing and assembly tolerances increase. It was.
[0008]
[Means for Solving the Problems]
  Accordingly, in view of the above problems, the mounter board setting device of the present invention includes a board backup unit in which a large number of backup pins are provided so as to support a board carried into a component mounting position from the back surface, and the board backup unit. TheA unit carrier that is loaded, loaded into the component mounting position, loaded to the component mounting position by the substrate transfer device that is unloaded from the component mounting position, and unloaded from the component mounting position; and the component mounting position by the substrate transfer device A unit lifting and lowering device that ascends from the unit carrier carried in and receives the substrate backup unit, supports it detachably, and lifts and lowers itIt is characterized by having.
[0009]
  According to this configuration,From the unit carrier carried to the component mounting position by the board conveying deviceThe substrate backup unit can be directly placed on the unit lifting device. Accordingly, it is possible to reduce the influence of machining / assembly tolerances.
[0013]
  AlsoThe unit carrier can be loaded and unloaded so that the backup pin of the substrate backup unit does not interfere with other component devices. In addition, a plurality of types of substrate backup units having different sizes can be transported by a single unit carrier.
[0017]
  Further, according to the backup pin switching method of the present invention, the substrate backup unit in which a large number of backup pins are detachably installed is configured to be detachable with respect to a unit lifting device that lifts and lowers the substrate backup unit. Place the backup unit on the board backup unit so that a large number of backup pins correspond to the board.A unit lifting device that is mounted on the unit carrier, carries the board to the component mounting position, and carries the unit carrier into the device by the board transfer device that unloads from the component mounting position, and lifts the board backup unit from the unit carrier.It is characterized by being attached.
[0018]
  According to this method,The backup pin can be rearranged outside the apparatus. For this reason, regardless of the board changeover, the backup pin can be rearranged for the next board, and this can be introduced into the equipment at the time of the board change. There is no need to change.
  In addition, the unit carrier can be loaded and unloaded so that the backup pin of the substrate backup unit does not interfere with other component devices.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, with reference to the attached drawings, a description will be given of a case where a mounter substrate setting device and a backup pin switching method according to an embodiment of the present invention are applied to a substrate supply unit of a multi-function chip mounter.
[0022]
This mounter is configured so that various electronic components can be mounted on different types of substrates. FIG. 1 is a plan view of the mounter. As shown in FIG. 1, the mounter 1 includes a machine base 2, a substrate supply unit 3 extending in the left-right direction at the center of the machine base 2, and a front part of the machine base 2. Component supply units are prepared respectively (on the lower side in the figure) and on the rear part (upper side in the figure) of the machine base 2.
[0023]
In the component supply unit, for example, a tape cassette feeder 4a that supplies components while being stored in a tape and a tray feeder 4b that supplies components while being stored in a tray are arbitrarily arranged. In the present embodiment shown in FIG. 1, two tape cassette feeders 4a including a plurality of tape cassette feeders 4a are arranged on the front part (lower side in the figure) of the machine base 2 and the rear part of the machine base 2 (Upper side in the figure) shows a state in which one tape cassette feeder group 4a and one tray feeder 4b are arranged.
[0024]
However, this is only an example, and it goes without saying that it can be arbitrarily changed according to the types of various components mounted on the substrate S to be handled. It is only necessary to arbitrarily select and arrange three types of component supply feeders including a stick feeder to be supplied at the same time.
[0025]
Further, the machine base 2 includes a group of adjacent parts supply units, for example, within a group of two tape cassette feeders 4a arranged in the front part (the lower side in the drawing) of the machine base 2, and An X beam 5a which is movable within the range of the tape cassette feeder 4a group and the tray feeder 4b arranged at the rear (upper side in the drawing), and the front of the machine base 2 with the X beam 5a interposed between the substrate supply unit 3 A pair of Y beams 5b are prepared so as to be movable across the rear part of the machine base 2 from the part.
[0026]
A first head unit 6a and a second head unit 6b for picking up and mounting electronic components are mounted on the X beam 5a. Each head unit 6a, 6b is equipped with a mounting head 8 on which a suction nozzle 7 (see FIG. 2) is mounted and a substrate recognition camera (not shown). A pair of component recognition cameras 10a and 10b and two nozzle stockers 11a and 11b are disposed on the machine base 2 with the board supply unit 3 interposed therebetween.
[0027]
In the mounter 1, small electronic components such as surface mount components are mainly supplied from the tape cassette feeder 4a group and stick feeder, and large electronic components such as multi-lead components are mainly supplied from the tray feeder 4b.
[0028]
Further, the substrate S is supplied from the left side by the substrate supply unit 3, is immovably set at the center of the machine base 2, and is discharged to the right side.
[0029]
For example, when the first head unit 6a is used to mount the electronic components supplied from the two tape cassette feeders 4a arranged on the front part (the lower side in the figure) of the machine base 2 on the substrate S. To explain, first, the first head unit 6a is caused to face the desired tape cassette feeder 4a by the operation of the X beam 5a, and the suction nozzle 7 is made to suck the desired electronic component. Subsequently, the electronic component in the state of being sucked by the suction nozzle 7 on the way of moving the first head unit 6a in the direction of the substrate by the operation of the Y beam 5b (on the front side of the machine base 2). The first head unit 6a is moved to a predetermined position on the substrate S by the operation of the Y beam 5b, and the substrate is recognized by the substrate recognition camera mounted on the first head unit 6a. After recognizing the position, the electronic component is mounted on the substrate S.
[0030]
The substrate supply unit 3 includes a clamp device 21 disposed in the center, a substrate carry-in mechanism 22 connected to the left side of the clamp device 21 in the drawing, and a substrate carry-out mechanism 23 connected to the right side of the clamp device 21 in the drawing. The substrate S is carried into the clamp device 21 from outside the device by the substrate carry-in mechanism 22, and is fixedly set so as to receive the electronic component mounted by the clamp device 21, and from the lower side so as not to bend when the component is mounted. Supported.
[0031]
Then, the substrate S on which the electronic component has been mounted is unloaded from the clamp device 21 via the substrate unloading mechanism 23.
[0032]
By the way, an electronic component is mounted (mounted) on the board S clamped by the clamping device 21. At this time, a back-up pin 13 (see FIG. 2) to be described later is provided from the back side of the board to prevent the board S from being bent. I'm going to support this. Since the arrangement of the substrate S differs depending on the size and thickness of the substrate S and whether or not there is a front part on the back side of the substrate, a large number of backup pins 13 are inserted and removed when changing the substrate, and a new substrate S is obtained. Are rearranged so that they are arranged appropriately.
[0033]
Hereinafter, the clamp device 21 will be described with reference to FIGS. 2 and 3. In the following description of the clamping device 21, the description will proceed with the substrate transport direction (longitudinal direction) as front and rear (left and right as a whole of the mounter 1) and the width direction of the substrate as left and right (back and forth as the whole of the mounter 1). And
[0034]
The clamping device 21 includes a fixed-side substrate introduction table 31a and a movable-side substrate introduction table 31b that respectively support the left and right ends of the substrate S, and the movable-side substrate introduction table 31b in the left-right direction according to the width of the substrate S to be introduced. An introduction table moving device (not shown) for advancing and retreating, receiving the substrate S from the substrate carry-in mechanism 22 and conveying the belt to a predetermined clamping position (component mounting position) of both the substrate introduction tables 31a and 31b, and mounting of electronic components A conveyor-type substrate transfer device 33 (conveyor rollers 33a and 33b and a belt 34 to be described later) that conveys the completed substrate S from the clamp position to the substrate carry-out mechanism 23 is provided. Reference numeral 39 denotes an air cylinder, which is positioned in the width direction of the substrate S carried into the substrate supply unit 3 by the operation of the air cylinder 39.
[0035]
Further, the clamp device 21 moves the vertical movement lever 37 up and down via an urging body (for example, a spring 36) by the operation of the air cylinder 39 fixed to the substrate introduction bases 31a and 31b. S can be separated from the conveyor level. That is, as shown in FIG. 3A, when the vertical movement lever 37 is moved downward, the substrate S is in a transfer level position by the conveyor and is transferred downstream as the conveyor is driven. Further, as shown in FIG. 3B, when the vertical movement lever 37 is moved upward, the substrate S is transferred above the transfer level position, and therefore the substrate S is transferred by the conveyor. Is released from.
[0036]
Further, the clamping device 21 includes a large number of backup pins 13 that face and support the substrate S set at the clamping position from below, a backup table 14a on which a large number of backup pins 13 are erected, and a backup table 14a. And a backup pin lifting / lowering device 15 (see FIGS. 2 and 5) that lifts and lowers the backup pin 13 through.
[0037]
The fixed-side substrate introduction table 31a and the movable-side substrate introduction table 31b are disposed so as to face each other, and the backup table 14a and the backup pin lifting / lowering device 15 are disposed below the substrate introduction tables 31a and 31b. It is arranged. The backup table 14a is formed in a substantially square shape in plan view, and a tweezer plate 14b for erecting the backup pin 13 is placed on the upper side of the backup table 14a. The backup pin 13 is mounted on the tweezer plate 14b. A number of set holes 14c for standing are formed. A large number of set holes 14c are distributed over the entire area of the tweezer plate 14b, but the fixed substrate introduction table 31a side has a fine pitch and the movable substrate introduction table 31b has a rough pitch so as to correspond to the substrates S having different widths. It is arranged. In this case, the backup pin 13 is set (mounted) according to the size of the substrate S, and when there is a front part on the back surface of the substrate S, escapes it and is inserted into the set hole 14c as appropriate. .
[0038]
In the backup table 14a, the motor 16 is driven to rotate, the rotation is transmitted to the cam 18 via the belt 17, and the cam 18 is rotated so that the link body 19 in contact with the cam 18 is connected to the cam 18. It swings along the outer peripheral diameter, and by this swinging, it is moved up and down by being pushed up by the distal end portion 20 of the link body 19.
[0039]
On the other hand, the fixed-side substrate introduction table 31a has a “U” -shaped guide that guides the side end portion of the substrate S by an inner portion thereof and a conveyor roller 33a of the substrate transfer device 33 attached thereto. A groove 38 is formed. Similarly, the movable-side substrate introduction table 31b has a “U” -shaped guide that guides the side edge of the substrate S by the inner portion thereof and the conveyor roller 33a of the substrate transfer device 33 attached thereto. A groove 38 is formed. Further, an air cylinder 39 faces the movable side substrate introduction table 31b in the guide groove 38, so that the introduced substrate S can be pressed and fixed between the fixed side substrate introduction table 31a.
[0040]
Hereinafter, the substrate transfer apparatus will be described with reference to FIGS. 4 and 5.
[0041]
In addition, this board | substrate conveyance apparatus is equipped with the board | substrate S (mounting work position in which a component is actually mounted in a clamp position in this embodiment, and a mounting work standby position) in a clamp position (component mounting position). The board S) can be mounted at the mounting work position and the mounting work standby position, and the board stop positions (on the board loading mechanism 22, on the mounting work standby position, on the mounting work position, and on the board carry-out mechanism 23) can be mounted. By shortening the transport stroke during substrate transport, the substrate transport time can be shortened.
[0042]
Further, the clamping device 21 is arranged in accordance with the mounting work position and the mounting work standby position (hereinafter, the clamping device on the mounting work position side is referred to as 21a, and the clamping device on the mounting work standby position side is referred to as 21b. The mounting work position side substrate and the mounting work standby position side substrate can be moved separately from the transport level by the substrate transfer device 33 by the vertical movement operation of each clamp device 21a, 21b. Thus, since the board S can be carried into the mounting work standby position during the mounting work on the board S at the mounting work position, the board transfer efficiency can be improved.
[0043]
45a and 45b are stoppers. The stopper 45a is for positioning the substrate S by abutting against the tip of the substrate S that has been carried into the mounting work position. 45b is a mounting work standby position from the board carry-in mechanism 22. This is for restricting the loading of the substrate S into the substrate. In the case of the substrate flow in the opposite direction (right to left) with respect to the substrate flow from left to right on the drawing paper described above, the stopper 45b contacts the tip of the substrate S that has been carried into the mounting work position. The substrate S is positioned by contact, and 45a regulates the loading of the substrate S from the substrate carry-out mechanism 23 (which corresponds to the substrate carry-in mechanism 22 as a function) to the mounting work standby position.
[0044]
Reference numerals 46a, 46b, 46c, 46d, 46e, 46f, 46g, and 46h are photosensors for detecting the passing state of each part of the substrate S by the conveyor.
[0045]
Reference numerals 50a, 50b, and 50c denote motors that drive the conveyors of the substrate carry-in mechanism 22, the substrate carry-out mechanism 23, and the substrate supply unit 3. The operation of the motors 50a, 50b, and 50c causes the substrates S on the conveyors to be belt-conveyed. The In the present embodiment, since the motors 50a, 50b, and 50c need to be position-controllable motors, for example, a pulse motor or a servo motor is used instead of the conventional AC motor. Furthermore, since the component mounting operation is accompanied by a component mounting operation, its stop accuracy is required, but the other substrate carry-in mechanism 22 and the substrate carry-out mechanism 23 often do not require stop accuracy up to that point, In such a case, it is possible to suppress an increase in cost by configuring the drive source of both the mechanisms 22 and 23 with an AC motor or the like as in the conventional case.
[0046]
Hereinafter, a substrate setting device and a backup pin switching method, which are features of the present invention, will be described with reference to the drawings.
[0047]
6 to 9 show a method of introducing the substrate backup unit 60 composed of the backup pin 13 and the tweezer plate 14b from the outside of the apparatus. In this case, the substrate backup unit 60 on which the backup pins 13 are set is mounted on the unit carrier 70, introduced through the substrate carry-in mechanism 22 in the same manner as the substrate is introduced, and received on the backup table 14a.
[0048]
When changing the setup, an empty unit carrier 70 is sent from outside the apparatus, and the substrate backup unit 60 is transferred from the backup table 14a to the unit carrier 70. In this state, the substrate unloading mechanism 23 is moved in the same manner as the substrate. Through the device. The substrate backup unit 60 (tweezer plate 14b) is prepared in several types having different sizes according to the size of the substrate to be handled. Of course, this set operation (removal / replacement operation) is performed outside the apparatus separately from the operation of the mounter 1.
[0049]
On the other hand, the unit carrier 70 has a rectangular plate-like carrier plate 71 similar to the substrate, a fixed support plate 72 and a movable support plate 73 attached to the left and right of the lower surface of the carrier plate 71, and the front and rear attached to the upper surface of the carrier plate 71. And a pair of handles 74.
[0050]
The fixed support plate 72 and the movable support plate 73 are formed to have a substantially “S” cross section and are arranged so as to face each other. And the board | substrate backup unit 60 is mounted so that it may pass between lower horizontal piece 72a, 73a of both the support plates 72,73. The hanging dimension of the fixed support plate 72 and the movable support plate 73 is not limited to the case where the backup pin 13 erected on the tweezer plate 14b can be held by the carrier plate 71, but also when the tweezer plate 14b is lifted for transfer. In addition, the backup pin 13 is of a size that cannot be held by the carrier plate 71.
[0051]
The lower horizontal piece 72a of the fixed support plate 72 is provided with a pair of front and rear upward projections 75, and the through holes 64 of the tweezer plate 14b are fitted to the upward projections 75 so that the substrate backup unit 60 is unit carrier. 70. By this positioning, the position of the substrate backup unit 60, more specifically, the backup pin 13 erected on the board backup unit 60, and the front end of the carrier plate 71 of the unit carrier 70 (actually, the position of one corner thereof) Accurate positioning. As a result, when the board backup unit 60 is transferred (moved up and down) from the unit carrier 70 carried into the component mounting position in the same manner as the board, the backup pin 13 is transferred at this stage. Will be accurately positioned with respect to the device.
[0052]
The upper end of the movable support plate 73 is fixed to the carrier plate 71 by a pair of front and rear levers 76 with screws. That is, the movable support plate 73 is fastened to the unit carrier 71 by the lever 76 through a long hole (not shown) formed in the carrier plate 71 extending in the left-right direction.
[0053]
As described above, several types of tweezer plates 14b having different sizes are prepared, and the unit carrier 70 is changed by releasing the fixing by the lever 76 and changing the position of the movable support plate 73 along the long hole. The board backup unit 60 having a different size can be mounted on the board.
[0054]
Further, a pair of front and rear positioning projections 51 project from the backup table 14a, and the positioning projections 51 are fitted into predetermined set holes 14c of the tweezer plate 14b, so that the substrate backup unit 60 is tweezers. Positioned on the plate 14b.
[0055]
Next, a procedure for introducing the substrate backup unit 60 will be described with reference to FIGS.
[0056]
First, outside the apparatus, a tweezer plate 14b is set on a jig (not shown), and a number of backup pins 13 are mounted on the tweezer plate 14b in correspondence with the substrate (rearrangement). Next, the substrate backup unit 60 is placed (set) on the unit carrier 70 and set in the substrate carry-in mechanism 22 in this state (see FIG. 6). 6 to 9 show a state in which only one backup pin 13 is mounted on the tweezer plate 14b for the sake of illustration, naturally, a large number of backup pins 13 are mounted. Yes. Here, the substrate supply unit 3 is driven.
[0057]
Thereby, first, the board | substrate carrying-in mechanism 22 and the board | substrate transfer apparatus 33 of the clamp apparatus 21 are driven, The unit carrier 70 is carried in to a component mounting position similarly to a board | substrate, and this is fixed.
[0058]
That is, when the unit carrier 70 is carried to a predetermined position on the backup pin lifting / lowering device 15, the backup table 14 a is lifted by driving the backup pin lifting / lowering device 15.
[0059]
Then, when the backup table 14a is raised, the positioning projection 51 standing on the backup table 14a is fitted into a predetermined set hole 14c of the tweezer plate 14b, and the board backup unit 60 is positioned on the tweezer plate 14b. Is done.
[0060]
Further, when the backup table 14a is raised, the board backup unit 60 is lifted from the unit carrier 70, and the board backup unit 60 is released from the unit carrier 70 (see FIG. 7).
[0061]
Then, after placing the substrate tweezer plate 14b on the backup table 14a, the empty unit carrier 70 is transported forward by the drive of the substrate transfer device 33 and the substrate carry-out mechanism 23, and is carried out of the device. (See FIG. 8).
[0062]
Finally, at the same time when the unit carrier 70 is unloaded from the component mounting position, the backup pin lifting / lowering device 15 is driven to lower the backup table 14a on which the board backup unit 60 is placed and return to the standby position. Thereafter, the substrate is introduced and the normal mounting operation is started.
[0063]
On the other hand, when a new substrate backup unit 60 is introduced at the time of setup change, the substrate backup unit 60 is first raised to the delivery position via the backup table 14a prior to the introduction. Next, the empty unit carrier 70 is carried into the component mounting position via the board carry-in mechanism 22.
[0064]
At this time, the unit carrier 70 is introduced so that both of the support plates 72 and 73 are under the substrate backup unit 60. Here, the backup table 14 a is lowered and the substrate backup unit 60 is transferred to the unit carrier 70. Then, the unit carrier 70 on which the substrate backup unit 60 is mounted is unloaded from the apparatus via the substrate unloading mechanism 23.
[0065]
As described above, according to the present embodiment, the backup pin 13 is set (rearranged) on the tweezer plate 14b outside the apparatus, and the substrate carry-in mechanism 22 is used when the substrate is replaced. Therefore, the backup pins 13 can be rearranged at the time of operation, not when the mounter 1 is replaced.
[0066]
In other words, the rearrangement operation of the backup pin 13 that requires the longest time among the replacement operations for the next substrate can be performed in parallel with the operation of the mounter 1. Therefore, the time required for the setup change can be extremely shortened.
[0067]
Further, in the present embodiment, the tweezer plate 14b provided with the backup pin 13 upright is directly placed on the backup table 14a constituting the backup pin lifting / lowering device 15 in a positioning state. ), The number of parts is reduced, and variations in machining and assembly tolerances can be reduced.
[0068]
As described above, in the present invention, since variations such as processing / assembly tolerances can be reduced, for example, when there is a front part under the board S, the backup pin 13 can be installed up to the very vicinity of the part. it can. Therefore, since the installation allowable range of the backup pin 13 is widened, the mounting accuracy of the mounted component can be improved.
[0069]
In this embodiment, the substrate backup unit is loaded (unloaded) into the apparatus while mounted on the unit carrier. However, it is not always necessary to use the unit carrier, and the substrate backup unit is loaded in the same manner as the substrate. You may make it do.
[0070]
In addition, the unit carrier on which the substrate backup unit is mounted is loaded into and unloaded from the apparatus using the substrate loading mechanism and the substrate unloading mechanism. You may make it carry in and set.
[0071]
Furthermore, the present invention can be applied to a so-called high-speed mounter (rotary type), and can be applied not only to a mounter but also to various apparatuses having a substrate transfer apparatus.
[0072]
【The invention's effect】
According to the present invention, since the substrate backup unit on which the backup pin is erected is directly placed on the backup pin lifting / lowering device in a positioning state, the influence due to processing / assembly tolerance can be reduced as compared with the conventional case.
[0073]
  In addition, outside the device, the backup pins are erected on the substrate backup unit in an arrangement corresponding to the substrate, and this is introduced into the device in the same manner as the substrate. No need to rearrange backup pins. Therefore, the time required for the setup change can be extremely reduced without being affected by the work time for rearranging the backup pins.
  Furthermore, the unit carrier can carry in / out the backup pin of the substrate backup unit so that it does not interfere with other component devices. In addition, a plurality of types of substrate backup units having different sizes can be transported by a single unit carrier.
[Brief description of the drawings]
FIG. 1 is a plan view of a mounter to which the present invention is applied.
FIG. 2 is a side view of a mounter to which the present invention is applied.
FIG. 3 is a side view of the clamping device of the substrate transfer apparatus of the present invention.
FIG. 4 is a plan view showing a substrate transfer apparatus according to the present invention.
FIG. 5 is a front view showing a substrate transfer apparatus of the present invention.
FIG. 6 is an explanatory diagram showing a backup pin switching method according to the present invention.
FIG. 7 is an explanatory diagram showing a backup pin switching method according to the present invention.
FIG. 8 is an explanatory diagram showing a backup pin switching method according to the present invention.
FIG. 9 is an explanatory diagram showing a backup pin switching method according to the present invention.
FIG. 10 is a diagram for explaining a conventional problem.
[Explanation of symbols]
1 Mounter
3 Substrate supply unit
13 Backup pin
14a Backup table
14b tweezers plate
15 Backup pin lifting device
21 Clamping device
22 Board loading mechanism
23 Substrate unloading mechanism
33 Substrate transfer device
51 Positioning protrusion
60 Substrate backup unit
70 unit carrier
75 upward projection

Claims (2)

A board backup unit with a number of backup pins standing upright to support the board carried to the component mounting position from the backside;
A unit carrier that carries the board backup unit, carries the board to the component mounting position, and carries it to the component mounting position by the board conveying device that carries it out from the component mounting position, and also carries it out of the component mounting position;
A substrate setting device for a mounter, comprising: a unit elevating device that ascends from the unit carrier carried into the component mounting position by the substrate conveying device, receives a substrate backup unit, supports it detachably, and elevates it . A board backup unit that detachably mounts a number of backup pins is configured to be detachable from a unit lifting device that lifts and lowers the board backup unit.
Outside the device, the board backup unit is erected in advance in an arrangement corresponding to the board, and the board backup unit is mounted on the unit carrier in this state, and the board is loaded into the component mounting position. And mounting the unit carrier into the apparatus by means of a board transfer apparatus that is unloaded from the component mounting position, and mounting the board backup unit from the unit carrier to the unit lifting apparatus. Backup pin switching method .

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