JP3312969B2 - Circuit element for microwave / millimeter wave band - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-reflection terminator, an attenuator, a matching line, a resonator element, a switch, etc. used in a circuit using a dielectric substrate or a dielectric line used for microwaves and millimeter waves. A circuit element for a microwave / millimeter wave band in which a circuit element is formed by integrally fusing a main line or a substrate dielectric portion and a high frequency absorbing member containing a material having a characteristic different from that of the main line or the substrate dielectric portion. And a method of manufacturing the same.

[0002]

2. Description of the Related Art An NRD guide line, which is a type of dielectric line used for microwaves and millimeter waves, will be described below as an example. Conventionally, a general NRD guide line having a configuration as shown in FIG. 50 is known. FIG. 50 is an explanatory view showing the principle of the NRD guide. In FIG. 50, a dielectric line 5003 for signal transmission having a height a is provided between the upper conductor plate 5001 and the lower conductor plate 5002. . At this time, the upper conductor plate 5001
The distance (height a) between the lower conductor plate 5002 and the upper conductor plate 5001 outside the dielectric line 5003
N equal to or less than 1/2 wavelength of the operating frequency in the portion between the two
Construct an RD guide.

FIG. 51 is an explanatory view showing the structure of a conventional anti-reflection terminator for an NRD guide.
101 is an upper dielectric resin strip, 5102 is a lower dielectric resin strip, 5103 is a resistive film, and 5104 is V
The V-shaped notch taper 5105 is a Δ-shaped dielectric sheet.

The resistive film 5103 is made of, for example, a resin film on which a metal is deposited, and is formed of, for example, an upper dielectric resin strip 5101 and a lower dielectric resin strip 51 made of pure fluorine resin or the like having good high-frequency electrical characteristics.
02 is sandwiched from above and below by two dielectric resin strips. In addition, a V-shaped cut portion on the input side of the resistive film 5103 for improving broadband / reflection characteristics is provided with a Δ-shaped dielectric in order to fill a gap generated by the upper dielectric resin strip 5101 and the lower dielectric resin strip 5102. The body sheet 5105, for example, a pure fluororesin sheet is put in and fixed with an adhesive or the like.
The dielectric sheet 5105 suppresses the loss of reflection due to the gap and the generation of unnecessary modes.

FIG. 52 is an explanatory view showing the configuration of a conventional NRD guide attenuator.
201 is an upper dielectric resin strip, 5202 is a lower dielectric resin strip, 5203 is a resistive film, 5205 is a dielectric sheet, and 5206 is a V-shaped cut portion.

The resistive film 5203 is formed by, for example, forming a resin film on which a metal is deposited by using an upper dielectric resin strip 5201 and a lower dielectric resin strip 52 formed of, for example, pure fluororesin having good high-frequency electrical characteristics.
02 is sandwiched from above and below by two dielectric resin strips. Also, a V-shaped cut portion 5206 on the input side of the resistive film 5203 has a structure in which a dielectric sheet 5205 matching the cut shape, for example, a pure fluororesin sheet is inserted.

FIG. 53 is an explanatory diagram showing the configuration of a conventional NRD guide semiconductor active circuit, and shows an example in which input / output matching of the semiconductor circuit is achieved. In the figure,
The main line input / output dielectric portions 5301 and 5302 and the matching input / output high dielectric blocks 5303 and 5304 are connected to the bias feed and high frequency signal extraction (or injection) coaxial line portion 5305, and the semiconductor diode 5
The circuit board 5307 on which the 306 is mounted is sandwiched from front and rear. Furthermore, the main line input / output dielectric part 5
301, 5302, matching input / output high dielectric block 53
03, 5304, and the circuit board 5307 are manually aligned with the spacing and axis alignment. In this case,
Dimensions and permittivity of matching input / output high dielectric blocks 5303 and 5304 and matching input / output high dielectric blocks 53
The distance between the 03, 5304 and the circuit board 5307 is designed in advance based on the high frequency characteristics of the semiconductor diode 5306 mounted on the circuit board 5307.

FIG. 60 is an explanatory diagram showing the alignment of each component in the above configuration. As shown in the figure,
The alignment of the gaps 6001 and the shaft cores 6002 and their securing were performed by using a jig or the like (in FIG. 60, upper and lower conductor plates are abbreviated).

FIG. 54 is an explanatory view showing a mounting example (filter example) of a conventional NRD guide resonator element.
In the figure, reference numerals 5401 and 5402 denote dielectric lines for input / output signal transmission, and a resonator element 540 is provided at the center thereof.
3 are arranged. This resonator element 5403 is manufactured as follows (the upper conductor plate is abbreviated in FIG. 54).

FIG. 55 shows a conventional resonator element 540.
FIG. 3 is an explanatory view showing a manufacturing method of No. 3; The resonator element 540
3 is a high dielectric constant (ε _r =
(Approximately 4 to 100) As the dielectric portion, for example, a dielectric disc resonant element 5501 using high relative dielectric constant ceramics;
Spacer support for low dielectric constant of the upper and lower supporting the dielectric disc resonator element 5501 and (epsilon _r = about 1.5 to 4) dielectric disk 5502,5503, the central axis of these three disc parts It comprises a low relative dielectric constant dielectric tube 5504 for overlapping, restraining and integrating, and for preventing condensation of water droplets and the like at the joint between the three disk components.

FIG. 61 is an explanatory view showing an assembled state of the resonator element. FIG. 61 (a) shows a dielectric disk resonator element 5501.
And a gap 6101 is generated between the dielectric disk 5502 and
(B) shows each component (dielectric disc resonance element 5501, dielectric disc 55) in the low relative dielectric constant dielectric tube 5504.
03, the low relative dielectric constant dielectric tube 5504) is inclined, and (c) shows each component (dielectric disk resonance element 5501, dielectric disk 5503, low relative dielectric constant dielectric tube 550).
FIG. 61 shows a case where the projections 6102 and the depressions 6103 are generated due to variation in the dimension 4) (the upper and lower conductor plates are abbreviated in FIG. 61).

FIG. 56 is an explanatory view showing the configuration of a conventional NRD guide / switch circuit. In FIG. 56, an electrode 5602 on which a PIN diode 5601 is loaded with a conductor pattern on a circuit board and a high-frequency choke pattern 56 are shown.
In this configuration, bias leads 5605 and 5606 are connected to the diode mount 5604 that constitutes No. 03, and the diode mount 5604 is sandwiched between the input-side dielectric line 5607 and the output-side dielectric line 5608. In this conventional example, a PIN diode 5601, a matching block 5609 for line matching, and a matching gap 5610 are provided (FIG. 56).
, The upper conductor plate is abbreviated).

Next, as a board type circuit example, a configuration example of a conventional MIC circuit board will be described with reference to FIGS. FIG. 57 is an explanatory view showing the configuration of a conventional microstrip line substrate. In the figure, this circuit is, for example, a B-type circuit in which a filter circuit 5706 is loaded.
The circuit 5701 and, for example, the A circuit 5702 and the C circuit 5703 loaded with the matching pattern circuit 5707,
A circuit 5702 and B circuit 5701, B circuit 5701 and C
The respective joints of the circuit 5703 are joints 5704 and 5705.
Are reconnected by a copper foil or the like. Further, the B circuit 5701, to the huge total length and area to constitute the same relative dielectric constant epsilon _r = 2 to 4 about the material as A circuit 5702 and C circuit 5703, the relative dielectric constant epsilon _r of the B circuit 5701 It is about 10. Also, the B circuit 570
1 base, another dielectric (e.g., alumina ceramic) or formed by, or constituting mixed alumina ceramic powder to a substrate of dielectric constant epsilon _r.

FIG. 58 is an explanatory diagram showing the configuration of a conventional microstrip line attenuator.
On the substrate 5801 of a certain specific dielectric constant epsilon _r, the microstrip circuit 5802, a resistor line portion 5803 by a thin film of tantalum nitride (or thick film) and the line arrangement a microstrip circuit 5803. Further, the resistance line portion 5803 is formed on the substrate 5801. Reference numeral 5805 is a ground plane.

FIG. 59 is an explanatory view showing the structure of a conventional MIC circulator using a magnetic ceramic. In FIG. 59, 5901, 5902, 5903 indicate a commonly used dielectric material having a relative dielectric constant of ε _r = 2 to 4. Reference numeral 5904 denotes a substrate formed by forming a microstrip pattern on a ferrite (magnetic ceramic) substrate, and reference numeral 5902 denotes a termination circuit. Similarly to FIG 57, the use of large ferrite (magnetic ceramics) plates relative permeability mu _r, 590
1, 5902, 5903 are separate.

[0016]

However, the prior art as described above has the following problems. That is, first, in the conventional non-reflection terminator for NRD guide, which is a kind of dielectric line, and a method of manufacturing the same, the resistive film is fixed by sandwiching the resistive film from above and below with a dielectric material, and is fixed on both surfaces of the resistive film. Adhesive is applied and bonded. Also, if the frequency generally used is an ultra-high frequency band such as a millimeter wave band, the wavelength in the dielectric line becomes about several millimeters, and the reflection and absorption characteristics of the frequency are improved. It will be small. Therefore, since the area of the bonding portion is small, the bonding operation is troublesome and easy to peel off, and there is a problem that a positional shift in the bonding surface is caused. Furthermore, there is a problem in reliability in that moisture absorption by the adhesive and chemical change to the resistive film are given, and the change over time in the electrical characteristics becomes large, and the uniformity of the anti-reflection characteristics is not maintained for a long time. .

Second, the conventional NRD guide attenuator and its manufacturing method also have the same configuration as that of the above-mentioned non-reflection terminator and are fixed by an adhesive. In addition, there were problems with adhesiveness and electrical characteristics.

Third, in the conventional NRD guide matching line and the method of manufacturing the same, the main line dielectric and the matching portion dielectric block are separately manufactured in advance, and mutual positioning is performed during assembly. As shown in FIG. 60, gaps between components and their axes are liable to occur because they are fixed using an adhesive or a double-sided tape. Therefore,
The relative misalignment of each component has caused the non-uniformity of the high-frequency characteristics and the yield during mass production to deteriorate. further,
The use of the adhesive or the double-sided tape has the same problems as described above in terms of adhesiveness and electrical characteristics.

Fourth, in the conventional resonator element for NRD guide and the method of manufacturing the same, after stacking the very small components with their central axes aligned,
Put in tube. For this reason, as shown in FIG. 61, gaps, inclinations, irregularities, and the like are likely to occur between the components, and high-frequency characteristics are inferior, and adjustments and corrections thereof, or selection of non-defective products are required. Etc.
There were problems in electrical characteristics and mass productivity.

Fifth, in the conventional NRD guide / switch circuit, the number of components is large, and the alignment and position fixation between the components is troublesome, which hinders mass productivity. There were problems in electrical characteristics and mass productivity. Furthermore, since a semiconductor diode is used, the amount of reflection is also increased in matching with the next circuit element connected to the line due to a change in line impedance when the switch is turned ON / OFF, which impedes the smooth transmission of signals. There was a problem.

Sixth, in the configuration of the conventional MIC circuit board, there is a problem that assemblability deteriorates, such as re-connection work of each line and troublesome work of sharing a ground plane on the back surface. was there.

The present invention has been made in view of the above, and realizes integration of a main line dielectric and a functional circuit element or a substrate connected to the main line dielectric without using an adhesive or the like. In addition, the object is to stabilize electric characteristics and improve mass productivity.

[0023]

In order to achieve the above object, the present invention provides a microwave / millimeter-wave circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter-wave band. , The main line or substrate dielectric part made of pure dielectric resin, and the high dielectric constant of pure dielectric resin,
A high frequency absorbing member filled with at least one kind of powder or granules having high specific magnetic permeability and resistivity; A circuit element for a millimeter wave band is provided.

A first step of uniformly filling a predetermined amount of a pure dielectric resin having a low relative dielectric constant and then compressing the same, and a step of forming a pure dielectric resin on the upper surface of the molded article formed in the first step. A second step in which a predetermined amount of powder or granules having a relative dielectric constant, a high relative magnetic permeability and a resistivity are uniformly blended and compression-molded, and a molding formed by the first and second steps. A method of manufacturing a circuit element for a microwave / millimeter wave band, which includes a third step of superimposing bodies, heating and fusing them, and joining them together.

Further, a first step of pre-compression molding (preliminary pressing) of the pure dielectric resin is performed, and at least one of powder or granules having a high relative dielectric constant, a high relative magnetic permeability and a resistivity is formed. A second step of pre-compressing (pre-pressing) a pure dielectric resin having a low relative dielectric constant uniformly mixed in a predetermined amount, and a pre-pressed molded article obtained by the second step is subjected to the first step. A microwave / millimeter-wave band circuit element including a third step of laminating or butting, pressing, heating and fusing together at the upper surface or intermediate portion of the preformed body. It provides a method.

A first step in which the pure dielectric resin is pre-compressed (pre-pressed) and then fired, and at least a powder or granules having a high dielectric constant, a high magnetic permeability and a high resistivity. A second step of pre-compression molding (pre-pressing) a low dielectric constant pure dielectric resin in which at least one kind is uniformly compounded in a predetermined amount, followed by baking, and a pre-pressed molded body in the second step. ,
A microwave / millimeter wave band including a third step of superimposing or butting, pressing, heating and fusing together at an upper surface or an intermediate portion of the preformed body in the first step. To provide a method for manufacturing a circuit element for use.

Further, in a microwave / millimeter wave band circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter wave band, a main line or a substrate dielectric portion made of a pure dielectric resin is used. A high-frequency absorbing member in which a dielectric resin is filled with a powder or a granular material having resistivity; and a joining surface between the main line or the substrate dielectric portion and the high-frequency absorbing member is tapered, or An object of the present invention is to provide a circuit element for microwave / millimeter wave band in which the filling rate of a resistor is changed in a step shape and the main line or the substrate dielectric portion and the high frequency absorbing member are joined and fused.

A first step of uniformly filling a predetermined amount of a pure dielectric resin having a low relative dielectric constant and then compressing the same, and forming a resist on the upper surface of the molded body formed in the first step or an intermediate portion thereof. A step of setting the properties of the powder or granules having the characteristics according to a predetermined filling rate, uniformly blending and compression-molding, and heating the compact formed by the first and second steps. And a third step of fusing and integrally joining the circuit elements.

Further, in a microwave / millimeter wave band circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter wave band, a main line or a substrate dielectric portion made of a pure dielectric resin is used. A high frequency absorbing member in which a dielectric resin is filled with a powder or a granular material having a high relative magnetic permeability, and a joining surface between the main line or the substrate dielectric portion and the high frequency absorbing member is tapered; A circuit element for a microwave / millimeter wave band in which a filling ratio of a high relative permeability material of a member is changed in a step shape, and the main line or a substrate dielectric portion and a high frequency absorbing member are joined and fused. .

Further, after a predetermined amount of a pure dielectric resin having a low relative dielectric constant is uniformly filled, a first step of compression-molding, and a step of forming a high-density resin on the upper surface of the molded body or the intermediate portion thereof by the first step. A second step of setting the characteristics of the powder or granules having magnetic permeability according to a predetermined filling rate, uniformly blending and compression-molding, and a molded body molded by the first and second steps And a third step of integrally bonding by heating and fusing the components to provide a circuit element for a microwave / millimeter wave band.

Further, in a microwave / millimeter wave band circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter wave band, a main line or a substrate dielectric portion made of a pure dielectric resin, A high-frequency absorbing member in which a dielectric resin is filled with a powder or a granular material having a high relative permittivity, and a joining surface between the main line or the substrate dielectric portion and the high-frequency absorbing member is tapered, or the high-frequency absorbing member is A circuit element for a microwave / millimeter wave band in which the main line or a substrate dielectric portion and the high frequency absorbing member are joined and fused by changing the filling ratio of a high dielectric constant material of the member into a step shape. is there.

Further, after a predetermined amount of a pure dielectric resin having a low relative permittivity is uniformly filled, a first step of compression molding, and a high ratio of the upper surface of the molded body formed in the first step or an intermediate portion thereof are provided. A second step of setting the properties of a powder or a granule having a dielectric constant according to a predetermined filling rate, uniformly blending and compression-molding, and a molded article molded by the first and second steps And a third step of integrally bonding by heating and fusing the components to provide a circuit element for a microwave / millimeter wave band.

Further, in a microwave / millimeter wave band circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter wave band, a main line or a substrate dielectric portion made of a pure dielectric resin is used. High relative dielectric constant for dielectric resin,
2 of powders or granules having high specific magnetic permeability and resistivity
An object of the present invention is to provide a circuit element for a microwave / millimeter wave band comprising a high frequency absorbing member filled with one or three types, and wherein the main line or the substrate dielectric portion and the high frequency absorbing member are joined and fused.

A first step of uniformly filling a predetermined amount of a low dielectric constant pure dielectric resin, followed by compression molding, and a pure dielectric resin in an intermediate portion of the molded body molded in the first step. First, two or three types of powder or granules having high relative permittivity, high relative magnetic permeability, and resistivity are selected, the characteristics are set according to a predetermined filling rate, and then uniform blending and compression molding are performed. 2. A method for manufacturing a circuit element for a microwave / millimeter wave band, comprising: a second step; and a third step of heating and fusing the molded body formed by the first and second steps to integrally join the molded bodies. To provide.

[0035]

According to a circuit element and a manufacturing method for a microwave / millimeter wave band according to the present invention, a dielectric resin is filled with powder or granules having high relative permittivity, high relative magnetic permeability, and resistivity. The unfilled portion is inseparable from the unfilled portion and is integrally formed into a continuous structure to constitute a functional circuit element or a substrate function.

Further, the dielectric resin is filled with a powder or a granular material having a resistivity, and is inseparable from an unfilled portion, and
The function of the main line and the non-reflection terminator, or the main line and the attenuator, is formed by forming the joint part into a tapered shape or changing the filling rate while integrally forming a continuous structure.

In addition, a dielectric resin is filled with powder or granules having a high relative magnetic permeability, is inseparable from the unfilled portion, and is integrally formed into a continuous structure. Alternatively, by changing the filling rate, the functions of the main line and the non-reflection terminator, the main line and the attenuator, the main line and the switch, or the main line and the isolator or circulator are configured.

In addition, the dielectric resin is filled with powder or granules having a high relative dielectric constant, is inseparable from the unfilled portion, and is integrally molded into a continuous structure, and the filling ratio is fixed or periodically set. By changing, the function of the main line and the matching element is configured.

Further, two or three kinds of powder or granules having a high relative permittivity, a high relative magnetic permeability, and a resistivity are filled in the dielectric resin, and are not separated from an unfilled portion, and
It is integrally molded into a continuous structure to configure the function of the main line and the matching / conversion element.

[0040]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a circuit element for an NRD guide, which is a kind of a dielectric line, and a method of manufacturing the same will be described below with reference to the accompanying drawings. Here, the following six embodiments will be described in detail. That is, the configuration of the non-reflection terminator for the NRD guide and its manufacturing method (Example 1) The configuration of the NRD guide attenuator and its manufacturing method (Example 2) The configuration of the NRD guide matching line and its manufacturing method (Example 3) Configuration of NRD Guide Resonator Element and Manufacturing Method Thereof (Embodiment 4) Configuration of NRD guide / switch circuit (Example 5) Configuration of an impedance matching conversion element (Example 6).

Embodiment 1 Configuration of NRD Guide Non-Reflective Terminator and Manufacturing Method Thereof [Configuration of NRD Guide Non-Reflective Terminator 1] Configuration 1 of the NRD guide non-reflective terminator will be described. FIG. 1 is an explanatory view showing a configuration 1 of an NRD guide non-reflection terminator according to the present invention.
Numeral 02 denotes a lower conductor plate, 103 denotes a non-reflection terminator, and an input portion pure dielectric resin portion 104 made of pure fluororesin and a high-frequency electromagnetic wave absorber portion 105 made of a dielectric resin filled with an electromagnetic wave absorbing material powder or the like. Consists of In addition, 106
Is a boundary surface between the input portion pure dielectric resin portion 104 and the high-frequency electromagnetic wave absorber portion 105.

The high-frequency electromagnetic wave absorbing portion 105 is made of, for example, a fluororesin (in this embodiment, an example will be described in which the dielectric is made of a fluororesin having excellent high-frequency characteristics).
A fine solid such as carbon, graphite, carbon fiber, or ferrite, which is a powder of a material having high-frequency electromagnetic wave absorption, is uniformly filled at a constant weight ratio or volume ratio. For example, when carbon is used, good reflection characteristics can be obtained at about 3 to 15 wt% in terms of the weight filling rate with respect to the fluororesin. FIG. 2 shows data of the reflection characteristics in this case.

Further, a boundary surface 106 between the input portion pure dielectric resin portion 104 and the high-frequency electromagnetic wave absorber portion 105 is formed of a tapered surface having a length l ₁ for improving the reflection characteristics. by relaxing the reflection characteristic of the input side by l _1, nonreflective by favorable frequency characteristics are realized such, sufficiently absorb and attenuate electromagnetic waves power input by the terminating portion of the length l ₂ last for broadband The terminator 103 is configured.

[Method 1 of Manufacturing Non-Reflective Terminator for NRD Guide] Method 1 of manufacturing a non-reflective terminal for NRD guide will be described. 3 and 4 are explanatory diagrams showing a method 1 of manufacturing an anti-reflection terminator for an NRD guide.
01 is a dielectric member, 302 is a high frequency absorbing member, 303 is a material for a non-reflection terminator, and 304 is a boundary surface. In FIG. 4, reference numeral 401 denotes a plate-like material for an anti-reflection terminator;
Denotes a fusion line, which is manufactured by the following steps.

As a first step, first, a tetrafluoroethylene resin (chemical name: polytetrafluoroethylene; hereinafter, P
After uniformly filling a predetermined amount with a TFE resin, cover with a pressing die and apply a surface pressure of 25 kgf / cm ² (at least 0.5 kgf / cm ² ).
gf / cm ² or more).

In the second step, next, a radio wave absorbing material-containing P which is uniformly blended with 10% by weight of carbon powder as a radio wave absorbing material is formed on the upper surface of the pre-press molded PTFE resin molded body.
A predetermined amount of TFE resin is charged.

Next, as a third step, a pressing die is used.
Molding pressure 250 kgf / cm ² (50-700 kgf / c
compression molded at m range ^2). Thus, the dielectric member 301 and the high frequency absorbing member 302 shown in FIG. 3 are obtained. At this time, it has been confirmed that the boundary surface 304 between the dielectric member 301 and the high frequency absorbing member 302 is pressure-agglomerated with PTFE resin and is firmly joined. Also,
This boundary surface 304 has no irregularities and is extremely smooth.

Next, as a fourth step, the compressed molded body material is taken out of the cylindrical mold and subjected to a heat treatment (firing) at a melting point of 327 ° C. (preferably 340 ° C.) or more of the PTFE resin for 3 hours. Then, a non-reflection terminator material 303 in which the dielectric member 301 and the high frequency absorbing member 302 are integrally bonded and fused at the boundary surface 304 is formed.

The non-reflective terminal material 303 can be formed by firing (hot coining) the compressed material in a cylindrical mold. Alternatively, the PTFE resin containing the absorber into which the radio wave absorber powder is uniformly blended may be pre-pressurized in advance, and compression molded together with the pre-pressed PTFE resin molded body.

In the fifth step, as shown in FIG. 4, the material for non-reflective terminator 303 is cut to form a plate-like material for non-reflective terminator 401. At this time, X at an angle θ with respect to the fusion line 402 (corresponding to the boundary surface 304).
-X 'and Y-Y' cut along the height a, width b, non-reflective terminator for NRD guide taper length l ₁ 1
03 is manufactured. In addition, it has been confirmed that this non-reflection terminator is formed by integrally joining the boundary surface between the dielectric line portion and the absorber portion by firmly joining and fusing.

[Operation of NRD Guide Non-Reflective Terminator] Next, the operation of the non-reflective terminator 103 will be described. FIG.
FIG. 3 is an explanatory view showing the operation principle of the non-reflection terminator, and shows a cross section of the dielectric line and the non-reflection terminator. FIGS. 5A and 5B show a malfunction state, and FIG. 5C shows a good operation state. As shown in FIG. 5C, the input wave signal 501 input to the non-reflection terminator 103 has a boundary surface 106 between the dielectric line portion 104 and the high-frequency electromagnetic wave absorber 105 physically formed integrally. In addition, since it has a tapered shape and the filling density of the high-frequency electromagnetic wave absorber 105 is appropriate, it enters the high-frequency electromagnetic wave absorber 105 without being reflected at the boundary surface 106, and
02 (the state of the input wave signal) is absorbed and attenuated.

A good input wave signal 5 as shown in FIG.
5A, a part of the input wave signal 501 becomes a reflected wave 503 at the boundary surface 106 in FIG. 5A since the taper angle of the boundary surface 106 is steep in FIG. Reflection characteristics cannot be obtained. Therefore, it can be understood that the optimum value of the taper angle of the boundary surface 106 changes depending on the filling density of the high-frequency electromagnetic wave absorber 105.

In FIG. 5B, since the filling density and the taper angle of the boundary surface 106 are appropriate, the reflection of the input wave signal 105 on the boundary surface 106 does not occur. However, since the length l ₂ of the high-frequency electromagnetic wave absorber 105 is insufficient, a transmitted wave 504 is generated from the high-frequency electromagnetic wave absorber 105, and sufficient broadband non-reflection characteristics cannot be obtained.

[Optimization of packing density, taper length and terminal length]
Therefore, in the non-reflection terminator 103 according to the present invention,
After optimizing the packing density of the high-frequency electromagnetic wave absorber 105, the taper angle of the boundary surface 106, that is, the taper length l ₁
And the terminal length l ₂ of the high-frequency electromagnetic wave absorber 105
Also need to be optimized. The details will be described below.

FIG. 6 is a graph showing reflection characteristic data when the filling rate of the high-frequency electromagnetic wave absorber 105 is changed. (A) is characteristic data when the filling rate is 15% or less, and (b) is characteristic data when the filling rate is 20% or more. In the sample shown in FIG. 6, the inclination of the tapered surface of the boundary surface 106 is perpendicular to the signal transmission direction, and the reflected wave 50
3 is a state in which the reflection is easy to occur, and the filling rate when the reflection is the least in this state is the most preferable ratio. Therefore, as apparent from FIG. 6, it is understood that the filling rate is preferably 15 wt% or less.

Next, FIG. 7 shows an example in which the taper length l ₁ is obtained by optimizing the taper length while keeping the filling rate constant. That is, FIG. 7 shows the case where the taper length l ₁ ≒ 8 mm, the filling rate is 10 wt% or less, and the terminal length l ₂ ≒ 6 mm of the absorption attenuation portion. In this case, the reflection characteristics are shown in FIG. Data.

Therefore, according to the above example, when the filling material of the high-frequency electromagnetic wave absorber 105 is, for example, carbon, graphite, ferrite or the like, the filling rate of the fluororesin is about 15% at the maximum to about 1% at the minimum by weight. , Taper length l ₁
Depends on the applied frequency, but if it is 40Hz or more,
About 5 to 20 mm, the termination length l ₂ of the absorbing damping part is longer is preferred by the filling factor, in practice 0-2
It is considered to be about 0 mm.

[Procedure of Manufacturing Method] The procedure of the method of manufacturing the non-reflection terminator for NRD guide will be described. A fluororesin dielectric member made of a low dielectric constant material in advance, and a high-frequency absorbing member in which the fluororesin dielectric member is filled with a resistor such as carbon, graphite, ferrite, or a radio wave absorbing material, is heated to a temperature higher than the melting point of the fluororesin. A material for the terminator that has been joined and fused at a temperature is molded, and a terminator having a desired size and shape is manufactured from the material for the terminator by, for example, cutting or cutting. Therefore, the high-frequency absorber portion and the dielectric line portion are integrally joined by fusion. In addition, since a terminator having a desired size and shape can be appropriately manufactured from the above-mentioned terminator material, a large number of non-reflective terminators 103 having uniform high-frequency electrical characteristics can be manufactured at a time.

[Configuration 2 of Non-Reflection Terminator for NRD Guide]
Configuration 2 of the non-reflection terminator for NRD guide will be described. FIG. 8 is an explanatory diagram showing the configuration of the configuration 2 of the non-reflection terminator for the NRD guide. In the figure, reference numeral 801 denotes a stack of absorber microblocks in which the packing density of the radio wave absorbing material increases sequentially in the direction of the incident radio wave. It is a high-frequency electromagnetic wave absorber part to be constituted.

The high-frequency electromagnetic wave absorbing portion 801 determines the weight or volume filling ratio of fillers such as carbon, graphite, carbon fiber, and ferrite, as shown in FIG. It is made of fluororesin filled with high-frequency electromagnetic wave absorbing material so that it is transmitted while suppressing reflection of incident electromagnetic waves by increasing the height in the transmission direction evenly, realizing anti-reflection characteristics by absorbing electromagnetic waves Let it.
The high-frequency electromagnetic wave absorber 801 is manufactured by simultaneous integral molding at the time of resin molding in the same manner as described above.

[Configuration 3 of Non-Reflection Terminator for NRD Guide]
Configuration 3 of the NRD guide non-reflection terminator will be described. FIG. 9 is an explanatory diagram showing the configuration of the configuration 3 of the non-reflection terminator for the NRD guide.
(A) V-shaped tapered boundary surface 901, or
(B) An inverted V-shaped tapered boundary surface 902 is formed.

A high-frequency electromagnetic wave absorbing portion 105 in which a high-frequency electromagnetic wave absorbing material such as carbon, graphite, carbon fiber, and ferrite is filled in a fluororesin or the like as a pure dielectric material, and a dielectric line portion made of a fluororesin. The shape of the boundary portion with the V. 104 is changed to a V-shaped tapered boundary surface 901 or an inverted V-shaped tapered boundary surface 90.
2 to improve the anti-reflection characteristics. Also, this tapered shape is manufactured by simultaneous integral molding at the time of resin molding in the same manner as described above.

[Method 2 of Manufacturing Non-Reflection Terminator for NRD Guide] Method 2 of manufacturing a non-reflection terminal for NRD guide will be described. FIG. 10 is an explanatory diagram illustrating a method 2 of manufacturing the non-reflection terminator for the NRD guide. In the figure, reference numeral 1001 denotes a mold used for manufacturing. Pre-fired PTFE
Pure dielectric member 301 made of resin molded body (block)
And fired PT uniformly blended with 10 wt% carbon powder
High frequency absorbing member 3 made of FE resin molded body (block)
02 separately. Next, the pure dielectric member 301
And the high-frequency absorbing member 302 are put in a mold 1001 and PT
Pressurization and heating are simultaneously performed at a temperature equal to or higher than the melting point of the FE resin (hot coining method) to form a material for an anti-reflection terminator. Thereafter, in the same manner as in the manufacturing method 1 of the NRD guide non-reflective terminator, the NRD guide non-reflective terminator 103 is used.
To manufacture.

[Method 3 of Manufacturing Non-Reflective Terminator for NRD Guide] Method 3 of manufacturing a non-reflective terminal for NRD guide will be described. FIG. 11 is an explanatory view showing a method 3 of manufacturing a non-reflection terminator for an NRD guide. As shown in FIG. 11, a cylindrical non-reflection termination in which a pure dielectric member 301 and a high-frequency absorbing member 302 are joined and fused. Form dexterous material. afterwards,
The material for the non-reflective terminator is cut to form a sheet 11
No. 01 is manufactured and the non-reflection terminator 103 for the NRD guide is manufactured in the same manner as in the manufacturing method 1 of the non-reflection terminator for the NRD guide.
To manufacture.

[Method 4 of Manufacturing Non-Reflection Terminator for NRD Guide] Method 4 of manufacturing a non-reflection terminal for NRD guide will be described. FIG. 12 is an explanatory view showing a method 4 of manufacturing an anti-reflection terminator for an NRD guide. In the figure, reference numeral 1201 denotes a mold body composed of a bottom mold 1202, a press mold 1203, an outer frame 1204, and the like. Reference numeral 1205 denotes a sheet-like pure dielectric member, and 1206 denotes a sheet-like high-frequency absorbing member.

First, a sheet-like pure dielectric member 1205 made of a fired molded body (sheet) and carbon powder 10 wt%
Are manufactured separately from the sheet-like high-frequency absorbing member 1206 made of a fired PTFE resin molded article (sheet) in which is uniformly mixed. Next, as shown in FIG. 12, in the mold body 1201, the end surfaces of the sheet-like pure dielectric member 1205 and the sheet-like high-frequency absorbing member 1206 are abutted to each other to form a PTF.
Pressurization and heating are simultaneously performed at a temperature equal to or higher than the melting point of the E resin (hot coining method) to form a sheet-shaped material for an anti-reflection terminator. Non-reflection terminator 10 for NRD guide
3 is manufactured.

[Method 5 of Manufacturing Non-Reflection Terminator for NRD Guide] Method 5 of manufacturing a non-reflection terminal for NRD guide will be described. FIG. 13 is an explanatory diagram illustrating a method 5 of manufacturing the non-reflection terminator for the NRD guide. As shown in FIG.
A half of the cross section of the TFE resin tube has a high frequency absorbing member 3 in which 10 wt% of carbon powder is uniformly mixed with PTFE resin.
02, a half-color tube made of a pure dielectric member 301 of the other half made of PTFE resin is formed by a paste extrusion method, and the pure dielectric member 301 and the high frequency absorbing member 302 are firmly joined and fused for an NRD guide. Is manufactured. After that, the tube is opened and straightened into a flat sheet as shown in FIG. 4, and the NRD guide non-reflective terminator 10 is manufactured in the same manner as in the NRD guide non-reflective terminator manufacturing method 1.
3 is manufactured.

[Effects of the First Embodiment] The effects of the first embodiment will be described. As described above, in the first embodiment, as the dielectric line member, for example, carbon,
High-frequency electromagnetic wave absorbing material such as graphite, carbon fiber, and ferrite are filled during resin molding to form a high-frequency electromagnetic wave absorbing part, and the dielectric line and the high-frequency electromagnetic wave absorbing part are simultaneously integrated by fusion bonding. Since it is molded and manufactured, it is possible to obtain a high bonding strength with respect to the mechanical strength of the bonding surface between the dielectric and the electromagnetic wave absorber, which was a problem in the conventional method, and it becomes unnecessary to use an adhesive, and In addition, it is possible to eliminate the displacement of the joining surface between the high-frequency electromagnetic wave absorber and the dielectric line. Also,
Since no adhesive is required, it is possible to suppress changes over time and variations in high-frequency characteristics due to the adhesive, and to stabilize electrical characteristics.

Further, the method of manufacturing the non-reflection terminator according to the first embodiment includes the steps of: providing a resin dielectric member made of a low dielectric constant material for an NRD guide dielectric line;
A high-frequency absorbing member filled with a high-frequency absorbing material such as carbon, graphite, carbon fiber, and ferrite is joined and fused at a temperature equal to or higher than the melting point of the resin dielectric member to form a material for an anti-reflection terminator. From the material for the non-reflective terminator, a desired non-reflective terminator having the same dimensions and shape can be manufactured from the material for the non-reflective terminator, for example, by mass production. Is realized.

Embodiment 2 Configuration of NRD Guide Attenuator and Manufacturing Method Thereof [Configuration 1 of NRD Guide Attenuator] Configuration 1 of the NRD guide attenuator will be described. FIG.
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory diagram showing a configuration 1 of an attenuator for an NRD guide according to the present invention, in which 1401 is an input-side dielectric resin line portion, 1402 is an electromagnetic wave attenuation portion, 1403.
Is a tapered junction surface between the input-side dielectric resin line portion 1401 and the electromagnetic wave attenuation portion 1402, 1404 is an output-side dielectric resin line portion, and 1405 is a junction taper surface between the electromagnetic wave attenuation portion 1402 and the output-side dielectric resin line portion 1404. It is.

For the input-side dielectric resin line portion 1401 and the output-side dielectric resin line portion 1404, for example, a pure dielectric resin line material having excellent high-frequency characteristics is used. Also,
The electromagnetic wave attenuating portion 1402 includes, as a resistor or an electromagnetic wave absorber, a material such as carbon,
Fill with powders or fine solids such as ferrite and graphite. Also, the joining tapered surfaces 1403 and 14
05 is a bonding surface having a taper length l ₁ for nonreflective frequency characteristic enhancement, no cut surface with respect to the signal travel direction,
It has a close contact structure.

[Operation of NRD Guide Attenuator] The operation of the attenuator configured as described above will be described. FIGS. 15 and 16 are explanatory diagrams showing the operation of the attenuator according to this embodiment. In the figures, an input wave signal (electromagnetic wave) incident on the input-side dielectric resin line portion 1401 has a taper length l ₁ . via the bonding tapered surface 1403, as shown in FIG. 15, it passes through the electromagnetic wave attenuation portion 1402, further, bonding the tapered surface 1405 of the taper length l ₁
And enters the output-side dielectric resin line portion 1404.

In the above description, if the taper length l ₁ is too short, the input wave signal (electromagnetic wave) will be
At portions 03 and 1405, the light is reflected as shown in FIG. Therefore, it has an optimum value specific to the applicable band. If the resistance of the resistor or the powder of the electromagnetic wave absorbing material in the electromagnetic wave attenuating portion 1402 is too dense, the input wave signal (electromagnetic wave) will not be applied to the joining tapered surface 1403.
As shown in FIG. 5, the electromagnetic wave attenuating portion 1402 is filled with impurities with a weight ratio or a volume ratio which has an optimum value specific to the powder of the resistor to be filled.

The length l ₂ of the electromagnetic wave attenuation portion 1402
Is a predetermined electromagnetic wave attenuation value, for example, 5 dB, 10 dB,
When the taper length l ₁ is fixed to a certain value, the length l ₂ and the electromagnetic wave attenuation value are proportional to each other.

[Procedure for Manufacturing Method] The procedure for manufacturing the attenuator will be described. A resin-made dielectric member made of a low dielectric constant material is sandwiched between a resin-made dielectric member and a high-frequency absorbing member in which an electromagnetic wave absorbing material such as carbon, graphite, and ferrite or a resistor is filled. An attenuator material joined and fused at a temperature equal to or higher than the melting point of the dielectric member is formed, and the attenuator material is appropriately formed from the attenuator material at a time to obtain an attenuator having a desired shape and size by, for example, cutting or cutting. A large number of attenuators can be manufactured, and manufacturing costs are reduced.

[Configuration 2 of NRD Guide Attenuator]
Configuration 2 of the NRD guide attenuator will be described. 17 and 18 are explanatory diagrams showing the configuration of an attenuator having a V-shaped joint surface. In the figures, the input-side dielectric resin line portion and the electromagnetic wave attenuation portion, and the electromagnetic wave attenuation portion and the output side dielectric material are shown. As shown in FIG. 17, the shape of each boundary portion with the resin line portion is changed to a V-shaped tapered boundary surface 1.
701, 1702, or an inverted V-shaped tapered boundary surface 1801, 1802 as shown in FIG.

FIG. 19 is an explanatory view showing an example in which the electromagnetic wave attenuating portion of the attenuator is formed into a laminated structure by minute division blocks. Reference numeral 1901 denotes a group of n minute blocks. Instead of a portion having a high resistivity, the electromagnetic wave attenuation portion is divided into small block groups 1901 along a plane perpendicular to the longitudinal direction, and a dielectric material, for example, up to the center (n / 2th) of the electromagnetic wave attenuation portion, , Pure fluororesin, resistor, electromagnetic wave absorber, etc.
The ratio of filling with carbon, graphite, ferrite, and the like is sequentially increased for each minute block, and the structure in which the number of the electromagnetic wave attenuating portion is gradually decreased for each minute block from the central portion to the nth portion is integrally molded with resin.

[Method 1 of Manufacturing Attenuator for NRD Guide] Method 1 of manufacturing an attenuator for NRD guide will be described. 20 and 21 are explanatory diagrams illustrating a method 1 of manufacturing an NRD guide attenuator. 20, 2001 is a dielectric member, 2002 is a high frequency absorbing member, 2003 is an attenuator material, 2004 and 2
005 is a boundary surface. Also, in FIG.
1 is a plate-like attenuator material, 2102 and 2103
Is a fusion line corresponding to the boundary surfaces 2004 and 2005.

As a first step, first, a predetermined amount of PTFE resin, which is a material having low dielectric constant, is uniformly filled in a bottomed cylindrical mold, and then a pressing mold is put thereon, and a surface pressure of 25 kgf is applied.
/ Cm ² (at least 0.5 kgf / cm ² or more).

In the second step, next, a predetermined amount of a PTFE resin containing an electromagnetic wave absorbing material uniformly mixed with carbon, graphite, ferrite, etc., which is an electromagnetic wave absorbing material, is formed on the upper surface of the prepress molded PTFE resin molded body. Then, pre-press molding is performed at a surface pressure of 25 kgf / cm ² .

Next, as a third step, a predetermined amount of PTFE resin is charged, and the whole is pressed at a molding pressure of 250K using a pressing die.
Compression molding is performed at gf / cm ² (in the range of 50 to 700 kgf / cm ² ). Thereby, as shown in FIG. 20, the high frequency absorbing member 2 sandwiched by the dielectric member 2001 is formed.
002 is obtained. At this time, the dielectric member 2001
Interface 2004 and 200 between
No. 5 confirms that the PTFE resin is pressure-aggregated and strongly bonded. Also, this boundary surface 2004,
2005 has no irregularities and is extremely smooth.

Next, as a fourth step, the compressed molded material is taken out of the cylindrical mold and heated (fired) at a melting point of 327 ° C. (preferably 340 ° C.) or higher of the PTFE resin for 3 hours. To form an attenuator material 2003 in which the dielectric member 2001 and the high-frequency absorbing member 2002 are integrally joined and fused at the boundary surfaces 2004 and 2005.

The attenuator material 2003 can also be formed by firing (hot coining) the compressed material in a cylindrical mold. Further, a PTFE resin containing an absorber, which is uniformly mixed with a resistor or a radio wave absorber powder, may be pre-pressed in advance, and may be compression-molded in another mold in the same manner as the pre-pressed PTFE resin compact. .

As a fifth step, as shown in FIG. 21, the attenuator blank 2003 is cut and processed.
A plate-like attenuator material 2101 is formed. At this time, the fusion lines 2103, 2104 (boundary surfaces 2004, 20)
XX 'and YY' at an angle?
Cut along the line, N of height a, width b, and taper length l ₁
Manufactures attenuators for RD guides. In this attenuator, it has been confirmed that the interface between the dielectric line portion and the absorber portion is firmly joined and fused.

[Manufacturing Method 2 of NRD Guide Attenuator] Manufacturing method 2 of the NRD guide attenuator will be described. FIG. 22 is an explanatory diagram showing a method 2 of manufacturing an attenuator for an NRD guide. In the figure, reference numeral 2201 denotes a mold used for manufacturing. Pre-fired PTFE
Dielectric member 2001 made of resin molded body (block)
And a high-frequency absorbing member 2002 made of a fired PTFE resin molded article (block) in which an electromagnetic wave absorbing material such as carbon, graphite, and ferrite is uniformly mixed. Next, these members are put in a mold 2201 and the PT
Pressurization and heating are simultaneously performed at a temperature equal to or higher than the melting point of the FE resin (hot coining method) to form an attenuator material. Then, NRD guide attenuator manufacturing method 1
In the same manner as described above, an attenuator for an NRD guide is manufactured.

[Method 3 of Manufacturing Attenuator for NRD Guide] Method 3 of manufacturing an attenuator for NRD guide will be described. FIG. 23 is an explanatory diagram illustrating a method 3 of manufacturing an attenuator for an NRD guide. First, as shown in the figure,
A cylindrical attenuator material to which the dielectric member 2001 and the high frequency absorbing member 2002 are joined and fused is formed.
Thereafter, the attenuator material is cut to produce a sheet-like body 2301, and an NRD guide attenuator is manufactured in the same manner as in NRD guide attenuator manufacturing method 1.

[Method 4 of Manufacturing Attenuator for NRD Guide] Method 4 of manufacturing an attenuator for NRD guide will be described. FIG. 24 is an explanatory view showing a method 4 of manufacturing an attenuator for an NRD guide. In the figure, reference numeral 2401 denotes a die body composed of a bottom die 2402, a pressing die 2403, an outer frame 2404, and the like. Reference numeral 2405 denotes a sheet-like dielectric member, and reference numeral 2406 denotes a sheet-like high frequency absorbing member.

First, a sheet-like dielectric member 2405 made of a fired molded body (sheet), carbon, graphite,
Fired P with uniform mixing of electromagnetic wave absorbing material such as ferrite
The sheet-like high-frequency absorbing member 2406 made of a TFE resin molded body (sheet) is separately manufactured. Next, as shown in FIG. 24, in the mold body 2401, the end surfaces of the sheet-shaped dielectric member 2405 and the sheet-shaped high-frequency absorbing member 2406 are abutted, and pressurized and heated simultaneously at a temperature equal to or higher than the melting point of the PTFE resin. After performing (hot coining method) to form a sheet-like attenuator material, an NRD guide attenuator is manufactured in the same manner as in the NRD guide attenuator manufacturing method 1.

[Method 5 of Manufacturing Attenuator for NRD Guide] Method 5 of manufacturing an attenuator for NRD guide will be described. FIG. 25 is an explanatory diagram illustrating a method 5 of manufacturing an NRD guide attenuator. As shown in FIG.
A streaked tube in which a high-frequency absorbing member 2002 in which PTFE resin is uniformly mixed with an electromagnetic wave absorbing member such as carbon, graphite, or ferrite is arranged in a part of a cross section of a TFE resin tube (dielectric member 2001) in a length direction is pasted. NRD molded by extrusion method, and dielectric member 2001 and high frequency absorption member 2002 are firmly joined and fused.
A guide attenuator 2501 is manufactured. Next, after opening this tube and straightening it into a flat sheet as shown in FIG. 21, an NRD guide attenuator is manufactured in the same manner as in NRD guide attenuator manufacturing method 1.

[Manufacturing Method 6 of NRD Guide Attenuator] Next, a method of manufacturing an attenuator composed of minutely divided blocks shown in FIG. 19 will be described. FIG. 26 and FIG. 27 are explanatory diagrams showing a method 6 of manufacturing an attenuator for an NRD guide.

In the first step, PT is placed in a cylindrical mold having a bottom.
After uniformly filling a predetermined amount of the FE resin, using a pressing mold, the surface pressure is 25 kgf / cm ² (at least 0.5 kgf / cm ² ).
Pre-press molding in ² or more).

In the second step, carbon, graphite,
A predetermined amount of an absorber-containing PTFE resin in which a resistor such as ferrite or an electromagnetic wave absorbing material is uniformly blended into a PTFE resin is charged, and pre-press molding is performed at a surface pressure of 25 kgf / cm ² .

As a third step, the amount of a resistor, such as carbon, graphite, or ferrite, or the amount of an electromagnetic wave absorbing member is placed on the upper surface of a high-frequency absorber 2002a made of a PTFE resin filled with an electromagnetic wave absorbing member preliminarily molded in the second step. To
A predetermined amount of the PTFE resin containing the absorber, which is more than the amount filled in the high frequency absorber 2002a and is uniformly blended, is charged and pre-press molded at a surface pressure of 25 kgf / cm ² to form the high frequency absorber 2002b. obtain.

As a fourth step, the amount of a resistor such as carbon, graphite, or ferrite or an electromagnetic wave absorbing material is placed on the upper surface of the high frequency absorber 2002b obtained by the preliminary press molding in the third step. Absorbent PTFE blended more evenly than body 2002b
A high-frequency absorber 2002c is obtained by charging a predetermined amount of resin and performing pre-press molding at a surface pressure of 25 kgf / cm ² .

As a fifth step, the amount of a resistor such as carbon, graphite, or ferrite or an electromagnetic wave absorbing material is placed on the upper surface of the high frequency absorber 2002c obtained by the pre-press molding in the fourth step. A predetermined amount of the same absorbent PTFE resin as that of the body 2002b is charged, and the surface pressure is set to 25%.
By performing pre-press molding at Kgf / cm ² , a high-frequency absorber 2002b ′ is obtained.

As a sixth step, the amount of a resistor such as carbon, graphite, or ferrite or an electromagnetic wave absorbing material is placed on the upper surface of the high frequency absorber 2002b obtained by the pre-press molding in the fifth step. A predetermined amount of the same absorbent PTFE resin as that of the body 2002a is charged, and a surface pressure of 25%.
By performing pre-press molding at Kgf / cm ² , a high frequency absorber 2002a ′ is obtained.

Next, as a seventh step, a predetermined amount of PTFE resin is charged, and the whole is pressed at a molding pressure of 250 kg using a pressing die.
f / cm ² (range of 50 to 700 kgf / cm ² ), and the dielectric member 2001 and the high frequency absorbing member 20
02 is obtained. At this time, the boundary surfaces 2601a, 2601b, 26 between the dielectric member 2001 and the high frequency absorbing member 2002
01c is pressure-agglomerated with PTFE resin and is strongly bonded. Also, the boundary surfaces 2601a, 2601b, 26
01c has no irregularities and is extremely smooth.

As an eighth step, the compression-molded body is taken out of the cylindrical mold and fired at a melting point of 327 ° C. (preferably 340 ° C.) or more of the PTFE resin for 3 hours. Member 2001 and high frequency absorbing member 2002
To form an attenuator material 2602 which is joined and fused together.

It is to be noted that the attenuator material 2602 is manufactured by firing (hot coining method) in the bottomed cylindrical mold as it is, without taking out the compressed compact from the bottomed cylindrical mold. Can also. Also,
The PTFE resin containing the absorber, in which the electromagnetic wave absorbing material of each content is uniformly blended, is pre-pressed using a separate mold, and is compressed together with the pre-pressed PTFE resin molded body in the same mold. It may be molded.

In the ninth step, as shown in FIG. 27, the attenuator material 2602 is cut to produce a plate-like attenuator material 2701. Then, cut along the MM ′ and NN ′ in a direction perpendicular to the fusion lines 2702a to 2702c (corresponding to the boundary surfaces 2601a to 2601c), and for an NRD guide having a height H and a width R. Manufactures attenuators. In this attenuator, the boundary between the dielectric line portion and the absorber portion is firmly joined and fused.

The attenuator having the configuration shown in FIG. 19 can be manufactured by using the same method as the above-described NRD guide attenuator manufacturing methods 1 to 5 in addition to the above embodiment.

[Effects of the Second Embodiment] The effects of the second embodiment will be described. As described above, in the second embodiment, the dielectric line member is made of fluororesin, and the high frequency absorber is made of, for example, carbon, graphite, or the like.
And a high-frequency electromagnetic wave absorbing material such as ferrite and powder or a minute solid body are filled during resin molding, and the dielectric line member and the high-frequency absorber are molded together by joint fusion. Compared to the mechanical strength of the joint surface between the dielectric and the electromagnetic wave absorber, which was a problem, high bonding strength can be obtained, and no adhesive is required, so high-frequency characteristics and electrical characteristics are reduced. Stable and improved. In addition, it is possible to almost eliminate the axial deviation in the signal transmission direction at the joining surface between the high frequency absorber and the dielectric line. Also, due to the nature of the machining process, mechanical precision machining can be applied, so that the dimensional accuracy, uniformity, and reproducibility of each circuit element in the product can be high, so that the high-frequency electrical characteristics of the circuit element are constant and the manufacturing reliability is reduced Can be secured.

The NRD shown in FIG. 17 and FIG.
In the guide attenuator, the junction taper portion is V-shaped or inverted V-shaped, so that the anti-reflection characteristics are further improved.

Further, in the method of manufacturing an attenuator according to this embodiment, a high-frequency absorbing material such as carbon, graphite and ferrite is provided between resin dielectric members made of a low dielectric constant material in advance. The high-frequency absorbing member filled with the material is sandwiched, joined and fused at a temperature equal to or higher than the melting point of the fluororesin, and the material for the attenuator is molded.
For example, a desired attenuator having the same size and shape can be manufactured by cutting or cutting, so that mass production of attenuators having high yield and uniform characteristics can be realized.

Embodiment 3 Configuration of NRD Guide Matching Line and Manufacturing Method Thereof [Configuration 1 of NRD Guide Matching Line] Configuration 1 of the NRD guide matching line will be described. FIG. 28 is an explanatory diagram showing the configuration of an NRD guide matching line according to the present invention. In the figure, reference numeral 2801 denotes an input-side integrated matching block unit integrated line, and 2802 denotes an output-side matching integrated block unit integrated line. The input-side matching dielectric block unit integrated line 280
1 and output side integrated dielectric block unit integrated line 2802
The main line I / O dielectric portion 2803 and the matching dielectric block 2804 are joined.

The main line input / output dielectric portion 2803 is
As the dielectric resin, for example, a pure fluororesin unsintered body having excellent super-high-frequency electrical characteristics is prepared, and the matching dielectric block 2804 is made of a high dielectric constant based on the pure fluororesin unsintered body. A material filled with a dielectric powder, for example, an oxide ceramic powder, is prepared. The unsintered pure fluororesin and the oxide ceramic powder are brought into close contact with each other before sintering, and the resin is molded (fired). Consolidation at the same time (fusion)
By doing so, the structure of the input-side matched dielectric block unit integrated line 2801 and the output-side matched dielectric block unit integrated line 2802 that are inseparable can be realized.

[Manufacturing Method 1 of NRD Guide Matched Line] Next, the input side matched dielectric block integrated line 2801
A method of manufacturing the output-side matching dielectric block unit integrated line 2802 will be described. FIG. 29, FIG. 30, and FIG. 31 are explanatory views showing a method 1 of manufacturing the NRD guide matching line, and are manufactured by the following steps.

In a first step, a predetermined amount of oxidized ceramics or ferrite powder having a high dielectric constant (3 to 100) is added to PTFE resin powder, which is a material having low dielectric constant, in a bottomed cylindrical mold. P with uniform filling
After uniformly injecting a predetermined amount of TFE resin, cover with a pressing mold
Surface pressure 25 kgf / cm ² (at least 0.5 kgf / c
preliminary pressing in m ² or more).

Next, as a second step, a predetermined amount of PTFE resin is put on the upper surface of the pre-pressurized PTFE resin containing the filler, and a pressing die is put on the PTFE resin, and a molding pressure of 250 kgf / c is applied.
Compression molding is performed at m ² (in the range of 50 to 700 kgf / cm ² ). Thus, as shown in FIG. 29, an input / output dielectric member layer 2901 and a matching dielectric block member layer 2902 are obtained. At this time, the input / output dielectric member layer 290
1 and interface 2 between matching dielectric block member layer 2902
No. 903 confirms that the PTFE resin is pressure-agglomerated and firmly joined. In addition, this boundary surface 290
No. 3 has no unevenness and is extremely smooth.

[0110] In the third step, the compressed molded body material is taken out of the cylindrical mold and the melting point of the PTFE resin is reduced to 32.
A heat treatment (firing) is performed at 7 ° C. or more (preferably 340 ° C.) for 3 hours, and the input / output dielectric member layer 2901 and the matching dielectric block member layer 2902 are joined and fused integrally at the boundary surface 2903. The obtained NRD guide matching line material 2904 is molded.

The NRD guide matching line material 2904 can be formed by firing (hot coining method) in a cylindrical mold as it is without taking out the compressed forming material. Alternatively, the PTFE resin containing the uniformly mixed filler may be pre-pressed, and may be compression-molded by overlapping the pre-pressed PTFE resin molded body with another mold in the same mold.

As a fourth step, next, as shown in FIG. 30, the NRD guide matching line material 2904 is cut to form a plate-like NRD guide matching line material 3001, and further, as shown in FIG. And finish it to the specified dimensions. At this time, the fusion line 3101 (boundary surface 2)
Cut along the X-X 'and Y-Y' at an angle of 90 ° to correspond) to 903, to produce the NRD guide alignment line shown in height a, width b, the length L ₁ of FIG. 28 . In addition,
The length L ₂ of the plate-shaped NRD guide matching line material 3001 is
Based on the reflection characteristic data of the element to be matched alone, optimization is performed in consideration of the relative permittivity of the plate-shaped NRD guide matching line material 3001. Further, it has been confirmed that in the NRD guide matched line, the boundary joint surface between the input side matched dielectric block unit integrated line 2801 and the output side matched dielectric block unit integrated line 2802 is firmly joined and fused.

Next, the NRD guide matched line constructed as described above is manufactured by using the above-mentioned manufacturing method, without using an adhesive or the like for the input-side matched dielectric block integrated line 2801 and the output-side matched dielectric block integrated line 2802. In addition,
Since it is manufactured as an integrated product by eliminating the axial and positional deviations, there is no unintended gap or positional deviation of the alignment block. In addition, the instability of the characteristics over time and the variation in the production characteristics due to the adhesive or the like are eliminated. The shape of the matching block does not necessarily have to be a rectangular parallelepiped as shown in FIG. 28, and in some cases, the side facing the main line may be a tapered flat surface that is inclined.

[Configuration 2 of NRD Guide Matching Line] NRD
Configuration 2 of the guide matching line will be described. The following embodiment is an application example using the above-described manufacturing method, in which a line has a function of phase adjustment. FIG. 32 is an explanatory diagram showing an application example (phase adjustment circuit) to another element according to the present invention. In the drawing, reference numeral 3201 denotes an integrated line 2801 on the input side matched dielectric block and an integrated line 2801 on the output side matched dielectric block. This is a line portion in which the line 2802 is integrated.
That is, the total length of the line portion 3201 is l = l ₀ + l ₁
+ L ₂ .

FIG. 32 (a) shows a pure dielectric fluororesin line without any modification. In this case, the loss portion is omitted for the sake of explanation. The phase rotation is determined by ε ^a (where a = jβ ₀ l) according to the line phase constant β ₀ and the length 1 inherent to the pure fluororesin. Next, FIG.
In (b), a fluororesin portion B having a length l ₁ filled with a powder of a high dielectric constant material, for example, an oxide ceramic powder, between the lengths l ₀ and l ₂ of the pure fluororesin A is used. The line portion 3201 formed integrally has a line phase constant β _{0 of A} ,
Assuming that the line phase constant β of B is ₁ , the overall phase rotation is ε ^b · ε ^c > ε ^d (where b = jβ ₀ (l ₀ + l ₂ ), c = iβ
₁ l ₁ , d = jβ ₀ l), and a phase adjustment function can be provided.

FIG. 33 shows a further extension of the manufacturing method shown in FIG. 28, and as shown in FIG.
1 are configured. In other words, a powder of a material (for example, a high dielectric material or a resistor) capable of changing the high-frequency characteristic propagation constant is provided between the input-side matched dielectric block unit integrated line 2801 and the output-side matched dielectric block unit integrated line 2802 (block A). A dielectric block C in which a body material or a powder of a high-frequency magnetic material) is filled in a pure fluorine resin is prepared. For example, as shown in the figure, the block A and the block C are periodically integrally formed in the signal transmission direction. .

In the above, the propagation constant of the block A portion is γ ₀ = α ₀ + jβ _0, and the propagation constant of the block C portion is γ ₂ = α ₂ + jβ ₂ (α ₀ and α ₂ are attenuation constants, If β ₀ and β ₂ are phase constants), a circuit / line having various characteristics peculiar to an ultrahigh-frequency line having a synchronous structure is realized. For example, a filter, a slow wave circuit, a leaky wave antenna using a spatial high frequency, and the like can be manufactured as an integrated product with good mass production accuracy and mass productivity.

[Method 2 for Manufacturing NRD Guide Matching Line] N
The method 2 of manufacturing the RD guide matching line will be described. FIGS. 34 and 35 are explanatory diagrams showing a method 2 for manufacturing an NRD guide matching line.
01a, core rod 3401b, outer frame 3401c, bottom mold 340
This is a cylindrical mold made of 1d. In FIG. 35, reference numeral 3501 denotes a pressing die 3501a, an outer frame 3501b,
This is a cylindrical mold having a bottom mold 3501c.

As a first step, first, as shown in FIG. 34, an input / output dielectric line 2901 made of a preliminarily fired cylindrical PTFE resin molded body, oxide ceramics, ferrite, and the like are uniformly mixed. Fired PT with filler
The matching dielectric block members 2902 made of the FE resin molded sheet are separately manufactured.

As a second step, next, as shown in FIG. 35, the input / output dielectric line 2901 and the matching dielectric block member 2902 are abutted in a mold 3501, and a PTF is formed.
Pressurization and heating are simultaneously performed at a temperature equal to or higher than the melting point of the E resin (hot coining method) to form a sheet-shaped NRD guide matching line material, and then the NRD guide matching line manufacturing method 1
The NRD guide matching line is manufactured in the same manner as described above.

[Method 3 of Manufacturing NRD Guide Matching Line] Another method of manufacturing the NRD guide matching line as shown in FIGS. 28 and 32 will be described. FIG. 36 is an explanatory diagram illustrating a method 3 for manufacturing an NRD guide matching line.

As a first step, as shown in FIG.
PTFE resin tube (input / output dielectric line member 290
1) A striped tube in which a matching dielectric block member 2902 in which oxide ceramics or ferrite is uniformly mixed with PTFE resin is arranged in a longitudinal direction on a part of the cross section is formed by a paste extrusion method. Dielectric line member 2901 and matching dielectric block member 290
The NRD guide matching line material 3601 in the form of a tube in which the joining boundary surface 2903 of the second is strongly joined and fused between the PTFE resins is manufactured.

As a second step, the tube-shaped NR
The D guide matching line material 3601 is opened, corrected to a flat sheet as shown in FIG. 31, and the NRD guide matching line is manufactured in the same manner as in the NRD guide matching line manufacturing method 1.

[Manufacturing Method 4 of NRD Guide Matching Line] Next, another manufacturing method of the NRD guide matching line as shown in FIG. 33 will be described. FIG. 37 is an explanatory diagram showing Method 4 of manufacturing the NRD guide matching line. It should be noted that a mold similar to that shown in FIG. 34 is used.

As a first step, first, a predetermined amount of PTFE resin is uniformly filled in a mold 3401,
01a, and a surface pressure of 25 kgf / cm ² (at least 1
(0 kgf / cm ² or more).

In a second step, a predetermined amount of a PTFE resin containing a filler obtained by uniformly mixing oxide ceramics or ferrite with the PTFE resin is put on the upper surface of the PTFE resin molded body which has been pre-pressed and formed, and a surface pressure is applied. 25kgf
/ Cm ² pre-press molding.

As a third step, a predetermined amount of PTFE resin is put on the upper surface of the filled PTFE resin molded article preliminarily pressed in the second step, and the surface pressure is 25 kgf /
Pre-press molding in cm ² .

In the fourth step, a predetermined amount of a PTFE resin containing a filler and a PTFE resin obtained by uniformly mixing oxide ceramics or ferrite with a PTFE resin are alternately charged in a predetermined amount, and finally the PTFE resin is added. After a predetermined amount has been charged, the pressing mold 3401a is covered, and a molding pressure 25
Compression molded at 0 kgf / cm ² (range 50~700kgf / cm ^2), a dielectric waveguide member layer 3701-1,3
701-2, to 3701-n, and the dielectric block layer 37
Reference numerals 03-1, 3702-3, to 3703-n denote PTs of the respective junction boundaries 3702-1, 3702-2, to 3702-n.
It was aggregated under pressure by the FE resin and was firmly joined. In addition, each of the above-mentioned joint boundaries 3702-1, 3702-2,.
3702-n has no irregularities and is extremely smooth.

In the fifth step, the compact obtained by compression molding is removed from the mold 3401 and
The resin is baked at a melting point of 327 ° C. or more (preferably 340 ° C.) or more for 3 hours or more.
02-1, 3702-2, to 3702-n, an NRD guide matching line member integrally joined and fused is formed.
Thereafter, processing is performed in the same manner as in the manufacturing method 1 of the NRD guide matching line, and an NRD guide line having a periodic structure as shown in FIG. 33 is manufactured.

[Manufacturing Method 5 of NRD Guide Matching Line] Next, another manufacturing method of the NRD guide line having a synchronous structure as shown in FIG. 33 will be described. FIG.
It is explanatory drawing which shows the manufacturing method 5 of a D guide matched line.

As a first step, as shown in FIG.
At several or dozens of locations on the cross section of the PTFE resin tube, oxide ceramics or ferrite is added to the PTFE resin, and the PTFE resin containing filler uniformly arranged in the longitudinal direction is molded by a paste-like extrusion method. The input / output dielectric line member 2901 and the matching dielectric block member 2902 are
At 03, an NRD guide line material 3801 having a periodic structure firmly joined to each other by PTFE resin is manufactured.

Next, as a second step, the NRD guide line material 3801 is opened, corrected to a flat sheet as shown in FIG. 31, processed into a predetermined shape and size, and then aligned with the NRD guide. Processing is performed in the same manner as the line manufacturing method 1, and an NRD guide line having a periodic structure as shown in FIG. 33 is manufactured.

[Effects of Third Embodiment] The effects of the third embodiment will be described. As described above, in the third embodiment, the pure fluororesin portion of the main dielectric line and the matching dielectric block portion in which the pure fluororesin is filled with a high dielectric material such as an oxide ceramic powder are used. In this case, the main line and the matching section are displaced and the axis is eliminated. Further, since unnecessary inclusions such as an adhesive are not used at the joint, the high-frequency characteristics are stabilized and improved, and the characteristics of the NRD guide line during mass production are stabilized, and the cost can be reduced.

Further, in the configuration example shown in FIG. 32, a phase adjustment function can be added to the dielectric circuit. Also, in the configuration example shown in FIG. 33, functions such as a filter, a slow wave circuit, and a leaky wave antenna using a spatial high frequency can be added to the dielectric circuit.

Embodiment 4 Configuration of NRD Guide Resonator Element and Manufacturing Method Thereof [Configuration 1 of NRD Guide Resonator Element]
The configuration of the D-guide resonator element and a method of manufacturing the same will be described. First, the configuration 1 of the resonator element for NRD guide
Will be described. FIG. 39 is an explanatory view showing the structure of a resonator element for an NRD guide according to the present invention and a method of manufacturing the same. In the figure, reference numeral 3901 denotes a high-permittivity dielectric ceramic ceramic element, and 3902 denotes an upper low-permittivity dielectric. A resin portion 3903 is a lower low dielectric constant dielectric resin portion.

This NRD guide resonator element has a high Q and high relative dielectric constant (ε _r = 4 to 100) which is a main part of the resonator.
High relative dielectric constant dielectric ceramic resonator 39
01 and the high relative dielectric constant dielectric ceramic resonator 390
As a spacer for supporting the first upper and lower, low dielectric constant (epsilon _r = about 1.5 to 4) above comprising a resin low dielectric constant dielectric resin portion 3902 and a lower low dielectric constant dielectric resin portion 3903.

Further, the upper low relative dielectric constant dielectric resin portion 390
2 and the lower low dielectric constant dielectric resin portion 3903 are made of fluororesin PT which is excellent in ultra-high-frequency electrical characteristics.
FE resin is used. Further, as the above-mentioned NRD guide resonator element, an unfired PTFE resin powder or a fired PTFE resin disk is prepared, and a high dielectric constant dielectric ceramic resonator element 3 is prepared.
901 is sandwiched between an upper low-permittivity dielectric resin portion 3902 and a lower-low-permittivity dielectric resin portion 3903, and is heated in a mold at or above the melting point of the PTFE resin after being compressed or in a compressed state. By doing so, the upper dielectric ceramic part 3902 and the lower dielectric resin part 3903 are superposed on both sides of the high dielectric ceramic resonator 3901 to form an inseparable single resonant element. Manufactured. Hereinafter, a specific manufacturing method will be described.

Further, as shown in FIG.
In addition to the structure of (a), a high dielectric constant dielectric ceramic resonance element 3901 and an upper low dielectric constant dielectric resin part 3 are further added.
902, and between the high-permittivity dielectric ceramic resonator element 3901 and the lower low-permittivity dielectric resin portion 3903, a high-permittivity ceramic powder having a high Q is added to the low-permittivity PTFE resin. Filled and molded high PTFE resin member 390
4 may be similarly superimposed.

Further, a circulator resonance element structure as shown in FIGS. 39 (c) to 39 (g) may be used. That is, (c) shows an example in which a ferrite disk 3905 is fused on both sides and a spacer resin 3906 is fused on the center thereof, and (d) shows an upper and lower portion 3907 formed of a _μr material such as a resin base + ferrite powder and a middle portion. An example in which the spacer 3908 is integrally fused with a pure fluororesin, (e) shows (c) and (d)
In the middle of the example, a ferrite powder filling layer 3909 is provided, and (f) and (g) are examples in which a magnetic material filling (or sandwich) portion 3910 such as ferrite is provided.

[Method 1 for Manufacturing NRD Guide Resonator Element] A method 1 for manufacturing an NRD guide resonator element will be described. FIG. 40 is an explanatory view showing a method 1 for manufacturing an NRD guide resonator element. In the figure, 4001 is a mold body, 4002 is a bottom mold, and 4003 is a push mold.

As a first step, a cylindrical space formed by a bottom mold 4002 set on the bottom of a mold body 4001 is filled with P, which is a low dielectric constant dielectric material for a lower spacer.
TFE resin powder is charged and pressurized at a surface pressure of 25 kgf / cm ² or more. A high Q dielectric ceramic resonator element 3901 (disk) having a high Q is stacked thereon. further,
As with the lower spacer PTFE resin powder, the upper spacer P
Add a predetermined amount of TFE resin powder, cover with a pressing die 4003,
The whole is pressurized with a surface pressure of 25 kgf / cm ² or more.

As a second step, in the above-mentioned pressurized state,
The melting point of PTFE resin is 327 ° C (preferably 340 ° C).
C) By performing the heat treatment at the above temperature for 30 minutes or more,
A resonator element for an NRD guide as shown in FIG.

NRD integrally molded in the mold
PTFE resin 400 for vertically supporting the guide resonator element
4,4005 and high dielectric constant dielectric ceramic resonance element 3
The joint surfaces 4006 and 4007 with the 901 (disk) are PT
FE resin is made of high relative dielectric constant dielectric ceramic resonance element 390
It is confirmed that at least 0.3 kgf / cm of the bonding strength can be obtained by the anchor effect because it is intimately buried into the uneven surface of the 1 (disk) surface without any gap. As a substitute for the PTFE resin powder, a fired PTFE resin disk whose dimensions and weight are controlled may be used.

[Method 2 for Manufacturing NRD Guide Resonator Element] A method 2 for manufacturing an NRD guide resonator element will be described. FIG. 41 is an explanatory view showing a method 2 for manufacturing an NRD guide resonator element. In the figure, reference numeral 4101 denotes a mold main body, 4102 denotes a bottom mold, 4103 denotes a press mold, and 4104 denotes a metal spacer.

As a first step, a cylindrical space formed by a bottom mold 4102 set on the bottom of a mold body 4101 is filled with a low-permittivity dielectric resin for vertical support in the order of a to h below. A certain amount of PTFE resin powder, high Q dielectric ceramic resonator element 3901 (disk),
Pressure is applied only when the metal spacers 4104 are stacked and PTFE resin powder is charged. That is, a. Inject PTFE resin powder for lower support and contact pressure 25Kg
Pressurize at f / cm ² or more. b. A high dielectric constant dielectric ceramic resonance element 3901 (disk) is overlaid. c. Inject PTFE resin powder for upper side support, surface pressure 25Kg
Pressurize at f / cm ² or more. d. The metal spacer 4104 is overlaid. e. Repeat the above a. f. Repeat the above b. g. Repeat the above c. h. Repeat the above d.

In the second step, a predetermined amount of PTFE resin powder, a high dielectric constant dielectric ceramic resonator element 3901 (disk), and a metal spacer 4104 are charged or stacked in the order of e to h in the above e to h. Is repeated a predetermined number of times. Next, cover the pressing die 4103 and apply a surface pressure of 25 kgf / c.
pressurized with m ² or more. After heat treatment at a temperature of 327 ° C. (preferably 340 ° C.) or more of the melting point of the PTFE resin for 30 minutes or more in the pressurized state, the metal spacer 4104 is removed to obtain a structure as shown in FIG. A large number of NRD guide resonator elements can be manufactured.

An NR configured as shown in FIG.
The resonator element for D guide includes a high dielectric constant dielectric ceramic resonance element 3901 and an upper low dielectric constant dielectric resin part 3902.
And the high dielectric constant dielectric ceramic resonator 39
01 and the lower low-permittivity dielectric resin portion 3903 have no gap at all, and at the time of molding, the high-permittivity dielectric ceramic resonator element 3901 and the upper low-permittivity dielectric The parallelism and center axis alignment of the body resin portion 3902 and the lower low relative dielectric constant dielectric resin portion 3903 are absolutely ensured. Therefore, the conventional tube is not required, and the design is simplified.
The value also improves, and production variations in electrical characteristics can be suppressed.

[Configuration 2 of NRD Guide Resonator Element] Next, the NRD guide resonator element shown in FIG. 39B will be described in detail. In the figure, between the high dielectric constant dielectric ceramic resonance element 3901 and the upper low dielectric constant dielectric resin part 3902, and between the high dielectric constant dielectric ceramic resonance element 3901 and the lower low dielectric constant dielectric resin part 3903
PTFE resin member 3 filled with high relative dielectric constant ceramic powder in the thickness direction at a uniform or constant density gradient
904, the upper low dielectric constant dielectric resin portion 3902, the PTFE resin member 3904, the high dielectric constant dielectric ceramic resonance element 3901, the PTFE resin member 3904, and the lower low dielectric constant dielectric resin portion. After the 3903 is stacked and integrally molded in a mold, or after being compressed and heated and fired at a temperature equal to or higher than the melting point of the PTFE resin, the 3903 is taken out of the mold, and as shown in FIG. An NRD guide resonator element is obtained. Hereinafter, this NR
A method for manufacturing the D-guide resonator element will be described.

[Method 3 for Manufacturing NRD Guide Resonator Element] A method 3 for manufacturing an NRD guide resonator element will be described. FIG. 42 is an explanatory diagram illustrating a method 3 for manufacturing an NRD guide resonator element. In this case, a mold similar to that shown in FIG. 40 is used.

As a first step, PTFE resin powder, which is a low dielectric constant dielectric material for a lower spacer, is charged into a cylindrical space formed by a bottom mold 4002 set on the bottom of a mold body 4001. PTFE resin 4004 is formed by pressing at a surface pressure of 25 kgf / cm ² or more.

In the second step, the PTFE resin 40
A predetermined amount of ceramic-filled PTFE powder containing high-Q, high-permittivity ceramic powder and uniformly mixed therein is put on top of the PTFE, and pressurized at a surface pressure of 25 kgf / cm ² or more.
A resin member 3904 is formed.

Next, as a third step, a high-permittivity dielectric ceramic resonator element 3901 (disk) having a high Q is stacked on the PTFE resin member 3904. further,
As a fourth step, the above-mentioned second step is repeated. Furthermore, as a fifth step, a predetermined amount of PTFE resin powder is charged, a pressing die 4003 is put on, and the whole is subjected to a surface pressure of 50 kgf / c.
pressurized with m ² or more. In the above-mentioned pressurized state, as a sixth step, the melting point of the PTFE resin is 327 ° C. (preferably,
By performing heat treatment at 340 ° C. or more for 30 minutes or more, a resonator element for NRD guide as shown in FIG. 39B is manufactured.

Note that PTFE resin and ceramic-filled PT
The joining boundary surfaces 4201 and 4202 of the FE resin are made of PTFE.
The resin is more strongly joined and fused to each other. Also, the joining boundary surfaces 4203, 42 of the high relative dielectric constant dielectric ceramic resonance element 3901 (disk) and the ceramic filled PTFE resin.
04 also has at least 0.3 kgf / d due to the anchor effect caused by the PTFE resin biting into the unevenness of the resonator element.
cm bonding strength is obtained.

[Effects of the Fourth Embodiment] The effects of the fourth embodiment will be described. As described above, in the fourth embodiment, the high relative dielectric constant is provided between the unfired or fired PTFE resin as the upper low relative dielectric resin portion 3902 and the lower low relative dielectric resin portion 3903. Dielectric ceramic resonator element or ceramic filled high relative permittivity PTFE
High dielectric constant dielectric ceramic resonator 390 made of resin
1 and simultaneously molded integrally with each other, so that the whole is integrally intimately bonded or integrally bonded and fused.
An RD guide resonator element is manufactured. Therefore, the ultra-high frequency electric characteristics (resonance frequency, stabilization of resonance mode characteristics, increase of Q, stabilization of temperature characteristics, etc.) can be remarkably improved and uniformed, and the production yield can be improved and the cost can be improved. Reduction can be achieved.

[Embodiment 5] Configuration of NRD guide / switch circuit [Configuration 1 of NRD guide / switch circuit] Here, N
Configuration 1 of the RD guide / switch circuit will be described.
FIGS. 43 (a) and 43 (b) are explanatory diagrams showing an embodiment of the switch circuit according to this embodiment. FIG. 43 (a) shows the structure of the switch circuit, and FIG.
Is a mounting diagram. In the figure, reference numeral 4301 denotes a switch circuit (line) unit, which is composed of a main line dielectric line 4302, a ferrite powder-filled dielectric line unit 4303, and an unnecessary mode suppressor 4304. 430
Reference numeral 5 denotes a tapered surface that forms a boundary between the elements.

The above configuration will be described in further detail. The main line dielectric line 4302 includes the main line dielectric line 430.
The ferrite powder-filled dielectric line portion 4303 in which the ferrite powder is mixed and filled at a constant ratio (for example, volume ratio or density ratio) into the material 2 is integrated with the main line dielectric line 4302 via the tapered surface 4305. In addition, an unnecessary mode suppressor 4304 made of a conductive foil is interposed between the ferrite powder-filled dielectric line section 4303 and the main line dielectric line 4302 at the center of the line, and is integrated. In addition, the section of the unnecessary mode suppressor 4304 is arranged so that five or more sections (〜) are provided for each of the input and output sections in the pure dielectric material without impurities.

The unnecessary mode suppressor 4304 is
Mainly vertically in the cross section of the line, the asymmetric reduction of the left and right shape, is intended to suppress the vertical, the unnecessary mode LSE ₀₁ and TE mode generated by the asymmetry of the left and right in a path section of the electromagnetic field. In other words, the unnecessary mode suppressor 4304
The purpose is to absorb an unnecessary mode generated by an abnormal magnetic field when a DC bias is applied to the ferrite powder-filled dielectric line section 4303 when the switch is turned off.

[Operation of NRD Guide / Switch Circuit] Next, the operation of the NRD guide / switch circuit configured as described above will be described. FIG. 44 is an explanatory view showing the operation of the NRD guide / switch circuit according to this embodiment in a side view. FIG. 45 shows the NRD according to this embodiment.
Guide main mode (LSM ₀₁ ) and unnecessary mode (L
It is explanatory drawing which shows _SE01 ).

To turn on this switch, FIG.
It works when there is no bias magnetic field as shown in FIG. As a result, the switch is turned on from the signal input in direction,
The tapered surface 4305 gently enters the ferrite powder-filled dielectric line portion 4303 and exits to the out side with a slight loss.

In order to turn off the switch, FIG.
In (b), a DC bias is applied to the upper conductor plate 101 and the lower conductor plate 102 in a vertical or horizontal direction or the like. As a result, since the filled ferrite is magnetically oriented in the direction of application, as can be seen from the mode diagram of FIG. 45, the main transmission mode is clearly suppressed but not completely reflected, and a part of the ferrite powder is filled. Although it is penetrated and absorbed by the dielectric line portion 4303, the portion that enters from in hardly exits out. Therefore, reflection on the in side can be reduced. However, since an unnecessary mode of the LSE occurs due to the abnormal magnetic field, an unnecessary mode suppressor 4304 is added.

[Configuration 2 of NRD Guide / Switch Circuit]
Next, configuration 2 of the NRD guide / switch circuit will be described. FIG. 46 is an explanatory diagram showing Configuration 2 of the NRD guide / switch circuit.
Numeral 3 is a ferrite powder-filled dielectric block portion, and the filling ratio is sequentially changed so that signal reflection is small and signal transmission is small in the signal transmission direction.

In this embodiment, the ferrite filling ratio in the ferrite powder-filled dielectric block portions 4601 to 4603 is set to 4601>4602> 4603, and the reflection is suppressed by the filling ratio. Therefore, in the configuration in FIG. 46, the tapered surface 4305 is not provided as shown in FIG. 43, but by providing the tapered surface 4305, the reflection characteristics are further improved.

[Effects of the Fifth Embodiment] The effects of the fifth embodiment will be described. As described above, according to the fifth embodiment, since the switch structure has a line integrated by ferrite filling, variations and defects due to assembling and mounting are all eliminated, and assembling and mounting properties are improved. In addition, the load impedance does not change extremely unlike a semiconductor, and the reflection characteristics when the switch is turned off are suppressed. In addition to the absorption at the ferrite filled portion and the suppression of unnecessary modes, the impedance at the switch ON / OFF is suppressed. It is possible to prevent the change from consistently affecting the circuit connected to the switch.

Embodiment 6 Configuration of Impedance Matching Conversion Element Next, an impedance matching conversion element will be described.
FIG. 47 is a line diagram for explaining impedance matching (complex conjugate matching). In general, the impedance Z ₀
Line to connect the load Z _l of conditions the input power P is supplied to effectively (the maximum) load Z _l is known as conjugate ^{_{matching, Z 0 = Z l * ···}} (1) (Z l = when R-jX, Z _l ^* = means R + jX) is established when the. In particular, for input / output matching of a semiconductor circuit, the above Z ₀ = Z _l ^* is widely used with an important concept.

FIG. 48 is a line diagram for explaining impedance conversion. Generally, a characteristic impedance Z ₀ and a length λ between two impedance lines Z _in and Z _out.
The g / 4 line is interposed, when Z ₀ of ^{_{2 = Z in · Z out ···}} (2), the input power P is transmitted most effectively from the port P1 to the port P2. This concept is often used when matching two types of lines (impedance conversion).

In any of the above cases (1) and (2), this is realized by preparing an element or a line having a characteristic impedance Z ₀ = R + jX. For example, R → Pure resin material is filled with ρ powder material etc.
・ X → Fill ε _r , μ _r powder material etc. to base pure resin material ・ ・
Ｚ realizes Z ₀ = R + jX within a certain range, so that the above-mentioned filling structure is changed to that shown in FIG.
By adopting the configuration shown in (b), a main line integrated impedance matching element or an impedance conversion line can be realized substantially.

[0167] Incidentally, [rho is the resistivity, using carbon, graphite, iron powder, a mu _r material or the like. ε _r is a relative dielectric constant, and is a relative dielectric constant of a high ε _r material to ceramics 3 to 100
Is used. μ _r is the relative permeability, high μ _r material-magnetic ceramics, using the ferrite.

[0168]

As described above, according to the circuit element for microwave / millimeter wave band and the method of manufacturing the same according to the present invention, the main line or the substrate dielectric, the non-reflection terminator, the attenuator, the matching line, A circuit element such as a resonator element or a switch is formed by blending a main line or a substrate dielectric with a material having characteristics different from those of the main line or the substrate dielectric. , The integration of the main line or the substrate dielectric with the functional circuit element or the substrate connected to the main line or the substrate dielectric can be realized without the need for an adhesive or the like, and the electrical characteristics can be stabilized. It is possible to improve mass productivity.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing the configuration of an NRD guide non-reflection terminator according to the present invention.

FIG. 2 is a graph showing reflection characteristic data of an NRD guide non-reflection terminator according to the present invention.

FIG. 3 is an explanatory view showing a method 1 of manufacturing an anti-reflection terminator for an NRD guide according to the present invention.

FIG. 4 is an explanatory view showing a method 1 of manufacturing an anti-reflection terminator for an NRD guide according to the present invention.

FIG. 5 is an explanatory diagram showing the operation principle of the non-reflection terminator according to the present invention.

FIG. 6 is a graph showing reflection characteristic data when the filling rate of the high-frequency electromagnetic wave absorber according to the present invention is changed.

FIG. 7 is an explanatory diagram showing an example of obtaining a taper length optimally with a constant filling factor according to the present invention.

FIG. 8 is an explanatory diagram showing a configuration of another non-reflection terminator according to the present invention.

FIG. 9 is an explanatory diagram showing a configuration of another non-reflection terminator according to the present invention.

FIG. 10 is an explanatory view showing a method 2 for manufacturing an anti-reflection terminator for an NRD guide according to the present invention.

FIG. 11 is an explanatory view showing a method 3 of manufacturing an anti-reflection terminator for an NRD guide according to the present invention.

FIG. 12 is an explanatory view showing a method 4 for manufacturing an anti-reflection terminator for an NRD guide according to the present invention.

FIG. 13 is an explanatory diagram showing a method 5 for manufacturing an anti-reflection terminator for an NRD guide according to the present invention.

FIG. 14 is an explanatory diagram showing a configuration of an NRD guide attenuator according to the present invention.

FIG. 15 is an explanatory diagram showing the operation of the NRD guide attenuator according to the present invention.

FIG. 16 is an explanatory diagram showing the operation of the NRD guide attenuator according to the present invention.

FIG. 17 is an explanatory view showing a configuration of an attenuator for an NRD guide according to the present invention, in which the shape of the joint surface is V-shaped.

FIG. 18 is an explanatory view showing a configuration of an attenuator for an NRD guide according to the present invention, in which the shape of the joint surface is an inverted V-shape.

FIG. 19 is an explanatory diagram showing an example in which the electromagnetic wave attenuation portion of the attenuator for an NRD guide according to the present invention has a laminated structure with minutely divided blocks.

FIG. 20 is an explanatory view showing a method 1 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 21 is an explanatory view showing a method 1 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 22 is an explanatory view showing a method 2 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 23 is an explanatory view showing a method 3 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 24 is an explanatory view showing a method 4 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 25 is an explanatory diagram showing a method 5 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 26 is an explanatory view showing a method 6 of manufacturing an attenuator for an NRD guide according to the present invention.

FIG. 27 is an explanatory view showing a method 6 of manufacturing an NRD guide attenuator according to the present invention;

FIG. 28 is an explanatory diagram showing a configuration of an NRD guide matching line according to the present invention.

FIG. 29 is an explanatory diagram illustrating a method 1 for manufacturing an NRD guide matching line according to the present invention;

FIG. 30 is an explanatory diagram illustrating a method 1 for manufacturing an NRD guide matching line according to the present invention.

FIG. 31 is an explanatory diagram illustrating a method 1 for manufacturing an NRD guide matching line according to the present invention;

FIG. 32 is an explanatory diagram showing an application example (a phase adjustment circuit) to another element according to the present invention.

FIG. 33 is an explanatory view showing a configuration in which a main line dielectric fluororesin portion is provided and expanded in the manufacturing method of FIG. 28 according to the present invention.

FIG. 34 is an explanatory diagram illustrating a method 2 for manufacturing an NRD guide matching line according to the present invention;

FIG. 35 is an explanatory diagram illustrating a method 2 for manufacturing an NRD guide matching line according to the present invention;

FIG. 36 is an explanatory diagram showing a method 3 for manufacturing an NRD guide matching line according to the present invention;

FIG. 37 is an explanatory diagram showing Method 4 of manufacturing the NRD guide matched line according to the present invention.

FIG. 38 is an explanatory diagram showing a method 5 for manufacturing an NRD guide matching line according to the present invention;

FIG. 39 is an explanatory diagram showing a configuration of a resonator element for an NRD guide according to the present invention and a method of manufacturing the same.

FIG. 40 is an explanatory view illustrating a method 1 of manufacturing a resonator element for an NRD guide according to the present invention;

FIG. 41 is an explanatory view illustrating a method 2 of manufacturing a resonator element for an NRD guide according to the present invention;

FIG. 42 is an explanatory view illustrating a method 3 of manufacturing a resonator element for an NRD guide according to the present invention.

FIGS. 43A and 43B are explanatory diagrams showing an embodiment of the switch circuit according to the present invention, wherein FIG. 43A is a structure of the switch circuit, and FIG.

FIG. 44 is an explanatory diagram showing the operation of the NRD guide / switch circuit according to the present invention.

FIG. 45 is an explanatory diagram showing operations in a main mode and an unnecessary mode according to the present invention.

FIG. 46 is an explanatory diagram showing a configuration of another NRD guide / switch circuit according to the present invention.

FIG. 47 is a line diagram for explaining impedance matching (complex conjugate matching) according to the present invention.

FIG. 48 is a line diagram for explaining impedance conversion according to the present invention.

FIG. 49 is an explanatory diagram showing a structural example of the impedance matching / conversion element according to the present invention.

FIG. 50 is an explanatory diagram showing the principle of an NRD guide.

FIG. 51 is an explanatory view showing a configuration of a conventional NRD guide non-reflection terminator.

FIG. 52 is an explanatory diagram showing the configuration of a conventional NRD guide attenuator.

FIG. 53 is an explanatory diagram showing a configuration of a conventional NRD guide semiconductor active circuit.

FIG. 54 is an explanatory view showing a mounting example (filter example) of a conventional NRD guide resonator element.

FIG. 55 is an explanatory view showing a conventional method for manufacturing a resonator element.

FIG. 56 is an explanatory diagram showing a configuration of a conventional NRD guide / switch circuit.

FIG. 57 is an explanatory diagram showing a configuration of a conventional microstrip line substrate.

FIG. 58 is an explanatory diagram showing a configuration of an attenuator according to a conventional microstrip line.

FIG. 59 shows a conventional MIC using a magnetic ceramic.
FIG. 3 is an explanatory diagram illustrating a configuration of a circulator.

FIG. 60 is an explanatory diagram showing a positioning state of each component in the configuration shown in FIG. 53;

FIG. 61 is an explanatory view showing an assembled state of a conventional resonator element.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 101 Upper conductor plate 102 Lower conductor plate 103 Non-reflection terminator 104 Input part pure dielectric resin part 105 High frequency electromagnetic wave absorber part 1401 Input side dielectric resin part 1402 Electromagnetic wave attenuation part 1403 Joining taper surface 1404 Output side dielectric resin part 2803 Main line input / output dielectric part 2804 Matching dielectric block 4301 Switch circuit

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI H01P 5/02 H01P 5/02 7/10 7/10 11/00 11/00 E (72) Inventor Tohru Takagi Yokohama-shi, Kanagawa 2 Takaracho, Kanagawa-ku Nissan Motor Co., Ltd. (56) References JP-A-2-17708 (JP, A) JP-A-51-12753 (JP, A) JP-A-61-163704 (JP, A) No.57-9524 (JP, B2) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01P 3/16 H01P 1/11 H01P 1/15 H01P 1/22 H01P 1/26 H01P 5/02 H01P 7/10 H01P 11/00

Claims (5)

(57) [Claims] In a microwave / millimeter wave circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter wave band, a main line or a substrate dielectric portion made of a pure dielectric resin is provided. A high-frequency absorbing member in which a dielectric resin is filled with at least one kind of powder or granules having high relative permittivity, high relative magnetic permeability and resistivity; A circuit element for microwave / millimeter wave band, characterized by joining and fusing. 2. A microwave / millimeter-wave circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter-wave band, comprising: a main line or a substrate dielectric portion made of a pure dielectric resin; A high-frequency absorbing member in which a dielectric resin is filled with a powder or a granular material having resistivity; and a joining surface between the main line or the substrate dielectric portion and the high-frequency absorbing member is tapered, or A microwave / millimeter-wave band circuit element, wherein the filling rate of a resistor is changed in a step shape, and the main line or the substrate dielectric portion and the high frequency absorbing member are joined and fused. 3. A microwave / millimeter-wave circuit element using a dielectric substrate or a dielectric line used in a microwave / millimeter-wave band, wherein a main line or a substrate dielectric portion made of a pure dielectric resin is provided. A high frequency absorbing member in which a dielectric resin is filled with a powder or a granular material having a high relative magnetic permeability, and a joining surface between the main line or the substrate dielectric portion and the high frequency absorbing member is tapered; A microwave / millimeter-wave circuit element, wherein the main line or the substrate dielectric portion and the high-frequency absorbing member are joined and fused by changing the filling ratio of the high relative permeability material of the member into a step shape. 4. A microwave / millimeter-wave circuit element using a dielectric substrate or a dielectric line for use in a microwave / millimeter-wave band, wherein a main line or a substrate dielectric portion made of a pure dielectric resin, A high-frequency absorbing member in which a dielectric resin is filled with a powder or a granular material having a high relative permittivity, and a joining surface between the main line or the substrate dielectric portion and the high-frequency absorbing member is tapered, or the high-frequency absorbing member is A circuit element for microwave / millimeter wave band, characterized in that said main line or substrate dielectric portion and said high frequency absorbing member are joined and fused by changing a filling rate of a member with a high relative permittivity material into a step shape. . 5. A microwave / millimeter-wave circuit element using a dielectric substrate or a dielectric line for use in a microwave / millimeter-wave band, wherein a main line or a substrate dielectric portion made of a pure dielectric resin is provided. It consists of a high frequency absorbing member in which two or three kinds of powder or granules having a high relative dielectric constant, a high relative magnetic permeability and a high resistivity are filled in a dielectric resin. A circuit element for microwave / millimeter wave band, characterized in that an absorbing member is joined and fused.